S912ZVMC12F3WKH vs S912XHZ256F1VAG 比較
詳細並排比較 S912ZVMC12F3WKH 由 NXP Semiconductors 與 S912XHZ256F1VAG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S912ZVMC12F3WKH - MagniV 16-bit S12Z MCU, 128KB Flash | NXP
S912ZVMC12F3WKH ✓ 啟用中NXP Semiconductors
S912XHZ256F1VAG - 16-bit MCU, S12X, 256KB Flash, 80MHz | NXP
S912XHZ256F1VAG ✓ 啟用中規格比較
| 參數 | S912ZVMC12F3WKH | S912XHZ256F1VAG |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core | S12Z (CISC, 16-bit) | HCS12X (S12X) with XGATE coprocessor |
| Program Flash | 128 KB (128K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in KB] | — |
| Maximum CPU Frequency | 50 MHz | — |
| Operating Voltage (Logic) | 5 V (from internal 12V->5V LDO) | — |
| Battery Supply Input | 12 V nominal (automotive range) | — |
| Integrated Voltage Regulator | 12 V to 5 V LDO on-chip | — |
| LIN Physical Layer | Yes (integrated) | — |
| 封裝 | 64-HLQFP, 10x10 mm with exposed thermal pad | 144-LQFP (20x20 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +150C | -40C to +105C |
| Automotive Qualification | AEC-Q100 qualified | — |
| Peak Reflow Temperature | 260 C (JESD-609 e3, MSL 3) | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Terminal Finish | Tin (Sn, e3) | — |
| Product Family | S12 MagniV S12ZVM | — |
| RoHS 狀態 | Compliant | Compliant |
| Motor Control Peripherals | Gated Timer / PWM for 3-phase BLDC, PMSM, SRM | — |
| 資料匯流排寬度 | — | 16-bit |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| RAM Size | — | 12 KB |
| EEPROM (emulated) | — | 4 KB |
| Maximum CPU Clock | — | 80 MHz |
| 供應電壓 | — | 2.5 V / 5 V |
| 腳位數 | — | 144 |
| Display Capability | — | On-chip TFT driver (up to 6 gauges, color TFT) |
| CAN Modules | — | Multiple MSCAN channels |
| AEC-Q100 | — | Automotive qualified |