S9S08EL32F1CTJ vs S9S08EL32F1MTL 比較

詳細並排比較 S9S08EL32F1CTJ 由 NXP Semiconductors 與 S9S08EL32F1MTL 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08EL32F1CTJ S9S08EL32F1CTJ - HCS08 32KB Flash MCU 144-LFQFP | NXP

S9S08EL32F1CTJ - HCS08 32KB Flash MCU 144-LFQFP | NXP

S9S08EL32F1CTJ Nrnd
NXP Semiconductors
S9S08EL32F1MTL S9S08EL32F1MTL - 8-bit S08 MCU, 32KB Flash, 40MHz | NXP Semiconductors

S9S08EL32F1MTL - 8-bit S08 MCU, 32KB Flash, 40MHz | NXP Semiconductors

S9S08EL32F1MTL ✓ 啟用中

規格比較

參數 S9S08EL32F1CTJ S9S08EL32F1MTL
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Product Type 8-bit Microcontroller (MCU) —
Core Family HCS08 —
Program Memory (Flash) 32 KB —
Data Memory (RAM) 1 KB —
CPU Core Freescale/NXP HCS08, 8-bit —
Maximum CPU Frequency [DATA_NEEDED: maximum bus frequency MHz] —
Package Type 144-pin LFQFP (FJ-type) —
Package Code LFQFP —
Terminal Form GULL WING —
Package Shape SQUARE —
工作溫度範圍 -40 C to +85 C —
Communication Interfaces SPI —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status from manufacturer page] —
On-Chip Analog Comparator Yes —
On-Chip Debug BDM (Background Debug Mode) —
Core Processor — HCS08 (S08)
Core Size — 8-bit
Core Architecture — CISC
最大時脈頻率 — 40 MHz
Program Memory Size — 32 KB (32K x 8) Flash
RAM Size — 1 KB (1K x 8)
EEPROM Size — 512 bytes (512 x 8)
Number of I/O Pins — 22
封裝 — 28-TSSOP (4.40 mm width)
供應電壓 — 3.3 V / 5 V
工作溫度 — -40C to +125C
ADC — 16-channel, 10-bit, 2.5 us conversion
Analog Comparators — 2 x ACMP
On-chip LIN Controller — Slave LIN Interface Controller (SLIC)
Connectivity — I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Oscillator — External
Automotive Qualification — AEC-Q100
Packaging — Tube

資料表與資源

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