S9S08SG4E2MTJ vs MC9S08SH4MFK 比較
詳細並排比較 S9S08SG4E2MTJ 由 NXP Semiconductors 與 MC9S08SH4MFK 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | S9S08SG4E2MTJ | MC9S08SH4MFK |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 啟用中 |
| Core | S08 (HCS08) 8-bit CPU | HCS08 (8-bit) |
| Core Clock Speed | 40 MHz | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| 供應電壓 | 2.7 V to 5.5 V | — |
| 工作溫度 | -40 degC to +125 degC | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Automotive Qualification | Automotive Qualified (AEC-Q100 family grade) | — |
| Interrupt/Reset Sources | Up to 32 | Up to 32 |
| Instruction Set | HC08 with added BGND instruction | HC08 with BGND instruction |
| Debug Interface | Background Debug Mode (BDM) | — |
| 封裝 | 20-TSSOP (MTJ) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| I/O Ports | [DATA_NEEDED: I/O port count] | — |
| Peripheral Set | [DATA_NEEDED: detailed peripheral list (timers, SCI, ADC)] | — |
| RoHS 狀態 | RoHS Compliant | — |
| 生命週期狀態 | End of Life (per NXP product page) | — |
| Target Applications | LIN slave, general market, high-temperature, space-constrained | — |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| 封裝 / 外殼 | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | — | Internal |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |