ATSAM3X8CA-AU - 84MHz Cortex-M3 MCU 512KB Flash | Microchip
MPN： ATSAM3X8CA-AU ✓ 啟用中ATSAM3X8CA-AU 概覽
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals to serve as the brain of an embedded system. The ATSAM3X8CA-AU belongs to the SAM3X/A family, part of the broader ARM Cortex-M based 32-bit microcontroller class within Microchip's SMART ARM-based MCU portfolio, sitting above 8-bit AVR MCUs and alongside Cortex-M4 SAM4 parts.
Key features include the ARM Cortex-M3 revision 2.0 core with Thumb-2 instruction set, a Memory Protection Unit (MPU), a 24-bit SysTick counter, and Nested Vectored Interrupt Controller (NVIC). Integrated high-speed USB with an on-chip transceiver enables fast data up/downloading, and the dual-bank Flash architecture supports safe in-application firmware updates.
Connectivity is comprehensive: CAN, Ethernet MAC, I2C (TWI), IrDA, LIN, MMC/SDIO, SPI, SSC, UART, and USB. Rich analog and timing peripherals make the device suitable for complex control and communication nodes. This exact silicon is best known as the MCU of the Arduino Due board, giving it a very large ecosystem of code, libraries, and community support.
Typical applications include industrial automation and control, CAN/Ethernet networking nodes, 3D printers, motor control, data loggers, and USB-connected instruments.
Design consideration: the dual 256 KB Flash banks allow read-while-write operation for bootloader strategies, but Flash wait states increase at 84 MHz, so code performance tuning via the cache/acceleration layer is worthwhile.
This page adds value beyond the datasheet by synthesizing distributor pricing tiers, drop-in same-family alternatives, practical design notes, and an Arduino Due ecosystem context not found on typical product pages.
直接替換替代品，適用於 ATSAM3X8CA-AU — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM3X8CA-AU （相同外形與佔位） — 差異在於 Connectivity, Supply Voltage, SRAM, Package, Flash Memory.
ATSAM3X8C-AU
✅ 直接替換📋 參考替代品（不在目錄中）
ATSAM3X4C-AU
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM3X8CA-AUT
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ATSAM3S8BA-MUR
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3N4BA-MU
✅ 直接替換聯絡詢價
查看資料表 →ATSAM3X8CA-AU 最大額定值與電氣特性
| Core Processor | ARM Cortex-M3 revision 2.0 |
| Core Size | 32-bit |
| Maximum Clock Speed | 84 MHz |
| Flash Memory | 512 KB (2 x 256 KB banks) |
| SRAM | 96 KB (64 KB + 32 KB banks) |
| Instruction Set | Thumb-2 |
| Memory Protection | MPU (Memory Protection Unit) |
| Connectivity | CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, SSC, UART, USB |
| USB | High-speed USB with integrated transceiver |
| 供應電壓 | 1.62 V to 3.6 V |
| 工作溫度 | -40C to +85C |
| 封裝 | 100-LQFP (14 x 14 mm) |
| 安裝類型 | Surface Mount |
| SysTick Timer | 24-bit |
| Interrupt Controller | NVIC (Nested Vectored Interrupt Controller) |
| Series | SAM3X/A |
| RoHS 狀態 | Compliant (Green package) |
ATSAM3X8CA-AU 100-lqfp (14 x 14 mm) 腳位配置指南
ATSAM3X8CA-AU（100-lqfp (14 x 14 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM3X8CA-AU.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM3X8CA-AU 適用於 6 應用s: 3D Printers and Digital Fabrication, Industrial Automation and Control, USB-Connected Instruments and Data Loggers, CAN Networking Nodes, Motor Control, Networking and IoT Gateways.
3D Printers and Digital Fabrication
The ATSAM3X8CA-AU is the controller of the Arduino Due, making it a de-facto standard for high-performance 3D printer mainboards. Its 84 MHz Cortex-M3 core executes step-generation and planner math far faster than 8-bit AVR alternatives, enabling higher microstepping rates and smoother motion. The 512 KB dual-bank Flash holds large firmware images (Marlin-class) with headroom for OTA-style updates, while 96 KB SRAM buffers G-code segments. USB device connectivity with the integrated high-speed transceiver provides reliable host communication, and SPI/UART channels interface TMC-class stepper drivers and thermistor ADC front-ends.
推薦
Industrial Automation and Control
In factory automation nodes, the ATSAM3X8CA-AU combines an on-chip CAN controller with an Ethernet MAC, allowing one MCU to bridge fieldbus and plant-network domains without external protocol silicon. The 84 MHz Cortex-M3 with MPU supports deterministic control loops and RTOS-based task isolation, and the industrial -40C to +85C rating covers cabinet environments. Dual-bank 512 KB Flash permits field firmware updates over Ethernet or CAN with rollback safety, an essential reliability feature in deployed equipment. Its 3.3 V I/O and rich UART/SPI/I2C complement connect PLC I/O modules, sensors, and HMI links.
推薦
USB-Connected Instruments and Data Loggers
The integrated high-speed USB transceiver of the ATSAM3X8CA-AU supports fast data up/downloading, which suits test instruments and logging devices that stream measurement data to a PC. The 96 KB SRAM (64 KB + 32 KB banks) provides generous buffering for burst acquisition, while DMA-class peripheral access offloads the Cortex-M3 core during transfers. The 24-bit SysTick and NVIC enable precise timestamping of logged events. Dual-bank Flash allows firmware updates in the field via the same USB link, and the Thumb-2 instruction set keeps data-processing routines compact and efficient.
推薦
CAN Networking Nodes
For vehicle and industrial CAN nodes, the ATSAM3X8CA-AU offers an on-chip CAN controller with the processing headroom to run higher-layer stacks such as CANopen or J1939 alongside application logic at 84 MHz. The industrial temperature rating of -40C to +85C and RoHS-compliant 100-LQFP package suit engine-bay-adjacent and cabinet installations. LIN and IrDA support add auxiliary bus options, and SPI/SSC connect to gateway PHYs. The 512 KB Flash accommodates diagnostic firmware, DTC storage code, and bootloader images with comfortable margin.
推薦
Motor Control
The ATSAM3X8CA-AU handles motor control tasks by exploiting its 84 MHz Cortex-M3 core for field-oriented control arithmetic, its timer resources for PWM generation, and CAN connectivity for networked drives. The 96 KB SRAM holds control state, observers, and commutation tables while Flash banks store parameter sets and diagnostics. Because the part is a general-purpose MCU, designers should verify ADC sampling rates and PWM channel counts in the SAM3X/A datasheet against their specific control topology (BLDC, PMSM, or stepper). Its high-speed USB port also enables drive commissioning and tuning via a PC GUI.
推薦
Networking and IoT Gateways
As a gateway MCU, the ATSAM3X8CA-AU couples its Ethernet MAC and CAN/UART peripheral suite to bridge sensor buses to IP networks. The 84 MHz core runs lightweight TCP/IP stacks such as lwIP, and the MPU plus Thumb-2 architecture support structured, secure firmware partitioning. Dual 256 KB Flash banks allow golden-image recovery bootloaders - a practical requirement for remotely deployed gateways. The 3.3 V, 1.62 V to 3.6 V supply range simplifies single-rail power design, and SPI connects Wi-Fi or LoRa modules for wireless extension of the wired backbone.
推薦
推薦產品摘要
工程參考資料，適用於 ATSAM3X8CA-AU — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM3X8C-AU | ATSAM3X4C-AU | ATSAM3S8BA-MUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP - same footprint family | 100-LQFP - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, lower max speed (SAM3S family) | ARM Cortex-M3, 96 MHz class (SAM3N) |
| Ethernet MAC | Yes | Yes | Yes | No | No |
| CAN | Yes | Yes | Yes | No | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C class | -40C to +85C class |
主要差異化特點
- Integrated Ethernet MAC plus CAN in one MCU (對比ATSAM3S8BA-MUR)
- Double the Flash of the low-cost sibling (對比ATSAM3X4C-AU)
- Arduino Due ecosystem leverage (對比ATSAM3N4BA-MU)
設計說明
Design the supply for a nominal 3.3 V rail within the 1.62 V to 3.6 V operating window of the SAM3X8CA. Use separate low-ESR decoupling on each VDDIO/VDDCORE pin pair per the Microchip SAM3X/A datasheet power scheme, with 100 nF ceramics placed within 2 mm of each supply pin plus bulk 4.7 uF. Note that I/O is not 5 V tolerant - level shifting is mandatory when interfacing legacy 5 V peripherals, a frequent failure source when porting from 8-bit AVR designs.
For the 100-LQFP 14 x 14 mm package, fan out high-frequency pins (USB, Ethernet RMII, SSC) first with short, matched traces. Provide a solid ground plane under the chip and stitch the Ethernet/CAN differential pairs with controlled impedance. Decouple the USB VDDUTMI pin independently. Keep crystal traces short and guarded by ground. Follow the Microchip SAM3X hardware design guidelines for the ERASE/NVMRSE pin network to guarantee production programming access.
Flash wait states must be configured for the 84 MHz clock per the datasheet electrical characteristics table; running at full speed with default reset wait-state settings causes hard faults. Additionally, dual-bank Flash read-while-write requires correct bank mapping in the linker script - writing the bank the code executes from stalls the CPU. Budget 96 KB SRAM carefully: the 64 KB + 32 KB split means large heap allocations may not be contiguous across banks.
合規資訊
GREEN IND TEMP package per Mouser listing indicates Microchip green (RoHS, halogen-free) molding with industrial temperature rating. Full REACH and conflict-minerals declarations not found in provided data.