BCM47063SN01 - 3x3 11N Gigabit WLAN Chipset | Broadcom
MPN： BCM47063SN01 ✓ 啟用中BCM47063SN01 概覽
An embedded WLAN chipset (also called a wireless SoC, radio-on-chip or combo connectivity SoC) is an integrated circuit that merges the RF front end, baseband MAC/PHY and embedded CPU into one package. This integration reduces board area, bill-of-material cost and software complexity versus discrete radio plus host-MCU designs. Within the product hierarchy, BCM47063SN01 sits at the top as a highly integrated connectivity SoC, one level above discrete Wi-Fi front-end modules and two levels above standalone 802.11 transceivers.
Verified distribution data identifies the device as a 3x3 11N GE WLAN chipset with ROHS3 compliance, tray package type, an NKESP order code of 73D-BCM47063SN01 and a listed base product number of BCM47063. The 3x3 notation refers to the three spatial streams and three antenna chains the radio supports, and the GE suffix denotes the integrated Gigabit Ethernet port that eliminates an external Ethernet PHY on typical designs.
Because Broadcom does not publicly publish a full detailed datasheet for this ordering code, core electrical characteristics such as supply voltage, current consumption, RF output power, operating temperature range, pin count and package dimensions are not verifiable from the sources consulted. These are marked in the specification table rather than guessed. Confirmation should be made with Broadcom or the authorised distributor before committing to a new PCB layout.
Typical deployments are dual-band and single-band 802.11n residential routers, wireless access points, cable modems and DSL gateways with Ethernet LAN ports, mesh node and range-extender designs, and other embedded networking appliances that require an integrated Wi-Fi plus Gigabit Ethernet solution on a single board.
When designing with this part, plan the PCB layout against the approved Broadcom reference design and evaluation kit, keep the RF path free of copper and metal obstructions, and provide the required decoupling and matching network footprint even if the values are only revealed under Broadcom NDA. Treat the RF section as a controlled-impedance, 50 ohm transmission-line layout from the outset, because retrofitting an antenna path after routing is a common source of yield loss.
This page consolidates verified distributor availability, RoHS and packaging data, ordering codes, family-level drop-in options and practical RF layout guidance that is normally spread across distributor listings and vendor portals, giving engineers a single reference before committing a board spin.
直接替換替代品，適用於 BCM47063SN01 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
BCM47063SNB1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
BCM47063AVB1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
BCM47063B1
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
BCM47063SN01G
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
BCM47063SN01 最大額定值與電氣特性
| Device Type | Integrated 802.11n WLAN chipset (SoC) with Gigabit Ethernet |
| Wireless Standard | IEEE 802.11n |
| Radio Configuration | 3x3 (3 spatial streams / 3 antenna chains) |
| Ethernet Support | Gigabit Ethernet (GE) integrated |
| Manufacturer | Avago Technologies (Broadcom Limited) |
| Base Product Number | BCM47063 |
| Orderable Part Number | BCM47063SN01 |
| NKESP Order Code | 73D-BCM47063SN01 |
| Package / Shipping Type | Tray |
| RoHS 狀態 | ROHS3 Compliant |
| Listed Stock (source listing) | 4167 pcs |
| 安裝類型 | Surface Mount (SMD) |
BCM47063SN01 tray 腳位配置指南
BCM47063SN01（tray 封裝）的腳位配置。 此類比元件具有輸入、輸出與電源腳位。偏移歸零、補償與致能腳位配置請參閱製造商資料表。適用於訊號調理與放大器電路。
無詳細腳位定義資料： BCM47063SN01.
請參閱 資料表 以查看完整腳位配置。
典型應用
BCM47063SN01 適用於 6 應用s: 802.11n Residential Router with Gigabit LAN, Wireless Access Point for Enterprise or Campus, Cable Modem and DSL Gateway Platforms, IoT Gateway and Smart-Hub Controller, Mesh Node and Range Extender, Industrial Network Appliance and Test Equipment.
802.11n Residential Router with Gigabit LAN
The BCM47063SN01 fits a residential router because a single 3x3 802.11n radio plus integrated Gigabit Ethernet replaces a separate Wi-Fi front end and Ethernet PHY, shrinking the router main board and BOM cost. The device sits between the WAN/LAN switch PHY and the RF front end: Ethernet frames are terminated on-chip while the 802.11n baseband drives three antenna chains for improved range and client capacity. Because the GE interface is integrated, only magnetics and a discrete switch are needed for multiple LAN ports. Design note: because no public pinout or electrical limits exist for this ordering code, engineers must follow the Broadcom reference design and evaluation kit exactly, and treat the RF path as a 50 ohm controlled-impedance layout with the matching network footprint retained.
推薦
Wireless Access Point for Enterprise or Campus
In an enterprise access point, the BCM47063SN01's 3x3 spatial-stream capability gives coverage and client-density headroom that single-stream access points cannot match, while the integrated Gigabit Ethernet port removes the need for a separate Ethernet controller on the board. Designers typically place the chip centrally, with three antenna chains routed to ceiling or wall antennas through matching networks and coax. Because Broadcom publishes no public datasheet for this code, RF layout must be copied from the approved reference design, and antenna clearances around the module and enclosure plastic must be validated early, since a metal enclosure or a misplaced ground pour will degrade the 3-chain performance the part is chosen for.
推薦
Cable Modem and DSL Gateway Platforms
Cable modems and DSL gateways need a high-performance wireless LAN alongside a wired WAN or LAN path, and the BCM47063SN01 provides both from one chipset: an 802.11n 3x3 radio for the wireless side and Gigabit Ethernet for the router or bridge ports. This consolidation reduces the number of active silicon devices in a cost-sensitive CPE enclosure and simplifies the power tree, since fewer regulators and clocks are needed. The design trade-off is that Broadcom's connectivity silicon for this family is typically NDA-protected, so supply continuity, firmware image availability and allocation from the authorised distributor must be secured early rather than at the end of the development cycle.
推薦
IoT Gateway and Smart-Hub Controller
Smart-hub and IoT gateway designs use the BCM47063SN01 as the central connectivity engine, combining Wi-Fi client connectivity with a wired Ethernet backhaul to the home network. Because the SoC handles both radio and Ethernet, a hub can expose a single serial or PCIe link to an application processor for cloud services, storage and voice control, which simplifies the board partitioning. Practical guidance: keep the antenna region clear of the switching regulator and isolate noisy digital return currents from the RF ground reference, and place the Ethernet magnetics at the board edge with short differential traces, since the integrated PHY is sensitive to reference-plane discontinuities under burst load.
推薦
Mesh Node and Range Extender
In a mesh node or range-extender product, the BCM47063SN01 is a natural fit because a 3x3 802.11n radio provides backhaul and client coverage in the same 3x3 mm-class footprint without a separate host MCU, while Gigabit Ethernet allows wired backhaul to be added on nodes that sit near a wall outlet. Firmware typically runs the mesh stack directly on the Broadcom platform, so the designer is freed from porting a separate TCP/IP stack. The key layout constraint is antenna diversity: the three chains should be physically separated and oriented away from the mains-derived power section, and the 50 ohm feed lines must run over uninterrupted ground to keep the multi-chain throughput consistent across units.
推薦
Industrial Network Appliance and Test Equipment
Industrial gateways, protocol analyzers and test equipment benefit from the BCM47063SN01 because it delivers both a Wi-Fi client interface and a wired Gigabit Ethernet interface in a single device, simplifying instrument front panels that must connect to both Wi-Fi and Ethernet test networks. The three antenna chains support MIMO measurements and non-destructive OTA testing setups. Two constraints deserve attention in an industrial enclosure: metal enclosures require a plastic RF window with defined clearance, and the industrial temperature range and thermal dissipation of the SoC are not published publicly, so the mechanical thermal design and the qualified temperature grade must both be confirmed with Broadcom rather than assumed from a consumer-grade data sheet.
推薦
推薦產品摘要
工程參考資料，適用於 BCM47063SN01 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | BCM47063SNB1 | BCM47063AVB1 | BCM47063B1 |
|---|---|---|---|---|
| Package / Shipping Type | Tray (Broadcom BCM47063 3x3 WLAN SoC) | Tray - same package family | Tray - same package family | Tray - same package family |
| Brand | Broadcom (Avago Technologies) | Broadcom - same | Broadcom - same | Broadcom - same |
| Wireless Standard | IEEE 802.11n | IEEE 802.11n | IEEE 802.11n | IEEE 802.11n |
| Radio Configuration | 3x3 (3 streams / 3 antenna chains) | 3x3 - identical | 3x3 - identical | 3x3 - identical |
| Integrated Gigabit Ethernet | Yes (GE integrated) | Yes | Yes | Yes |
| Base Product Number | BCM47063 | BCM47063 | BCM47063 | BCM47063 |
主要差異化特點
- Three-stream radio plus Gigabit Ethernet in a single connectivity SoC (對比A discrete 2.4 GHz radio + external Ethernet PHY architecture)
- Same-die sibling orderable codes enable genuine drop-in supply resilience (對比Cross-brand Wi-Fi SoC alternatives)
- Integration reduces system BOM and power-tree complexity (對比Broadcom MCU plus separate WLAN front-end module)
設計說明
Treat the RF section as a controlled-impedance 50 ohm transmission-line structure from the module pads to the antenna connector. Keep the antenna feed microstrip or CPWG over an uninterrupted ground plane, remove ground pours and split planes directly under the feed, and never route digital, Ethernet or switching-supply return currents beneath the antenna path. Because this ordering code has no public pinout, the safe procedure is to clone the Broadcom reference design footprint exactly, including the matching-network pads, and to keep those pads populated even when the tuned values are only released under NDA.
Preserve antenna clearance to the board edge, enclosure plastic and any metal shield can. A 3x3 multi-chain radio loses range and MIMO gain quickly when the antenna is detuned by adjacent metal or by a ground-pour termination close to the feed. Reserve a keep-out band around all three chains, keep tall components and copper pours out of the antenna region, and validate the antenna pattern with the reference enclosure before tooling, since enclosure changes alter the matching that the reference design assumes.
The integrated Gigabit Ethernet and 802.11n baseband make the power tree sensitive to supply droop and switching ripple, especially in burst TX states. Provide the local bulk and high-frequency decoupling specified by the reference design at the supply pins, keep the DC/DC converter switching loop tight and physically separated from the antenna region, and use low-ESR parts on the Ethernet rail so burst traffic does not modulate the radio supply. Exact voltage rails and current limits are not published for this code, so obtain them from Broadcom before finalising the supply design.
Do not assume that any other vendor's 802.11n + Ethernet SoC can be substituted on the same board. The pad map, RF matching network, reference clock, firmware/bootloader and the Broadcom-hosted driver stack are all family-specific, so a foreign chipset is a redesign rather than a drop-in. The realistic mitigation for supply risk is to qualify the sibling Broadcom BCM47063 ordering codes (SNB1, AVB1, B1) early, validate them on the same reference design and firmware branch, and keep the pin-compatible footprint fixed in the layout.
合規資訊
Distributor listings state RoHS Status: ROHS3 Compliant. REACH, AEC-Q100 qualification status, halogen-free declaration and conflict-minerals reporting are not published in the sources verified on 2026-10-30 and are marked unknown; AEC-Q100 qualification is normally not claimed for this class of consumer/enterprise WLAN SoC but must be confirmed with Broadcom for automotive-grade projects.
