DSPIC33CK64MP206-E/MR - 100MHz 16-bit DSC 64KB Flash | Microchip
MPN： DSPIC33CK64MP206-E/MR ✓ 啟用中DSPIC33CK64MP206-E/MR 概覽
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic control behavior of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits between general-purpose MCUs and dedicated digital power ASICs, providing a modified Harvard architecture with a 16-bit dsPIC DSC core executing up to 100 MIPS for closed-loop control of power conversion and motor drive systems.
Key features include dual-partition Flash with error-correction code (ECC) and Live Update support, which allows firmware upgrades while the controller continues to run; Memory Built-In Self-Test (MBIST) for functional-safety designs; high-resolution PWM outputs suited to digitally controlled power supplies; and CAN Flexible Data (CAN FD) for industrial and automotive networking. The three integrated op-amps reduce external component count in current-sense front ends.
Technically, the dsPIC33CK core operates from 3.0V to 3.6V and integrates DSP multiply-accumulate instructions alongside deterministic interrupt latency, making it well matched to fixed-point control loops executing at switching frequencies of hundreds of kilohertz. The functional-safety (FuSa) variant designation supported by this part aids IEC 61508 and ISO 26262 oriented development flows.
Typical applications include digital power supplies (LLC, totem-pole PFC), brushless DC and PMSM motor control, solar micro-inverters, and battery-management systems. The integrated analog front end (op-amps, comparators, 12-bit ADC peripherals in the family) enables single-chip current shaping and fast overcurrent protection.
When designing with this device, budget the 8 KB SRAM carefully for control-loop state plus communications buffers, and leverage the PTG to offload deterministic trigger sequencing from the CPU.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with specifications verified against Microchip and distributor listings as of 2026-09-23.
直接替換替代品，適用於 DSPIC33CK64MP206-E/MR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33CK64MP206-E/MR （相同外形與佔位） — 差異在於 Program Flash, Data SRAM, Operating Temperature, Package, CAN Interface.
DSPIC33CK64MP206-I/MR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33CK32MP206-I/MR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33CK128MP206-I/MR
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK32MP506-E/MR
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK128MP506-E/MR
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK64MP206-E/MR 最大額定值與電氣特性
| Core | dsPIC33CK 16-bit DSC core |
| Maximum Operating Frequency | 100 MHz (100 MIPS) |
| Program Flash | 64 KB with ECC and dual-partition Live Update |
| Data SRAM | 8 KB with MBIST |
| 供應電壓 | 3.0 V to 3.6 V |
| 工作溫度 | -40C to +150C (E grade) |
| Architecture | Modified Harvard, single-core |
| On-chip Op-Amps | 3 |
| Analog Comparators | 3 |
| Peripheral Trigger Generator | Yes (PTG) |
| CAN Interface | CAN Flexible Data (CAN FD) |
| PWM | High-Resolution PWM |
| Functional Safety Support | Yes (FuSa variant features) |
| 封裝 | 64-QFN (9x9 mm), MR |
| 安裝類型 | Surface Mount |
DSPIC33CK64MP206-E/MR 64-qfn (9x9 mm), mr 腳位配置指南
DSPIC33CK64MP206-E/MR（64-qfn (9x9 mm), mr 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33CK64MP206-E/MR.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33CK64MP206-E/MR 適用於 6 應用s: Digital Power Supplies, Brushless DC and PMSM Motor Control, Battery Management Systems, Solar Micro-Inverters, Industrial Networking and Sensing Nodes, Audio and Signal Processing Equipment.
Digital Power Supplies
The DSPIC33CK64MP206-E/MR fits digitally controlled power converters such as LLC resonant stages and totem-pole PFC because its 100 MHz (100 MIPS) core closes voltage and current loops at switching frequencies in the hundreds of kilohertz with deterministic latency, while high-resolution PWM delivers fine duty and phase resolution for soft-switching control. The three on-chip op-amps amplify current-shunt signals and the three comparators provide cycle-by-cycle overcurrent trips without CPU intervention. Placed as the main controller between the feedback dividers and gate drivers, it replaces analog control chips and enables firmware-tunable compensation; the trade-off versus dedicated analog controllers is firmware development effort and the need to verify worst-case loop timing within the 8 KB SRAM budget.
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Brushless DC and PMSM Motor Control
For field-oriented control of BLDC and PMSM motors, the DSPIC33CK64MP206-E/MR provides the 100 MIPS DSP throughput required for current-loop execution at PWM frequencies of 20-100 kHz, with DSP multiply-accumulate instructions accelerating Clarke/Park transforms and PI compensation. The integrated 3-op-amp front end conditions phase-current shunts directly, and the 3 comparators implement hardware overcurrent shutdown. The -40C to +150C E-grade rating tolerates ambient temperatures near drive electronics. In a typical drive, the DSC receives position feedback from hall or encoder inputs, computes FOC in fixed point, and drives a three-phase inverter through its high-resolution PWM outputs; the advantage over general-purpose MCUs is single-chip current shaping with lower external BOM cost, while the constraint is the 8 KB SRAM limiting very complex state machines.
推薦
Battery Management Systems
The DSPIC33CK64MP206-E/MR serves as a battery-pack controller where its CAN FD interface packs cell-voltage and state-of-charge telemetry onto modern vehicle and industrial buses, and its 12-bit-capable analog resources measure stack currents via the on-chip op-amps. The dual-partition Flash with ECC and Live Update allows firmware field updates with rollback protection - important for deployed energy-storage assets - while MBIST supports self-diagnostic routines. Operating from a 3.0V to 3.6V rail, the DSC supervises a front-end AFE, executes coulomb-counting and protection algorithms at 100 MIPS, and trips pack disconnect through comparator outputs in hardware. The E-grade temperature range covers under-hood and outdoor cabinet environments; the trade-off versus dedicated BMS ASICs is firmware qualification effort offset by full algorithm flexibility.
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Solar Micro-Inverters
In a solar micro-inverter, the DSPIC33CK64MP206-E/MR executes maximum-power-point tracking, grid-synchronization (PLL), and DC/AC modulation concurrently on its 100 MHz single core. High-resolution PWM generates the switching patterns for interleaved boost and DC/AC stages, and the PTG offloads deterministic ADC-trigger sequencing so the CPU spends cycles on the MPPT algorithm rather than trigger housekeeping. CAN FD or UART links report panel-level performance data to gateway electronics. The on-chip comparators add a hardware layer of overcurrent protection between firmware decisions. The single-chip integration of op-amps, comparators, and control DSP shrinks the control card, which matters in encapsulated micro-inverter housings with limited PCB area and constrained thermal budgets where the -40C to +150C rating is a distinct advantage.
推薦
Industrial Networking and Sensing Nodes
The DSPIC33CK64MP206-E/MR works well as an intelligent industrial sensing node: CAN FD supports payloads up to 64 bytes at higher bit rates than classical CAN, making it suitable for factory automation backbones, while the Peripheral Trigger Generator automates sensor sampling sequences. The three op-amps amplify bridge-sensor outputs (pressure, load-cell) and the DSP engine applies fixed-point filtering faster than a typical MCU. Dual-partition Flash allows field firmware updates over the network with ECC protection against bit corruption in electrically noisy environments. Designers typically connect an analog front end to the op-amp inputs, terminate CAN FD through an external transceiver, and schedule acquisition-to-transmission pipelines in the 8 KB SRAM. The main design consideration is SRAM budgeting when buffering multiple sensor streams alongside the protocol stack.
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Audio and Signal Processing Equipment
The DSP core of the DSPIC33CK64MP206-E/MR executes fixed-point audio algorithms - filtering, dynamic processing, and control-plane tasks - at 100 MIPS, sufficient for multi-channel effects chains at 48 kHz sampling rates. The three integrated op-amps serve as input buffer/anti-alias gain stages, reducing external component count in compact audio hardware, and the ADC-triggering through the PTG yields consistent sampling latency, which matters for latency-sensitive paths. Dual-partition Flash supports feature updates shipped to deployed units. Typical topology: analog inputs buffered by the on-chip op-amps, converted by the family ADC under PTG control, processed with DSP library functions, and output through PWM-DAC or external codec via SPI/UART. Compared with general-purpose MCUs, the DSC instruction set provides single-cycle MAC operations; compared with floating-point DSPs, firmware must be written in fixed point within the 8 KB SRAM envelope.
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推薦產品摘要
工程參考資料，適用於 DSPIC33CK64MP206-E/MR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33CK64MP206-I/MR | DSPIC33CK32MP206-I/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) MR | 64-QFN (9x9) MR - same | 64-QFN (9x9) MR - same | 64-QFN (9x9) MR - same | 64-QFN (9x9) MR - same |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Program Flash | 64 KB | 64 KB | 32 KB | 32 KB | 128 KB |
| Operating Temperature | -40C to +150C (E grade) | -40C to +125C (I grade) | -40C to +125C (I grade) | -40C to +150C (E grade) | -40C to +150C (E grade) |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Extended +150C operation (對比DSPIC33CK64MP206-I/MR)
- Integrated analog front end (對比DSPIC33CK32MP506-E/MR)
- Balanced 64 KB Flash with Live Update (對比DSPIC33CK128MP506-E/MR)
- Honest trade-off: memory budget (對比DSPIC33CK128MP506-E/MR)
設計說明
Estimated: the dsPIC33CK core draws on the order of tens of mA at 100 MHz from a 3.0-3.6V rail (exact ICC per the datasheet electrical-specifications tables). Budget a low-ESR 10 uF bulk capacitor plus 0.1 uF ceramic decoupling at each VDD pin pair of the 64-QFN, placed within 2 mm of the pads. All VDD/VSS pairs must be connected - leaving a power pin unconnected is a common failure mode on QFN DSCs and can cause erratic resets under load transients.
The 64-QFN (9x9) has a center exposed thermal pad that must be soldered to a grounded copper pour with an array of thermal vias - it is both the primary heat-removal path for -40C to +150C operation and the main ground return for the analog front end. Keep the three op-amp input traces short and guarded away from high-resolution PWM and CAN FD routing to prevent coupling; use a solid, unsplit ground plane under the analog section.
The 8 KB SRAM fills quickly when running a control loop plus CAN FD stacks plus a logger. Estimate worst-case stack depth with the MPLAB compiler's memory-usage report and leave at least 20% headroom. When using dual-partition Live Update, remember both partitions are carved out of the 64 KB Flash, halving single-image capacity - verify the firmware fits the active partition before committing to live-update architecture. Configure configuration bits (oscillator, watchdog, PPS mapping) via MPLAB Code Configurator to avoid bit-field mistakes.
High-resolution PWM edges are fast enough to cause ringing into gate-driver inputs; place a small series resistor (10-33 ohm, estimate to tune per layout) close to the DSC pin on each PWM output, and route PWM pairs as tightly coupled traces to limit radiated EMI. Keep the op-amp and ADC reference grounds star-connected to the exposed pad rather than daisy-chaining through digital return paths.
合規資訊
Compliance data not present in the verified web data for this exact ordering code; consult Microchip's product page or environmental datasheet for RoHS/REACH confirmation.
