E180-2G4Z20SX-TB - EFR32MG21 ZigBee 3.0 Test Kit | EBYTE
MPN： E180-2G4Z20SX-TB ✓ 啟用中E180-2G4Z20SX-TB 概覽
A ZigBee module is a pre-certified, surface-mount radio module that integrates an RF transceiver, microcontroller, antenna interface, and matching networks into a single shielded package. ZigBee modules belong to the broader hierarchy of wireless connectivity modules -> short-range IoT radios -> 2.4 GHz ISM-band transceivers -> IEEE 802.15.4-based mesh networking devices, designed to reduce RF design complexity for OEMs building mesh-enabled smart products.
Key features of the E180-2G4Z20SX-TB test kit include: the host module operates in the 2.4 GHz ISM band with maximum transmit power of 20 dBm, supports ZigBee 3.0 self-organizing mesh networking, and provides USB power and serial port access via a 2.0 mm pitch pin header. The carrier PCB is pre-soldered to the E180-2G4Z20SX module so developers can plug the kit directly into a breadboard or USB host. Product weight is 3.5 g +/- 0.1 g.
The E180-2G4Z20SX-TB is purpose-built for engineers evaluating the E180-2G4Z20SX module: it exposes the module's UART, GPIO, and power pins through standard 2.54 mm headers, removes RF layout risk during firmware bring-up, and ships with reference firmware for rapid ZigBee 3.0 stack validation. The internal PA delivers the 20 dBm TX power needed for long-range mesh nodes.
Typical applications include ZigBee 3.0 smart-home device prototyping, industrial sensor mesh networking, smart metering pilots, building automation gateways, and wireless HVAC/lighting control development. The test kit is also used as a reference design for designers integrating the bare E180-2G4Z20SX module into their own carrier PCB.
When designing with this test kit, note that the kit is a development-only assembly - it is not intended for deployment in the final product. For production designs, use the host E180-2G4Z20SX module directly on a custom carrier PCB and obtain modular transmitter / certification requirements before shipping.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for E180-2G4Z20SX-TB selection, sourcing, and integration guidance.
直接替換替代品，適用於 E180-2G4Z20SX-TB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
E180-2G4Z20SX
✅ 直接替換📋 參考替代品（不在目錄中）
E180-2G4Z20SX-TB
✅ 直接替換聯絡詢價
查看資料表 →E180-2G4Z20SX-TB 規格（製造商公布）
| Product Type | ZigBee 3.0 Wireless Module Test/Development Kit |
| Host Module | E180-2G4Z20SX (Silicon Labs EFR32MG21-based) |
| Wireless Protocol | ZigBee 3.0 / IEEE 802.15.4 |
| Operating Frequency Band | 2.4 GHz ISM (2400-2483.5 MHz) |
| Maximum Transmit Power | 20 dBm |
| Form Factor | USB-stick development board, 28.5 x 24.6 mm |
| Pin Header Pitch | 2.0 mm |
| Host Module Package | SMD, 19.5 x 13.5 mm |
| 介面 | USB (power + serial) |
| Product Weight | 3.5 +/- 0.1 g |
| Power Supply | External / USB (user-supplied) |
| Mesh Networking | ZigBee 3.0 self-organizing mesh supported |
| RoHS 狀態 | Compliant |
| Host Module Antenna | Integrated (per host module datasheet) |
E180-2G4Z20SX-TB 介面與連接器
E180-2G4Z20SX-TB 依製造商公布提供以下介面與連接器：無線。擴充排針腳位、連接器腳位編號與電氣限制均定義於製造商文件中。
| 無線 | ZigBee 3.0 / IEEE 802.15.4 |
請參閱 製造商文件 以取得完整的擴充排針腳位定義與連接器腳位編號。
典型應用
E180-2G4Z20SX-TB 適用於 6 應用s: ZigBee 3.0 Smart Home Device Prototyping, Industrial Sensor Mesh Network Pilot, Smart Metering and AMI Development, Building Automation and HVAC Control, Wireless Lighting Control Development, IoT Mesh Reference Design Validation.
ZigBee 3.0 Smart Home Device Prototyping
The E180-2G4Z20SX-TB provides a plug-and-play evaluation platform for engineers developing ZigBee 3.0 end devices such as smart bulbs, sensors, and switches. The host module's 20 dBm TX power and self-organizing mesh support let designers verify range and commissioning behavior before committing to a custom carrier PCB. Using the kit with reference firmware shortens time-to-prototype for IEEE 802.15.4 mesh nodes.
推薦
Industrial Sensor Mesh Network Pilot
Pilot deployments of industrial sensor meshes benefit from the E180-2G4Z20SX-TB's 2.4 GHz operation and 20 dBm maximum transmit power, which extends link margin in metal-rich factory environments. Engineers wire the kit's 2.0 mm header to external sensors via UART or GPIO, then validate mesh routing, range, and reliability before designing a sealed industrial housing. The kit accelerates pilot validation for IEEE 802.15.4-based sensor networks.
推薦
Smart Metering and AMI Development
Smart metering Advanced Metering Infrastructure (AMI) pilots leverage the E180-2G4Z20SX-TB's ZigBee 3.0 stack and 20 dBm TX power to validate mesh coverage for residential and small-commercial meter networks. The carrier's USB-style form factor simplifies desk testing of meter firmware and over-the-air firmware upgrade (OTA) flows. Engineers can characterize power consumption and RF performance using the same host module that ships in production designs.
推薦
Building Automation and HVAC Control
Building automation gateways and wireless HVAC controllers use the E180-2G4Z20SX-TB to prototype ZigBee 3.0 coordinators and routers that join thermostats, dampers, and lighting nodes into a single mesh. The 2.4 GHz band and integrated power amplifier deliver reliable connectivity across commercial floor plates, while the carrier's accessible headers simplify wiring of UART-controlled actuators. The kit is well suited to commissioning-tool development for BAS integrators.
推薦
Wireless Lighting Control Development
Wireless lighting control designers use the E180-2G4Z20SX-TB to evaluate ZigBee 3.0 mesh behavior for dimmers, color controllers, and luminaire nodes. The host module's 20 dBm TX power ensures robust mesh links across large lighting grids, while the carrier PCB's 2.0 mm headers allow direct connection to driver electronics for fast bring-up. The kit shortens the path from ZigBee stack bring-up to dimming firmware validation.
推薦
IoT Mesh Reference Design Validation
Engineers building IoT reference designs use the E180-2G4Z20SX-TB as a known-good ZigBee 3.0 node against which to validate custom carrier PCBs and firmware stacks. The kit's pre-soldered host module eliminates RF variability during stack bring-up, allowing focus on application-layer behavior, OTA updates, and security provisioning. This makes the kit an effective baseline for regression testing across mesh product variants.
推薦
推薦產品摘要
工程參考資料，適用於 E180-2G4Z20SX-TB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | E180-2G4Z20SX | E180-2G4Z20SX-TB |
|---|---|---|---|
| Brand | EBYTE (Chengdu Ebyte) | EBYTE | EBYTE |
| Package / Form Factor | USB-stick carrier, 28.5 x 24.6 mm, 2.0 mm header | SMD module, 19.5 x 13.5 mm (no carrier) | USB-stick carrier, 28.5 x 24.6 mm, 2.0 mm header (same as this product) |
| Wireless Protocol | ZigBee 3.0 / IEEE 802.15.4 | ZigBee 3.0 / IEEE 802.15.4 | ZigBee 3.0 / IEEE 802.15.4 |
| Operating Frequency | 2.4 GHz ISM | 2.4 GHz ISM | 2.4 GHz ISM |
| Max Transmit Power | 20 dBm | 20 dBm | 20 dBm |
| Mesh Networking | ZigBee 3.0 self-organizing mesh | ZigBee 3.0 self-organizing mesh | ZigBee 3.0 self-organizing mesh |
| Use Case | Development / test kit (pre-soldered module) | Bare module for production PCB integration | Development / test kit (pre-soldered module) |
| RoHS | Compliant | Compliant | Compliant |
主要差異化特點
- Pre-soldered host module eliminates assembly risk during evaluation (對比E180-2G4Z20SX (bare module))
- 2.0 mm pin header exposes UART, GPIO, and power for breadboard prototyping (對比Bare E180-2G4Z20SX module (SMD only))
- Identical RF silicon to the production variant (EFR32MG21 + integrated PA) (對比Third-party EFR32MG21 carrier boards)
設計說明
Do not integrate the E180-2G4Z20SX-TB into a shipped product. Per the Ebyte product specification, the -TB suffix denotes a development-only assembly with a 28.5 x 24.6 mm carrier PCB and 2.0 mm headers intended for bench evaluation. For production designs, place the host E180-2G4Z20SX bare module directly onto your own carrier PCB and obtain modular transmitter / certification requirements for your target market before volume shipment.
The E180-2G4Z20SX-TB accepts external power and serial connections through its 2.0 mm pitch header. Verify the supply voltage matches the host module's range before powering the kit; the bare E180-2G4Z20SX module's electrical ratings are documented in the host datasheet (cdebyte.com/pdf-down.aspx?id=3923). Add bulk decoupling at the supply pins to suppress USB-bus noise during RF transmission at the 20 dBm maximum power level.
When characterizing radiated performance with the E180-2G4Z20SX-TB, keep the carrier board clear of metal surfaces and enclosures that can detune the host module's integrated antenna. Mount the kit on a non-conductive stand during range tests to obtain repeatable 2.4 GHz link-budget measurements. For conducted RF testing, refer to the host module datasheet for the RF test pad layout rather than probing the carrier PCB.
合規資訊
RoHS compliance confirmed by JLCPCB and LCSC product listings for the host module and test kit. REACH, halogen-free, and conflict-minerals status were not explicitly published in the verified data and are marked unknown. AEC-Q100 does not apply - this is a development kit, not an automotive-qualified IC.
