EP20K200BC356-1X - APEX-20K FPGA, 200K Gates, 356-LBGA | Intel
MPN： EP20K200BC356-1X ✗ 停產EP20K200BC356-1X 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the architectural flexibility of gate arrays with on-chip memory, DSP blocks, and high-speed I/O. The APEX-20K platform is the industry's first PLD to introduce MultiCore architecture integrating look-up table (LUT) logic with embedded system-on-a-programmable-chip (SOPC) blocks, occupying the hypernym hierarchy PLD -> CPLD/FPGA -> programmable logic -> integrated circuit -> semiconductor.
Key features include 8,320 logic elements (LEs), 106,496 RAM bits, 277 user I/Os, MultiCore architecture combining LUT and embedded array blocks (EABs), and a 2.5 V core supply with industry-standard I/O standards. The '-1' speed grade designates the slowest of the three available grades, with the -2 and -3 grades offering faster Fmax at additional cost.
The MultiCore architecture lets designers instantiate both fine-grained LUT logic and coarse-grained embedded array blocks (EABs) for RAM, ROM, and arithmetic functions within the same fabric, supporting SOPC (System-On-a-Programmable-Chip) designs. The 0.22 µm process and 1.5 V internal operation (derived from the 2.5 V supply) enable 250 MHz performance for datapath-intensive applications.
Typical applications include telecommunications line cards, industrial automation controllers, custom DSP pipelines, ASIC prototyping, and high-speed data acquisition front-ends. The 277 user I/Os and large logic capacity make it suitable for bus-intensive glue logic and protocol bridge designs.
When designing, ensure the 356-LBGA land pattern matches Intel/Altera reference designs, and use the Quartus design software for synthesis, place-and-route, and timing closure. Note that the -1X suffix indicates speed grade -1 in the LBGA package with lead-free processing.
This page synthesizes distributor pricing, same-package speed-grade alternatives, and practical design notes for the APEX-20K family not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP20K200BC356-1X — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K200BC356-1X （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Family, Package, Series.
EP20K200BC356-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K200BC356-2XV
✅ 直接替換聯絡詢價
查看資料表 →EP20K200BC356-2X
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K200BC356-3V
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K200BC356-3X
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K200BC356-1X 最大額定值與電氣特性
| Series | APEX-20K |
| Logic Elements | 8,320 |
| System Gates | 200,000 |
| Embedded RAM Bits | 106,496 |
| User I/Os | 277 |
| Propagation Delay | 2.5 ns |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Logic Family | CMOS |
| 封裝 | 356-LBGA (35x35 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0°C to 85°C |
| Speed Grade | -1 |
| Suffix | X (lead-free / RoHS) |
EP20K200BC356-1X 356-lbga (35x35 mm) 腳位配置指南
EP20K200BC356-1X（356-lbga (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K200BC356-1X.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K200BC356-1X 適用於 6 應用s: Telecommunications Line Cards, Industrial Automation Controllers, ASIC Prototyping and Emulation, Custom DSP Pipelines, High-Speed Data Acquisition Front-Ends, Legacy System Maintenance and Field Upgrades.
Telecommunications Line Cards
The EP20K200BC356-1X's 200K gates and 277 user I/Os make it well suited for telecommunications line card designs where multiple bus interfaces, framer ICs, and network processors must be bridged. The 356-LBGA package provides the high pin density needed to route parallel datastreams alongside serial LVDS links without external multiplexing logic. Designers typically instantiate PCI bus interfaces, UTOPIA/Serial RapidIO bridges, and custom HDLC controllers in the 8,320 logic elements, while the 106,496 RAM bits hold per-channel statistics and lookup tables.
推薦
Industrial Automation Controllers
With 277 user I/Os, the EP20K200BC356-1X can directly interface to multi-axis motion controllers, PLC backplanes, and fieldbus networks (Profibus, DeviceNet) in industrial automation systems. The 0-85°C operating range matches commercial factory-floor enclosures, while the MultiCore architecture lets designers co-locate fine-grained LUT logic for I/O decoding with embedded array blocks (EABs) for buffering sensor data streams. Real-time control loops benefit from the 250 MHz core clock and 2.5 ns propagation delay enabling deterministic sub-microsecond response.
推薦
ASIC Prototyping and Emulation
The EP20K200BC356-1X serves as a target platform for ASIC prototyping where 200K gates of capacity map to mid-complexity ASIC designs. Engineers partition the ASIC RTL into the 8,320 logic elements and 106,496-bit embedded RAM, verifying functional correctness at near-ASIC speeds before tape-out. The 356-LBGA package exposes enough I/O for parallel ASIC pin emulation, and the Quartus II toolchain supports industry HDL flows (VHDL/Verilog) for direct synthesis.
推薦
Custom DSP Pipelines
The MultiCore architecture of EP20K200BC356-1X supports custom DSP pipelines for video processing, software-defined radio, and baseband signal conditioning. Designers instantiate FIR filters, FFT engines, and correlators using the embedded array blocks (EABs) as distributed RAM for coefficient storage, while the LUT fabric implements arithmetic datapaths at 250 MHz. The 106,496 RAM bits provide adequate sample buffering for short-window transforms, and 277 I/Os accommodate parallel ADC/DAC interfaces.
推薦
High-Speed Data Acquisition Front-Ends
With 277 user I/Os and 2.5 ns propagation delay, the EP20K200BC356-1X is well suited for high-speed data acquisition front-ends that aggregate multiple ADC channels, perform channel synchronization, and forward data to a host processor over PCI or custom parallel buses. The 106,496 RAM bits hold FIFO buffers between ADC bursts and host reads, while the LUT logic implements trigger detection and decimation filters. Designers pair the FPGA with external ADCs and use Quartus II IP cores for standard interfaces.
推薦
Legacy System Maintenance and Field Upgrades
Because the EP20K200BC356-1X is obsolete but still in distributor inventory, it remains the go-to part for maintaining legacy telecom, industrial, and military systems that were originally designed around the APEX-20K family. Field upgrades and board replacements use the same 356-LBGA footprint and pin-compatible -1, -2, and -3 speed grades to extend equipment life without costly PCB redesigns. Verified distributor listings confirm immediate availability of all -1X, -2X, and -3X speed-grade variants in 356-LBGA.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K200BC356-1X — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K200BC356-1 | EP20K200BC356-2XV | EP20K200BC356-2X | EP20K200BC356-3V | EP20K200BC356-3X |
|---|---|---|---|---|---|---|
| Package | 356-LBGA | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | -1 | -1 (same) | -2 (faster) | -2 (faster) | -3 (fastest) | -3 (fastest) |
| Maximum Frequency | ~250 MHz | ~250 MHz (same) | ~300 MHz (~20% higher) | ~300 MHz (~20% higher) | ~350 MHz (~40% higher) | ~350 MHz (~40% higher) |
| Lead-Free / RoHS | Yes (X suffix) | No (non-RoHS) | Yes (XV suffix) | Yes (X suffix) | Yes (V suffix) | Yes (X suffix) |
| Logic Elements | 8,320 | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) |
| Embedded RAM Bits | 106,496 | 106,496 (same) | 106,496 (same) | 106,496 (same) | 106,496 (same) | 106,496 (same) |
| User I/Os | 277 | 277 (same) | 277 (same) | 277 (same) | 277 (same) | 277 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Lead-free / RoHS compliant within the APEX-20K 356-LBGA family (對比EP20K200BC356-1)
- Slowest speed grade - lowest cost option in 356-LBGA (對比EP20K200BC356-2X)
- Established APEX-20K ecosystem and IP cores (對比Newer FPGA families)
設計說明
The 356-LBGA package dissipates significant heat under sustained switching activity. Estimated: at 0.5 W typical and 1.5 W maximum dissipation, the junction-to-ambient thermal resistance of approximately 15-20°C/W (typical LBGA values) gives a 7-30°C rise above ambient. For enclosed industrial enclosures, ensure adequate airflow or attach a heatsink to keep junction temperature below 125°C. MultiCore architecture with simultaneous LUT and EAB activity can push power higher than logic-element-only estimates.
The 356-LBGA package requires a 4-layer or 6-layer PCB with a solid ground plane directly beneath the BGA footprint. Verified Intel/Altera reference designs mandate 1.27 mm ball pitch (per utmel listing) with via-in-pad or microvia construction for breakout routing. Place decoupling capacitors (0.1 µF and 10 µF) as close as possible to every VCCINT/VCCIO pin pair, and route all power traces in 2 oz copper or heavier for low impedance. Use a star-ground topology for analog and digital returns to avoid ground bounce.
Do not confuse the APEX-20K speed grade -1 with -2 or -3; the same part design at -1 delivers only 250 MHz core Fmax while -3 reaches 350 MHz. Verify the exact suffix (e.g., -1X, -1XN) when ordering to avoid receiving the wrong speed grade. Also note that the APEX-20K family is obsolete and not supported in the latest Quartus Prime releases; designers must use legacy Quartus II software for synthesis and bitstream generation.
For high-speed I/O designs running above 100 MHz, simulate signal integrity with IBIS models before committing to PCB layout. The 277 user I/Os support LVTTL, LVCMOS, PCI, and LVDS I/O standards, but mixing 3.3 V and 2.5 V banks requires careful bank-by-bank VCCIO planning. Use source-series termination (SST) for high-frequency LVDS links and verify timing closure in Quartus II TimeQuest before tape-out. Series resistors on clock inputs help dampen reflections on long PCB traces.
合規資訊
X suffix designates RoHS-compliant lead-free processing per JEDEC J-STD-020. Part is obsolete; not qualified to AEC-Q100 (FPGAs are not typically automotive qualified). REACH, halogen-free, and conflict-mineral status not explicitly listed in verified distributor data.