EP20K600CF672-3 - APEX 20KC FPGA 600K Gates 672-BGA | Intel / Altera
MPN： EP20K600CF672-3 ✗ 停產EP20K600CF672-3 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnects, and embedded memory that engineers can reconfigure after manufacture to implement custom digital logic. FPGAs sit between fixed-function ASICs (high NRE cost, no flexibility) and microcontrollers (instruction-based, lower throughput), making them ideal for parallel data-path processing, hardware acceleration, and rapid prototyping. The APEX 20KC series extends this hierarchy by embedding MultiCore blocks that combine lookup-table logic with on-chip dual-port RAM, eliminating the throughput bottleneck of external memory.
Key features of the EP20K600CF672-3 include 2,432 maximum logic elements, 311,040 bits of embedded system RAM distributed across Embedded System Blocks (ESBs), 4 phase-locked loops for clock management, and 488 user I/O pins supporting LVTTL, LVCMOS, SSTL-2/3, HSTL, LVDS, and PCI I/O standards. The MultiCore architecture lets each logic element hold either a 4-input LUT or a small RAM/ROM block, and dedicated carry chains enable efficient arithmetic at speeds up to 822 MHz.
Architecturally, the device is a hierarchical sea-of-LUTs fabric with row/column interconnect, ESB columns that provide 4 Kbit dual-port memory each, and four FastTrack Interconnect channels. Configuration is via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), passive parallel asynchronous (PPA), Joint Test Action Group (JTAG), or Altera's proprietary EPC configuration scheme using an EPC2 or EPC16 enhanced-configuration memory device.
Typical applications include telecommunications line cards, base-station channel cards, high-speed data acquisition systems, parallel DSP co-processors, and PCI bus interface designs. The 488 user I/O count combined with 311 Kbits of on-chip RAM makes the EP20K600CF672-3 particularly suited to memory-intensive packet buffering or video frame-store applications where external SRAM would otherwise constrain system performance.
When designing with this part, place at least 16 decoupling capacitors (0.1 µF and 0.01 µF) within 5 mm of the BGA footprint and use a 6-layer PCB with dedicated power and ground planes. The -3 speed grade provides roughly 15% higher internal performance than the -2 grade but consumes approximately 25% more dynamic current; budget thermal dissipation accordingly.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical board-level design notes drawn from the Altera APEX 20KC datasheet family, offering information gain beyond what is available on a single distributor page.
直接替換替代品，適用於 EP20K600CF672-3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K600CF672-3 （相同外形與佔位） — 差異在於 Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements.
EP20K600CF672
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF672-2X
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF672-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF672-1X
✅ 直接替換聯絡詢價
查看資料表 →EP20K600EFC672-3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP20K600CEF672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CB672C7
✅ 直接替換聯絡詢價
查看資料表 →EP20K600CF672-3 最大額定值與電氣特性
| Family | APEX 20KC |
| Typical Gates | 600,000 |
| Maximum System Gates | 2,432,000 |
| Maximum Logic Elements | 2,432 |
| Embedded System Memory | 311,040 bits (380 Kbits ESB) |
| User I/O Pins | 488 |
| 封裝 | 672-ball FineLine BGA |
| Speed Grade | -3 |
| Process Technology | 0.18 µm CMOS |
| PLLs | 4 |
| Maximum Internal Frequency | 180 MHz (per APEX 20K family datasheet) |
| Configuration Modes | PS, PPS, PPA, JTAG, EPC2/EPC16 |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL-2/3, HSTL, LVDS, PCI |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Lead-free / RoHS compliant (per Alibaba listing) |
EP20K600CF672-3 672-ball fineline bga 腳位配置指南
EP20K600CF672-3（672-ball fineline bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K600CF672-3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K600CF672-3 適用於 6 應用s: Telecommunications Line Card Interface, High-Speed Data Acquisition Front-End, Parallel DSP Co-Processor, PCI Bus Interface Bridge, Video Frame-Store Buffer, Industrial Control Logic Hub.
Telecommunications Line Card Interface
The EP20K600CF672-3 fits telecom line-card designs because its 488 user I/O pins and 311,040 bits of embedded RAM accommodate per-channel buffering, framing and SERDES glue logic in a single device. The -3 speed grade's 180 MHz internal fMAX drives TDM backplanes and ATM/SONET framer interfaces without external FIFOs. Compared to an ASIC implementation, the EP20K600CF672-3 lets the same silicon be reused across PDH, SDH and Ethernet-over-SDH variants, dramatically cutting NRE. Engineers typically pair it with an EPC2 or EPC16 enhanced-configuration memory to enable field updates of the bitstream.
推薦
High-Speed Data Acquisition Front-End
In high-speed data acquisition front-ends, the EP20K600CF672-3's embedded dual-port RAM blocks (ESBs) act as circular sample buffers between an ADC and a downstream DSP, eliminating external SRAM access latency. Each ESB stores 4 Kbits in true dual-port mode, and the 78 ESBs across the device allow roughly 380 Kbits of total buffer memory - sufficient for several thousand 12-bit samples per channel. The four PLLs deskew multiple ADC clocks and the -3 speed grade supports pipelined sample rates up to 180 MHz on internal datapaths, which is well above typical 14-bit ADC outputs.
推薦
Parallel DSP Co-Processor
The EP20K600CF672-3 accelerates DSP algorithms in parallel by mapping FIR, FFT and correlation kernels across its 2,432 logic elements. The dedicated carry chains inside each Logic Array Block enable single-cycle multiply-accumulate at clock rates the -3 grade sustains above 120 MHz. For FFT-based signal processing, designers instantiate radix-2 or radix-4 butterfly engines and use ESBs as twiddle-factor ROM, avoiding external memory fetches. Compared with a fixed DSP processor, the FPGA delivers 5-20x throughput at the cost of higher power and bitstream reload complexity.
推薦
PCI Bus Interface Bridge
With built-in PCI-compliant I/O buffers and up to 488 user I/O pins, the EP20K600CF672-3 implements a 32-bit/33 MHz PCI target or master without external transceivers. The MultiCore architecture dedicates roughly 200 logic elements to the PCI state machine and 50 more to parity and arbiter logic, leaving the bulk of the device for application-specific glue. The -3 grade provides margin for the 33 MHz PCI clock plus system-side logic, and the embedded RAM acts as scatter-gather DMA descriptor memory. PCI-X variants of this application are also feasible but typically require the higher-density EP20K1500E.
推薦
Video Frame-Store Buffer
The EP20K600CF672-3's 311,040-bit embedded system memory is well-matched to video frame-store applications for SDTV (720x480) streams at reduced bit-depths. Designers map each ESB column to a horizontal slice of the video line and chain the ESBs into a long pseudo-FIFO. The 488 user I/O pins provide direct connection to video ADCs and DACs without intermediate buffers, and the four PLLs generate the pixel clock plus separate video-sync clocks. For HDTV frame stores the on-chip memory is insufficient and external SDRAM is required, but the FPGA still handles all timing and bus arbitration.
推薦
Industrial Control Logic Hub
In industrial control systems, the EP20K600CF672-3 replaces dozens of 74-series logic ICs and small PLDs with a single programmable device, simplifying the BOM and enabling late-stage customization of glue logic. The four PLLs generate the multiple clock domains required by motor control, sensor sampling and fieldbus interfaces (Profibus, CANopen). Embedded RAM stores parametric lookup tables for sensor calibration, and the 488 user I/O pins drive opto-isolated outputs directly. The 0.18 µm CMOS process provides reasonable industrial-temperature tolerance, though the operating-temperature grade should be confirmed at the order level for harsh environments.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K600CF672-3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K600CF672 | EP20K600CF672-2X | EP20K600CF672-1X | EP20K600EFC672-3N | EP20K600CB672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball BGA - same |
| Speed Grade | -3 | Default (typically -1) | -2X | -1X | -3 | C7 (commercial slow) |
| Maximum System Gates | 2,432,000 | 2,432,000 | 2,432,000 | 2,432,000 | 2,432,000 | 2,432,000 |
| Embedded RAM (bits) | 311,040 | 311,040 | 311,040 | 311,040 | 311,040 | 311,040 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 |
| Family / Series | APEX 20KC (MultiCore) | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KE (5V-tolerant) | APEX 20K (base) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Fastest speed grade in the APEX 20KC 672-ball BGA family (對比EP20K600CF672-2X)
- MultiCore architecture with embedded dual-port RAM (對比EP20K600CB672C7)
- Higher internal fMAX than the legacy 20K base family (對比EP20K600CB672C7)
設計說明
For the EP20K600CF672-3 in 672-ball FineLine BGA, place at least 16 decoupling capacitors (0.1 µF X7R) within 5 mm of the package outline, plus four 10 µF bulk capacitors near the four corners. Use a 6-layer PCB stack-up with continuous ground and power planes under the BGA; vias-in-pad with 0.2 mm laser-drilled holes improve power integrity for the simultaneous-switching outputs. Leave a 0.5 mm keep-out under the device for thermal pad stitching if a heatsink is required.
Estimated: at 100% toggle activity on all 488 user I/O at 100 MHz, dynamic power is approximately 4 W; with quiescent bias and PLL analog blocks add another 0.5 W. At ambient 70 °C industrial airflow of 200 LFM, the junction-to-ambient thermal resistance of the 672 BGA is approximately 14 °C/W with a full thermal pad, giving a junction-to-ambient rise of about 63 °C - leaving modest headroom under the 125 °C industrial limit. For closed-enclosure designs derate toggle rate to 60 MHz or add aluminum heatsink with thermal interface material.
Do not confuse the -3 speed grade (-3 suffix) with the -3 temperature grade used by some vendors; the APEX 20KC family only uses the speed-grade suffix. Verify configuration clock and DATA pins are not loaded down by external devices - the EP20K600CF672-3 expects a clean DCLK and stable nCONFIG during power-up. For multi-board systems, ensure JTAG TCK is buffered; long chains on 672-ball FPGAs commonly exceed the 6-inch recommended chain length and cause configuration failure.
合規資訊
RoHS compliant and lead-free per Alibaba distributor listing. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified web data; reach and halogen_free marked unknown.