EP2C50F484C6N - 50K Logic Elements Cyclone II FPGA 484-BGA | Intel
MPN： EP2C50F484C6N ✓ 啟用中EP2C50F484C6N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of programmable logic cells, embedded memory blocks, and programmable routing that engineers can configure after manufacture to implement arbitrary digital logic. FPGAs sit hierarchically between discrete logic ICs (lower density, fixed function) and ASICs (higher volume, fixed mask-set), and they belong to the broader programmable logic device (PLD) family that also includes CPLDs and SPLDs. Cyclone II specifically targets cost-sensitive high-volume applications by combining low-power 90 nm geometry with embedded 18x18 multipliers and M4K RAM blocks, eliminating the need for external multipliers in DSP pipelines.
Key features include 50,528 logic elements, 594,432 RAM bits, 129 embedded 18x18 multipliers for DSP workloads, and 4 PLLs for clock management. The device supports LVDS, SSTL, LVTTL, PCI, and LVCMOS I/O standards and offers up to 16 global clock networks. Embedded memory is organized into M4K blocks of 4 Kbits each, configurable as RAM, ROM, or FIFO.
The Cyclone II architecture uses a Look-Up Table (LUT)-based logic element combined with a fine-grained routing interconnect, delivering a balance of logic density and predictable timing closure. The 90 nm process node positions this part between the older Cyclone (130 nm) family and the newer Cyclone III (65 nm) family, making the EP2C50 a cost-effective choice when low unit price matters more than absolute lowest power.
Typical applications include industrial motor control, video processing, software-defined radio, embedded vision, and prototyping bridges to ASICs. Cyclone II is widely deployed in factory automation, broadcast equipment, and cost-sensitive consumer devices where 50K logic elements and embedded multipliers are sufficient.
When designing with the 484-BGA package, allocate an even number of PCB layers for the BGA breakout (typically 6 to 8 layers), keep all decoupling capacitors within 100 mils of their balls, and follow Altera's recommended power sequencing to avoid latch-up. Engineers migrating to a newer device should evaluate Cyclone IV E or Cyclone V for active product longevity, while still using the EP2C50 for new cost-driven designs targeting the legacy Cyclone II silicon revision.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone II and Cyclone III families, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP2C50F484C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2C50F484C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Total RAM Bits, Configuration Modes.
EP2C50F484C8N
✅ 直接替換聯絡詢價
查看資料表 →EP2C50F484C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2C50F484I6N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP2C50F484C6
✅ 直接替換聯絡詢價
查看資料表 →EP2C35F484C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2C35F484C8N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2C50F484C6N 最大額定值與電氣特性
| Family | Cyclone II |
| Part Number | EP2C50F484C6N |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 50,528 |
| Total RAM Bits | 594,432 bits |
| Embedded Multipliers (18x18) | 129 |
| User I/O Count | 294 |
| 封裝 | 484-ball BGA |
| Speed Grade | C6 (commercial) |
| 工作溫度 | 0 C to +85 C (commercial) |
| Core Voltage | 1.2 V |
| I/O Standards Supported | LVDS, SSTL, LVTTL, LVCMOS, PCI |
| PLLs | 4 |
| Process Node | 90 nm |
| Lead-Free / RoHS | Yes (lead-free suffix 'N') |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 |
EP2C50F484C6N 484-ball bga 腳位配置指南
EP2C50F484C6N（484-ball bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2C50F484C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2C50F484C6N 適用於 6 應用s: Industrial Motor Control, Video Processing and Bridging, Software Defined Radio (SDR) Baseband, ASIC Prototyping, Embedded Vision Systems, Industrial Communication Gateways.
Industrial Motor Control
The EP2C50F484C6N is well suited for industrial motor control loops where its 129 dedicated 18x18 multipliers can implement field-oriented control (FOC) algorithms and its 4 PLLs can synthesize the multiple PWM carrier frequencies demanded by three-phase inverter bridges. With 294 user I/O pins in the 484-BGA package, designers can directly interface to encoder feedback, Hall sensors, and gate-driver signals without external muxing. The 0-85 C commercial temperature grade is sufficient for cabinet-mounted industrial drives, and LVDS-capable I/O pairs support noise-immune feedback lines. Compared with a microcontroller-based solution, the FPGA's parallel DSP fabric dramatically shortens current-loop sample times.
推薦
Video Processing and Bridging
The Cyclone II EP2C50F484C6N delivers enough logic and memory bandwidth to implement real-time video scaling, color-space conversion, and format bridging between parallel RGB, LVDS, and HDMI-style interfaces. Its 594 Kbits of embedded RAM organize line buffers and frame-store FIFOs without external SRAM, and the 4 PLLs generate the precise pixel-clock multiples required by 720p and 1080p timing. LVDS I/O support enables direct connection to serializer/deserializer pairs commonly found in industrial cameras and broadcast equipment. Designers targeting a higher-density pipeline can migrate to Cyclone IV E or Cyclone V while reusing the same 484-BGA footprint.
推薦
Software Defined Radio (SDR) Baseband
The EP2C50F484C6N's combination of 129 18x18 multipliers and 594 Kbits of embedded RAM is well matched to software-defined-radio baseband DSP chains for narrowband protocols such as LTE, WiMAX, and proprietary industrial RF links. FFT and FIR filtering primitives fit comfortably within the 50K logic elements, and the 4 PLLs synthesize sample-clock frequencies for 30-50 MHz ADC front-ends. The 484-BGA package supports the high pin count demanded by parallel ADC/DAC interfaces and LVDS sampling-clock distribution. Engineers prototyping SDR IP on Cyclone II typically migrate to Cyclone V GT for production designs requiring integrated transceivers.
推薦
ASIC Prototyping
Engineers use the EP2C50F484C6N to functionally prototype ASIC designs before tape-out because the 50K logic elements, 129 multipliers, and 594 Kbits of RAM can host a single ASIC block at full speed. The 484-BGA footprint gives 294 user I/O pins, enough to break out most ASIC pads into prototype board test points. Quartus II software supports the Cyclone II family end-to-end, including synthesis from Verilog or VHDL via Quartus and ModelSim. Compared with ASIC emulation on larger FPGAs, the EP2C50 is a cost-effective prototyping vehicle for designs that fit in 50K logic elements.
推薦
Embedded Vision Systems
The EP2C50F484C6N is well matched to mid-resolution embedded vision pipelines because its 129 18x18 multipliers accelerate Sobel, Gaussian, and convolution kernels at 30-60 fps for VGA to 720p sensors. M4K memory blocks store line buffers and feature maps without external SRAM, reducing BOM cost and PCB area. The LVDS-capable I/O banks connect directly to CMOS-sensor parallel interfaces and serializer/deserializer pairs. Engineers building smart-camera or machine-vision prototypes often combine the EP2C50 with an external DDR SDRAM for frame buffering, using the FPGA's PLLs to generate DDR clocks with precise phase control.
推薦
Industrial Communication Gateways
The EP2C50F484C6N's 50K logic elements and 294 I/O pins enable multi-protocol industrial gateways that bridge EtherCAT, PROFINET, Modbus TCP, and proprietary fieldbus networks on a single chip. M4K memory blocks hold protocol frame buffers and FIFOs for each industrial Ethernet port. The Cyclone II architecture supports up to 16 global clock networks, allowing multiple industrial-Ethernet ports to run on independent 100 Mbps sample clocks. Compared with an MCU plus external PHY solution, the FPGA approach consolidates three or four protocol stacks onto one device while remaining cost-competitive at $180-300 per unit.
推薦
推薦產品摘要
工程參考資料，適用於 EP2C50F484C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2C50F484C8N | EP2C50F484C7N | EP2C50F484I6N | EP2C50F484C6 | EP2C35F484C6N | EP2C35F484C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball BGA | 484-ball BGA (same) | 484-ball BGA (same) | 484-ball BGA (same) | 484-ball BGA (same) | 484-ball BGA (same) | 484-ball BGA (same) |
| Logic Elements | 50,528 | 50,528 (same) | 50,528 (same) | 50,528 (same) | 50,528 (same) | 33,216 (-34%) | 33,216 (-34%) |
| Total RAM Bits | 594,432 | 594,432 (same) | 594,432 (same) | 594,432 (same) | 594,432 (same) | 483,840 (-19%) | 483,840 (-19%) |
| Embedded 18x18 Multipliers | 129 | 129 (same) | 129 (same) | 129 (same) | 129 (same) | 70 (-46%) | 70 (-46%) |
| User I/O | 294 | 294 (same) | 294 (same) | 294 (same) | 294 (same) | 322 (+10%) | 322 (+10%) |
| Speed Grade | C6 | C8 (slower) | C7 (slightly slower) | C6 industrial temp | C6 (same, non-RoHS) | C6 (same speed grade) | C8 (slower) |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C (same) | 0 C to +85 C (same) | -40 C to +100 C (industrial) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) |
| RoHS / Lead-Free | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | No (non-RoHS) | Yes (lead-free) | Yes (lead-free) |
主要差異化特點
- Highest logic density in Cyclone II family at 484-BGA (對比EP2C35F484C6N)
- C6 speed grade offers faster timing margin than C7 or C8 (對比EP2C50F484C8N)
- Lead-free material set for RoHS markets (對比EP2C50F484C6 (non-N suffix))
設計說明
BGA breakout for the 484-ball package requires careful PCB layer stackup planning. Use 6 to 8 PCB layers with the top layer for signal escape and dedicated ground/power planes on inner layers. Via-in-pad or dog-bone fanout both work; via-in-pad saves board area but requires advanced assembly (filled and planarized vias). Route differential pairs (LVDS, SSTL) with 100 ohm differential impedance and keep length matching within 50 mils across a pair and 100 mils across a bus per Altera's Cyclone II hardware design guidelines.
Decouple VCCINT (1.2 V core) with at least one 10 uF tantalum or ceramic bulk cap plus 0.1 uF and 0.01 uF ceramic caps within 100 mils of each BGA ball. Each VCCIO bank requires its own 0.1 uF decoupling cluster sized by I/O-bank drive current (typically 8 to 16 caps per bank). A ferrite bead in series with each VCCIO rail can suppress switching noise from crossing into the core supply, and the PLL analog supply pins (VCCA_PLL) should be filtered with an LC network to minimize PLL jitter degradation.
Do not omit the configuration device. Although the EP2C50F484C6N supports JTAG configuration for prototyping, a real production design requires an external EPCS serial configuration memory (e.g. EPCS16SI8N for bitstreams up to ~16 Mbit, or EPCS64SI16N for larger bitstreams) to retain the design at power-up. Also verify the JTAG chain pin order when chaining multiple devices - the Cyclone II JTAG ID differs from Cyclone III/IV/V/10, so BSDL files must match the exact silicon revision. Finally, respect Altera's recommended power-on reset (POR) sequence: VCCINT must rise before or simultaneously with VCCIO, otherwise the I/O pins may latch-up and damage the device.
合規資訊
RoHS and lead-free status inferred from the trailing 'N' in the part number (per Altera Cyclone II ordering code convention). AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free and conflict-mineral status not stated in the verified web data; set to unknown.
