EP2C5AF256A7N - Cyclone II FPGA, 4608 LE, 256-FBGA | Intel / Altera
MPN： EP2C5AF256A7N ⚠ 最後購買機會EP2C5AF256A7N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs belong to the programmable logic device (PLD) hierarchy, sitting alongside CPLDs and structured ASICs as flexible logic alternatives to fixed-function ASICs. Cyclone II FPGAs target high-volume, cost-sensitive applications where designers need hardware parallelism without the NRE cost of an ASIC. They integrate logic, embedded multipliers (18x18), embedded memory blocks (M4K RAM), and PLL clock management on a single die, enabling complete digital systems on one chip.
Key features of the EP2C5AF256A7N include 4,608 logic elements organized into 288 logic array blocks (LABs), 13 embedded 18x18 multipliers, 26 M4K RAM blocks providing 119,808 RAM bits, two PLLs, and 158 maximum user I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards, plus 66 MHz 32-bit PCI compliance. Configuration is handled through Altera's serial or parallel configuration schemes using JTAG or active/passive serial modes.
Typical applications span industrial motor control, automotive infotainment and driver-assistance subsystems, video processing pipelines, software-defined radio front-ends, embedded control, and digital signal processing pre-processing. The Cyclone II architecture is supported by the Quartus II design software (legacy) and remains popular for legacy maintenance and cost-driven new designs in mature product lines.
Designers should plan thermal dissipation carefully - the FBGA package requires proper PCB thermal via arrays under the exposed pad. For automotive applications, the AEC-Q100 qualification enables deployment in cabin electronics, instrument clusters, and body controllers. JTAG programming via the Altera USB-Blaster or compatible download cable is required for in-system configuration. Consider migrating to Cyclone IV E (EP4CE6) for new designs where supply longevity matters.
直接替換替代品，適用於 EP2C5AF256A7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2C5AF256A7N （相同外形與佔位） — 差異在於 Package, Process Technology, Configuration Modes, Speed Grade, Operating Temperature.
EP2C5AF256I7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2C5AF256C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2C5AF256A8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2C8AF256A7N
✅ 直接替換聯絡詢價
查看資料表 →EP2C5F256I8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CE6F256I7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2C5AF256A7N 最大額定值與電氣特性
| Series | Cyclone II |
| Family | Cyclone II FPGA |
| Logic Elements (LE) | 4,608 |
| Logic Array Blocks (LAB) | 288 |
| Embedded Memory | 119,808 bits (RAM) |
| M4K RAM Blocks | 26 |
| Embedded 18x18 Multipliers | 13 |
| PLLs | 2 |
| Maximum User I/Os | 158 |
| Operating Frequency (max) | 402.58 MHz |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| 封裝 | 256-pin FBGA |
| Package Code | LBGA (FineLine BGA) |
| 安裝類型 | Surface Mount |
| Operating Temperature Grade | Automotive (AEC-Q100) |
| Lead-Free / RoHS | Yes |
| Configuration | JTAG / Active Serial / Passive Serial |
EP2C5AF256A7N lbga (fineline bga) 腳位配置指南
EP2C5AF256A7N（lbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2C5AF256A7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2C5AF256A7N 適用於 6 應用s: Automotive Infotainment Systems, Industrial Motor Control, Video Processing and Image Pipelines, Software-Defined Radio Front-Ends, Embedded Control and Interface Bridging, Digital Signal Processing Pre-Processing.
Automotive Infotainment Systems
The EP2C5AF256A7N is well-suited for entry-level automotive infotainment systems where its AEC-Q100 automotive qualification and 1.2V Cyclone II architecture provide the right balance of cost, integration, and reliability. The 4,608 logic elements handle audio routing, volume mixing, and display backlight control logic, while the 158 user I/Os interface to LCD panels, touch controllers, AM/FM tuner ICs, and Bluetooth modules. The 13 embedded 18x18 multipliers support audio effects processing (equalizers, surround decoders) at 48 kHz without CPU offload. The automotive temperature grade (A7N suffix) ensures operation from -40 C to +125 C, which covers cabin electronics and instrument-cluster environments. Designers typically pair this FPGA with an external ARM Cortex-M0 host microcontroller and a dedicated audio DAC.
推薦
Industrial Motor Control
In industrial motor-control applications, the EP2C5AF256A7N implements field-oriented control (FOC), space-vector PWM, and encoder feedback processing. Its 13 embedded 18x18 multipliers execute Park/Clarke transforms and PID loops at switching frequencies up to 20 kHz for three-phase inverters. The 119,808 bits of embedded RAM buffer current and voltage samples, while the two PLLs generate the precise PWM timer base and the ADC sampling clock. The automotive-grade temperature range easily handles industrial cabinet environments, and the 256-FBGA package provides the I/O count needed for multi-axis servo or stepper drives. Typical companion ICs are isolated gate drivers (such as the Si8271) and 16-bit ADCs for current sensing. Verify the PCB thermal via array is sized for the application duty cycle.
推薦
Video Processing and Image Pipelines
The EP2C5AF256A7N handles low-resolution video pipelines such as CCTV muxing, deinterlacing, and overlay generation. The 4,608 logic elements implement line buffers in distributed RAM plus a few M4K blocks, supporting standard-definition (SD) PAL/NTSC streams at 27 MHz pixel clocks. The 158 user I/Os connect directly to CMOS image sensors, BT.656 decoders, and TFT LCD panels without an external bridge ASIC. For higher resolutions, consider the EP2C20F256I8N or EP2C35F484 series which double or quadruple the logic capacity. Designers use the Cyclone II's embedded multipliers for chroma upsampling and color-space conversion, achieving deterministic latency that software CPUs cannot match.
推薦
Software-Defined Radio Front-Ends
In software-defined radio (SDR) front-ends, the EP2C5AF256A7N performs DDC (digital down-conversion), channelization, and baseband preprocessing. The 13 hardware multipliers execute FIR pulse-shaping filters and Hilbert transforms for I/Q demodulation at IF frequencies up to 100 MHz. The 119,808 RAM bits buffer ADC samples for FFT pre-staging. Pair the FPGA with a 12- or 14-bit ADC (such as the AD9648 or AD9288 family) sampling at 100 MSPS to digitize IF signals, then feed the digital baseband to a host DSP or ARM processor. The automotive temperature grade allows mobile and vehicle-mounted SDR deployments. Note that for high-bandwidth transceivers, an FPGA with SERDES such as the Cyclone IV GX is recommended.
推薦
Embedded Control and Interface Bridging
The EP2C5AF256A7N serves as a flexible interface bridge in embedded systems, converting between legacy parallel buses, custom protocols, and modern serial standards. Common deployments include SPI-to-parallel bus bridges, I2S audio mux/demux, UART-to-LIN gateways, and custom logic analyzers. The 158 user I/Os simultaneously drive a 32-bit CPU local bus, four SPI peripherals, and a 16-bit GPIO expansion header. The 4,608 logic elements are sufficient for typical glue-logic and protocol-conversion tasks while keeping cost low. The 90nm Cyclone II architecture offers proven Quartus II tool support and a mature IP library, making this part a strong choice for legacy maintenance and long-lifecycle industrial designs.
推薦
Digital Signal Processing Pre-Processing
The EP2C5AF256A7N is used as a pre-DSP accelerator in audio and vibration-analysis systems. Its 13 embedded 18x18 multipliers execute FIR filters, biquad IIR stages, and Goertzel algorithms for tone detection at sample rates up to 1 MSPS. The M4K RAM blocks store coefficient tables and circular sample buffers, while the two PLLs derive independent audio and sensor clocks from a common reference. Typical systems pair the FPGA with a 24-bit sigma-delta ADC for vibration or acoustic emission monitoring. The automotive temperature grade (AEC-Q100) enables deployment in vehicle-mounted monitoring and predictive-maintenance installations. For higher DSP throughput, migrate to the EP2C20F256I8N which adds more multipliers.
推薦
推薦產品摘要
工程參考資料，適用於 EP2C5AF256A7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2C5AF256I7N | EP2C5AF256C7N | EP2C5AF256A8N | EP2C8AF256A7N | EP2C5F256I8N | EP4CE6F256I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-pin FBGA | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same | 256-pin FBGA - same |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 (+79%) | 4,608 | 6,272 (+36%) |
| Embedded Multipliers | 13 (18x18) | 13 | 13 | 13 | 23 (+77%) | 13 | 15 |
| Embedded Memory (bits) | 119,808 | 119,808 | 119,808 | 119,808 | 165,888 | 119,808 | 270,000 (+125%) |
| User I/Os (max) | 158 | 158 | 158 | 158 | 158 | 158 | 179 (+13%) |
| Temperature Grade | Automotive (A7N) | Industrial | Commercial | Automotive (A8N, faster) | Automotive (A7N) | Industrial | Industrial |
| Process / Generation | 90nm Cyclone II | 90nm Cyclone II | 90nm Cyclone II | 90nm Cyclone II | 90nm Cyclone II | 90nm Cyclone II | 60nm Cyclone IV E |
主要差異化特點
- Lowest-density Cyclone II FPGA with AEC-Q100 automotive qualification (對比EP2C5AF256I7N)
- Higher logic density within same package (對比EP2C8AF256A7N)
- Modern process node migration path (對比EP4CE6F256I7N)
設計說明
The 256-pin FBGA package has a 1.0 mm ball pitch, which requires a four-layer PCB minimum with laser-drilled micro vias or 4-mil via-in-pad for proper BGA breakout. Place a thermal via array (0.3 mm drill, 1.0 mm pitch) under the package center to dissipate the ~1.2 W typical core power. Use the Altera FBGA package library symbols in your PCB CAD tool to ensure pad diameters match the recommended 0.5 mm land pattern.
Cyclone II FPGAs require a 1.2V core supply plus separate VCCIO banks for I/O standards (typically 3.3V, 2.5V, 1.8V, or 1.5V). Use a low-noise LDO or DC-DC regulator for VCCINT with at least 10% headroom over the maximum core current. Decoupling: place 0.1 uF and 10 uF capacitors within 100 mil of every VCC pin pair. Power sequencing is not mandatory but VCCINT should not exceed VCCIO by more than 0.7V at any time.
Do not connect the JTAG TCK signal with long traces - this can cause programming failures due to ringing. Keep TCK trace under 2 inches with a 47 ohm series damping resistor at the FPGA end. The MSEL[3..0] pins configure the FPGA's configuration scheme (AS, PS, JTAG) and must be pulled up or down with 1 kohm resistors at boot - incorrect MSEL settings cause configuration failures that look like dead silicon.
Estimated: at 1.2V core, 4,608 LE operating at 50% utilization, and 100 MHz, total power dissipation is approximately 0.5-0.8 W depending on toggle rate. The 256-FBGA theta_JA is approximately 22 C/W with proper thermal vias, yielding a 11-17 C junction temperature rise above ambient. Add airflow or copper pour for sustained high-temperature operation.
合規資訊
AEC-Q100 qualified for automotive applications per the A7 ordering suffix. RoHS and REACH compliant per Intel product page. Lead-free FBGA package.
