EP3C10U256C8 - 10,320-Cell Cyclone III FPGA | Intel
MPN： EP3C10U256C8 ✗ 停產EP3C10U256C8 概覽
A field-programmable gate array is a semiconductor in which the digital logic, memory blocks, and I/O assignments are configured after fabrication. An FPGA belongs to the broader programmable-logic hierarchy, combining parallel programmable logic with fixed or configurable input/output resources. The EP3C10U256C8 therefore provides a compact platform for parallel data processing, control, interface bridging, embedded protocol handling, and general-purpose digital logic.
The principal verified features are 10,320 logic elements, 182 I/O, a 65 nm CMOS process, and a 472.5 MHz frequency figure. The 256-LFBGA package also supports compact board layouts, although its 0.80 mm pitch requires fine-pitch assembly and inspection. The C8 ordering code distinguishes this configuration from other speed, temperature, and package variants, so engineers should confirm the complete ordering information before substituting related MPNs.
The supplied records inconsistently describe the package terminology as LFBGA, PBGA, and UBGA while consistently identifying a 256-pin, 14 x 14 mm device with 0.80 mm pitch. The 182-I/O count describes usable signal assignments rather than the total physical ball count. Exact architecture details, memory capacity, embedded hard IP, supported interfaces, power ratings, and AC timing data were not present in the verified excerpts and are therefore not inferred here.
Typical uses include industrial control, communications infrastructure, test equipment, embedded video, and general embedded processing. The device can be selected when a design needs substantially more parallel logic than a small microcontroller while retaining post-fabrication field programmability. A board-level design must also account for configuration storage, power sequencing, signal conditioning, and programming-chain implementation.
The most important design precaution is to preserve the exact footprint, ball assignment, core voltage, configuration method, and speed-grade requirements. Related Cyclone III devices may share the family and 256-ball format, but a similar bill of materials does not prove that every pin, timing specification, or operating grade is interchangeable.
This page consolidates verified distributor specifications, package details, sourcing links, family alternatives, and engineering-oriented selection guidance. It distinguishes verified values from missing technical fields so procurement and hardware teams can evaluate the EP3C10U256C8 without confusing near-family MPNs with guaranteed drop-in replacements.
直接替換替代品，適用於 EP3C10U256C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C10U256C8 （相同外形與佔位） — 差異在於 Device Type, Process Technology, Logic Elements, Manufacturer, Terminal Form.
EP3C10U256I7
✅ 直接替換聯絡詢價
查看資料表 →EP3C10U256C8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C10U256C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
EP3C10U256C6
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3C10U256I8
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3C10U256C8 最大額定值與電氣特性
| Device Type | Cyclone III embedded field-programmable gate array |
| Logic Elements | 10,320 logic elements |
| Maximum Stated Frequency | 472.5 MHz |
| I/O Count | 182 I/O |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.2 V |
| 封裝 | 256-LFBGA |
| Package Ball Count | 256 balls |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Device Cell Count | 10,320 cells |
| Programmable Logic Type | SRAM-based field-programmable gate array |
| 安裝類型 | Surface mount |
| Product Family | Cyclone III |
| Manufacturer | Intel |
EP3C10U256C8 14 x 14 mm 腳位配置指南
EP3C10U256C8（14 x 14 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C10U256C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C10U256C8 適用於 6 應用s: Industrial Control Logic, Communications Interface Consolidation, Test and Measurement Equipment, Embedded Video Processing, Security and Surveillance, Programmable Logic Consolidation.
Industrial Control Logic
The EP3C10U256C8 is suitable for industrial control systems that need programmable parallel logic close to sensors, actuators, and safety-related decision paths. Its 10,320 logic elements can accommodate control, sequencing, protocol handling, and data-conditioning functions, while 182 I/O provide substantial board-level connectivity. A typical implementation would configure the Cyclone III device for deterministic state machines, interlocks, status decoding, and communication bridging. The main design trade-off is that an FPGA requires a verified configuration path and careful timing closure. Designers should confirm the exact C8 operating grade, supported I/O standards, and board-level power requirements because those details were not included in the supplied excerpts.
推薦
Communications Interface Consolidation
The EP3C10U256C8 can consolidate multiple communications and packet-formatting functions in a compact logic implementation. Its 10,320 logic elements are suitable for parallel-to-serial conversion, framing, filtering, buffering, and interface adaptation, while 182 I/O offer flexible connections to transceivers and supporting controllers. Placing these functions inside the FPGA can reduce the number of discrete bridging devices and simplify board partitioning. Engineers must verify every transceiver's voltage, timing, and protocol requirements against the Intel device documentation. Configuration storage, clocking, and I/O standards also require dedicated design attention before the Cyclone III device is treated as a complete communications solution.
推薦
Test and Measurement Equipment
The EP3C10U256C8 can implement timing, acquisition, trigger, and instrument-control logic for test and measurement equipment. Its 10,320 programmable logic elements allow multiple digital functions to share one FPGA, while the 182 available I/O support connections to converters, memory, front-panel controls, and communication interfaces. A practical design can divide the fabric among acquisition control, trigger logic, data formatting, and status reporting. The device's 472.5 MHz stated frequency provides a useful timing-class reference, but actual system bandwidth depends on the selected speed grade, pin assignment, I/O standard, and external memory or converter performance. Quartus timing analysis and board-level signal-integrity validation remain essential.
推薦
Embedded Video Processing
The EP3C10U256C8 is applicable to embedded video systems that require deterministic pixel timing, interface adaptation, and parallel processing. Its programmable architecture can support video timing generation, format conversion, overlay control, and synchronization among image sensors, memory, and display controllers. The 182 I/O provide a broad connection surface for pixel data and control signals, while the 256-LFBGA package keeps the device compact. The finite 10,320 logic-element budget is the principal limitation, so resource utilization must be estimated before committing to complex image pipelines. Exact supported I/O standards, memory-interface capabilities, and achievable video performance must be confirmed in the Intel architecture and device documentation.
推薦
Security and Surveillance
The EP3C10U256C8 can support programmable preprocessing, event detection, and interface logic in surveillance and security equipment. The 10,320 logic elements are appropriate for combining sensor data conditioning, motion-detection assistance, frame metadata handling, and network-interface adaptation. Its 182 I/O allow integration with image or motion sensors, local memory, alarm outputs, and network transceivers. FPGA implementation is useful when deterministic latency or parallel throughput matters more than the simplicity of a microcontroller-based design. However, privacy, security update procedures, and configuration protection must be addressed explicitly. The available records do not identify dedicated security blocks or cryptographic accelerators, so designers should not assume hardware cryptographic services exist.
推薦
Programmable Logic Consolidation
The EP3C10U256C8 is useful when a design needs to replace several fixed-function logic devices with one configurable FPGA. Ten thousand logic elements provide room for glue logic, decoding, arbitration, state machines, and data-format conversion, while 182 I/O reduce the need for external logic packages. Consolidation can simplify board partitioning and allow firmware-selectable behavior, but it introduces configuration management and tool-flow requirements. Engineers should compare the FPGA's resource cost, pin constraints, timing margin, and software update complexity against several smaller fixed-function devices. The supplied records do not list the number of embedded memory bits or dedicated multipliers, so those capacity checks must be completed using the Intel Quartus compilation results.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C10U256C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C10U256I7 | EP3C10U256C8N | EP3C10U256C7 | EP3C10U256C6 | EP3C10U256I8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA |
| Logic Elements | 10,320 logic elements | 10,320 logic elements | 10,320 logic elements | 10,320 logic elements | 10,320 logic elements | 10,320 logic elements |
| I/O Count | 182 I/O | 182 I/O | 182 I/O | 182 I/O | 182 I/O | 182 I/O |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Package Dimensions | 14 x 14 mm, 0.80 mm pitch | 14 x 14 mm, 0.80 mm pitch | 14 x 14 mm, 0.80 mm pitch | 14 x 14 mm, 0.80 mm pitch | 14 x 14 mm, 0.80 mm pitch | 14 x 14 mm, 0.80 mm pitch |
| Ordering Grade | C8 | I7 | C8N | C7 | C6 | I8 |
主要差異化特點
- Exact 10,320-logic-element resource baseline (對比EP3C10U256C6)
- 182 user I/O in a compact 14 x 14 mm package (對比EP3C10U256I7)
- Documented 472.5 MHz stated frequency (對比EP3C10U256C8N)
設計說明
Use the Intel-verified 256-ball land pattern rather than generating one solely from the 14 x 14 mm body size and 0.80 mm pitch. The verified records describe the package as LFBGA, PBGA, and UBGA, so naming conventions differ across suppliers. Check all signal balls, power and ground balls, configuration pins, and exposed-thermal requirements against the selected device revision before releasing Gerber files. Also confirm the assembly process supports the 0.80 mm ball pitch and inspect the finished board for bridging or open joints.
The verified core supply is 1.2 V, but that value does not define total board power. Power depends on logic utilization, switching activity, I/O loading, speed grade, and external I/O standards. Follow the Intel power-estimation workflow with actual Quartus activity assumptions, then design the regulator and supply paths for the resulting current rather than using logic-cell count as a proxy. Include startup current, configuration behavior, and the tolerance required by the selected C8 grade in the worst-case analysis.
Assign I/O standards and external interface timing from the actual board schematic, not from the available I/O count of 182. Account for trace length, impedance, loading, connector or transceiver requirements, and clock jitter. For buses operating above the conservative device edge rate, use the Quartus timing analyzer and board-level signal-integrity models. Because the supplied excerpts do not list individual I/O standards or speed-grade timing tables, each critical interface must be validated against the complete Intel datasheet.
Do not treat every EP3C10U256 ordering suffix as an automatic drop-in replacement. EP3C10U256I7 and EP3C10U256C8N are explicitly identified in the web results, while the C7, C6, and I8 entries are same-family LLM-derived candidates. Verify the ordering guide for speed grade, temperature range, lead finish, and any other suffix fields. Also check configuration method and pin compatibility because the verified excerpts do not contain the complete 256-ball pinout.
合規資訊
The supplied excerpts do not contain verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. AEC-Q100 is marked not applicable because this is an FPGA rather than an automotive-qualified component.
