EP4CGX30CF23C6N - Cyclone IV GX FPGA 29K LE 484-FBGA | Intel
MPN： EP4CGX30CF23C6N ✓ 啟用中EP4CGX30CF23C6N 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and routing interconnects after manufacturing. In the broader system hierarchy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, which execute sequential firmware, FPGAs implement true hardware parallelism. The Cyclone IV family specifically targets low-power, high-volume applications and is the successor to Cyclone III, with the GX variant adding integrated transceivers for serial protocols.
Key features of the EP4CGX30CF23C6N include 29,440 logic elements arranged in 1,840 logic array blocks (LABs), 66 embedded 18x18 multipliers for DSP operations, 4 general-purpose PLLs, and 8 global clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with on-chip termination, and operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage interfacing. The transceiver blocks support PCIe Gen1, Gigabit Ethernet, CPRI, and Serial RapidIO protocols.
Typical applications include industrial control and motor drives, video processing and display controllers, telecommunications line cards, PCIe endpoint designs, and low-cost ASIC prototyping. The combination of integrated transceivers and low static power consumption (approximately 300 mW typical) makes the EP4CGX30CF23C6N especially attractive for portable or thermally constrained systems.
When designing with this device, use Intel Quartus II (or the newer Quartus Prime Lite edition) for synthesis, place-and-route, and bitstream generation. Pay close attention to power-rail sequencing and decoupling; the FBGA package demands a multi-layer PCB with buried vias for clean transceiver performance.
This page synthesizes distributor pricing, parametric alternatives in the same Cyclone IV GX family, and practical design notes not found in the standalone manufacturer datasheet.
直接替換替代品，適用於 EP4CGX30CF23C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX30CF23C6N （相同外形與佔位） — 差異在於 Speed Grade, Operating Temperature, Package, Transceivers, Embedded Memory.
EP4CGX30CF23C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF23C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF23I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF23C6
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF19C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30BF14C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX30CF23C6N 最大額定值與電氣特性
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Logic Array Blocks (LABs) | 1,840 |
| Embedded Memory Bits | 1,105,920 |
| Embedded 18x18 Multipliers | 66 |
| User I/O Pins | 290 |
| Transceiver Data Rate | up to 3.125 Gbps |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 8 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| 封裝 | 484-FBGA (F23) |
| 工作溫度 | 0C to +85C (commercial) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Speed Grade | 6 (medium-speed) |
EP4CGX30CF23C6N 484-fbga (f23) 腳位配置指南
EP4CGX30CF23C6N（484-fbga (f23) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CGX30CF23C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CGX30CF23C6N 適用於 6 應用s: Industrial Motor Control, Video Processing and Display Controllers, PCIe Endpoint Cards, Telecommunications Line Cards, Low-Cost ASIC Prototyping, Portable Test and Measurement Instruments.
Industrial Motor Control
The EP4CGX30CF23C6N suits industrial motor control applications where its 66 embedded 18x18 multipliers handle field-oriented control (FOC) and space-vector PWM computation in parallel hardware, achieving sub-microsecond loop times impossible with software-only microcontrollers. The 290 user I/O pins connect directly to multi-axis encoder interfaces (QEP, SSI, BiSS), gate-driver PWM outputs, and isolation barriers. The integrated 3.125 Gbps transceivers carry EtherCAT, PROFIBUS, or SERCOS III industrial Ethernet to the master controller. Operating at approximately 300 mW typical static power, the device enables compact sealed-drive enclosures without active cooling, and the commercial temperature grade (0C to +85C) is sufficient for indoor cabinet installations.
推薦
Video Processing and Display Controllers
The EP4CGX30CF23C6N handles real-time video pipeline processing including color-space conversion, scaling, de-interlacing, and on-screen display (OSD) overlay for industrial HMIs, medical imaging displays, and digital signage. Its 1,105,920 bits of embedded memory buffer multiple video lines and serve as frame buffers for low-latency processing, while the 66 multipliers implement FIR filters and chroma resampling in a single clock cycle. LVDS I/O support drives direct connections to flat-panel displays without external serializer chips. The 60 nm low-power process keeps thermal dissipation low enough for fanless sealed enclosures common in medical and kiosk applications.
推薦
PCIe Endpoint Cards
The EP4CGX30CF23C6N integrates hardened PCI Express Gen1 (2.5 Gbps) IP blocks in the transceiver channels, enabling compact PCIe endpoint cards for data acquisition, software-defined radio (SDR), and protocol analysis without external PHY chips. With 29,440 logic elements, designers implement DMA engines, MSI-X interrupt logic, and application-specific data-path functions while leaving margin for future feature expansion. The 484-FBGA package provides ample I/O for parallel sensor interfaces (LVDS, parallel ADC/DAC buses). Quartus II PCIe hard-IP wizard generates the complete PCIe stack, including transaction layer, link training, and enumeration support.
推薦
Telecommunications Line Cards
Telecommunications line-card applications benefit from the EP4CGX30CF23C6N's combination of serial connectivity and DSP resources. The 3.125 Gbps transceivers carry CPRI, OBSAI, or Serial RapidIO links to baseband processors and adjacent line cards, while the 66 embedded 18x18 multipliers implement channel filtering, equalization, and FEC encoding/decoding functions. The 1.1 Mbit of embedded memory serves as packet buffers and coefficient storage for adaptive filters. Industrial temperature variants are available for outdoor cell-site deployments.
推薦
Low-Cost ASIC Prototyping
The EP4CGX30CF23C6N provides 29,440 logic elements for prototyping mid-complexity ASIC designs before committing to mask costs. Quartus II's broad IP library (memory controllers, processor cores, peripheral interfaces) enables quick architectural validation, and the integrated transceivers allow prototyping of high-speed serial interfaces that match the target ASIC's SerDes. Engineers can re-use the same RTL across Cyclone IV and the target ASIC, reducing verification effort. Multiple EP4CGX30 devices can be chained via transceivers to prototype larger ASICs than a single device holds.
推薦
Portable Test and Measurement Instruments
The EP4CGX30CF23C6N is well suited for portable bench-top test and measurement instruments such as logic analyzers, protocol analyzers, and LCR meters where its 290 user I/O pins connect directly to high-speed probe channels. The device performs real-time signal conditioning, triggering, and data compression in parallel hardware, freeing any companion processor for display and user-interface functions. The 60 nm process keeps typical power consumption around 300 mW, enabling battery-powered designs with several hours of runtime. Quartus II signal-tap logic analyzer provides real-time internal-signal visibility for debug.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CGX30CF23C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX30CF23C7N | EP4CGX30CF23C8N | EP4CGX30CF23I7N | EP4CGX30CF23C6 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Speed Grade | 6 (medium) | 7 (slow) | 8 (fastest) | 7 (slow) | 6 (medium) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| User I/O Pins | 290 | 290 | 290 | 290 | 290 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| Approx. Unit Price (qty 1) | $142.97 | Lower (slower speed grade typically cheaper) | Higher (fastest speed grade typically more expensive) | Higher (industrial temperature premium) | Similar (tray vs tray) |
主要差異化特點
- Cost-optimized Cyclone IV GX density with integrated 3.125 Gbps transceivers (對比EP4CGX30BF14C6N)
- Largest 484-ball FBGA package with maximum user I/O exposure (對比EP4CGX30CF19C6N)
- Optimal balance of speed grade, cost, and timing margin (對比EP4CGX30CF23C8N)
- Comprehensive Quartus II and Quartus Prime tool support including legacy compatibility (對比Cross-vendor FPGAs (Xilinx, Lattice))
設計說明
The EP4CGX30CF23C6N requires a minimum of three power rails: VCCINT (1.2 V core), VCCIO (1.2 V-3.3 V I/O banks, bank-dependent), and VCCA (2.5 V PLL analog supply). A separate VCCD_PLL (1.2 V) is recommended for digital PLL supplies. Power-rail sequencing must follow Intel's recommended sequence (VCCINT before VCCIO) to prevent latch-up; failure to sequence correctly can cause permanent device damage. Use a dedicated power-supply supervisor or FPGA power sequencer IC to enforce the correct order.
The 484-ball FBGA (F23) package uses a 1.0 mm ball pitch with a 19x19 ball array (one depopulated corner for orientation). PCB design requires microvia (HDI) technology with at least 4-6 layers for clean signal integrity, especially for the 3.125 Gbps transceiver channels. Use buried and blind vias to break out the dense BGA; through-via stubs longer than 0.3 mm on transceiver traces degrade signal integrity at 3 Gbps. Target 50 ohm single-ended (100 ohm differential) impedance for transceiver lanes with 4 mil trace widths and 8 mil spacing on a typical 4-mil-dielectric stackup.
Estimated: At typical utilization (50% LE, 50% memory, 4 transceivers active), the EP4CGX30CF23C6N dissipates approximately 1-2 W. The 484-FBGA package's theta_JA of approximately 15 C/W (with 4-layer JEDEC test board) yields a junction-temperature rise of 15-30 C above ambient, which is acceptable for the commercial 0C-85C temperature grade without active cooling. For extended industrial-temperature operation or full transceiver utilization, attach a small thermal pad or copper-pour heatsink to the top of the package and ensure adequate airflow.
Three common design pitfalls: (1) The configuration mode (AS, PS, JTAG, or Fast Passive Parallel) must be selected via MSEL pins and is not software-configurable; populate the correct pull-up/pull-down resistors on MSEL[3:0] at board level. (2) The JTAG pins (TDI, TDO, TMS, TCK) must be terminated to VCCIO with 10 kohm pull-ups; floating JTAG pins prevent successful programming. (3) Unused transceiver channels must be powered down in software AND have their differential pairs AC-terminated with 100 ohm resistors to prevent reflections during power-up/down sequencing.
合規資訊
RoHS and lead-free compliant per manufacturer product page. Not AEC-Q100 qualified (use industrial-temperature EP4CGX30CF23I7N for automotive-adjacent designs, or migrate to Cyclone V family for full AEC-Q100). Halogen-free status not explicitly confirmed in provided data.
