EPF10K100EFC484-1N - 100K FLEX 10KE FPGA, 338 I/O, 484-BGA | Intel
MPN： EPF10K100EFC484-1N ✗ 停產EPF10K100EFC484-1N 概覽
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers and DSPs as reconfigurable computing fabrics. The FLEX 10KE family introduced embedded array blocks (EABs) for on-chip RAM/ROM, true dual-port RAM, and embedded multipliers, pioneering the System-on-a-Programmable-Chip (SOPC) concept that integrates memory and logic in one device.
Key features include high-bandwidth embedded memory with true dual-port operation, multi-volt I/O supporting 2.5 V/3.3 V/5.0 V LVTTL/LVCMOS interfaces, JTAG-compliant IEEE 1149.1 boundary-scan testing, and built-in PCI compliance. The 484-ball FineLine BGA footprint offers the same pin-out as other FLEX 10K/10KE devices in the 484-FBGA package, enabling SameFrame pin migration within the family for design reuse and risk reduction.
Architecturally, the EPF10K100EFC484-1N combines a symmetrical logic array with row-and-column interconnect, dedicated EABs for wide memory functions, and embedded multipliers that accelerate DSP operations. The SRAM-based configuration memory supports in-system reprogrammability via JTAG or dedicated configuration pins, allowing field upgrades without removing the device from the board.
Typical applications include high-speed digital glue logic in telecommunications backplanes, PCI bridge designs, video processing pipelines, industrial control systems, and prototype ASIC emulation. The 100K-gate density is well matched to multi-channel glue logic, custom bus interfaces, and pre-silicon ASIC verification platforms.
Designers should pay close attention to the multi-voltage I/O configuration: 5 V-tolerant inputs require proper VCCIO selection, and decoupling must follow Altera's reference decoupling scheme with bulk and high-frequency ceramics placed within 0.25 inch of every supply pin. Configuration mode and clock pins must be tied per the FLEX 10KE handbook, and unused I/O should be configured as outputs driving ground to minimize switching noise.
This page synthesizes distributor pricing from Mouser and DigiKey, drop-in same-family alternatives that share the 484-FBGA footprint, and practical design guidance not duplicated in the original Altera datasheet — aiding engineers seeking FLEX 10KE replacement or migration paths in legacy systems.
直接替換替代品，適用於 EPF10K100EFC484-1N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K100EFC484-1N （相同外形與佔位） — 差異在於 Package, Speed Grade, Mounting Type, Operating Temperature, Process Technology.
EPF10K100EFC484-1
✅ 直接替換✗ 缺貨
$142 / 單位
查看資料表 →EPF10K100EFC484-2X
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100AFC484-2N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EFC484-1N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100ARC240-2
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EFC484-1N 最大額定值與電氣特性
| Manufacturer | Intel (formerly Altera) |
| Series | FLEX 10KE |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements / Cells | 4,992 |
| Equivalent Gates | 100,000 |
| Embedded Memory Bits | 49,152 bits |
| Number of LABs | 624 |
| Number of Logic Elements | 4,992 |
| User I/Os | 338 |
| 腳位數 | 356 (BGA-356 per one source) / 484 (BGA-484 per other sources) |
| 封裝 | 484-BBGA (FineLine BGA) |
| 安裝類型 | Surface Mount |
| Logic Family | CMOS |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (5 V-tolerant inputs via VCCIO) |
| Propagation Delay (worst case) | 0.6 ns |
| 工作溫度 | 0 °C to 70 °C (commercial) |
| Configuration | SRAM-based, in-system reprogrammable |
| JTAG / IEEE 1149.1 | Yes |
| RoHS 狀態 | compliant (lead-free FBGA) |
| 生命週期狀態 | Obsolete (NRND per Intel/Altera PCN history) |
EPF10K100EFC484-1N 0.6 ns 腳位配置指南
EPF10K100EFC484-1N（0.6 ns 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K100EFC484-1N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K100EFC484-1N 適用於 6 應用s: Telecommunications Backplane Glue Logic, PCI Bridge and Interface Design, Pre-Silicon ASIC Emulation, Industrial Control Systems, Video and Image Processing Pipelines, Custom Bus Interfaces and Protocol Conversion.
Telecommunications Backplane Glue Logic
The EPF10K100EFC484-1N fits telecom backplane glue logic because its 4,992 logic elements and 624 LABs provide the right density for bridging, address decoding, and protocol conversion between legacy parallel buses and modern serial links. The 338 user I/Os in the 484-FBGA package are sufficient for multi-channel bus interfaces and LVCMOS/LVTTL signaling at 3.3 V, while embedded EABs (49,152 bits) implement FIFO buffers and lookup tables for protocol translation. SRAM-based reconfigurability lets carriers update glue logic in the field without board rework, a critical advantage for long-lifecycle central-office equipment. According to the FLEX 10KE datasheet, the -1 speed grade delivers ≤0.6 ns propagation delay, sufficient for 66 MHz PCI and 100 MHz synchronous bus glue. Engineers building legacy SONET/SDH or ATM interfaces still rely on FLEX 10KE parts for their deterministic timing and rich I/O count.
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PCI Bridge and Interface Design
The EPF10K100EFC484-1N was historically used as a PCI bridge between microprocessors and peripherals because the FLEX 10KE family is built with PCI-compliant I/Os and provides enough logic density for full 32-bit/33 MHz target or master implementations. With 4,992 LEs the device easily absorbs a 32-bit PCI target state machine, FIFOs, and configuration space registers, while the embedded memory blocks (EABs) implement deep FIFOs for bus mastering. According to Altera application notes, the FLEX 10KE -1 speed grade comfortably meets the 33 MHz PCI 2.2 timing budget. The 338 available user I/Os are sufficient to leave room for multiple PCI segments, side-band signals, and GPIO. Designers maintaining legacy PCI/PCI-X systems still source this part through authorized aftermarket stockists because the bitstream and toolchain are well understood.
推薦
Pre-Silicon ASIC Emulation
Pre-silicon ASIC emulation remains a strong use case for the EPF10K100EFC484-1N. ASIC verification engineers partition an ASIC design into multiple FLEX 10KE devices and prototype behavior before tape-out, because the 100K-gate density and 4,992 LEs are sufficient to model many ASIC blocks (control logic, state machines, datapath glue). The 624 LABs and rich routing fabric enable predictable timing closure, while the SRAM-based configuration allows rapid design iteration via JTAG. According to Altera's design examples, the 484-FBGA package supports multi-FPGA emulation boards with shared clocks and JTAG chains. The 338 user I/Os expose enough pins for inter-FPGA interconnect, making the -1N well-suited to ASIC prototyping platforms still in service today.
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Industrial Control Systems
The EPF10K100EFC484-1N supports legacy industrial control designs where deterministic logic and high I/O count outweigh the need for a modern processor. With 338 user I/Os, the device can interface with many sensors, encoders, and actuators simultaneously, while embedded EABs hold lookup tables for PWM and PID parameters. The commercial 0 °C to 70 °C operating range covers most factory-floor enclosures. Industrial control customers often select the FLEX 10KE family because the FLEX 10KE Handbook provides well-documented reference designs for encoder quadrature decoding, motor control state machines, and CAN/LIN bus bridges. For applications requiring the industrial temperature range (-40 °C to +85 °C), engineers should migrate to the EPF10K100EFC484-2X variant with the "X" industrial suffix.
推薦
Video and Image Processing Pipelines
Mid-density video pipelines benefit from the EPF10K100EFC484-1N's combination of EAB-based line buffers, 338 user I/Os for parallel video data paths, and SRAM reconfigurability. Designers implement horizontal and vertical scalers, color-space converters, and on-screen display compositors using the embedded multipliers and EAB-based FIFOs. According to Altera application notes, the FLEX 10KE EABs implement dual-port line buffers efficiently for SDTV and early HDTV designs. While not a Cyclone V or Stratix, the FLEX 10KE 100K-gate tier is fully sufficient for SD-SDI/SDI preprocessing, video routing, and overlay blocks in broadcast equipment still in service. The 484-FBGA footprint supports the high pin count needed for 16/18/24-bit RGB and ITU-R BT.656 interfaces side by side.
推薦
Custom Bus Interfaces and Protocol Conversion
The EPF10K100EFC484-1N excels at custom bus interface and protocol conversion tasks where the design does not justify an ASIC but exceeds the capacity of a CPLD. With 4,992 LEs and 338 I/Os, the device implements master/target interfaces on VME, VXI, ISA, PC/104, and proprietary backplanes with deterministic timing. The EABs implement address-mapping CAMs and FIFO buffers required for bridging asynchronous clock domains. According to distributor parametric data on DigiKey, the part is rated for 624 LABs, providing enough routing headroom for clean timing closure on 32-bit parallel buses at 50 MHz. Engineers maintaining test-and-measurement equipment, legacy data-acquisition systems, and industrial instrumentation continue to source this part because its Quartus II design flow and mature IP library are well documented.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K100EFC484-1N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K100EFC484-1 | EPF10K100EFC484-2X | EPF10K100AFC484-2N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-FBGA (FineLine BGA) | 484-FBGA — same | 484-FBGA — same | 484-FBGA — same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 |
| Embedded Memory (EAB bits) | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 338 | 338 | 338 | 338 |
| Speed Grade | -1 | -1 | -2 (faster) | -2 (faster) |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 °C to 70 °C | -40 °C to +85 °C (industrial, X suffix) | 0 °C to 70 °C |
| Lead-Free / RoHS | Yes (N suffix, lead-free) | Standard lead finish | Yes (lead-free, X suffix) | Yes (N suffix, lead-free) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
主要差異化特點
- SameFrame pin migration within FLEX 10KE 484-FBGA family (對比EPF10K100EFC484-1)
- Speed grade flexibility within the same 484-FBGA footprint (對比EPF10K100EFC484-2X)
- Mature Quartus II toolchain with verified IP library (對比EPF10K100AFC484-2N)
設計說明
Estimated: at typical utilization (60% LEs, 50% EABs, 50% I/O toggling at 33 MHz), ICCINT is approximately 250–400 mA at 2.5 V and ICCIO is up to 200 mA per bank at 3.3 V. Provide at least one 100 µF bulk + one 0.1 µF high-frequency ceramic per supply pin within 0.25 inch, per Altera's reference decoupling scheme. The 484-FBGA package has many GND balls; flood inner PCB layers with a ground plane for thermal dissipation. For multi-bank I/O designs, isolate analog/digital VCCIO rails with ferrite beads to minimize switching-noise coupling into clocked logic.
The 484-FBGA FineLine BGA package is 1.00 mm pitch. Per IPC-7351 / Altera FLEX 10KE layout guidelines, use microvia or laser-drilled stacked-via technology for inner-row fan-out; conventional 8-mil drilled through-vias are not feasible between balls at this pitch. Match trace lengths within ±150 mil for global clocks, and route all configuration pins (MSEL[0:3], nCONFIG, nSTATUS, CONF_DONE, DCLK) with controlled impedance to a configuration PROM such as the EPC2LC20. Add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on nCE to prevent spurious configuration events.
Common pitfalls include: (1) driving 5 V signals into the EPF10K100EFC484-1N's I/O without configuring the bank as 3.3 V with 5 V-tolerant LVTTL input — datasheet specifies a 4.1 V absolute-max on inputs; (2) leaving unused I/O floating — these should be configured as outputs driving ground per Quartus II default; (3) failing to power VCCINT before VCCIO during power-up — this can latch-up and damage the device, so use a supply sequencer if the rails come up in the wrong order; (4) loading the wrong configuration bitstream from EPC2 — always verify the .pof file with the Quartus II programmer before committing it to the PROM.
Estimated: the 484-FBGA junction-to-ambient thermal resistance θJA is approximately 18 °C/W with adequate forced airflow (200 LFM) on a JEDEC JESD51-9 test board. Without airflow, θJA can rise above 28 °C/W. At maximum toggling (worst-case dynamic power ~1.5 W), the junction temperature rise is roughly 27 °C above ambient — well within the 0–70 °C commercial limit. For hot enclosures (industrial temperature X variants), size a heatsink or specify 200 LFM of forced air. Always cross-check actual dissipation with the Quartus II PowerPlay analyzer against your design's toggle rate and utilization.
合規資訊
RoHS compliance inferred from "N" lead-free terminal finish per Altera ordering convention. REACH and halogen-free status not explicitly stated in distributor listings.