GX36220-F-DNT - 2x64Gbps Linear TIA | Renesas Electronics
MPN： GX36220-F-DNT ✓ 啟用中GX36220-F-DNT 概覽
A transimpedance amplifier (TIA) is an analog amplifier that converts a current input, typically from a photodiode, into a voltage output with gain expressed in ohms (V/A). In the optical-module hierarchy, the TIA sits directly behind the photodetector (PD) in the receive path, feeding a limiting amplifier or linear equalizer, then a clock-and-data-recovery (CDR) unit - forming the optical receiver signal chain of a power management and signal-conditioning sub-system. Linear TIAs such as this device preserve waveform amplitude information, which is required for PAM4 reception and DSP-based equalization in high-speed links.
The GX36220 integrates two independent TIA channels on one die, enabling compact dual-lane optical subassemblies such as OSFP, QSFP-DD, and CDFP-based 100-400 Gbps module implementations. The linear output architecture supports both NRZ and multi-level PAM4 signaling, allowing the downstream DSP or CDR to perform the slicing decision.
Being supplied as a bare die (Telecom IC Amplifier Die per DigiKey classification), the device is intended for direct die-attach into optoelectronic packages, typically co-packaged with photodiodes in TO-can or butterfly subassemblies by module manufacturers. It is not a board-level packaged component; die-level handling, bond-pad design, and assembly require appropriate cleanroom and wire-bond capability.
Typical applications include 400G/800G data-center optical transceiver receive paths, telecom coherent receiver front ends, active optical cables, and test instrumentation optical front ends where dual-channel density and 64 Gbps-per-lane linearity are required.
Design consideration: because this is a die product, electrical performance is strongly dependent on bond-wire inductance, photodiode capacitance, and bias network layout; consult the Renesas datasheet for reference bond-out configurations before finalizing the subassembly.
This page synthesizes distributor pricing, lifecycle, and sourcing data for the GX36220-F-DNT that is otherwise fragmented across multiple distributor listings.
直接替換替代品，適用於 GX36220-F-DNT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： GX36220-F-DNT （相同外形與佔位） — 差異在於 Package, Number of Channels, Aggregate Data Rate, Data Rate per Channel, Mounting Type.
GX36220-DNT
✅ 直接替換聯絡詢價
查看資料表 →GX36220-F-DNT 最大額定值與電氣特性
| 功能 | Linear Transimpedance Amplifier (TIA) |
| Number of Channels | 2 |
| Data Rate per Channel | 64 Gbps |
| 輸出類型 | Linear (supports PAM4/NRZ) |
| Application Segment | Telecom / Optical Communications |
| 封裝 | Die (DNT) |
| 安裝類型 | Surface Mount (die attach) |
| Packaging Type | Tray (per distributor listing) |
GX36220-F-DNT die (dnt) 腳位配置指南
GX36220-F-DNT（die (dnt) 封裝）的腳位配置。 此類比元件具有輸入、輸出與電源腳位。偏移歸零、補償與致能腳位配置請參閱製造商資料表。適用於訊號調理與放大器電路。
無詳細腳位定義資料： GX36220-F-DNT.
請參閱 資料表 以查看完整腳位配置。
典型應用
GX36220-F-DNT 適用於 6 應用s: 400G/800G Data Center Optical Transceivers, PAM4 Optical Receive Signal Chain, Telecom Coherent Receiver Front Ends, Active Optical Cables (AOC), Test and Measurement Optical Front Ends, On-Board Optics (OBO) and Co-Packaged Optics.
400G/800G Data Center Optical Transceivers
In 400G and 800G pluggable modules (OSFP, QSFP-DD, CDFP), each receive lane requires a TIA that converts photodiode current into a linear voltage for the downstream DSP. The GX36220-F-DNT provides two 64 Gbps linear channels on a single die, allowing one die to serve two lanes or two dies to serve a 4-lane electrical interface with reduced component count. Its linear transfer characteristic preserves PAM4 level spacing, which is mandatory because PAM4 eyes have one-third the amplitude of NRZ at the same baud rate. Die-level integration lets module makers co-attach the TIA close to the photodiode, minimizing input node inductance and preserving bandwidth at 64 Gbps.
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PAM4 Optical Receive Signal Chain
PAM4 reception demands linear TIAs rather than limiting TIAs because the DSP must perform symbol slicing on preserved amplitude information. The GX36220-F-DNT's linear architecture delivers the PD current-to-voltage conversion with fidelity sufficient for downstream CTLE/FFE equalization at 64 Gbps per lane (26 GBaud-class PAM4 at 53 GBaud requires linear front ends). In this chain the die sits between the photodiode and the linear equalizer or ADC-based CDR. The trade-off versus a limiting TIA is reduced inherent sensitivity margin, so photodiode responsivity and TIA noise must be budgeted in the optical link calculation.
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Telecom Coherent Receiver Front Ends
Coherent optical receivers in long-haul and metro telecom systems use balanced photodiode pairs feeding linear TIAs before the DSP-based coherent signal processor. The GX36220-F-DNT's telecom classification and 64 Gbps-per-channel linear architecture suit high-baud coherent subassemblies where linear conversion of the photocurrent is essential for digital carrier and polarization recovery. As a bare die it can be integrated directly into butterfly-type coherent receiver packages alongside the hybrid photodetector. Designers should budget TIA gain and bandwidth against the transimpedance-phase requirements of the DSP's equalizer training algorithms.
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Active Optical Cables (AOC)
Active optical cables embed compact optical subassemblies at each cable end, where board space and power are constrained. The GX36220-F-DNT's dual-channel integration halves the TIA die count versus single-channel solutions, shrinking the receive-side footprint inside the AOC connector head. Its 64 Gbps per channel capability supports 100-200 Gbps-per-endpoint AOCs built on PAM4 signaling. Because AOCs are consumer-priced products, the TIA's die-level cost must be amortized across lanes; using a dual-channel die improves cost per lane versus two single-channel parts, though assembly yield depends on die-attach process control.
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Test and Measurement Optical Front Ends
Bit-error-rate testers, sampling oscilloscope optical heads, and optical spectrum instrumentation require TIAs with high bandwidth and linear response to faithfully reproduce optical waveforms. The GX36220-F-DNT's 64 Gbps linear channels make it a candidate for the optical-to-electrical conversion stage in next-generation test heads targeting PAM4 signal analysis. The linear output allows the instrument ADC to capture eye diagrams without amplitude clipping. In instrument designs, the die is typically mounted in a controlled-impedance hybrid on a thermoelectrically controlled submount to stabilize gain over temperature.
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On-Board Optics (OBO) and Co-Packaged Optics
On-board and co-packaged optics move the optical engine from the faceplate onto the switch board or ASIC package, where bare-die components are preferred over packaged parts to minimize height and electrical path length. The GX36220-F-DNT, supplied as a die, integrates directly into these optical engines with wire bonds to the photodiode array. Two 64 Gbps linear channels per die align with lane counts of OBO engines targeting 400-800 Gbps per engine. The key design consideration is thermal coupling between the TIA die and adjacent DSP or laser dies on the shared submount.
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工程參考資料，適用於 GX36220-F-DNT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | GX36220-DNT |
|---|---|---|
| Package | Die (DNT) | Die (DNT) - same die form |
| Brand | Renesas Electronics | Renesas Electronics |
| Channels | 2 | 2 |
| Data Rate per Channel | 64 Gbps | 64 Gbps |
| Output Type | Linear (PAM4-capable) | Linear |
| Application | Telecom / Optical | Telecom |
主要差異化特點
- Dual-channel integration (2 x 64 Gbps on one die) (對比GX36220-DNT (single-family counterpart marketed for the base configuration))
- Linear output topology for PAM4 (對比Limiting TIAs in the same bandwidth class)
- Bare-die delivery format (對比Packaged TIA alternatives)
設計說明
As a bare-die TIA, the GX36220-F-DNT's input bandwidth is dominated by the photodiode junction capacitance plus bond-wire inductance. Keep the PD-to-TIA input bond as short as possible (ideally under 0.5 mm), use twin or ribbon bonds to reduce inductance, and reference the input return path to a solid ground on the submount. Simulate the PD capacitance with the bond model in an RF simulator before locking the pad assignment; a 100 fH-level change in bond geometry at 64 Gbps visibly shifts the input pole.
Bare die lacks the ESD protection structures of a packaged part. All handling, bond, and test operations must occur at class-1000 or better cleanliness with rated wrist straps and ionized airflow; a single ESD event below visible damage thresholds can degrade TIA input noise. Also note that die specs (gain, noise, supply) are in the Renesas die document, which is typically NDA-gated - do not finalize a subassembly design from distributor summaries alone.
Estimated: die-level TIAs dissipate power concentrated in a very small silicon area; even a modest total dissipation can produce high local flux density. Provide a die-attach with low thermal resistance (AuSn eutectic or silver epoxy per Renesas assembly notes) onto a metallized ceramic submount or copper tungsten carrier, and verify junction temperature against the datasheet maximum using the die thermal resistance given by Renesas for your attach method.
合規資訊
Compliance data for this die product was not present in the verified web data; die-form telecom components are typically exempt from some surface-mount compliance declarations - confirm with Renesas.
