M2GL050-FGG484 - 56K LE IGLOO2 FPGA | Microchip Technology
MPN： M2GL050-FGG484 ✗ 停產M2GL050-FGG484 概覽
A field-programmable gate array is a programmable digital semiconductor used to implement control logic, interface conversion, data acquisition, communications, and system-management functions. The M2GL050 belongs to the IGLOO2 low-density FPGA family and is designed for applications requiring flexible hardware configuration, moderate logic capacity, and numerous external I/O. Its 484-ball package supports dense PCB routing without requiring a leaded component.
Key device characteristics include 56K logic elements, 56,340 FPGA cells, 267 I/O, a 1.2 V core supply, and a 484-pin FBGA configuration. The 267 available I/O make the device suitable for bridging functions, I/O expansion and conversion, secure connectivity, and general-purpose embedded control. The IGLOO2 family also targets communications, industrial, medical, defense, and aviation equipment.
The device uses nonvolatile flash configuration, allowing its programmed logic, I/O assignments, and system parameters to be retained without continuous external configuration storage. This architecture supports field updates and shortened design iterations when requirements change. Designers can implement parallel datapaths, protocol interfaces, state machines, glue logic, and embedded system-management functions in programmable logic rather than relying exclusively on fixed-function devices.
Typical implementations include industrial protocol bridges, image and video processing interfaces, dual PCI Express control-plane functions, communications infrastructure, secure connectivity, sensor acquisition, and general-purpose control systems. Its combination of logic capacity and I/O density is particularly useful when a design must connect multiple external buses, converters, memories, or industrial interfaces while retaining reconfigurability.
A principal design consideration is lifecycle planning. Although the M2GL050 family remains listed as in production, current distributor guidance directs new designs toward M2GL060. Existing M2GL050-FGG484 platforms should therefore be qualified against device availability, migration requirements, and the lifecycle status appropriate to the intended production program before new schematic commitments are made.
This product page combines the manufacturer’s family description, device listings, package and pin-information documentation, migration guidance, and drop-in candidate analysis. It also highlights the distinction between the standard MPN, industrial-grade suffixes, the FG484 package spelling, and the M2GL060 new-design recommendation so engineers can make a more informed sourcing and migration decision.
直接替換替代品，適用於 M2GL050-FGG484 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： M2GL050-FGG484 （相同外形與佔位） — 差異在於 Device Type, Logic Elements, Package.
M2GL050-FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
M2GL050TS-FGG484
✅ 直接替換📋 參考替代品（不在目錄中）
M2GL050T-1FG484M
✅ 直接替換📋 參考替代品（不在目錄中）
M2GL050-FG484
✅ 直接替換聯絡詢價
查看資料表 →M2GL060-VF400
✅ 直接替換聯絡詢價
查看資料表 →M2GL050-FGG484 最大額定值與電氣特性
| Device Type | IGLOO2 low-density field-programmable gate array |
| Configuration Technology | Flash programmable |
| Logic Elements | 56K LE |
| FPGA Cells | 56,340 cells |
| Input/Output Count | 267 I/O |
| Core Supply Voltage | 1.2 V |
| Package Type | FBGA |
| Package Pin/Ball Count | 484 pins |
| Package Shape | Square |
| Terminal Form | Ball |
| 安裝類型 | Surface mount |
| Manufacturer Status | In Production |
| New-Design Guidance | Use M2GL060 |
| Programmable Logic Type | FPGA |
| Product Family | IGLOO2 |
| Device Density Class | Low-density FPGA |
M2GL050-FGG484 square 腳位配置指南
M2GL050-FGG484（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： M2GL050-FGG484.
請參閱 資料表 以查看完整腳位配置。
典型應用
M2GL050-FGG484 適用於 6 應用s: Industrial Protocol Bridging, Data Acquisition and Sensor Interfaces, Communications Control Plane, Video and Image Processing Interfaces, Secure Connectivity and System Management, Medical, Defense, and Aviation Control Logic.
Industrial Protocol Bridging
The M2GL050-FGG484 fits industrial protocol-bridge designs that combine several peripheral interfaces with configurable control logic. Its 267 I/O provide substantial connectivity for buffering, translating, and multiplexing signals, while 56K logic elements and 56,340 cells can implement protocol state machines, FIFOs, address decoding, and supervisory functions. The 1.2 V core supply and 484-pin FBGA support compact, high-density industrial controller boards. Before layout release, use the manufacturer pin-information guide to map every power, ground, configuration, and user-I/O ball, then confirm acquisition timing and industrial temperature requirements against the selected device suffix.
推薦
Data Acquisition and Sensor Interfaces
The M2GL050-FGG484 is suitable for data-acquisition systems that must consolidate parallel sensors, counters, converters, and control signals into a programmable datapath. The 267 available I/O offer enough external connectivity for multi-channel sensing, while 56K LE and 56,340 cells support sampling control, filtering, thresholding, timestamp logic, and data formatting. Its flash-programmable architecture retains configuration between power cycles and permits field updates when acquisition requirements change. Engineers should budget I/O standards, pin-bank restrictions, clock routing, and synchronous interface timing directly from the device documentation.
推薦
Communications Control Plane
The M2GL050-FGG484 can implement communications control-plane logic, including dual PCI Express control functions, protocol engines, packet routing, and supervisory state machines. Its 56K LE capacity and 267 I/O provide a practical balance between logic density and high external connectivity, while the 1.2 V core operation suits modern digital subsystems. The flash FPGA configuration allows secure connectivity or system-management functions to be updated without relying on volatile configuration RAM. Design closure should focus on bank-specific I/O voltage limits, clock quality, reference-clock routing, and timing margins for each communication interface.
推薦
Video and Image Processing Interfaces
The M2GL050-FGG484 fits video and image-processing interface roles that require parallel pixels, control signals, and programmable timing rather than a fixed video processor. With 267 I/O, 56K logic elements, and 56,340 cells, it can implement pixel transport, line and frame timing, color-space conversion, test-pattern generation, or image pre-processing. The 484-pin FBGA also provides a dense routing solution for systems with many high-speed parallel nets. Validate each I/O bank’s voltage compatibility and source-synchronous timing, and place decoupling and clock references according to the manufacturer’s power and layout guidance.
推薦
Secure Connectivity and System Management
The M2GL050-FGG484 is appropriate for secure-connectivity and system-management functions where programmable logic must coordinate authentication, key-handling interfaces, monitoring, alarms, and recovery behavior. Its nonvolatile flash configuration supports persistent programmed logic and simplifies field maintenance. The 267 I/O can connect security peripherals, status inputs, communications channels, and programmable indicators, while 56K LE provides space for control and protocol logic. Confirm the intended security boundary, boot and update mechanism, temporary or permanent enable behavior, and tamper-response requirements at the system architecture level before selecting the production suffix.
推薦
Medical, Defense, and Aviation Control Logic
The M2GL050-FGG484 can support programmable control logic in medical equipment, defense systems, and aviation electronics when the selected ordering option satisfies the required environmental and qualification profile. Its 56K logic elements, 267 I/O, and flash configuration suit supervisory controllers, sensor conditioning, communication isolation, and redundant monitoring functions. The square 484-pin FBGA supports dense aerospace and industrial board layouts, but successful implementation requires disciplined BGA assembly, thermal analysis, and exact configuration-pin routing. Engineers should use Microchip’s IGLOO2 pin and package documentation and confirm the appropriate grade before treating qualification requirements as satisfied.
推薦
推薦產品摘要
工程參考資料，適用於 M2GL050-FGG484 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | M2GL050-FGG484I | M2GL050TS-FGG484 | M2GL050T-1FG484M | M2GL050-FG484 | M2GL060 |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-BGA | FGG484 package | 484-BGA | FG484 package | 484-pin FBGA migration candidate |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FPGA Family | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
| Logic Elements | 56K LE | 56K LE | 56K LE | 56K LE | 56K LE | 60K LE class |
| Ordering-Code Difference | M2GL050-FGG484 | Added I suffix | TS suffix | T-1 and M suffix | One fewer G in package code | Higher-density M2GL060 family |
主要差異化特點
- Exact standard device identity with production-family continuity (對比M2GL060)
- Closest grade-specific ordering option (對比M2GL050-FGG484I)
- Identical listed I/O and cell counts in a direct family comparison (對比M2GL050T-1FG484M)
- Clear new-design succession path (對比M2GL050-FG484)
設計說明
Create the 484-ball footprint from Microchip’s mechanical package drawing and assign balls using the M2GL050 device table in the IGLOO 2 Packaging and Pin Descriptions User Guide. Place the device’s core and I/O supply decoupling structures close to their assigned balls, preserve the documented reference-clock and configuration-pin topology, and route every power and ground ball. A generic BGA library footprint should not be used without verifying ball numbering, pad geometry, and package revisions.
Plan high-speed interfaces and clocks before general-purpose signal routing. Identify the applicable I/O banks and voltage limits, then reserve compatible pins for high-speed pairs, clocks, configuration signals, and debug functions. Keep sensitive clock paths short, return unused inputs to defined levels, and observe the manufacturer’s guidance for unused global pins. After an M2GL060 migration, rerun these checks because a nominal footprint match does not guarantee identical bank flexibility or timing performance.
Treat the 484-pin FBGA as a thermal and assembly-design item rather than only an electrical footprint. Use the package thermal model and the actual board stackup to estimate junction temperature under the worst expected logic activity. Provide a thermal via field and copper area that match the package recommendations where permitted by the layout rules. Also validate solder-mask and pad design, component placement, reflow profile, and assembly yield because a large BGA can magnify thermal, warpage, and inspection risks.
Do not substitute an M2GL050 ordering variant solely because its package name resembles the target. Check temperature grade, speed grade, package revision, voltage limits, configuration method, and lifecycle status. In particular, M2GL050-FGG484I and M2GL050-FG484 appear closely related, while M2GL060 is a density migration rather than an unconditional substitution. Preserve the original configuration and timing constraints, recompile the design, and run hardware timing and functional tests before production release.
合規資訊
The manufacturer product page and device listings do not state the requested compliance fields for this exact ordering code. The package documentation and ordering information should be checked before making a compliance declaration.
