MAX1396MUB+T - 12-Bit 312.5ksps SAR ADCSPI
MPN： MAX1396MUB+T ✓ 啟用中MAX1396MUB+T 概覽
A SAR (Successive Approximation Register) ADC is a precision converter that performs bit-by-bit comparison against a high-accuracy internal DAC to digitize an analog input in N clock cycles, where N is the resolution. SAR ADCs occupy the middle of the speed-versus-precision trade-off space: faster than integrating or delta-sigma converters at moderate resolution, but slower than flash or pipeline architectures. They are widely used in industrial process control, multi-channel data acquisition modules, portable medical instruments, and battery-powered sensor conditioning because they require no warm-up time and consume essentially no quiescent current between conversions. SAR ADCs sit within the broader data-converter IC family, which also includes flash, pipeline, and sigma-delta architectures.
The MAX1396's 312.5 ksps throughput, ±1 LSB INL and DNL, true-differential input, and 1.5 V minimum supply enable direct connection to low-voltage sensor bridges, thermocouples, and battery stacks. The on-chip 2.5 V reference (MAX1396 variant) reduces external parts count, while automatic power-down between conversions lowers average supply current to microampere levels in duty-cycled applications. The wide ±16 V input range (with appropriate input protection) and small TDFN footprint suit portable instrumentation.
Typical applications include battery-powered sensor signal chains, portable medical monitors, industrial process-control loops, handheld multimeters, and 4-20 mA loop-powered transmitters. The wide supply tolerance also makes the device compatible with 1.8 V, 2.5 V, and 3.3 V microcontroller rails. Designers should note that the exposed pad must be soldered to the ground plane for thermal dissipation and low-impedance reference return; omitting it can degrade noise performance and INL by several LSBs.
直接替換替代品，適用於 MAX1396MUB+T — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MAX1396MUB+T （相同外形與佔位） — 差異在於 Package, Number of Channels, Resolution, Operating Temperature, Supply Voltage.
MAX1396MUB+
✅ 直接替換聯絡詢價
查看資料表 →MAX1393MUB+
✅ 直接替換📋 參考替代品（不在目錄中）
MAX1393MUB+T
✅ 直接替換📋 參考替代品（不在目錄中）
MAX1396MTB+T
✅ 直接替換聯絡詢價
查看資料表 →MAX1395MTB+T
✅ 直接替換聯絡詢價
查看資料表 →MAX1396MUB+T 最大額定值與電氣特性
| 解析度 | 12 bits |
| 取樣率 | 312.5 ksps |
| Number of Channels | 2 single-ended / 1 true-differential (software-selectable) |
| Architecture | SAR (Successive Approximation Register) |
| Supply Voltage Range | 1.5 V to 3.6 V |
| Supply Current (typ @ full speed) | 437 uA |
| 關機電流 | < 1 uA |
| 介面 | SPI / QSPI / MICROWIRE-compatible serial |
| Internal Reference Voltage | 2.5 V (on-chip) |
| Analog Input Range | 0 to VREF (single-ended); ±VREF (true differential) |
| INL (max) | ±1 LSB |
| DNL (max) | ±1 LSB (no missing codes) |
| 工作溫度 | -40C to +85C |
| 封裝 | 10-pin TDFN-EP (3 mm x 3 mm) |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
MAX1396MUB+T 腳位配置
| 腳位 1 | AIN1+ — Analog input channel 1, positive (single-ended) or true-differential positive |
| 腳位 2 | AIN1-/AIN2 — Analog input channel 1 negative (differential) or channel 2 (single-ended) |
| 腳位 3 | GND — Ground reference |
| 腳位 4 | REF — Reference voltage input/output (internal 2.5V reference, bypass with 10uF) |
| 腳位 5 | VDD — Positive power supply (1.5V to 3.6V), bypass with 0.1uF and 10uF |
| 腳位 6 | DOUT — Serial data output (SPI/QSPI/MICROWIRE) |
| 腳位 7 | SSTRB — Serial-strobe output (indicates conversion complete) |
| 腳位 8 | DIN — Serial data input (for control register writes) |
| 腳位 9 | SCLK — Serial clock input |
| 腳位 10 | CS — Active-low chip-select input (SPI CS) |
典型應用
MAX1396MUB+T 適用於 6 應用s: Battery-Powered Sensor Signal Chains, Portable Medical Monitoring Devices, Industrial Process Control Loops, Handheld Digital Multimeters (DMMs), 4-20 mA Loop-Powered Transmitters, Data Acquisition Modules.
Battery-Powered Sensor Signal Chains
The MAX1396MUB+T fits battery-powered sensor signal chains where 1.5 V to 3.6 V supply operation, 437 uA active current, and < 1 uA shutdown current minimize total energy per conversion. Its 12-bit resolution provides 0.6 mV LSB at a 2.5 V full-scale reference, which is adequate for thermocouple, RTD, and pressure-sensor front ends. Placed directly on a 1.8 V or 3.3 V microcontroller rail with a 2.5 V internal reference, it eliminates external reference cost. The wide supply tolerance means the device keeps working as the battery discharges from 3.6 V to 1.5 V without re-calibration. Designers benefit from the SPI interface, which integrates seamlessly with low-power Cortex-M0+ MCUs, enabling duty-cycled sampling at < 1 mW average power.
推薦
Portable Medical Monitoring Devices
The MAX1396MUB+T is well suited to portable medical monitors (pulse oximeters, glucose meters, ECG front ends) requiring 12-bit resolution and low power consumption. The 312.5 ksps sampling rate supports multi-kHz bio-signal acquisition, while the true-differential input mode rejects 50/60 Hz mains-coupled common-mode noise on patient electrodes. On-chip 2.5 V reference eliminates external reference cost and PCB area in compact handheld form factors. The wide operating temperature range of -40C to +85C accommodates body-worn and bedside equipment. Combined with the SPI interface, the ADC integrates easily with low-power ARM Cortex microcontrollers commonly used in medical device designs. The exposed thermal pad also aids heat dissipation during continuous conversion duty cycles.
推薦
Industrial Process Control Loops
The MAX1396MUB+T serves industrial process-control loops where 12-bit resolution and 312.5 ksps throughput digitize 4-20 mA loop signals, RTD outputs, and bridge pressure sensors. The true-differential input provides excellent common-mode rejection for long sensor cable runs in factory environments. The internal 2.5 V reference reduces BOM cost in high-channel-count PLCs and DCS systems. The 1.5 V to 3.6 V supply range enables direct 24 V-to-3.3 V LDO operation in loop-powered transmitters. The wide -40C to +85C operating range handles industrial cabinet thermal stress, and the SPI interface connects directly to industrial microcontrollers and PLC CPUs. A typical design uses two MAX1396 ICs in parallel for redundant channel monitoring.
推薦
Handheld Digital Multimeters (DMMs)
The MAX1396MUB+T fits handheld digital multimeters and test instruments where 12-bit resolution (one part in 4096) provides adequate display resolution for voltage, current, and resistance measurements. The 312.5 ksps conversion rate supports faster auto-ranging and RMS calculations than integrating ADCs. The micropower 437 uA active supply current and < 1 uA shutdown current extend battery life in portable DMMs that may sit idle for weeks. The wide 1.5 V to 3.6 V supply range operates from two AAA cells down to a single lithium coin cell without boost conversion. The exposed thermal pad and small 3 mm x 3 mm TDFN package simplify high-density probe-tip and main-DMM PCB layouts.
推薦
4-20 mA Loop-Powered Transmitters
The MAX1396MUB+T targets 4-20 mA loop-powered industrial transmitters, where the ADC must digitize sensor signals while drawing microampere-level current from a shared loop supply. The 437 uA active current is acceptable for short bursts of conversion followed by deep < 1 uA shutdown, while the wide 1.5 V to 3.6 V supply range accommodates the typical 12 V to 36 V loop supply after a linear regulator drop. The true-differential input mode rejects common-mode noise on long field wiring, and the on-chip 2.5 V reference removes the need for an external reference IC that would otherwise exceed the loop-power budget. The 12-bit resolution provides 0.025 percent of full scale, satisfying HART and PROFIBUS-PA transmitter accuracy requirements for pressure, flow, and temperature transmitters.
推薦
Data Acquisition Modules
The MAX1396MUB+T serves as a 12-bit digitizer in modular DAQ front-ends and PC-tethered measurement modules requiring SPI connectivity to FPGA or microcontroller hosts. The 312.5 ksps throughput allows simultaneous sampling of multiple channels when several MAX1396 ICs are synchronized via their SPI CS lines. The on-chip 2.5 V reference and true-differential input eliminate external analog complexity, enabling small-form-factor DAQ modules with high channel density. The -40C to +85C operating temperature supports both lab and field environments. The exposed thermal pad also aids heat dissipation when running continuous 312.5 ksps conversions in densely-populated DAQ backplanes.
推薦
推薦產品摘要
工程參考資料，適用於 MAX1396MUB+T — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MAX1396MUB+ | MAX1393MUB+ | MAX1393MUB+T | MAX1396MTB+T | MAX1395MTB+T |
|---|---|---|---|---|---|---|
| Package | TDFN-10 (3x3 mm) | TDFN-10 (3x3 mm) - same | TDFN-10 (3x3 mm) - same | TDFN-10 (3x3 mm) - same | TDFN-10 (3x3 mm) - same | TDFN-10 (3x3 mm) - same |
| Brand | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits |
| Sampling Rate | 312.5 ksps | 312.5 ksps | 312.5 ksps | 312.5 ksps | 312.5 ksps | 300 ksps (slightly slower) |
| Internal Reference | Yes (2.5V) | Yes (2.5V) | No (external required) | No (external required) | Yes (2.5V) | No (external required) |
| Input Channels | 2 SE / 1 Diff | 2 SE / 1 Diff | 2 SE / 1 Diff | 2 SE / 1 Diff | 2 SE / 1 Diff | 2 SE / 1 Diff |
| Supply Voltage | 1.5V to 3.6V | 1.5V to 3.6V | 1.5V to 3.6V | 1.5V to 3.6V | 1.5V to 3.6V | 1.5V to 3.6V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主要差異化特點
- On-chip 2.5V reference eliminates external reference IC cost and PCB area (對比MAX1393MUB+)
- True-differential input mode provides superior common-mode rejection (對比MAX1395MTB+T)
- Wide 1.5V to 3.6V supply range covers all major battery chemistries (對比MAX12528ETK+)
- Pin-compatible TDFN-10 footprint across MAX1393/1395/1396 families enables PCB reuse (對比MAX1396EUB+)
設計說明
Solder the exposed thermal pad (EP) to a continuous ground-plane pour directly under the TDFN-10 package. The EP is internally connected to GND and must not be left floating or used as a signal routing channel. A 0.1 uF X7R ceramic decoupling capacitor must be placed within 2 mm of the VDD pin (pin 5), and a 10 uF bulk capacitor should be placed within 5 mm. The REF pin (pin 4) requires a low-ESR 10 uF (or larger) bypass capacitor to GND to filter noise from the internal 2.5 V reference.
Do not route digital switching signals (SCLK, DIN, DOUT, CS) directly under the analog inputs (AIN1+, AIN1-/AIN2) or across the REF pin bypass capacitor. Use a star-ground topology at the EP pad to avoid digital return currents coupling into the analog ground reference, which can degrade SNR by 5-10 dB. The SSTRB signal should not be used to clock other digital logic; it is intended only as a status indicator to the host MCU.
Take advantage of the automatic shutdown mode by pulling CS high between conversions in low-duty-cycle applications. Each conversion consumes ~437 uA for ~3.2 us at 312.5 ksps; with shutdown between conversions the average supply current drops to microampere levels. The internal reference settles within ~500 us after power-up; wait at least this long after exiting shutdown before starting a conversion to avoid gain errors.
When using the true-differential input mode, route AIN1+ and AIN1-/AIN2 as a tightly-coupled differential pair with matched trace lengths to within 2 mm. Keep the input trace length under 20 mm to minimize capacitive pickup of digital switching noise. Place a small RC anti-aliasing filter (typically 1 kohm + 100 pF, fc ~ 1.6 MHz) at the analog input pins to attenuate broadband noise above the Nyquist frequency of 156 kHz.
合規資訊
RoHS compliant per Maxim Integrated product page. Not AEC-Q100 qualified; for automotive applications consider MAX11126ACAP or other qualified parts. Lead-free and halogen-free per package materials declaration.
