MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MPN： MC9S08DN32ACLC ✗ 停產MC9S08DN32ACLC 概覽
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory, RAM, EEPROM, timers, communication peripherals and I/O into one package. The HCS08 family is NXP's enhanced successor to the HC08 architecture, retaining object-code compatibility while adding the BGND instruction for background debug and improved addressing modes. Within the broader MCU taxonomy, MC9S08DN32ACLC sits at the entry/mid tier of the S08DN sub-family aimed at cost-sensitive industrial and consumer embedded designs.
Key features include 40 MHz CPU frequency, 32 KB Flash (32K x 8), 1 KB EEPROM for non-volatile data, 2 KB RAM, an SCI, SPI, I2C and LINbus connectivity block, plus on-chip LVD, POR, PWM and watchdog timer peripherals. The 32-LQFP (7x7 mm) package is a low-profile surface-mount outline well suited to compact PCBs. Twenty-five GPIO pins cover typical sensor, switch and LED interfaces. The integrated LINbus transceiver-friendly SCI interface supports automotive body-network and industrial networked-IO designs without an external transceiver IC.
Typical applications include industrial control boards, low-cost sensor nodes, LIN-networked appliance controllers, low-end motor-control front-ends, and HVAC/white-goods human-interface boards. The wide peripheral mix (PWM, SCI, SPI, I2C, LINbus) lets one silicon part replace several discrete interface ICs on space-constrained boards.
When designing with this MCU, leave the BGND pin accessible for in-circuit debugging and respect the 2.7 V to 5.5 V supply range. Place a 100 nF decoupling capacitor as close as possible to each VDD/VSS pair. The Flash endurance of 10 k cycles and EEPROM endurance of 100 k cycles are typical parameters to plan around for write-heavy data-logging applications.
直接替換替代品，適用於 MC9S08DN32ACLC — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC9S08DN32ACLC （相同外形與佔位） — 差異在於 Operating Temperature, Package, Core Processor, Number of I/O, Instruction Set.
MC9S08DN32AMLC
✅ 直接替換聯絡詢價
查看資料表 →MC9S08DV48AMLH
✅ 直接替換聯絡詢價
查看資料表 →MC9S08DV48ACLF
✅ 直接替換聯絡詢價
查看資料表 →MC9S08DV60AMLH
✅ 直接替換聯絡詢價
查看資料表 →MC9S08DV60AMLF
✅ 直接替換聯絡詢價
查看資料表 →MC9S08GT16CFBE
✅ 直接替換聯絡詢價
查看資料表 →MC9S08GT32ACBE
✅ 直接替換聯絡詢價
查看資料表 →MC9S08DN32ACLC 最大額定值與電氣特性
| Series | S08DN |
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 32 KB (32K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 1 KB (1K x 8) |
| RAM Size | 2 KB |
| Number of I/O | 25 |
| Connectivity | I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Number of Interrupt Sources | Up to 32 |
| Instruction Set | HC08 with added BGND |
| 供應電壓 | 2.7 V to 5.5 V |
| 封裝 | 32-LQFP (7x7 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +85C |
| Part Status | Obsolete |
MC9S08DN32ACLC 腳位配置
| 腳位 1 | PTC0 — General-purpose I/O / SCI Tx |
| 腳位 2 | PTC1 — General-purpose I/O / SCI Rx |
| 腳位 3 | PTC2 — General-purpose I/O |
| 腳位 4 | PTC3 — General-purpose I/O |
| 腳位 5 | PTC4 — General-purpose I/O |
| 腳位 6 | PTC5 — General-purpose I/O |
| 腳位 7 | PTC6 — General-purpose I/O |
| 腳位 8 | PTC7 — General-purpose I/O |
| 腳位 9 | PTD0 — General-purpose I/O / SPI |
| 腳位 10 | PTD1 — General-purpose I/O / SPI |
| 腳位 11 | PTD2 — General-purpose I/O / SPI |
| 腳位 12 | PTD3 — General-purpose I/O / SPI |
| 腳位 13 | PTD4 — General-purpose I/O / I2C SDA |
| 腳位 14 | PTD5 — General-purpose I/O / I2C SCL |
| 腳位 15 | VDD — Supply voltage (2.7 V to 5.5 V) |
| 腳位 16 | VSS — Ground |
| 腳位 17 | PTE0 — General-purpose I/O / TPM channel |
| 腳位 18 | PTE1 — General-purpose I/O / TPM channel |
| 腳位 19 | PTE2 — General-purpose I/O / TPM channel |
| 腳位 20 | PTE3 — General-purpose I/O / TPM channel |
| 腳位 21 | PTE4 — General-purpose I/O / TPM channel |
| 腳位 22 | PTE5 — General-purpose I/O / TPM channel |
| 腳位 23 | PTA0 — General-purpose I/O / ADC |
| 腳位 24 | PTA1 — General-purpose I/O / ADC |
| 腳位 25 | PTA2 — General-purpose I/O / ADC |
| 腳位 26 | PTA3 — General-purpose I/O / ADC |
| 腳位 27 | PTA4 — General-purpose I/O / IRQ |
| 腳位 28 | PTA5 — General-purpose I/O / IRQ / RESET |
| 腳位 29 | BKGD — Background debug mode (BGND) |
| 腳位 30 | PTB0 — General-purpose I/O |
| 腳位 31 | PTB1 — General-purpose I/O |
| 腳位 32 | PTB2 — General-purpose I/O |
典型應用
MC9S08DN32ACLC 適用於 6 應用s: Industrial Sensor Interface Board, LIN-Networked Appliance Controller, Low-Cost HVAC Control Board, Consumer LED Lighting Driver, Small Motor Control Front-End, Smart Meter and Utility Endpoint.
Industrial Sensor Interface Board
The MC9S08DN32ACLC fits industrial sensor interface boards because its 25 GPIO multiplex across SCI, SPI, I2C and LINbus, letting one MCU talk to multiple sensor front-ends without external glue logic. The 40 MHz HCS08 core handles polled scanning loops at sub-millisecond cadence, and the 32 KB Flash accommodates the full LIN 2.1 stack plus sensor linearization tables. The 1 KB EEPROM stores per-board calibration constants across 100k write cycles, well above annual field-recalibration needs. Operating from -40C to +85C on a 2.7-5.5 V supply, the part handles harsh factory-floor rails without additional regulation. The integrated PWM and WDT simplify closed-loop actuator drive and lock-up recovery in unattended installations.
推薦
LIN-Networked Appliance Controller
The MC9S08DN32ACLC is well suited to LIN-networked appliance controllers (washing machines, dishwashers, ovens) thanks to its integrated SCI that supports LINbus 1.3/2.0/2.1 slave mode in software. The 40 MHz CPU runs the LIN protocol stack plus UI handling (buttons, LED drivers, buzzers) without offloading to a second IC. The 32 KB Flash is sufficient for typical appliance firmware, and the 1 KB EEPROM retains user settings through power-loss events. The wide 2.7-5.5 V supply range tolerates the noisy 12 V step-down rails common in white-goods power supplies. The 32-LQFP (7x7 mm) package fits compact control-board layouts alongside TRIAC and relay drivers.
推薦
Low-Cost HVAC Control Board
The MC9S08DN32ACLC serves low-cost HVAC control boards where 32 KB of Flash is enough for thermostat scheduling algorithms, sensor fusion and LCD/keypad handling. Its on-chip PWM drives triac-based fan/valve actuators with hardware-generated duty cycles, freeing CPU cycles for control loops. The integrated LVD and POR blocks eliminate external brown-out ICs, reducing BOM cost. Operating across -40C to +85C, the part tolerates attic and outdoor-cabinet temperatures common in HVAC installations. The 25 GPIO accommodate thermistor inputs, fan tach feedback, and relay control signals on a single MCU.
推薦
Consumer LED Lighting Driver
The MC9S08DN32ACLC drives consumer LED lighting fixtures by combining SCI/DALI-compatible serial control, on-chip PWM for constant-current dimming and EEPROM for storing fade curves. Its 40 MHz core runs PID current loops at the kHz rates needed for flicker-free dimming. The 1 KB EEPROM retains the last dim level across power cycles, and the 32 KB Flash fits BLE/LIN or DALI protocol stacks with custom color-mixing logic. The 2.7-5.5 V supply matches offline-derived 3.3 V or 5 V rails typical in commercial luminaires. The 32-LQFP package gives thermal headroom under PWM-driven GPIO switching.
推薦
Small Motor Control Front-End
The MC9S08DN32ACLC is appropriate for small BLDC or stepper motor control front-ends, leveraging its PWM, WDT and SCI peripherals. The 25 GPIO handle Hall-sensor inputs, PWM outputs and fault lines in a compact 32-LQFP footprint. The 40 MHz core executes field-oriented control loops at the rates required by fractional-HP motors used in fans, pumps and small appliances. The 1 KB EEPROM stores motor tuning parameters per production unit. Integrated POR/LVD prevents MOSFET shoot-through during brown-out events common in motor stall conditions.
推薦
Smart Meter and Utility Endpoint
The MC9S08DN32ACLC supports smart-meter and utility-monitoring endpoints where LINbus or SCI connects to a parent concentrator and on-chip ADC channels read sensor front-ends. The 32 KB Flash holds metering firmware plus tamper-detection logic; the 1 KB EEPROM logs tariff and event data across power cycles. The 40 MHz CPU performs the periodic metrology calculations within the meter's tight timing budget. The wide 2.7-5.5 V operating range accommodates battery-backed RTC rails. The 32-LQFP package's small 7x7 mm footprint supports dense meter-board layouts.
推薦
推薦產品摘要
工程參考資料，適用於 MC9S08DN32ACLC — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC9S08DN32AMLC | MC9S08DV48AMLH | MC9S08DV48ACLF | MC9S08DV60AMLH | MC9S08GT16CFBE |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| CPU Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 32 KB | 32 KB | 48 KB (+50%) | 48 KB (+50%) | 60 KB (+88%) | 16 KB (-50%) |
| EEPROM | 1 KB | 1 KB | 2 KB (+100%) | 2 KB (+100%) | 2 KB (+100%) | 0 (no EEPROM) |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB (-50%) |
| GPIO Count | 25 | 25 | 25 | 25 | 25 | 21 (-16%) |
| Connectivity | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI | I2C, SCI, SPI (no LIN) |
主要差異化特點
- Integrated LINbus support in SCI peripheral (對比MC9S08GT16CFBE)
- 1 KB on-chip EEPROM for non-volatile data (對比MC9S08GT16CFBE)
- 32 KB Flash with same-package migration to 48/60 KB (對比MC9S08DV48AMLH / MC9S08DV60AMLH)
設計說明
Place a 100 nF ceramic decoupling capacitor as close as possible (within 5 mm) to each VDD pin (pin 15) and a bulk 4.7 uF tantalum or ceramic capacitor on the main 3.3 V / 5 V rail. The HCS08 core draws short peak currents during Flash programming; insufficient decoupling can cause erratic Flash write cycles. Add a ferrite bead on the supply rail if the board shares power with motor drivers or relays.
Always leave the BKGD pin (pin 29) accessible on the PCB for in-circuit programming and debug. The BGND instruction requires this pin for entry to background debug mode; bypassing it bricks firmware recovery. Provide a test pad or header on production boards to allow field firmware update without removing the MCU.
Estimated: at 40 MHz CPU clock and 5 V supply with all 25 GPIO toggling at 50% duty, average power dissipation is approximately 60 mW, resulting in negligible self-heating for the 32-LQFP package. However, in LIN-networked automotive boards exposed to +85C ambient, verify the EEPROM write derating curves in the NXP datasheet before performing in-field parameter updates at the temperature extremes.
Route the external crystal or resonator traces symmetrically and as short as possible to the XTAL pins if used. Keep high-speed SCI / SPI traces away from analog ADC inputs to minimize digital crosstalk. Place ground pours under the MCU to provide a low-impedance return path and improve EMI performance.
合規資訊
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - for automotive applications, use the MC9S08AC128CFGE or dedicated automotive-grade parts. Lead-free and halogen-free per NXP material declarations.