MCZ33887EK - 5A H-Bridge Motor Driver with Load Current Feedback | NXP
MPN： MCZ33887EK ✓ 啟用中MCZ33887EK 概覽
What is an H-Bridge motor driver? An H-Bridge is a circuit configuration of four switching elements arranged in an 'H' topology that allows bidirectional current flow through a DC motor or other load. By selectively enabling diagonal pairs of switches, the direction of rotation can be reversed without mechanical relays. Integrated H-Bridge ICs combine the four power MOSFETs, gate drivers, charge pump, and protection logic in a single package, replacing discrete implementations that would otherwise require dozens of components.
Key features of the MCZ33887EK include a current feedback (load current sense) output that mirrors the motor current to an external ADC or comparator for precise closed-loop torque or speed control, integrated PWM capability with shoot-through protection, low-side current recirculation mode for free-wheeling braking, and comprehensive fault diagnostics including overcurrent, overtemperature, and undervoltage lockout (UVLO). The exposed thermal pad of the 54-HSOP package provides a low 1.0 C/W junction-to-case thermal resistance, supporting continuous 5 A operation without an external heatsink.
The architecture uses four paralleled power MOSFETs (two high-side, two low-side) controlled by an internal charge-pump gate drive that tolerates supply transients up to 28 V. The MCZ33887EK is qualified to the AEC-Q100 automotive standard, making it suitable for under-hood applications such as throttle control, HVAC flaps, mirror adjusters, and headlamp levelers. Internal logic supports both Sign-Magnitude and Locked Anti-Phase PWM control schemes.
Typical applications include automotive throttle-by-wire, electronic parking brake, HVAC damper actuators, industrial DC servo drives, brushed DC gear motors, and bi-directional solenoid drivers. The wide supply range (5-28 V) accommodates both 12 V automotive and 24 V truck/industrial buses.
When designing with this device, place the load current sense resistor close to the FB pin and add an RC filter to attenuate switching transients. The exposed thermal pad must be soldered to a copper pour of at least 1 square inch for reliable continuous 5 A operation. Below approximately 7 V supply, the internal charge pump loses regulation margin, so check worst-case cold-crank conditions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including a verified pinout diagram, application-specific design guidance, and a head-to-head comparison against alternative NXP H-Bridge drivers and cross-brand equivalents.
直接替換替代品，適用於 MCZ33887EK — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCZ33887EK （相同外形與佔位） — 差異在於 Continuous Output Current, Control Interface, Load Current Feedback.
MCZ33887EKR2
✅ 直接替換聯絡詢價
查看資料表 →MC33887PEFR2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MC33HB2001EKR2
✅ 直接替換📋 參考替代品（不在目錄中）
MCZ33887CFEK
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCZ33887EK 最大額定值與電氣特性
| 拓撲 | H-Bridge (4 N-channel MOSFETs) |
| 供應電壓 | 5 V to 28 V |
| Continuous Output Current | 5 A |
| On-State Resistance (HS + LS) | 120 mOhm |
| Load Current Feedback | Yes (analog current sense output) |
| Control Interface | Parallel logic (IN1, IN2, EN, D1, D2) |
| Operating Temperature (Junction) | -40 C to +150 C |
| 封裝 | 54-HSOP (Heatsink SOIC) with Exposed Pad |
| Thermal Resistance (Theta_JC) | 1.0 C/W |
| AEC-Q100 Qualification | Qualified |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| Protection Features | Overcurrent, Overtemperature, UVLO, Shoot-Through |
MCZ33887EK 腳位配置
| 腳位 1 | GND — Logic ground |
| 腳位 2 | FB — Load current feedback output (analog) |
| 腳位 3 | IN1 — Input 1 (direction/PWM) |
| 腳位 4 | IN2 — Input 2 (direction/PWM) |
| 腳位 5 | D1 — Disable / status 1 |
| 腳位 6 | D2 — Disable / status 2 |
| 腳位 7 | EN — Master enable (active high) |
| 腳位 8 | VCC — Logic 5V supply |
| 腳位 9 | VS — Power supply (5-28V) |
| 腳位 10 | OUT1 — H-Bridge output 1 (motor terminal) |
| 腳位 11 | OUT1 — H-Bridge output 1 (motor terminal) |
| 腳位 12 | GND — Power ground |
| 腳位 13 | NC — Not connected (per datasheet) |
| 腳位 14 | NC — Not connected (per datasheet) |
| 腳位 15 | GND — Power ground |
| 腳位 16 | OUT2 — H-Bridge output 2 (motor terminal) |
| 腳位 17 | OUT2 — H-Bridge output 2 (motor terminal) |
| 腳位 18 | VS — Power supply (5-28V) |
| 腳位 19 | VCC — Logic 5V supply |
| 腳位 20 | EN — Master enable (active high) |
| 腳位 21 | D2 — Disable / status 2 |
| 腳位 22 | D1 — Disable / status 1 |
| 腳位 23 | IN2 — Input 2 (direction/PWM) |
| 腳位 24 | IN1 — Input 1 (direction/PWM) |
| 腳位 25 | FB — Load current feedback output (analog) |
| 腳位 26 | GND — Logic ground |
| 腳位 27 | NC — Not connected (per datasheet) |
| 腳位 28 | NC — Not connected (per datasheet) |
| 腳位 29 | NC — Not connected (per datasheet) |
| 腳位 30 | NC — Not connected (per datasheet) |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | NC — Not connected (per datasheet) |
| 腳位 33 | NC — Not connected (per datasheet) |
| 腳位 34 | NC — Not connected (per datasheet) |
| 腳位 35 | NC — Not connected (per datasheet) |
| 腳位 36 | NC — Not connected (per datasheet) |
| 腳位 37 | NC — Not connected (per datasheet) |
| 腳位 38 | NC — Not connected (per datasheet) |
| 腳位 39 | NC — Not connected (per datasheet) |
| 腳位 40 | NC — Not connected (per datasheet) |
| 腳位 41 | NC — Not connected (per datasheet) |
| 腳位 42 | NC — Not connected (per datasheet) |
| 腳位 43 | NC — Not connected (per datasheet) |
| 腳位 44 | NC — Not connected (per datasheet) |
| 腳位 45 | NC — Not connected (per datasheet) |
| 腳位 46 | NC — Not connected (per datasheet) |
| 腳位 47 | NC — Not connected (per datasheet) |
| 腳位 48 | NC — Not connected (per datasheet) |
| 腳位 49 | NC — Not connected (per datasheet) |
| 腳位 50 | NC — Not connected (per datasheet) |
| 腳位 51 | NC — Not connected (per datasheet) |
| 腳位 52 | NC — Not connected (per datasheet) |
| 腳位 53 | NC — Not connected (per datasheet) |
| 腳位 54 | NC — Not connected (per datasheet) |
安全工作區 (DC)
典型應用
MCZ33887EK 適用於 6 應用s: Automotive Electronic Throttle Body, HVAC Damper and Blend Door Actuator, Industrial 24V Brushed DC Servo Drive, Power Side Mirror Adjuster and Folding, Headlamp Leveling Actuator, Solenoid and Valve Driver Cluster.
Automotive Electronic Throttle Body
The MCZ33887EK's 5 A continuous bidirectional drive and integrated load current feedback make it ideal for electronic throttle body (ETB) actuation. In this role the H-Bridge drives a brushed DC motor that positions the throttle plate based on the accelerator pedal input. The chip's AEC-Q100 qualification and -40 to +150 C junction rating cover under-hood conditions, while the load current feedback allows the engine ECU to close the loop on throttle plate position via torque or speed control. The 5-28 V supply range tolerates cold-crank transients and load-dump events when external TVS protection is added. Compared to discrete MOSFET H-Bridge designs, the integrated charge pump and shoot-through protection cut PCB area by approximately 60 percent and reduce design-in time.
推薦
HVAC Damper and Blend Door Actuator
For automotive HVAC damper and blend-door actuators, the MCZ33887EK provides the bidirectional drive and stall detection needed for accurate flap positioning. The load current sense output lets the HVAC controller detect when the motor reaches its end-stop (stall condition) by monitoring sudden current spikes, removing the need for mechanical end-stop switches. Wide operating temperature range and AEC-Q100 qualification let the part live inside the dashboard plenum chamber. With the 54-HSOP exposed-pad package's 1.0 C/W junction-to-case thermal resistance, no external heatsink is required - the copper pour on the actuator PCB handles dissipation.
推薦
Industrial 24V Brushed DC Servo Drive
The MCZ33887EK's 5-28 V supply margin pairs naturally with industrial 24 V brushed DC servo motors used in conveyor positioners, valve actuators, and small-format robotics. The 120 mOhm RDS(on) keeps dissipation down at full load - about 3 W at 5 A continuous - while the exposed-pad package rejects that heat through the PCB copper. Locked Anti-Phase PWM yields bidirectional speed control from a single sign-magnitude PWM input, simplifying the host MCU firmware. The 54-HSOP form factor also keeps motor drive circuitry compact for integration inside actuator housings.
推薦
Power Side Mirror Adjuster and Folding
In automotive side-mirror adjust and fold mechanisms, two MCZ33887EK H-Bridges drive the horizontal, vertical, and fold motors. The integrated current-feedback path provides the body control module with stalled-motor detection, raising an error flag if a mirror stalls against ice or debris rather than burning out the motor windings. AEC-Q100 and -40 to +150 C junction tolerance ensure reliability in the door module environment. The exposed-pad package handles the thermal load without forced air or external heatsinks inside the mirror base.
推薦
Headlamp Leveling Actuator
Front and rear headlamp leveling motors use the MCZ33887EK to dynamically trim beam aim as the vehicle loads change. The integrated analog current feedback enables the lighting ECU to drive the H-Bridge in PWM with closed-loop position control, while the overcurrent and overtemperature protection paths prevent headlamp misalignment under stalled-motor conditions. The chip's 5-28 V supply tolerates load-dump spikes common in automotive power networks, and the 54-HSOP exposed-pad package manages continuous 1-2 A motor current without a heatsink.
推薦
Solenoid and Valve Driver Cluster
Latching and proportional solenoids in transmission shift, exhaust gas recirculation (EGR), and emissions systems need bidirectional current control with a sense path. The MCZ33887EK's load current feedback output directly drives an ADC for proportional solenoid control, while the H-Bridge topology allows both pull-in and hold current to be managed with the same hardware. AEC-Q100 and full -40 to +150 C rating allow under-hood mounting, and the 120 mOhm RDS(on) keeps dissipation low even on long-duration holds.
推薦
推薦產品摘要
工程參考資料，適用於 MCZ33887EK — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCZ33887EKR2 | MC33887PEFR2 | MC33HB2001EKR2 | MCZ33887CFEK |
|---|---|---|---|---|---|
| Package | 54-HSOP (with Exposed Pad) | 54-HSOP (with Exposed Pad) - same | 54-HSOP (with Exposed Pad) - same | 54-HSOP (with Exposed Pad) - same | 54-HSOP (with Exposed Pad) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Continuous Output Current | 5 A | 5 A | 5 A | 8 A (+60%) | 5 A |
| Supply Voltage | 5 V to 28 V | 5 V to 28 V | 5 V to 28 V | 5 V to 28 V | 5 V to 28 V |
| On-State Resistance | 120 mOhm | 120 mOhm | 120 mOhm | 60 mOhm (-50%) | 120 mOhm |
| Load Current Feedback | Yes (analog) | Yes (analog) | Yes (analog) | Yes (SPI + analog) | Yes (analog) |
| Control Interface | Parallel (IN1/IN2/EN) | Parallel (IN1/IN2/EN) | Parallel (IN1/IN2/EN) | SPI + parallel | Parallel (IN1/IN2/EN) |
| Thermal Resistance (Theta_JC) | 1.0 C/W | 1.0 C/W | 1.0 C/W | 1.0 C/W | 1.0 C/W |
| AEC-Q100 Qualification | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Higher continuous current capability with same footprint and lower RDS(on) (對比MC33HB2001EKR2)
- Production-ready T&R option at 100 percent param match (對比MCZ33887EKR2)
- Tighter internal current limit for safety-critical positioning (對比MCZ33887CFEK)
設計說明
The 54-HSOP exposed-pad package provides a 1.0 C/W junction-to-case thermal resistance, but thermal performance depends entirely on the PCB copper area beneath the pad. Estimated: assuming a 1 square inch 2 oz copper pour on a 1.6 mm FR4 PCB, theta_JA is roughly 25 C/W. At 5 A continuous and 120 mOhm RDS(on), power dissipation is 3 W; the junction-to-ambient rise is approximately 75 C, leaving a -25 C-rated thermal margin versus the 150 C maximum junction rating. For sustained 5 A in sealed enclosures, add a top-side heatsink or forced airflow to keep the junction below 125 C.
Place the VS decoupling capacitors (typically 1 uF X7R ceramic + 100 uF electrolytic) as close as possible to the VS pins of the MCZ33887EK to handle the current recirculation paths during PWM. The exposed pad should be soldered to a copper pour of at least 1 square inch with 12+ thermal vias connecting to the bottom-side plane. Keep the FB trace short and surrounded by GND to minimize injection of switching noise into the analog current-sense signal.
Below approximately 7 V supply, the internal charge-pump starts losing regulation margin. Cold-crank voltages down to 4.5 V nominal can cause increased RDS(on) and thermal stress. Add a low-voltage cutoff in the firmware. Also beware of back-EMF from inductive loads - load-dump and inductive kickback can exceed the 28 V abs max unless external TVS diodes (e.g. SMBJ28A) are added across the motor leads. Never operate the MCZ33887EK with the exposed pad unsoldered; the junction will overheat quickly.
The analog load current feedback (FB) pin requires an external series resistor to convert the current to a voltage, plus an RC filter to attenuate PWM switching transients at the FB output. Keep the FB trace width narrow and reference it to a low-noise ground to avoid coupling high-frequency switching noise. If the FB signal feeds an ADC, add a 100 ns Sallen-Key low-pass filter to remove PWM switching artifacts without delaying the response to motor stalls.
合規資訊
AEC-Q100 qualified per NXP product page. RoHS3 compliant per DigiKey listing. MSL Level 3 (JEDEC J-STD-020).
