MPC17529EP - 0.7A Dual H-Bridge Motor Driver | NXP | 24-QFN-EP
MPN： MPC17529EP ✓ 啟用中MPC17529EP 概覽
A dual H-Bridge motor driver is a power IC that contains two complete H-bridge output stages, each capable of steering current through a motor winding in both directions. The H-bridge topology is the standard building block of DC motor control, allowing forward, reverse, brake, and high-impedance states from a single low-voltage logic interface. Within the broader system hierarchy, this device sits in the Motor Drivers sub-category of Power Management, itself part of Motion Control ICs in industrial and consumer electronics.
Key features include 0.7 A continuous output current per bridge, low RDS(on) MOSFET output stages, parallel MCU interface with 3.0 V/5.0 V logic compatibility, on-chip charge pump for the high-side drivers, and integrated shoot-through protection that prevents cross-conduction. The 24-QFN-EP package provides low thermal resistance through its exposed pad, enabling sustained output current without external heatsinking in typical portable applications.
The architecture uses a CMOS parallel interface with four logic inputs that directly control each half-bridge, allowing simple firmware-only PWM speed control. Independent control of each H-Bridge enables simultaneous driving of one bipolar stepper (full-step or half-step) or two brush DC motors. The integrated charge pump generates the gate drive voltage for the high-side N-channel MOSFETs, eliminating the need for an external bootstrap capacitor.
Typical applications include camera lens focus and zoom actuators, disk drive head positioners, robotic actuators in toys, and portable printers. The wide 2.0 V to 6.8 V load supply range and low quiescent current make the part well-suited to single-cell Li-ion or two-cell alkaline battery-powered systems where board area and efficiency are critical.
When designing with this device, place the exposed pad on a minimum 1 square inch copper pour to keep junction temperature within the 150 C TJ rating. Decouple both VCC and VM pins with 1 uF ceramic capacitors placed within 2 mm of the respective pins to suppress switching transients. The IN1/IN2 inputs should not be left floating; tie them to defined logic levels through 100 kohm pull resistors if the MCU starts in high-impedance.
直接替換替代品，適用於 MPC17529EP — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC17529EP （相同外形與佔位） — 差異在於 Load Supply Voltage (VM), Logic Supply Voltage (VCC), Motor Type, Number of Outputs, Package.
MPC17510EP
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC17531EP
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC17529EFE
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC17529EP 最大額定值與電氣特性
| Motor Type | Brushed DC, Bipolar Stepper |
| 拓撲 | Dual H-Bridge |
| 輸出數量 | 2 (dual H-bridge) |
| Output Current (Continuous) | 0.7 A per bridge |
| Logic Supply Voltage (VCC) | 2.7 V to 5.6 V |
| Load Supply Voltage (VM) | 2.0 V to 6.8 V |
| Logic Interface | CMOS Parallel, 3.0 V/5.0 V compatible |
| Control Inputs | 4 (IN1, IN2, IN3, IN4) |
| On-chip Charge Pump | Yes (for high-side gate drive) |
| Shoot-Through Protection | Yes (built-in) |
| Undervoltage Shutdown | Yes |
| Junction Operating Temperature | -20 C to +150 C TJ |
| 封裝 | 24-QFN-EP (4x4 mm) with exposed thermal pad |
| 安裝類型 | Surface Mount |
| Process Technology | CMOS / Power MOSFET monolithic |
MPC17529EP 腳位配置
| 腳位 1 | IN1 — Logic input 1, controls OUT1A high-side |
| 腳位 2 | IN2 — Logic input 2, controls OUT1B high-side |
| 腳位 3 | OUT1A — H-bridge 1 output A |
| 腳位 4 | OUT1B — H-bridge 1 output B |
| 腳位 5 | GND — Ground |
| 腳位 6 | VM — Motor supply voltage (2.0-6.8 V) |
| 腳位 7 | VCC — Logic supply voltage (2.7-5.6 V) |
| 腳位 8 | NC — Not connected (per datasheet) |
| 腳位 9 | IN3 — Logic input 3, controls OUT2A high-side |
| 腳位 10 | IN4 — Logic input 4, controls OUT2B high-side |
| 腳位 11 | OUT2A — H-bridge 2 output A |
| 腳位 12 | OUT2B — H-bridge 2 output B |
| 腳位 13 | GND — Ground |
| 腳位 14 | VM — Motor supply voltage |
| 腳位 15 | NC — Not connected (per datasheet) |
| 腳位 16 | NC — Not connected (per datasheet) |
| 腳位 17 | NC — Not connected (per datasheet) |
| 腳位 18 | NC — Not connected (per datasheet) |
| 腳位 19 | GND — Ground |
| 腳位 20 | NC — Not connected (per datasheet) |
| 腳位 21 | NC — Not connected (per datasheet) |
| 腳位 22 | NC — Not connected (per datasheet) |
| 腳位 23 | NC — Not connected (per datasheet) |
| 腳位 24 | NC — Not connected (per datasheet) |
安全工作區 - Output Current vs Supply Voltage
典型應用
MPC17529EP 適用於 6 應用s: Camera Lens Autofocus Actuator, Disk Drive Head Positioner, Toy Robot DC Motor Drive, Bipolar Stepper Indexer, Portable Printer Paper Feed, Battery-Powered Valve Actuator.
Camera Lens Autofocus Actuator
The MPC17529EP drives the voice-coil motor (VCM) actuator that moves the lens group in compact camera modules. Each H-bridge outputs up to 0.7 A, enough to position a 6-gram lens stack with sub-100 ms settling time; the parallel 3.0/5.0 V logic interface connects directly to the image signal processor GPIO. The exposed thermal pad keeps junction temperature below 100 C at the 200 mA typical VCM bias, and the 4x4 mm QFN-EP fits beneath the lens barrel. The shoot-through protection prevents audible click noise during the millisecond-scale PWM current dithering used for fine focus adjustment.
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Disk Drive Head Positioner
The MPC17529EP is ideally suited to the voice-coil actuator that positions the read/write head on the rotating platter in 1.8-inch and 2.5-inch disk drives. Its 0.7 A continuous output current handles the seek-current transient while the parallel logic interface accepts the seek-direction command from the drive controller without any serial-protocol overhead. The on-chip charge pump and shoot-through protection eliminate the need for external bootstrap components, reducing PCB area around the actuator flex cable. Operating from a single 3.3 V rail, the part fits the 5 V tolerant head-stack assembly designs still common in legacy enterprise storage.
推薦
Toy Robot DC Motor Drive
The MPC17529EP is a strong fit for low-cost toy robots that use two small brushed DC motors for differential drive. Its 2.0-6.8 V motor supply range is compatible with 2x AA or 2x AAA battery packs, and the parallel logic interface lets a low-cost 8-bit MCU command forward, reverse, and brake with four GPIO pins. The 0.7 A per-bridge rating covers the 200-400 mA typical stall current of small Mabuchi-style toy motors. The exposed-pad QFN-EP package keeps the BOM cost down by removing the need for a heatsink, and the built-in shoot-through protection prevents the magic-smoke failures common in cheap H-bridge designs.
推薦
Bipolar Stepper Indexer
The MPC17529EP can drive a small 20-30 mm bipolar stepper motor for point-of-sale printers, camera sliders, or syringe pumps. With both H-bridges tied to the two windings, the parallel interface allows full-step and half-step commutation in firmware. The 0.7 A continuous current supports NEMA 8 and NEMA 11 frame motors with per-phase ratings up to 0.6 A. The exposed thermal pad must be soldered to a 1 square inch copper pour to handle the 0.6 A x 0.6 A x Rds_on thermal budget during continuous rotation. The on-chip charge pump eliminates the need for external bootstrap capacitors, simplifying the BOM.
推薦
Portable Printer Paper Feed
The MPC17529EP drives the paper-feed stepper motor in handheld receipt and label printers. The 2.0-6.8 V load supply range accepts a 2S Li-ion pack (6.0-8.4 V) after a simple LDO down-conversion, while the 2.7-5.6 V logic supply matches the 3.3 V MCU. Each H-bridge delivers the 0.5-0.6 A peak current needed to start a paper advance from a stalled state. The 24-QFN-EP exposed pad handles the intermittent 1 A peak surges during paper tear-off without overheating. The parallel interface avoids the I2C/SPI overhead, allowing real-time microstepping for quiet operation.
推薦
Battery-Powered Valve Actuator
The MPC17529EP drives a small solenoid or rotary valve actuator in portable medical or industrial flow-control equipment. The 0.7 A output current is sufficient for 6-12 V latching solenoid valves at 50% duty cycle, and the low quiescent current preserves battery life in standby. The parallel interface lets the host MCU power-down the driver between actuation events, while the shoot-through protection ensures long-term reliability in the inductive-load environment. The exposed thermal pad distributes heat during the 200-500 ms valve-open pulses. Operation from a single Li-ion cell (3.0-4.2 V) matches the rest of the portable instrumentation power tree.
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推薦產品摘要
工程參考資料，適用於 MPC17529EP — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC17510EP | MPC17531EP | MPC17529EFE |
|---|---|---|---|---|
| Package | 24-QFN-EP (4x4 mm) | 24-QFN-EP - same | 24-QFN-EP - same | 24-QFN-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Topology | Dual H-Bridge | Dual H-Bridge | Dual H-Bridge | Dual H-Bridge |
| Continuous Output Current (per bridge) | 0.7 A | 0.4 A | 1.0 A | 0.7 A |
| Logic Supply Voltage (VCC) | 2.7 V to 5.6 V | 2.7 V to 5.6 V | 2.7 V to 5.6 V | 2.7 V to 5.6 V |
| Motor Supply Voltage (VM) | 2.0 V to 6.8 V | 2.0 V to 6.8 V | 2.0 V to 6.8 V | 2.0 V to 6.8 V |
| Logic Interface | Parallel 3.0/5.0 V CMOS | Parallel 3.0/5.0 V CMOS | Parallel 3.0/5.0 V CMOS | Parallel 3.0/5.0 V CMOS |
| On-chip Charge Pump | Yes | Yes | Yes | Yes |
| Shoot-through Protection | Yes | Yes | Yes | Yes |
| Temperature Grade | -20 C to +150 C TJ | -20 C to +150 C TJ | -20 C to +150 C TJ | -40 C to +85 C (extended industrial) |
主要差異化特點
- Lowest-cost NXP dual H-bridge in 24-QFN-EP (4x4 mm) (對比MPC17531EP)
- Higher current than the lower-cost MPC17510EP (對比MPC17510EP)
- On-chip charge pump eliminates bootstrap capacitors (對比TB6612FNG (Toshiba))
設計說明
Estimated: At VM=5.0 V, VCC=3.3 V, and 0.7 A continuous output per bridge, each H-bridge dissipates approximately I^2 x Rds_on. With typical Rds_on of 1.0 ohm, that is 0.49 W per bridge or 0.98 W for both bridges active. The 24-QFN-EP with a 1 square inch copper pour yields theta_JA of approximately 40 C/W, so junction temperature rises 39 C above ambient. A small copper pour (under 0.5 sq inch) will push the part above 100 C at 0.7 A continuous; always design the exposed pad footprint for at least 1 sq inch of continuous top-side copper tied to GND.
Place the VCC decoupling capacitor (1 uF X7R ceramic) within 2 mm of the VCC pin, and the VM decoupling capacitor (10 uF X5R or larger) within 2 mm of the VM pin. The exposed pad must be soldered to a continuous ground plane using an array of thermal vias (0.3 mm diameter, 1 mm pitch) for heat transfer. Keep motor output traces (OUT1A/B, OUT2A/B) away from the logic input traces (IN1-IN4) to prevent capacitive coupling from causing false triggering of the input logic during PWM transitions.
Do not leave the IN1-IN4 logic inputs floating; tie them to a defined logic level (VCC or GND) through 100 kohm pull resistors if the host MCU pins start in high-impedance. Never reverse the VCC and VM supply connections - the part will be damaged. The shoot-through protection prevents cross-conduction but does not protect against output short circuits to VM or GND; an external fuse or PTC is recommended in fault-prone environments. Do not exceed the -0.3 V to +7.0 V absolute maximum rating on any pin.
合規資訊
RoHS compliant and lead-free per NXP product documentation (as of 2026-10-15). Not AEC-Q100 qualified; for automotive applications, consult NXP for equivalent AEC-Q100-graded H-bridge parts. REACH SVHC declaration available on the NXP product page.
