MPC8241LZQ266D - PowerPC 603e MPU, 266 MHz, 357-PBGA | NXP
MPN： MPC8241LZQ266D ⚠ 最後購買機會MPC8241LZQ266D 概覽
An Integrated Host Processor (also called an integrated communications processor or PowerQUICC II) is a category of system-on-chip that merges a CPU core, a system / peripheral bus bridge, and memory-control logic into one silicon die. The hypernym hierarchy runs: microprocessor -> MPU -> integrated host processor -> PowerQUICC II -> communications SoC. The MPC8241 belongs to the MPC82xx (PowerQUICC II) family, originally introduced by Motorola, transferred to Freescale Semiconductor, and now maintained by NXP Semiconductors.
Key features include a 266 MHz PowerPC 603e core delivering 266 MIPS of integer performance, a 64-bit SDRAM memory controller with ECC support, a 32-bit PCI v2.2-compatible bridge operating up to 66 MHz, and an integrated DMA engine with four channels. The device supports both 60x and local-bus peripherals, provides two I2C controllers, and integrates a 32-bit address / 64-bit data SDRAM interface.
Architecturally the part uses a 0.25 micrometer CMOS process, separate core and I/O voltage domains (1.8 V core, 3.3 V I/O) to reduce power dissipation, and a Harvard-style split I/D cache. The on-chip PCI bridge eliminates the need for a discrete PCI controller chip, allowing engineers to connect standard PCI peripherals directly to the host.
Typical applications include industrial routers and network gateways, RAID and storage controllers, embedded single-board computers, telecom line cards, printing and imaging controllers, and PCI-based peripheral expansion boards. The combination of PowerPC processing, integrated PCI, and SDRAM control suits mid-range embedded designs that need deterministic real-time behaviour.
When designing with this part, ensure the dual-rail supply sequence matches the datasheet (typically core first, then I/O). The 25 x 25 mm PBGA requires a 1.27 mm pitch PCB land pattern and at least six PCB layers for the power/ground and SDRAM-trace routing. Decoupling follows the PowerQUICC II reference design, with one bulk cap per voltage pin plus high-frequency ceramics.
This page synthesizes distributor pricing, same-family and cross-reference drop-in alternatives, and practical design notes not found on a single manufacturer page.
直接替換替代品，適用於 MPC8241LZQ266D — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8241LZQ266D （相同外形與佔位） — 差異在於 Operating Temperature, Memory Controller, Package, Series, Core Frequency.
MPC8241LVR266D
✅ 直接替換聯絡詢價
查看資料表 →MPC8241LZQ200D
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MPC8241LZQ266DR2
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8241LZQ266D 最大額定值與電氣特性
| Manufacturer | NXP (formerly Freescale / Motorola) |
| Series | PowerQUICC II (MPC82xx) |
| Core | PowerPC 603e |
| Bit Width | 32-bit |
| Core Frequency | 266 MHz |
| Performance | 266 MIPS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.25 micrometer CMOS |
| Number of Cores | 1 |
| 封裝 | 357-PBGA (25 x 25 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0 C to 105 C |
| PCI Bridge | PCI v2.2 up to 66 MHz, 32-bit |
| Memory Controller | 64-bit SDRAM with ECC |
| DMA Engine | 4 channels |
| Bus Support | 60x bus and local bus |
| I2C Controllers | 2 |
| Lead Status | Contains Lead (per NXP product page) |
| Packaging | Tray |
MPC8241LZQ266D 357-pbga (25 x 25 mm) 腳位配置指南
MPC8241LZQ266D（357-pbga (25 x 25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8241LZQ266D.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8241LZQ266D 適用於 6 應用s: Industrial Router / Network Gateway, RAID / Storage Controller, Telecom Line Card / Embedded SBC, Printing and Imaging Controller, PCI Expansion / Peripheral Card, Legacy Embedded System Maintenance.
Industrial Router / Network Gateway
The MPC8241LZQ266D's 266 MHz PowerPC 603e core and integrated PCI bridge make it a fit for industrial router designs where deterministic packet handling and PCI-attached NICs are required. The on-chip 64-bit SDRAM controller with ECC supports large routing tables without external memory glue logic. The 0 to 105 C operating temperature covers factory-floor cabinets, and the dual 1.8 V core / 3.3 V I/O supply simplifies integration with standard PHY and magnetics. Compared with a discrete CPU-plus-PCI-controller solution, this single-chip integration reduces board area and EMI.
推薦
RAID / Storage Controller
The MPC8241LZQ266D's 4-channel DMA engine and 64-bit SDRAM controller make it suitable for RAID controller cards where high-throughput data movement and ECC-protected buffer storage are essential. The PCI v2.2 bridge running at 66 MHz provides a standard host-side interface for desktop or server RAID products. Hardware ECC on the SDRAM interface protects against soft errors in long-running storage applications. The 266 MIPS integer performance is adequate for command queuing and XOR-acceleration firmware.
推薦
Telecom Line Card / Embedded SBC
The MPC8241LZQ266D's combination of PowerPC processing and PCI expansion suits telecom line cards and embedded single-board computers that need to drive PCI-based mezzanine cards. The 60x and local bus interfaces allow connection to legacy or custom peripherals alongside the PCI domain. The 1.8 V / 3.3 V split rail reduces power dissipation compared with older 5 V designs, important for sealed enclosures. The integrated peripherals (two I2C controllers, four DMA channels) shrink the BOM count for cost-sensitive SBCs.
推薦
Printing and Imaging Controller
Printer and imaging controller designs benefit from the MPC8241LZQ266D's deterministic real-time performance and rich DMA and bus connectivity. The PCI bridge connects to scanner engines and image-processing accelerators, while the SDRAM controller buffers large page images at high bandwidth. The PowerPC 603e's integer performance handles raster image processor (RIP) workloads efficiently, and the integrated DMA offloads page-description-language parsing. The 357-PBGA footprint supports compact PCI-card form factors used in print engines.
推薦
PCI Expansion / Peripheral Card
The MPC8241LZQ266D can act as the host CPU on PCI expansion cards such as data-acquisition boards, software-defined-radio front-ends, or industrial I/O cards. The PCI v2.2 bridge supports both initiator and target roles, allowing custom peripherals to communicate with the host system. The local bus connects to FPGA or ASIC companion devices, and the 32-bit/64-bit SDRAM interface provides high-bandwidth local memory. This makes the part a flexible platform for PCI-based proprietary I/O products.
推薦
Legacy Embedded System Maintenance
The MPC8241LZQ266D is widely used to maintain deployed legacy embedded systems where the PowerPC firmware cannot be easily ported to a newer architecture. Existing real-time operating systems (VxWorks, Linux 2.6 PowerPC, etc.) and toolchains remain available through NXP's long-term support channels. The integrated peripherals match the original reference design, allowing direct board-replacement without firmware changes. For new designs, however, migrating to QorIQ Layerscape or ARM Cortex-A SoCs is recommended.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8241LZQ266D — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8241LVR266D | MPC8241LZQ200D | MPC8241LZQ266DR2 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (different grade/suffix) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Core Frequency | 266 MHz | 266 MHz | 200 MHz (-25%) | 266 MHz |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| PCI Bridge | PCI v2.2 / 66 MHz | PCI v2.2 / 66 MHz | PCI v2.2 / 66 MHz | PCI v2.2 / 66 MHz |
主要差異化特點
- Same-package, same-clock alternate source (對比MPC8241LVR266D)
- Lower-cost 200 MHz same-footprint option (對比MPC8241LZQ200D)
- Tape-and-reel packaging for high-volume assembly (對比MPC8241LZQ266DR2)
設計說明
The MPC8241LZQ266D requires two independent rails - 1.8 V for the core and 3.3 V for I/O - sequenced core-first per the datasheet. Place one bulk tantalum or polymer cap (47 to 100 uF) per rail close to the BGA, plus 0.1 uF and 0.01 uF ceramics on each power pin pair. The estimated core current at 266 MHz is roughly 500 to 700 mA; the I/O rail draws additional current proportional to bus activity.
The 357-PBGA at 25 x 25 mm with 1.27 mm pitch needs at least a six-layer PCB to route the 64-bit SDRAM data bus, the 32-bit PCI bus, and the 60x bus without excessive vias. Use microvia or laser-drilled vias if the board house supports them, and keep the SDRAM trace lengths matched within the datasheet's stated skew. The exposed thermal pad (if present in the specific BGA variant) should be soldered to a continuous ground plane to aid heat spreading.
Do not assume the MPC8241LZQ266D is RoHS-compliant - the verified distributor data shows 'Contains Lead' for this suffix. Do not substitute the MPC8241TVR200D without verifying the ball-map, because the package suffix differs. Finally, confirm DDR/SDRAM compatibility - the MPC8241 supports SDR SDRAM with specific row/column addressing rules, not DDR memory; mixing the two will not work.
合規資訊
Lead-free status is 'No' / 'Contains Lead' per NXP product page per verified distributor data. RoHS non-compliant. AEC-Q100 not applicable - this is an industrial/telecom MPU, not an automotive-grade part.
