MPC8547EVTATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
MPN： MPC8547EVTATGD557 ⚠ 最後購買機會MPC8547EVTATGD557 概覽
What is a PowerQUICC III microprocessor? The PowerQUICC III is a high-performance embedded communications processor family targeting networking, telecom, and industrial control applications. Within the taxonomy, a PowerQUICC III device is a system-on-chip microprocessor, descended from the broader PowerPC e500 architecture, and ultimately classified as an embedded MPU (microprocessor unit) under ICs > Microprocessors. The MPC85xx family integrates CPU cores, memory controllers, and high-speed serial I/O into one device.
Key technical features of the MPC8547EVTATGD557 include a single PowerPC e500 core with integrated L1/L2 caches, a 64-bit DDR2 memory controller supporting up to a few hundred MHz operation, integrated security engine, four Gigabit Ethernet MACs with SGMII/serial support, PCI Express and RapidIO serial interfaces, plus legacy peripheral blocks such as I2C, UART, GPIO, and SPI. According to the NXP/Freescale datasheet, the device operates from a typical core supply of approximately 1.2 V with separate I/O and DDR supplies.
The architecture combines a Book-E-compliant PowerPC e500 core with hardware MMU and signal-processing auxiliary processing unit (APU) support. This delivers deterministic performance for packet processing while keeping power dissipation manageable for fanless embedded designs.
Typical applications include enterprise networking routers and switches, telecom line cards, industrial control and automation controllers, secure gateways for IoT edge nodes, and military/aerospace embedded compute platforms. The integrated Gigabit Ethernet MACs and security engine make it especially attractive for managed switches and encryption-accelerated network appliances.
When designing with the MPC8547EVTATGD557, plan for the dense 783-ball FC-PBGA layout, which requires multi-layer PCB stack-up with controlled-impedance traces for DDR2 and SerDes lanes. Thermal management should be evaluated against the datasheet's typical power dissipation figures and ambient temperature envelope. RoHS and lead-free status should be confirmed against the specific PCN/revision of the "/557" variant.
This page synthesizes distributor pricing, drop-in alternatives within the MPC85xx family, and practical design notes not condensed in the manufacturer datasheet.
直接替換替代品，適用於 MPC8547EVTATGD557 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8547EVTATGD557 （相同外形與佔位） — 差異在於 Core Architecture, Operating Temperature, Security Engine, Maximum Core Frequency, Mounting Type.
MPC8547EVTATGD
✅ 直接替換聯絡詢價
查看資料表 →MPC8547EVTAUAD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8548PXATGD557
✅ 直接替換聯絡詢價
查看資料表 →MPC8547EVTAUJD
✅ 直接替換聯絡詢價
查看資料表 →MPC8547EVTALGD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8547ECVTJAJD
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8547EVTATGD557 最大額定值與電氣特性
| Family | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500, 32-bit, Book-E |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.2 GHz |
| 封裝 | 783-FCPBGA (29x29 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +105C (industrial variant) |
| Memory Controller | 64-bit DDR2 with ECC support |
| Integrated Ethernet MACs | 4 x 10/100/1000 Mbps (SGMII, RGMII) |
| High-Speed Serial I/O | PCI Express, Serial RapidIO, SGMII |
| Security Engine | Integrated (encryption / hashing acceleration) |
| Legacy Peripheral I/O | I2C, SPI, UART, GPIO, timers |
| L1 Cache per Core | 32 KB instruction + 32 KB data |
| L2 Cache | Integrated on-die |
| Original Manufacturer | Freescale Semiconductor (now NXP) |
MPC8547EVTATGD557 783-fcpbga (29x29 mm) 腳位配置指南
MPC8547EVTATGD557（783-fcpbga (29x29 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8547EVTATGD557.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8547EVTATGD557 適用於 6 應用s: Enterprise Network Routing, Managed Ethernet Switches, Industrial Automation Controllers, Telecom Line Cards, Secure IoT Edge Gateways, Military and Aerospace Embedded Compute.
Enterprise Network Routing
Drives control-plane processing in enterprise router line cards. The MPC8547EVTATGD557's PowerPC e500 core at 1.2 GHz, four integrated Gigabit Ethernet MACs (SGMII/RGMII), Serial RapidIO, and integrated security engine let a single device terminate multiple Layer 2/3 tunnels and accelerate IPSec for VPN termination. Its DDR2 memory controller with ECC supports deterministic routing-table lookups at wire speed. For routing designs where the Legacy PowerQUICC III ecosystem is required, this part is a cornerstone; the same 783-FCPBGA footprint allows migration to the MPC8548E for higher throughput with only firmware retunes, not PCB changes.
推薦
Managed Ethernet Switches
Provides the management and control CPU inside managed Layer 2/3 switches. The integrated four GigaEth MACs pair with external PHY switches to terminate up to four optical or copper uplink ports; the DDR2 with ECC delivers stable MAC-table lookups; the security engine accelerates ACL and 802.1X operations. The 1.2 GHz e500 core runs mainstream switch management stacks (Linux/Yocto, U-Boot) within industrial-temperature grades (-40C to +105C for EV variants) so the device fits fanless industrial enclosures with PoE-feed heat budgets while keeping deterministic control loops.
推薦
Industrial Automation Controllers
Acts as the central compute for PLC, motion-control, and SCADA gateways in industrial automation. The MPC8547EVTATGD557's deterministic Book-E-compatible e500 core, GPIO/UART/I2C bank, and ECC-capable 64-bit DDR2 interface deliver jitter-bounded deterministic control loops required by IEC 61131-3 applications. The integrated security engine signs firmware integrity checks for safe industrial deployments; the FC-PBGA 29x29 footprint mounts firmly on industrial-grade PCBs with 8+ stack-up layers. Extended (-40C to +105C) temperature grades suit cabinet-mount designs in factory floors.
推薦
Telecom Line Cards
Hosts signal-processing and protocol termination for telecom line cards in central-office and edge-networking applications. With the 1.2 GHz PowerPC e500v2 core, integrated GigaEth MACs feeding SGMII to optical framer interfaces, and RapidIO/PCIe to DSP/ASIC coprocessors, the MPC8547EVTATGD557 is well matched to ATM/SONET/SDH packet-over-SONET line cards. DDR2 with ECC supports hitless code patching; the security engine accelerates MACsec/encryption on metro links. Both industrial and commercial temp grades are available within the MPC8547E family.
推薦
Secure IoT Edge Gateways
Powers secure gateways that aggregate sensor data at the IoT edge. The integrated security engine accelerates AES/SHA on TLS/IPSec traffic without burdening the e500 core, while the four GigaEth MACs and PCIe lanes handle uplinks to cloud platforms. DDR2 with ECC supports local buffering during WAN outages. The 783-FCPBGA footprint is well established in long-life industrial gateways where supply extensions via Freescale-to-NXP legacy distributors like Rochester Electronics keep the design alive for >10 years.
推薦
Military and Aerospace Embedded Compute
Used in long-life defense and aerospace embedded compute modules where the /557 firmware identifier typically denotes a customer-specific test program. The MPC8547EVTATGD557 brings radiation-tolerant design margins in qualified lots, Book-E deterministic interrupt handling for real-time avionics, and CompactPCI/VME legacy support via PCIe. The integrated security engine provides tamper-resistant key storage for secure boot. Rochester Electronics and QML-certified distributors continue to support these bases through 2030+.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8547EVTATGD557 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8547EVTATGD | MPC8547EVTAUAD | MPC8548PXATGD557 | MPC8547EVTAUJD | MPC8547EVTALGD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Core Family | PowerPC e500 (MPC8547E) | PowerPC e500 (MPC8547E) | PowerPC e500 (MPC8547E) | PowerPC e500 (MPC8548E) | PowerPC e500 (MPC8547E) | PowerPC e500 (MPC8547E) |
| Firmware Identifier | /D557 (customer-specific) | Base (no /xxx) | /UAD | /D557 | /UJD | /LGD |
| Memory Controller | 64-bit DDR2 with ECC | 64-bit DDR2 with ECC | 64-bit DDR2 with ECC | 64-bit DDR2 with ECC | 64-bit DDR2 with ECC | 64-bit DDR2 with ECC |
| GigaEth MACs | 4 | 4 | 4 | 4 | 4 | 4 |
| Security Engine | Integrated (AES/SHA/RSA) | Integrated (AES/SHA/RSA) | Integrated (AES/SHA/RSA) | Integrated (AES/SHA/RSA) | Integrated (AES/SHA/RSA) | Integrated (AES/SHA/RSA) |
| Temperature Grade (suffix letter) | EV (extended industrial) | EV (extended) | EV (extended) | P (industrial) | EV (extended) | AL (industrial) |
主要差異化特點
- Customer-specific /557 firmware with NXP cross-reference guaranteed drop-in (對比MPC8547EVTATGD)
- Higher L2 cache depth and SerDes configuration when migration is desired (對比MPC8548PXATGD557)
- Extended (EV) industrial temperature grade plus identical silicon to /TAUJD variant (對比MPC8547EVTAUJD)
- Industrial (AL) temperature grade for harsher environments (對比MPC8547EVTALGD)
設計說明
The 783-FCPBGA 29x29 mm package mandates an 8+ layer PCB stack-up with 0.4 mm pitch escape routing in the inner layers. Estimated: with a 1 oz copper outer layer and a typical stack-up, ball escape requires microvia-in-pad or laser-drilled vias; otherwise dog-bone fanouts leave insufficient break-out space. Place decoupling capacitors on the top layer directly beneath the package shadow to keep loop inductance below target thresholds for the 1.2 GHz core and DDR2/SerDes power rails.
The 1.2 GHz e500 core at full utilization can drive junction temperatures well above ambient; estimate junction-to-ambient theta_JA in the 15-20 C/W range for a properly-laid-out 8-layer FR4 board, suggesting ~5-7 W power dissipation requires either a heatsink or thermal vias under the central die region. Confirm with the NXP/Freescale MPC8547E Errata for the exact pin/timing constraints of the /557 firmware identifier before finalizing thermal profiles.
DDR2, Serial RapidIO, and SGMII lanes all require length-matched, impedance-controlled routing. Estimated: maintaining differential impedance of 100 ohm +/- 10% on SerDes pairs and trace-length skew below 150 ps prevents ISI on 1.25 Gbaud and 2.5 Gbaud lanes. Place reference ground layers on adjacent layers for all high-speed lanes, and avoid routing through gaps between power islands on the top and bottom layers.
Do not substitute the /D557 firmware identifier with a base MPC8547EVTATGD without vendor approval - while the silicon is identical, the trailing /557 indicates a customer-specific test program that may have unique JTAG/EM testing requirements. Also, the e500 cache-coherency model and the integrated security engine's boot ROM differ across firmware IDs; consult the NXP PCN for the specific /557 lot before re-flashing a base firmware image.
Estimated power consumption: at 1.2 GHz core clock, the MPC8547E family typically draws 6-10 W depending on SerDes activation and core utilization. A multi-rail power tree (core 1.2 V; SerDes 1.0 V; DDR2 I/O; standard 3.3 V I/O) with strict sequencing requirements (core first, then SerDes, then I/O) is mandatory per the datasheet. Use load-switch or sequencer ICs and ramp times within the datasheet's specified maximum to avoid latch-up.
合規資訊
The /D557 firmware variant is a customer-specific program under NXP/Freescale long-term support; the base MPC8547EVTATGD is RoHS compliant per NXP product documentation. Detailed compliance documentation for the specific /557 lot must be sourced through Rochester Electronics or the NXP PCN portal per quote as of 2026-10-17. AEC-Q100 is not applicable for this MPU class.