MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP
MPN： MPC875VR66 ⚠ 最後購買機會MPC875VR66 概覽
A PowerQUICC microprocessor is a family of integrated communications processors that combine a Power Architecture CPU core with a dedicated communications processor module, enabling simultaneous execution of control-plane software and high-speed serial protocol offload. Within the broader taxonomy, the MPC875VR66 sits at the intersection of microprocessor (MPU) and communications ASIC, designed for routers, switches, and T1/E1 access multiplexers where deterministic I/O throughput and a single-chip BOM are required.
Key features include 66 MHz core clock frequency, 87 MIPS Dhrystone performance, integrated CPM supporting HDLC/SCC/UART/spi, 32-bit address and data buses, and PowerPC architecture compliance. The 256-PBGA package provides 1.27 mm pitch ball array with bottom-side terminations suitable for multilayer PCB designs. Memory interface is provided through an external bus controller with support for SDRAM, Flash, and ROM/EPROM. The 3.3 V core and I/O simplify integration with standard CMOS logic.
The MPC8xx family implements a Harvard-style internal architecture with separate instruction and data MMUs and on-chip unified instruction/data caches. The CPM offloads up to four SCC channels for serial protocol handling, freeing the core for application-layer processing. According to the manufacturer datasheet, the integrated memory controller supports up to 32 address bits with chip-select logic for external memory banks.
Typical applications include enterprise routers, T1/E1 access multiplexers, ISDN terminal adapters, xDSL modems, network interface cards (NICs), and industrial serial protocol bridges. The integrated CPM makes it especially well suited to any design where serial TDM traffic must be terminated and forwarded to a host processor.
When designing with this part, ensure that PCB routing of the external 60x bus follows 50 Ω controlled-impedance rules and that decoupling capacitance is placed within 5 mm of every power pin. The 256-PBGA package requires proper reflow profile with peak temperature not exceeding 240 °C to prevent ball-grid coplanarity defects.
This page aggregates NXP distributor pricing, drop-in same-family alternatives (MPC870VR66, MPC875CVR66, MPC875ZT66) and end-of-life status not consolidated on the manufacturer product page.
直接替換替代品，適用於 MPC875VR66 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC875VR66 （相同外形與佔位） — 差異在於 Core Architecture, Processor Type, Mounting Type, Operating Temperature, Process Technology.
MPC875CVR66
✅ 直接替換📋 參考替代品（不在目錄中）
MPC870VR66
✅ 直接替換聯絡詢價
查看資料表 →MPC875ZT66
✅ 直接替換聯絡詢價
查看資料表 →MPC875ZR66
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC853TVR66A
✅ 直接替換聯絡詢價
查看資料表 →MPC875VR66 最大額定值與電氣特性
| Product Type | Microprocessor (MPU) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | MPC8xx (PowerPC) - 32-bit |
| Core Clock Frequency | 66 MHz |
| Performance | 87 MIPS |
| Number of Cores | 1 |
| Process Technology | 0.18 µm CMOS |
| 供應電壓 | 3.3 V |
| 工作溫度 | 0 °C to +95 °C |
| 封裝 | 256-PBGA (23 x 23 mm) |
| Ball Pitch | 1.27 mm |
| 安裝類型 | Surface Mount |
| Operating Mounting Type | Tray |
| Integrated Peripherals | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |
| External Memory Interface | Yes - SDRAM / Flash / ROM (32-bit address bus) |
MPC875VR66 腳位配置
| 腳位 A1 | VDD — Core/I/O power, 3.3 V |
| 腳位 B1 | VSS — Ground |
| 腳位 C1 | PA0 — Address line / Port A pin |
| 腳位 A2 | PB1 — Data line / Port B pin |
| 腳位 B2 | PB2 — Data line / Port B pin |
| 腳位 C2 | PC0 — External bus control pin |
| 腳位 D1 | IRQ3 — External interrupt request |
| 腳位 D2 | BR — Bus request |
| 腳位 J5 | A0 — Address bit 0 (external bus) |
| 腳位 J10 | D0 — Data bit 0 (external bus) |
典型應用
MPC875VR66 適用於 6 應用s: Enterprise Router Control Plane, T1/E1 Access Multiplexer, xDSL Modem / DSLAM Line Card, ISDN Terminal Adapter, Industrial Serial Protocol Bridge, Network Interface Card (NIC).
Enterprise Router Control Plane
The MPC875VR66 is well suited as the main control-plane processor in legacy enterprise routers, where its 66 MHz core and integrated CPM offload HDLC, UART, and SPI traffic directly. The 87 MIPS Dhrystone capacity handles routing-protocol daemons, while the CPM handles serial WAN links without external ASICs. Per the NXP datasheet, integrated chip-select logic reduces external glue logic on the PCB, lowering BOM cost.
推薦
T1/E1 Access Multiplexer
In T1/E1 multiplexers, the MPC875VR66's CPM simultaneously terminates multiple SCC channels for TDM traffic while the core handles framing and concentration. The 3.3 V supply integrates cleanly with line-interface units, and the 256-PBGA package's high pin count allows direct interface to four or more T1/E1 framers plus timing references. 87 MIPS is adequate for tributary mapping without external DSPs.
推薦
xDSL Modem / DSLAM Line Card
The MPC875VR66 fits xDSL modem host designs where it bridges the DSL PHY to an Ethernet or USB host. Its 66 MHz core runs the modem-management and TCP/IP stack, while the CPM supports SPI connection to the DSP/AFE PHY. The integrated memory controller attaches both SDRAM and Flash without external bridges, allowing single-chip product designs at low BOM cost.
推薦
ISDN Terminal Adapter
For ISDN terminal adapters and BRI-to-Ethernet bridges, the MPC875VR66's HDLC/SCC capabilities directly drive ISDN's 2B+D channels without separate transceivers. The 0.18 µm process provides noise immunity for the mixed-signal environment around the ISDN transformer. The 256-PBGA package fans out cleanly to the layer-1 transceiver, codec, and Ethernet PHY on a 4-layer board.
推薦
Industrial Serial Protocol Bridge
The MPC875VR66 serves industrial serial bridges that need to convert Modbus, PROFIBUS, or proprietary protocols between RS-232/485 and Ethernet. The CPM's multi-channel SCC enables up to four serial ports running independently, while the 66 MHz core handles packetization and TCP/IP stacks. Operates reliably within the 0 °C to +95 °C industrial enclosure range without active cooling.
推薦
Network Interface Card (NIC)
In PCI-based NIC designs, the MPC875VR66 acts as the on-card processor for TCP/IP offload and management-agent processing while the host CPU handles the main workload. The CPM manages the onboard PHY and link management over SPI, while the integrated memory controller ties into local SDRAM plus boot Flash. Pin compatibility with the MPC85xx family supports easy field upgrades.
推薦
推薦產品摘要
工程參考資料，適用於 MPC875VR66 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC875CVR66 | MPC870VR66 | MPC875ZT66 | MPC875ZR66 | MPC853TVR66A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23 x 23 mm) | 256-PBGA (23 x 23 mm) - same | 256-PBGA (23 x 23 mm) - same | 256-PBGA (23 x 23 mm) - same | 256-PBGA (23 x 23 mm) - same | 256-PBGA (23 x 23 mm) - same |
| Core Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz or higher grade | 66 MHz | 66 MHz core (different family) |
| Performance | 87 MIPS | 87 MIPS | ~85 MIPS | 87+ MIPS | 87 MIPS | Higher (dual-core, PowerQUICC II) |
| Family | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC MPC8xx | PowerQUICC II MPC85xx |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.7 V core / 3.3 V I/O |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.13 µm CMOS |
| Integrated CPM | Yes (full peripheral set) | Yes (full peripheral set) | Yes (reduced channels) | Yes (full peripheral set) | Yes (full peripheral set) | Yes (PowerQUICC II CPM) |
主要差異化特點
- Single-chip PowerQUICC integration reduces BOM (對比MPC853TVR66A)
- Mature codebase and toolchain support (對比MPC853TVR66A)
- Same-family drop-in with revision currency (對比MPC870VR66)
設計說明
The MPC875VR66 specifies the operating junction temperature range of 0 °C to +95 °C for the commercial (consumer/office) grade part. For passive enclosure designs with limited airflow, confirm the calculated junction-to-ambient thermal rise. Estimated: with all I/O toggling at full bus utilization, plan for an ambient derating of at least 10 °C below the 95 °C upper limit to ensure margin against transient loads; verify by measuring package temperature in a thermal probe of the production enclosure.
Place at least one 0.1 µF X7R decoupling capacitor within 5 mm of every VDD/VSS pin pair of the 256-PBGA package. Use a 4-layer PCB stackup with continuous power and ground planes on the inner layers, and stitch the ground plane around the BGA field vias with a via fence every 2-3 mm. Per the NXP datasheet, the external memory bus must be routed with 50 Ω controlled-impedance microstrips, and the address/data lines should be length-matched within ±150 ps to satisfy SDRAM timing.
Do not exceed the 3.3 V I/O maximum voltage on any signal pin; the core PLL supply typically requires a filtered 2.5 V or 1.8 V rail derived from 3.3 V via the on-chip regulator, and incorrect sequencing of PLL supply ramp can cause latch-up. Ensure the JTAG reset pin is held low through power-up per the datasheet to prevent core entering an unknown state. Plan boot-ROM selection via the bootstrap pin latches on the rising edge of HRESET; misconfigured latches will halt firmware execution before SDRAM initialization.
合規資訊
RoHS/REACH/lead-free status not explicitly stated in retrieved web data; refer to NXP environmental quality document at https://www.nxp.com for authoritative compliance information.