PI7C8150DNDE - 2-Port PCI Bridge | Diodes Incorporated
MPN： PI7C8150DNDE ✓ 啟用中PI7C8150DNDE 概覽
A PCI-to-PCI bridge is an interface IC that connects two PCI domains or links within a computer system. It belongs to the broader PCI interface family, specialized interface controllers, and semiconductor hierarchy. Rather than providing a general-purpose processor function, this component translates and coordinates PCI traffic between compatible bus interfaces while preserving the electrical signaling required by the PCI architecture.
The PI7C8150DNDE provides two PCI ports in a single package, reducing the number of discrete bridge devices needed when a system requires more than one interconnection path. Its 3 V to 3.6 V operating supply range supports conventional 3.3 V system rails. The 256-BGA package also offers a high pin count for routing the numerous address, data, control, clock, and power connections associated with two PCI interfaces.
As an asynchronous bridge, the device is intended for systems in which the linked PCI interfaces do not share a common clock domain. This makes it useful in embedded computers, industrial controllers, communication appliances, and legacy PCI expansion systems where two PCI resources must be connected through a dedicated bridge. The exact bridge mode, protocol timing, and supported host configurations should be confirmed against the manufacturer datasheet before implementation.
The 256-BGA package is a surface-mount solution intended for multilayer PCB assembly. Its 17 mm by 17 mm footprint allows access to the package's high pin count, but it also requires careful escape routing, power-plane distribution, and thermal design. Tube packaging is appropriate for production processes that use a compatible component-placement and tray-handling sequence.
Designers should pay particular attention to signal integrity when routing the PCI bus through a fine-pitch BGA. Use continuous reference-plane return paths, minimize stub branches, apply device-decoupling recommendations, and observe the manufacturer layout requirements for the package. Because this is a complex interface IC rather than a power component, SOA is not applicable, and thermal qualification depends on the complete board environment.
This product summary combines the verified package, supply-voltage, port-count, packaging, and environmental attributes with practical guidance for PCI bridge implementation, BGA layout, and system integration. It also identifies the absence of confirmed drop-in substitutes so engineers can validate interchangeability against electrical and pin-level requirements before redesigning a production PCB.
直接替換替代品，適用於 PI7C8150DNDE — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此產品無可直接替換的替代品。
申請替代品PI7C8150DNDE 最大額定值與電氣特性
| Product Type | Asynchronous PCI-to-PCI bridge |
| PCI Port Count | 2 ports |
| Supply Voltage Range | 3 V to 3.6 V |
| Interface Category | Specialized interface IC |
| 封裝 | 256-BGA |
| Package Dimensions | 17 mm x 17 mm |
| 安裝類型 | Surface mount |
| Packaging | Tube |
| Lead-Free Status | Lead-free |
| RoHS 狀態 | Compliant |
PI7C8150DNDE 17 mm x 17 mm 腳位配置指南
PI7C8150DNDE（17 mm x 17 mm 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： PI7C8150DNDE.
請參閱 資料表 以查看完整腳位配置。
典型應用
PI7C8150DNDE 適用於 6 應用s: Embedded PCI Controller Expansion, Industrial Control Systems, Communication Appliances, Legacy PCI Expansion Systems, Data Acquisition Equipment, High-Density Embedded PCI Platforms.
Embedded PCI Controller Expansion
The PI7C8150DNDE fits embedded computer architectures that need to connect two PCI resources through a dedicated asynchronous bridge. Its two-port configuration provides a practical way to add a secondary PCI path without distributing the bridge function across discrete devices. The 3 V to 3.6 V operating range aligns with a 3.3 V system rail. Before schematic capture, confirm the host topology, bridge mode, clock relationship, and PCI timing limits in the manufacturer datasheet.
Industrial Control Systems
Industrial controllers can use the PI7C8150DNDE when legacy PCI expansion must coexist with a modern control system architecture. The device's two asynchronous PCI ports allow two compatible bus segments to be linked through one specialized interface IC. Its 256-BGA package supports dense multilayer routing, while the 3 V to 3.6 V supply range supports conventional embedded power rails. System qualification should also account for operating temperature and industrial program requirements.
Communication Appliances
Communication appliances with multiple PCI resource requirements can benefit from the PI7C8150DNDE's integrated two-port asynchronous PCI bridge. Consolidating the interconnect into one device simplifies system partitioning compared with using separate bridge implementations for each PCI domain. The 17 mm by 17 mm BGA provides many external connections, although it requires careful escape routing and continuous return planes. Validate arbitration, interruption, power, and clocking behavior against the target platform architecture.
Legacy PCI Expansion Systems
The PI7C8150DNDE is applicable to legacy PCI expansion systems that need an asynchronous bridge between PCI-compatible domains. Its two-port organization supports controlled interconnection of expansion resources in embedded platforms where a single host controller cannot directly support the required topology. Because legacy PCI designs commonly depend on precise timing and signal-integrity margins, engineers should follow the manufacturer reference layout and verify all acyclic relationships before fabrication.
Data Acquisition Equipment
Data-acquisition and instrumentation equipment can use the PI7C8150DNDE to connect PCI-compatible measurement or processing resources through an asynchronous two-port bridge. This arrangement can isolate two PCI segments while preserving a structured connection between them. The device's 3 V to 3.6 V operating range is compatible with a 3.3 V rail, and the 256-BGA package limits board area despite its large pin count. Validate transfer performance, bus ownership, and interrupt behavior in the final system.
High-Density Embedded PCI Platforms
High-density embedded platforms benefit from the PI7C8150DNDE when two PCI paths are required but routing space is constrained. A single 256-BGA bridge combines the package footprint of two interconnected ports rather than requiring separate bridge packages and associated routing. The package still demands multilayer assembly, via transitions, and high-density escape routing. Coordinate the land pattern, paste stencil, reflow profile, and X-ray inspection requirements with the selected PCB assembly process.
工程參考資料，適用於 PI7C8150DNDE — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 |
|---|---|
| Package | 256-BGA |
| Brand | Diodes Incorporated |
| Product Type | Asynchronous PCI-to-PCI bridge |
| PCI Port Count | 2 ports |
| Supply Voltage Range | 3 V to 3.6 V |
| Package Dimensions | 17 mm x 17 mm |
| Mounting Type | Surface mount |
| Packaging | Tube |
| Lead-Free Status | Lead-free |
| RoHS Status | Compliant |
主要差異化特點
- Two PCI connections in one bridge device (對比No confirmed drop-in alternative was identified)
- Compact high-density integration (對比No confirmed drop-in alternative was identified)
- Conventional embedded supply range (對比No confirmed drop-in alternative was identified)
設計說明
The 256-BGA footprint requires a deliberate multilayer escape strategy. Route each BGA ball through the shortest practical path to the corresponding PCI signal, maintain a continuous reference plane beneath the device, and avoid long copper stubs that create unnecessary reflections. PCI edge rates make signal-integrity continuity more important than cosmetic trace reduction. Follow the manufacturer package drawing and reference-layout guidance when defining pad, via, and solder-mask geometry.
Implement separate power and ground connections exactly as shown in the manufacturer datasheet, and place local high-frequency bypass capacitors close to their associated BGA power balls. The PI7C8150DNDE operates across a 3 V to 3.6 V supply range, so the rail must remain within that limit under transient and tolerance conditions. Use plane stitching and adequate vias to control return-path impedance and prevent localized current concentration during bus activity.
Treat every PCI connection as a high-speed signal path rather than a conventional low-speed logic route. Match trace geometry where practical, maintain consistent reference-plane transitions, and prevent split planes beneath active nets. Avoid adding test pads or routing stubs on sensitive paths unless their loading has been evaluated. Validate the completed layout with the intended processor platform and peripheral devices because compliant component placement alone does not guarantee system-level timing closure.
A matching 256-BGA package does not establish drop-in compatibility for a replacement device. Check every ball assignment, supply name, clock input, reset behavior, arbitration signal, and configuration strap before considering a substitute. The two asynchronous PCI ports also impose topology requirements that cannot be inferred from the package outline. Schematic and layout reviews should be performed as separate gates to prevent footprint reuse from creating an electrical incompatibility.
合規資訊
The PI7C8150DNDE is identified as lead-free and RoHS compliant. No qualification standard, halogen-free declaration, REACH status, or conflict-minerals declaration is stated.
