PIC16F15355-E/ML - 8-Bit 32MHz 14KB Flash MCU 28-QFN | Microchip
MPN： PIC16F15355-E/ML ✓ 啟用中PIC16F15355-E/ML 概覽
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (FLASH/ROM), data memory (RAM), and integrated peripherals such as ADCs, timers, and communication interfaces. Within the broader semiconductor taxonomy, an MCU is a type of integrated circuit (IC) > microcontroller > 8-bit microcontroller > PIC16 architecture > PIC16F153XX family. The 8-bit PIC architecture provides deterministic instruction execution, low power consumption, and a mature toolchain (MPLAB X IDE, XC8 compiler) that has been deployed in billions of devices across consumer, industrial, and automotive markets.
Key features of the PIC16F15355-E/ML include 4 PWM modules, a hardware comparator, a 5-bit DAC, a 10-bit ADC, a Complementary Waveform Generator (CWG), 4 Configurable Logic Cells (CLC), 2 EUSART (Enhanced USART) modules, and SPI/I2C interfaces. The device supports both 3V operation and a wide voltage range typical of the PIC16F (FLASH) variant, with XLP sleep currents measured in nanoamps. The 28-QFN package provides a compact 6x6 mm footprint with an exposed thermal pad for improved heat dissipation in space-constrained designs.
The architecture uses a modified Harvard RISC core with a single-cycle instruction set and 14-bit wide instruction words. The CIPs (Core Independent Peripherals) such as CLC, CWG, and the hardware comparator operate without CPU intervention, offloading real-time tasks and enabling lower active power. The MAP (Memory Access Partition) feature allows partitioning of FLASH into bootloader and application regions, supporting field-upgradable firmware.
Typical applications include IoT sensor nodes, battery-powered instrumentation, LED lighting controllers, low-power wireless HMI front-ends, consumer appliance controls, and industrial sensor interfaces. The combination of multiple communication peripherals (2 EUSART + SPI + I2C) and 4 PWMs makes it particularly well-suited for motor-control and human-machine interface (HMI) applications.
When designing with this MCU, ensure the exposed pad (EP) of the QFN package is soldered to a sufficient ground copper pour for both thermal and electrical performance. Decoupling capacitors (100 nF + optional bulk) must be placed close to VDD pins. Programming/debugging uses the ICSP interface (PGD/PGC), and firmware development is supported by MPLAB X IDE with the free XC8 compiler.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing a single-source reference for procurement and design engineers evaluating the PIC16F15355-E/ML.
直接替換替代品，適用於 PIC16F15355-E/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16F15355-E/ML （相同外形與佔位） — 差異在於 Package, Program Memory (Flash), DAC, PWM Channels, Comparators.
PIC16F15354-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F15325-E/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16F15345-E/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16F15376-E/ML
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC16F15255-I/SP
✅ 直接替換聯絡詢價
查看資料表 →PIC16F15355-E/ML 最大額定值與電氣特性
| Core Architecture | PIC16 8-bit RISC |
| Program Memory (FLASH) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB (1024 bytes) |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 2.3V to 5.5V (PIC16F variant) |
| 封裝 | 28-pin QFN (6x6 mm) with exposed pad |
| ADC | 10-bit |
| DAC | 5-bit |
| PWM Modules | 4 |
| Comparators | Yes (hardware) |
| EUSART | 2 |
| SPI / I2C | Yes (1x SPI, 1x I2C) |
| CLC (Configurable Logic Cells) | 4 |
| CWG (Complementary Waveform Generator) | Yes |
| 工作溫度範圍 | -40C to +125C (E = Extended) |
| 安裝類型 | Surface Mount (QFN) |
| RoHS 狀態 | Compliant |
PIC16F15355-E/ML 腳位配置
| 腳位 1 | RA5 — GPIO / ADC input |
| 腳位 2 | RA4 — GPIO |
| 腳位 3 | RA3 — GPIO / MCLR |
| 腳位 4 | RA2 — GPIO / analog |
| 腳位 5 | RA1 — GPIO / analog |
| 腳位 6 | RA0 — GPIO / analog / ICSPDAT |
| 腳位 7 | VSS — Ground |
| 腳位 8 | RA7 — GPIO / OSC1 |
| 腳位 9 | RA6 — GPIO / OSC2 |
| 腳位 10 | RC0 — GPIO |
| 腳位 11 | RC1 — GPIO |
| 腳位 12 | RC2 — GPIO |
| 腳位 13 | RC3 — GPIO / SCL |
| 腳位 14 | RC4 — GPIO / SDA |
| 腳位 15 | RC5 — GPIO |
| 腳位 16 | RC6 — GPIO / TX |
| 腳位 17 | RC7 — GPIO / RX |
| 腳位 18 | RB7 — GPIO / ICSPCLK |
| 腳位 19 | RB6 — GPIO / ICSPDAT |
| 腳位 20 | RB5 — GPIO |
| 腳位 21 | RB4 — GPIO |
| 腳位 22 | RB3 — GPIO |
| 腳位 23 | RB2 — GPIO |
| 腳位 24 | RB1 — GPIO |
| 腳位 25 | RB0 — GPIO / PWM |
| 腳位 26 | VDD — Power supply |
| 腳位 27 | VSS — Ground |
| 腳位 28 | VDD — Power supply |
典型應用
PIC16F15355-E/ML 適用於 6 應用s: IoT Sensor Node Controller, Battery-Powered Instrumentation, LED Lighting and Signage Controller, Consumer Appliance Control Panel, Industrial Sensor Interface Module, Low-Power Wireless HMI Front-End.
IoT Sensor Node Controller
The PIC16F15355-E/ML is well-suited for IoT sensor node controllers because of its nanoamp XLP sleep current, 32 MHz active performance for periodic sensor reads, and integrated 10-bit ADC. The 14 KB FLASH accommodates small wireless stacks (e.g., LoRaWAN or proprietary protocols) and bootloader MAP partitioning. The 4 PWMs and 2 EUSART allow simultaneous sensor sampling and wireless module interfacing on the same 28-QFN footprint, reducing BOM versus discrete solutions.
推薦
Battery-Powered Instrumentation
For battery-powered instrumentation, the PIC16F15355-E/ML provides XLP sleep modes measured in nanoamps, extending coin-cell battery life to multiple years. The 4 Configurable Logic Cells (CLC) and Complementary Waveform Generator (CWG) offload real-time waveform tasks from the CPU, allowing the core to remain in sleep until interrupt wake-up. The 5-bit DAC supports analog trimming, and the 28-QFN 6x6 mm footprint fits miniaturized handheld enclosures.
推薦
LED Lighting and Signage Controller
The PIC16F15355-E/ML drives multi-channel LED lighting and signage through its 4 PWM outputs and CWG for high-resolution dimming. The 32 MHz clock supports up to 16-bit PWM resolution when multiple channels are time-multiplexed, while CIPs (CLC, comparator) handle fault detection and over-current protection autonomously. The 28-QFN package provides good thermal dissipation for moderate-load LED driver circuits.
推薦
Consumer Appliance Control Panel
In consumer appliance control panels (washing machines, microwave ovens, induction cookers), the PIC16F15355-E/ML integrates the HMI logic, sensor acquisition, and communication in one 28-QFN chip. The 2 EUSART interfaces support simultaneous communication with motor controllers and external displays, while the 10-bit ADC reads temperature and current sensors. The 14 KB FLASH accommodates multiple menu languages and safety protocol state machines.
推薦
Industrial Sensor Interface Module
The PIC16F15355-E/ML serves industrial 4-20 mA loop-powered sensor interfaces by combining the 10-bit ADC for analog inputs, hardware comparator for threshold detection, and 2 EUSART for Modbus RTU or RS-485 communication. The extended -40C to +125C operating temperature range supports factory-floor deployment. The 28-QFN compact footprint allows integration into standard industrial sensor housings.
推薦
Low-Power Wireless HMI Front-End
For wireless HMI front-ends (BLE remote controls, Zigbee wall switches), the PIC16F15355-E/ML pairs a low-power PIC core with a wireless transceiver, using EUSART or SPI for host MCU communication. The CLCs implement custom wake-up patterns from wireless packets without CPU intervention, dramatically reducing average current. The 14 KB FLASH supports OTA-bootloader designs via MAP memory partitioning for field updates.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16F15355-E/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16F15354-E/ML | PIC16F15325-E/ML | PIC16F15345-E/ML | PIC16F15376-E/ML | PIC16F15255-I/SP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) option exists (PIC16F15255-I/ML) |
| FLASH Memory | 14 KB | 7 KB | 14 KB | 7 KB | 28 KB | 8 KB |
| RAM | 1 KB | 512 B | 512 B | 512 B | 2 KB | 1 KB |
| Max Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 20 MHz |
| PWM Modules | 4 | 4 | 4 | 4 | 4 | 3 |
| CLC | 4 | 4 | 2 | 4 | 4 | 0 |
| EUSART | 2 | 2 | 2 | 2 | 2 | 1 |
主要差異化特點
- Largest memory in PIC16F153xx 28-pin QFN family (對比PIC16F15354-E/ML)
- Four CLCs vs only two on PIC16F15325 (對比PIC16F15325-E/ML)
- 28 KB FLASH headroom in same package for future-proofing (對比PIC16F15376-E/ML)
設計說明
The 28-QFN (6x6 mm) package of the PIC16F15355-E/ML has an exposed thermal pad (EP) on the underside that MUST be soldered to the PCB ground plane. Without proper soldering, the EP loses its thermal and electrical connection, causing junction temperature to rise and reducing long-term reliability. Use thermal vias under the EP to conduct heat into inner copper layers; a minimum of 4-9 thermal vias (0.3 mm diameter) is recommended.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pin 26 and pin 28 on the 28-QFN), with a 10 uF bulk capacitor nearby. The PIC16F15355-E/ML XLP sleep current is in the nanoamp range, so any leakage from PCB contamination or insufficient decoupling can dominate the sleep budget. Use a low-leakage ceramic capacitor (C0G/NP0 dielectric) for analog reference pins.
For ICSP programming/debugging, keep the PGD (pin 19 / RB6) and PGC (pin 18 / RB7) traces short and direct to the programming connector. Avoid routing high-frequency signals adjacent to the ICSP lines to prevent programming failures. The MCLR pin (pin 3 / RA3) requires a 10 kohm pull-up to VDD; some debuggers add a capacitor to ground, but this slows MCLR rise time and may cause programming issues.
Do not confuse the PIC16F15355 (FLASH, 2.3-5.5V) with the PIC16LF15355 (FLASH, 1.8-3.6V) - they share the same datasheet but have different voltage ranges. The 'E' suffix indicates -40C to +125C extended temperature grade. Configuring the device for an oscillator mode that requires an external crystal without the crystal present will lock up the part until the configuration bits are reprogrammed via ICSP.
合規資訊
RoHS and REACH compliant per Microchip product page. The 'E' temperature grade indicates -40C to +125C extended industrial range; AEC-Q100 qualification is not indicated for this part - select PIC16F15355-E/MLVAO or automotive-grade variants for AEC-Q100 compliance.
