PIC16F1764-E/ML - 8-bit 32MHz MCU 7KB Flash 16-QFN | Microchip
MPN： PIC16F1764-E/ML ✓ 啟用中PIC16F1764-E/ML 概覽
An 8-bit microcontroller (MCU) is a small, low-cost processor with an 8-bit data bus, typically used for embedded control tasks such as sensor reading, motor control, LED driving, and battery-powered IoT devices. The PIC16F1764 belongs to the Microchip PIC16 family, which sits within the broader 8-bit MCU -> microcontroller -> embedded processor -> semiconductor taxonomy. The 'F' suffix denotes Flash program memory, while 'XLP' (eXtreme Low Power) branding marks it as optimized for energy-constrained applications.
Key features include a 10-bit ADC with computation, a 10-bit DAC, an operational amplifier, zero-cross detect (ZCD), high-current 100 mA I/Os, Peripheral Pin Select (PPS), 10/16-bit PWMs, three Configurable Logic Cells (CLC), and Core Independent Peripherals (CIP). These CIPs allow hardware-based state machines and signal conditioning without CPU intervention, drastically reducing firmware complexity for closed-loop applications.
The internal 32 MHz oscillator combined with the 4x PLL-free architecture supports deterministic instruction execution at 125 ns per instruction. The device operates from 2.3V to 5.5V and supports an extended temperature range of -40C to +125C. Internal voltage reference and signal routing via PPS make it adaptable to multi-loop power-conversion or lighting control designs.
Typical applications include LED lighting drivers, switch-mode power supply (SMPS) control, battery chargers, fan control, and sensor signal conditioning. The combination of op-amp, ZCD, and high-resolution PWM makes it well suited for digital power conversion where the MCU replaces discrete analog controllers.
When designing with this part, ensure the exposed pad (EP) is thermally and electrically connected to a ground copper pour for heat dissipation and noise suppression. The PPS feature must be configured in firmware before alternate pin functions become active; otherwise the peripherals will not respond.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, with cross-references to PIC16F1765, PIC16F1768, and PIC16F1769 family variants.
直接替換替代品，適用於 PIC16F1764-E/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16F1764-E/ML （相同外形與佔位） — 差異在於 Package, Operating Temperature, Core Architecture, ADC, I/O Pins.
PIC16F1765-E/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16F1704-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16F1614-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1825-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1615-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1509-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1764-E/ML 最大額定值與電氣特性
| Core | PIC 8-bit |
| Series | PIC16 (L)F176x |
| Program Memory Size | 7 KB (4K x 14 words) Flash |
| RAM Size | 512 bytes |
| Maximum CPU Frequency | 32 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V |
| ADC | 10-bit with computation |
| DAC | 10-bit |
| Operational Amplifiers | On-chip op-amp |
| Zero-Cross Detect | Yes (ZCD peripheral) |
| High-Current I/O Drive | 100 mA I/O pins |
| PWM | 10/16-bit PWM peripherals |
| CLC | 3x Configurable Logic Cells |
| PPS | Peripheral Pin Select |
| 封裝 | 16-QFN (4x4 mm) with exposed pad |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40 C to +125 C (Extended, 'E' suffix) |
| RoHS 狀態 | Compliant |
PIC16F1764-E/ML 腳位配置
| 腳位 1 | RA5 — I/O / analog input / PPS remappable |
| 腳位 2 | RA4 — I/O / analog input / PPS remappable |
| 腳位 3 | RA3 — I/O / MCLR (Reset) |
| 腳位 4 | RA2 — I/O / analog input / DAC output / op-amp output |
| 腳位 5 | RA1 — I/O / analog input / DAC reference / op-amp in- |
| 腳位 6 | RA0 — I/O / analog input / op-amp in+ |
| 腳位 7 | VSS — Ground reference |
| 腳位 8 | RC5 — I/O / PWM / PPS remappable |
| 腳位 9 | RC4 — I/O / PWM / PPS remappable |
| 腳位 10 | RC3 — I/O / PWM / ZCD input / PPS remappable |
| 腳位 11 | RC2 — I/O / PWM / ZCD output / PPS remappable |
| 腳位 12 | RC1 — I/O / PWM / op-amp output / PPS remappable |
| 腳位 13 | RC0 — I/O / PWM / DAC output / PPS remappable |
| 腳位 14 | VDD — Positive supply voltage (2.3V to 5.5V) |
| 腳位 15 | RB7 — I/O / high-current 100 mA / PPS remappable |
| 腳位 16 | RB6 — I/O / high-current 100 mA / PPS remappable |
| 腳位 EP | EP — Exposed thermal pad - connect to VSS copper pour for thermal/grounding |
典型應用
PIC16F1764-E/ML 適用於 6 應用s: LED Lighting Drivers, Switch-Mode Power Supply (SMPS) Control, Battery Chargers, Fan Motor Control, Sensor Signal Conditioning, Industrial Control Loops.
LED Lighting Drivers
The PIC16F1764-E/ML fits LED lighting drivers because its integrated 10/16-bit PWM, op-amp, and ZCD peripherals support constant-current regulation and TRIAC-dimming phase-angle detection without external components. The 32 MHz CPU executes PID-style brightness loops in under 100 us per cycle, while the 100 mA high-current I/O pins directly drive power-MOSFET gates or low-side LED strings. With 7 KB Flash and CLC logic cells, dimming curves and color-mixing state machines run in hardware, freeing the CPU for housekeeping. The 16-QFN footprint enables compact MR16 bulb and linear-tube form factors.
推薦
Switch-Mode Power Supply (SMPS) Control
The PIC16F1764-E/ML suits digital SMPS control because the high-resolution PWM (up to 16-bit), op-amp current sensing, and ZCD enable valley-switching topology at switching frequencies up to 1 MHz. The 32 MHz instruction rate delivers 31.25 ns PWM resolution, sufficient for peak-current-mode control with adaptive slope compensation. CLC logic cells implement hardware-based fault shutdown within nanoseconds, faster than interrupt latency. The 2.3V to 5.5V operating range tolerates start-up transients on the rectified AC rail. The 16-QFN exposed pad provides thermal relief for continuous switching losses.
推薦
Battery Chargers
The PIC16F1764-E/ML supports battery charger designs because the on-chip 10-bit ADC with computation and 10-bit DAC provide closed-loop voltage/current regulation, while the op-amp enables direct current-sense amplification without external analog ICs. XLP sleep currents in the nA range minimize standby drain for always-on chargers. The 100 mA I/O can drive charge-FET gates directly. The 7 KB Flash holds CC/CV charge profiles for Li-ion, NiMH, and lead-acid chemistries. The 16-QFN 4x4 mm package fits inside USB-C charger bricks and 18650 docking stations.
推薦
Fan Motor Control
The PIC16F1764-E/ML is well suited for BLDC and DC brushless fan control because the ZCD peripheral detects back-EMF zero-crossings for sensorless commutation, while the 16-bit PWM outputs commutate phase FETs with <1% duty resolution. The integrated op-amp conditions the BEMF signal without external analog stages. The CLC implements hardware commutation timing independent of CPU load, preventing jitter under varying firmware complexity. The 32 MHz CPU executes field-oriented-control (FOC) loops at 25 kHz PWM with margin for advanced fan curve algorithms.
推薦
Sensor Signal Conditioning
The PIC16F1764-E/ML excels at sensor signal conditioning because the on-chip op-amp amplifies low-level thermocouple, RTD, or strain-gauge signals directly to the 10-bit ADC input range, eliminating external instrumentation amplifiers. The 10-bit DAC provides excitation current for resistive bridges, while CLC implements hardware oversampling or Sinc filters. The 32 MHz CPU supports 100 kSPS ADC conversions with digital filtering at 16 kHz output rate. PPS routes analog and digital peripherals to any pin, simplifying PCB routing for multi-sensor arrays. The 16-QFN 4x4 mm footprint enables miniaturized industrial transmitter designs.
推薦
Industrial Control Loops
The PIC16F1764-E/ML enables up to two independent closed-loop industrial control channels using the combination of op-amp, ADC, DAC, and 16-bit PWM as a complete analog front-end and actuator driver. CLC hardware state machines implement PID control at 50 us loop rates without CPU intervention. The extended -40 C to +125 C temperature range supports harsh factory-floor environments. The 100 mA high-current I/O drives relays, solenoids, and solid-state relays directly. The 7 KB Flash holds multiple PID profiles for different process recipes, and the 512 RAM buffers sensor logs during comms latency.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16F1764-E/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16F1765-E/ML | PIC16F1704-I/ML | PIC16F1614-E/ML | PIC16F1825-I/ML | PIC16F1615-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-QFN (4x4 mm) | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same |
| Flash Memory | 7 KB (4K x 14) | 7 KB (4K x 14) | 7 KB (4K x 14) | 7 KB (4K x 14) | 14 KB (8K x 14) - 100% more | 14 KB (8K x 14) - 100% more |
| RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 1024 bytes - 100% more | 1024 bytes - 100% more |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Op-Amp + ZCD + CLC | Yes (full set) | Yes (full set) | No (different peripheral mix) | Partial (no CLC) | No (mTouch instead) | Partial |
| mTouch Capacitive Sensing | No | No | No | No | Yes (mTouch) | No |
| XLP Low Power Branding | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) | Yes (XLP) |
| Operating Voltage Range | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Pin-to-Pin Compatible | 16-QFN baseline | Yes (same 16-QFN) | Yes (same 16-QFN) | Yes (same 16-QFN) | Yes (same 16-QFN) | Yes (same 16-QFN) |
主要差異化特點
- Full op-amp + ZCD + CLC integration in same 16-QFN package (對比PIC16F1704-I/ML)
- Lower Flash footprint than PIC16F1825 for cost-sensitive designs (對比PIC16F1825-I/ML)
- Dedicated power-conversion peripherals vs general-purpose PIC16F1614 (對比PIC16F1614-E/ML)
- Two independent closed-loop channels from a single IC (對比PIC16F1615-I/ML)
設計說明
The 16-QFN exposed pad (EP) MUST be soldered to a ground copper pour of at least 25 mm^2 to provide the primary heat-dissipation path. Without this connection, the silicon junction temperature can rise 40-50 C above ambient at full 32 MHz CPU + ADC + DAC operation, exceeding the 125 C maximum. Route the EP to a continuous ground plane using multiple thermal vias (4-8 vias, 0.3 mm drill) directly under the package.
Peripheral Pin Select (PPS) must be configured in firmware before alternate peripheral functions become active on their assigned pins. A common mistake is to write PPS registers but fail to unlock the PPS sequence (PPSLOCKED bit) - in which case the assignments are ignored and peripherals remain on default pins, leading to 'dead' outputs. Always consult the Configuration Word section of the datasheet before assuming any non-default pin mapping is active.
Route the analog op-amp inputs (RA0, RA1) using differential pair routing with ground guard traces to minimize noise pickup. The 10-bit DAC and 10-bit ADC share internal voltage reference - if both are used simultaneously, decouple VDD with 100 nF ceramic + 10 uF bulk within 5 mm of pins 7 (VSS) and 14 (VDD). Avoid routing digital PWM traces (RC0-RC5) directly under analog traces on adjacent PCB layers to prevent coupling.
Place a 100 nF X7R ceramic decoupling capacitor on VDD (pin 14) and a 10 uF X5R bulk capacitor within 5 mm of the package. For applications using the on-chip voltage reference for ADC accuracy, add a separate 100 nF capacitor on the reference pin. Estimated: total decoupling budget = 100 nF + 10 uF + 100 nF reference = sufficient for 32 MHz operation and ADC < 0.5 LSB stability.
合規資訊
RoHS and lead-free confirmed per Microchip product page and Avaq component data. Not AEC-Q100 qualified - the 'E' suffix in MPN denotes Extended temperature range (-40C to +125C), not automotive qualification.
