PIC16F1847-I/ML - 8-Bit 32MHz 14KB Flash MCU | Microchip
MPN： PIC16F1847-I/ML ✓ 啟用中PIC16F1847-I/ML 概覽
An 8-bit microcontroller is a single-chip computer built around an 8-bit data path, on-chip program memory, RAM, and a rich set of peripherals such as timers, ADC, and communications modules. PIC16F-series MCUs target ultra-low-power embedded applications. In the broader taxonomy, the PIC16F1847 is part of Microchip's PIC16F1xxx enhanced mid-range family, which bridges the classic baseline (PIC10/12/16F) and 16-bit (PIC24/dsPIC33) architectures for cost-sensitive, low-power designs.
Key specifications include 14 KB (8K x 14) Flash, 1 KB SRAM, 256 B EEPROM, 12-bit ADC, multiple Enhanced Universal Synchronous/Asynchronous Receiver Transmitters (EUSART), MSSP (I2C/SPI), and up to 16 I/O pins. The integrated mTouch module provides capacitive touch sensing without external components, while XLP technology delivers nanoWatt sleep currents below 50 nA typical, enabling years of battery life on coin cells.
The PIC16F1847 uses a Harvard RISC architecture with 49 single-cycle instructions (excluding branches), 16-level hardware stack, and nanoWatt XLP power management. Core independent peripherals (CIPs) such as Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), Complementary Waveform Generator (CWG), and zero-cross detect operate autonomously from the CPU, offloading tasks and reducing active-mode current.
Typical applications include battery-powered IoT sensor nodes, capacitive touch user interfaces, low-power wireless sensor platforms, home automation, portable medical devices, and consumer electronics requiring extended battery life. The 28-QFN footprint suits space-constrained designs needing up to 16 GPIOs and rich analog integration.
When designing with this device, evaluate the 28-QFN land pattern and exposed-pad thermal/ground connection during PCB layout, ensure the operating voltage is kept within 1.8V-5.5V for LF variants or 2.5V-5.5V for F, and pair with MPLAB X IDE plus XC8 compiler for development. In-system programming is supported via ICSP.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference for PIC16F1847-I/ML selection.
直接替換替代品，適用於 PIC16F1847-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16F1847-I/ML （相同外形與佔位） — 差異在於 Package, Operating Temperature, Timers, Program Memory (Flash), ADC.
PIC16F1847-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1847T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F18456-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16F18346-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1829-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F1847-I/ML 最大額定值與電氣特性
| Product Family | PIC16F1xxx enhanced mid-range 8-bit MCU |
| Core | 8-bit PIC RISC, 49 instructions |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| EEPROM | 256 B |
| Supply Voltage (Vdd) | 2.5 V to 5.5 V (F suffix) |
| I/O Pins | 16 |
| ADC | 12-bit, multiple channels |
| Timers | Multiple 8/16-bit timers |
| Communication | EUSART, MSSP (I2C/SPI) |
| Capacitive Touch | mTouch module integrated |
| Low-Power Technology | XLP (eXtreme Low Power), nanoWatt |
| Core Independent Peripherals | CLC, NCO, CWG, ZCD |
| 封裝 | 28-pin QFN (6x6 mm) with exposed pad (ML) |
| 工作溫度 | -40 to +85 C (Industrial) |
| 安裝類型 | Surface Mount |
| Programming/Debug | ICSP, MPLAB PICkit 3, MPLAB ICD 3 |
| RoHS 狀態 | Compliant |
PIC16F1847-I/ML 腳位配置
| 腳位 1 | RA3/AN3/C1IN+/VREF+ — GPIO RA3 / Analog input 3 / Comparator 1 non-inverting input / Voltage reference + |
| 腳位 2 | RA4/AN4/C1OUT/T1G — GPIO RA4 / Analog input 4 / Comparator 1 output / Timer1 gate |
| 腳位 3 | RA5/AN5/SS/HLVDIN — GPIO RA5 / Analog input 5 / SPI slave select / High/Low-Voltage detect input |
| 腳位 4 | RA6/OSC2/CLKOUT — GPIO RA6 / Oscillator output / Clock out |
| 腳位 5 | RA7/OSC1/CLKIN — GPIO RA7 / Oscillator input / Clock in |
| 腳位 6 | Vdd — Positive supply voltage (2.5V-5.5V) |
| 腳位 7 | Vss — Ground reference |
| 腳位 8 | RB0/AN12/INT/SRX — GPIO RB0 / Analog input 12 / External interrupt / UART RX |
| 腳位 9 | RB1/AN10/P1C/SCK/SCL — GPIO RB1 / Analog input 10 / PWM1 complementary / SPI clock / I2C clock |
| 腳位 10 | RB2/AN8/P1B/SDI/SDA — GPIO RB2 / Analog input 8 / PWM1 / SPI data in / I2C data |
| 腳位 11 | RB3/AN9/CCP1/SDO — GPIO RB3 / Analog input 9 / CCP1 / SPI data out |
| 腳位 12 | RB4/AN11/P1D/TX/CK — GPIO RB4 / Analog input 11 / PWM1 / UART TX / I2C clock |
| 腳位 13 | RB5/AN13/P2A/T1CKI — GPIO RB5 / Analog input 13 / PWM2 A / Timer1 clock in |
| 腳位 14 | RB6/PGC/ICSPCLK — GPIO RB6 / ICSP clock / Programming clock |
| 腳位 15 | RB7/PGD/ICSPDAT — GPIO RB7 / ICSP data / Programming data |
| 腳位 16 | RC0/P2D/SOSCO — GPIO RC0 / PWM2 D / Secondary oscillator output |
| 腳位 17 | RC1/P2C/SOSCI — GPIO RC1 / PWM2 C / Secondary oscillator input |
| 腳位 18 | RC2/AN6/P2B/CCP2 — GPIO RC2 / Analog input 6 / PWM2 B / CCP2 |
| 腳位 19 | RC3/AN7/P2A/CCP1 — GPIO RC3 / Analog input 7 / PWM2 A / CCP1 |
| 腳位 20 | RC4/AN14/P3B — GPIO RC4 / Analog input 14 / PWM3 B |
| 腳位 21 | RC5/AN15/P3C — GPIO RC5 / Analog input 15 / PWM3 C |
| 腳位 22 | RC6/AN16/P3D/TX2 — GPIO RC6 / Analog input 16 / PWM3 D / UART2 TX |
| 腳位 23 | RC7/AN17/P3A/RX2 — GPIO RC7 / Analog input 17 / PWM3 A / UART2 RX |
| 腳位 24 | RA0/AN0/C1IN0-/C2IN0- — GPIO RA0 / Analog input 0 / Comparator inputs |
| 腳位 25 | RA1/AN1/C1IN1-/C2IN1- — GPIO RA1 / Analog input 1 / Comparator inputs |
| 腳位 26 | RA2/AN2/C2IN+/VREF- — GPIO RA2 / Analog input 2 / Comparator 2 non-inverting / Voltage reference - |
| 腳位 27 | Vdd — Positive supply voltage |
| 腳位 28 | Vss — Ground reference |
典型應用
PIC16F1847-I/ML 適用於 6 應用s: Battery-Powered IoT Sensor Nodes, Capacitive Touch User Interfaces, Home Automation and Smart Home Devices, Portable Medical and Health Devices, Industrial Sensor Hubs and Field Transmitters, Consumer Electronics and Wearables.
Battery-Powered IoT Sensor Nodes
The PIC16F1847-I/ML suits coin-cell and 2xAA battery sensor nodes thanks to its nanoWatt XLP technology delivering sleep currents below 50 nA typical, integrated 12-bit ADC for sensor reading, and EUSART/MSSP peripherals for UART or I2C sensor interfacing. At 32 MHz HFINTOSC the part executes sensor-fusion algorithms quickly and returns to deep sleep, extending battery life to years. The 14 KB Flash comfortably fits BLE command stacks or LoRaWAN drivers, while 16 GPIOs allow multi-sensor expansion.
推薦
Capacitive Touch User Interfaces
The integrated mTouch module enables robust capacitive touch button, slider, and proximity detection without external touch ICs, reducing BOM cost and PCB area. The PIC16F1847-I/ML's 32 MHz core scans mTouch channels and runs UI logic in real time, while XLP sleep modes drop consumption to nanoamps between touches. With 16 I/O pins, designers can implement up to 12 touch channels alongside LEDs and communication lines, making it ideal for appliances, smart locks, and consumer touch panels.
推薦
Home Automation and Smart Home Devices
The PIC16F1847-I/ML powers smart-home endpoints such as occupancy sensors, dimmer switches, and HVAC controllers. Its EUSART/MSSP interfaces support wireless modules (BLE, Sub-GHz, Wi-Fi companion chips) while the 12-bit ADC reads analog sensors like temperature, light, and humidity. With XLP nanoWatt sleep, battery-powered door/window sensors can run for over a decade on a single coin cell. The 28-QFN footprint fits into compact wall-switch form factors.
推薦
Portable Medical and Health Devices
For portable medical applications such as glucose meters, pulse oximeters, and patient wearables, the PIC16F1847-I/ML offers precise 12-bit ADC for biosignal acquisition, low-power sleep for long battery life, and reliable Flash for FDA-traceable firmware storage. The CIPs (CLC, NCO, CWG) offload waveform generation and signal conditioning from the CPU, reducing firmware complexity. Industrial -40C to +85C operation covers clinical and home-use environments.
推薦
Industrial Sensor Hubs and Field Transmitters
Industrial 4-20 mA loop-powered transmitters and Modbus sensor hubs benefit from the PIC16F1847-I/ML's 2.5 V-5.5 V supply range, integrated EUSART for RS-485 Modbus, and 12-bit ADC for precision measurement. The 28-QFN package supports compact DIN-rail or PCB-mount enclosures. Core Independent Peripherals like CLC and NCO enable sensor excitation and signal conditioning without CPU wake-up, reducing overall system power and response latency in process-control loops.
推薦
Consumer Electronics and Wearables
Wearables such as fitness bands, BLE beacons, and small appliances leverage the PIC16F1847-I/ML's combination of mTouch sensing, XLP low power, and rich peripherals. The 32 MHz core supports fast UI response, while 16 KB Flash accommodates Bluetooth Low Energy state machines via companion modules. Industrial temperature rating ensures reliable operation across consumer and outdoor conditions, and the 6x6 mm QFN fits inside thin wearable housings.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16F1847-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16F1847-E/ML | PIC16F1847T-I/ML | PIC16F18456-I/ML | PIC16F18346-I/ML | PIC16F1829-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) - ML | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Core | 8-bit PIC16 enhanced mid-range | 8-bit PIC16 enhanced mid-range | 8-bit PIC16 enhanced mid-range | 8-bit PIC16 next-gen | 8-bit PIC16 next-gen | 8-bit PIC16 enhanced mid-range |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 14 KB | 14 KB | 14 KB | 28 KB | 28 KB | 7 KB |
| RAM | 1 KB | 1 KB | 1 KB | 2 KB | 2 KB | 1 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Capacitive Touch (mTouch) | Yes (integrated) | Yes | Yes | Yes (updated) | Yes (updated) | Yes |
主要差異化特點
- Same QFN-28 footprint with extended temperature grade option (對比PIC16F1847-E/ML)
- Larger Flash and richer CIPs than PIC16F1829-I/ML (對比PIC16F1829-I/ML)
- Cost-effective 14 KB Flash alternative to newer PIC16F18456-I/ML (對比PIC16F18456-I/ML)
設計說明
The 28-QFN (6x6 mm) package has an exposed thermal pad on the underside that must be soldered to a PCB land of approximately equal size with multiple thermal vias to the ground plane. Per Microchip QFN PCB layout recommendations, this pad is the primary thermal dissipation path and serves as the chip's main ground reference. Failure to solder the e-pad will degrade thermal performance and may cause intermittent operation. Use NSMD (Non-Solder Mask Defined) pads and 0.3 mm via diameter array under the pad for optimal heat transfer.
Decouple Vdd with a 100 nF ceramic capacitor placed within 2 mm of each Vdd pin, plus a bulk 1-10 uF tantalum or aluminum capacitor on the supply rail. For battery designs using XLP sleep modes, ensure no leakage paths exist on ADC or comparator input pins during deep sleep by disabling unused peripherals in firmware. Use the PIC16F1847's internal voltage regulator and configure the VREGPM bit for normal or low-power regulator operation depending on whether active current or sleep current is more critical.
Do not confuse the PIC16F1847-I/ML with the PIC16F1847-I/P (PDIP-28). The I/P is a 28-pin through-hole package; pinout differs significantly. Always verify the package code (ML = QFN, P = PDIP, SO = SOIC, SS = SSOP) before PCB assembly. Another common pitfall is operating the part below 2.5 V on the F suffix - if you need sub-2.5 V operation, use the LF (low-voltage) variant instead. Finally, when migrating to PIC16F18456 or PIC16F18346, register names and bit positions change, so do not assume drop-in firmware compatibility.
合規資訊
RoHS and lead-free compliance stated on Microchip product page; REACH compliance is standard for Microchip PIC16F series. The part is not AEC-Q100 qualified; automotive designs should verify Q-1 suffix variant availability.
