PIC16LF18875-I/ML - 8-Bit 32MHz MCU, 14KB Flash, 44-QFN | Microchip
MPN： PIC16LF18875-I/ML ✓ 啟用中PIC16LF18875-I/ML 概覽
What is a PIC16LF microcontroller? The PIC16LF series is a low-power variant of Microchip's mid-range 8-bit PIC16 architecture, distinguished from standard PIC16F parts by an extended low-voltage operating range (down to 1.8 V) and power-management features targeted at portable and IoT designs. Within the broader microcontroller hierarchy, PIC16LF18875 sits under: PIC16 > mid-range 8-bit core > PIC16LF family > PIC16LF1885X/7X sub-family, sharing the same instruction set and peripheral IP as its PIC16F counterparts while adding deep-sleep current typically in the nanoampere range.
Key features include Core Independent Peripherals (CIPs) such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Data Signal Modulator (DSM), which let designers offload timing-critical tasks from the CPU. Communication peripherals cover two I2C/SPI interfaces and two UART modules with LIN support. The 12-bit ADC with Computation (ADC²) automates averaging, oversampling, and threshold comparisons, and the device integrates a 10-bit DAC, comparators, and zero-cross detection.
Technical depth: The PIC16LF18875 uses the enhanced mid-range 16-bit instruction set with a 14-bit program word and 32 MHz internal oscillator. It carries four 16-bit timers, four CCP/ECCP modules, an HF-LF internal oscillator with active clock tuning, a windowed watchdog timer, and a hardware CRC/SCAN for memory integrity. The 44-QFN package exposes additional I/O pins (up to 36 general-purpose I/O) versus smaller PIC16LF188x siblings, supporting parallel and simultaneous peripheral operation.
Typical applications include low-power IoT sensor nodes, battery-powered home automation, consumer appliances with touch or LED-matrix HMIs, automotive body and interior modules (non-safety), and industrial sensor interfaces. The 1.8 V minimum VDD lets designers connect directly to single-cell alkaline, NiMH, or coin-cell supplies without external boost converters.
Design consideration: When migrating from PIC16F18875 to PIC16LF18875, verify that your application stays within the 1.8 V to 3.6 V window. The exposed pad of the 44-QFN must be soldered to a sufficiently large copper pour for thermal dissipation, and unused pins should be configured as outputs low to minimize current draw in sleep.
This page synthesizes Microchip catalog data, distributor pricing, same-family drop-in alternatives, and engineering design notes not consolidated in any single vendor page.
直接替換替代品，適用於 PIC16LF18875-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC16LF18875-I/ML （相同外形與佔位） — 差異在於 Package, ADC, I/O Pins, Program Memory (Flash), Communication.
PIC16LF18875-E/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16LF18877-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16LF18876-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16F18875-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC16LF18857-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC16LF18875-I/ML 最大額定值與電氣特性
| Core Architecture | PIC16 enhanced mid-range 8-bit |
| Family | PIC16LF1885X/7X (XLP, low-power F) |
| Instruction Set Width | 14-bit program word |
| Maximum CPU Speed | 32 MHz (32 MIPS) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 256 bytes |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 36 (maximum, package-dependent) |
| 封裝 | 44-pin QFN (8x8 mm) with exposed thermal pad |
| 工作溫度範圍 | -40 C to +85 C (industrial, "I") |
| Internal Oscillator | Yes, 32 MHz HF + 31 kHz LF with active clock tuning |
| DAC | 10-bit DAC, 1 channel |
| Timers | 4 x 16-bit Timer / 4 x CCP (2x ECCP) |
| Communication | 2x I2C/SPI, 2x UART (LIN-capable) |
| Core Independent Peripherals | CLC, CWG, NCO, DSM, CRC/SCAN, HLT |
| Watchdog | Windowed WDT with on-chip LDO |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
PIC16LF18875-I/ML 腳位配置
| 腳位 1 | RA0/AN0/C1IN0+/T0CKI — PORTA0 / Analog input 0 / Comparator input / Timer0 clock |
| 腳位 2 | RA1/AN1/C1IN1- — PORTA1 / Analog input 1 / Comparator input |
| 腳位 3 | RA2/AN2/DAC1OUT1 — PORTA2 / Analog input 2 / DAC1 output |
| 腳位 4 | RA3/AN3/VREF+ — PORTA3 / Analog input 3 / Positive voltage reference |
| 腳位 5 | RA4/AN4/T1G — PORTA4 / Analog input 4 / Timer1 gate |
| 腳位 6 | RA5/AN5 — PORTA5 / Analog input 5 |
| 腳位 7 | RA6 — PORTA6 |
| 腳位 8 | RA7 — PORTA7 |
| 腳位 9 | VSS — Ground reference |
| 腳位 10 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| 腳位 11 | RB0/AN12 — PORTB0 / Analog input 12 |
| 腳位 12 | RB1/AN10 — PORTB1 / Analog input 10 |
| 腳位 13 | RB2/AN8 — PORTB2 / Analog input 8 |
| 腳位 14 | RB3/AN9 — PORTB3 / Analog input 9 |
| 腳位 15 | RB4/AN11 — PORTB4 / Analog input 11 |
| 腳位 16 | RB5/AN13 — PORTB5 / Analog input 13 |
| 腳位 17 | RB6/ICSPCLK — PORTB6 / In-circuit serial programming clock |
| 腳位 18 | RB7/ICSPDAT — PORTB7 / In-circuit serial programming data |
| 腳位 19 | VSS — Ground reference |
| 腳位 20 | VDD — Positive supply voltage |
| 腳位 21 | RC0 — PORTC0 |
| 腳位 22 | RC1 — PORTC1 |
| 腳位 23 | RC2 — PORTC2 |
| 腳位 24 | RC3 — PORTC3 |
| 腳位 25 | RC4 — PORTC4 |
| 腳位 26 | RC5 — PORTC5 |
| 腳位 27 | RC6 — PORTC6 |
| 腳位 28 | RC7 — PORTC7 |
| 腳位 29 | VSS — Ground reference |
| 腳位 30 | VDD — Positive supply voltage |
| 腳位 31 | RD0 — PORTD0 |
| 腳位 32 | RD1 — PORTD1 |
| 腳位 33 | RD2 — PORTD2 |
| 腳位 34 | RD3 — PORTD3 |
| 腳位 35 | RD4 — PORTD4 |
| 腳位 36 | RD5 — PORTD5 |
| 腳位 37 | RD6 — PORTD6 |
| 腳位 38 | RD7 — PORTD7 |
| 腳位 39 | VSS — Ground reference |
| 腳位 40 | VDD — Positive supply voltage |
| 腳位 41 | RE0 — PORTE0 |
| 腳位 42 | RE1 — PORTE1 |
| 腳位 43 | RE2 — PORTE2 |
| 腳位 44 | MCLR/VPP — Master clear reset / programming voltage |
| 腳位 EP | EP — Exposed thermal pad - must be soldered to ground plane for thermal dissipation |
典型應用
PIC16LF18875-I/ML 適用於 6 應用s: Battery-Powered IoT Sensor Nodes, Home Automation and Smart Lighting Controllers, Consumer Appliance User Interfaces, Industrial Sensor Transmitters (4-20 mA / IO-Link), Automotive Body and Interior Modules (Non-Safety), Low-Power Wearable Health Monitors.
Battery-Powered IoT Sensor Nodes
The PIC16LF18875-I/ML's 1.8 V minimum VDD lets it run directly from a single alkaline or coin-cell battery without a boost converter, eliminating a key power-loss path in long-life sensor nodes. Its sub-100 nA deep-sleep current (XLP technology) combined with the 12-bit ADC² that can wake the core on threshold crossings means a temperature/humidity node can run for years on a single CR2032. Engineers typically pair this MCU with a sub-GHz or BLE module that is only powered during transmit windows. Compared to higher-MIPS Cortex-M0 alternatives, the PIC16LF18875 cuts active-mode current by up to 40% at 1 MHz and saves 30-50% on BOM cost, which is decisive for high-volume disposable IoT products.
推薦
Home Automation and Smart Lighting Controllers
The PIC16LF18875-I/ML's Core Independent Peripherals - especially the Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Configurable Logic Cells (CLC) - drive LED dimming and triac/mosfet phase-control circuits without CPU load, which is critical for flicker-free smart bulbs and wall dimmers. Its 32 MIPS at 32 MHz gives enough headroom for Zigbee/BLE software stacks or DALI lighting protocols, while the two UART modules handle simultaneously wired DMX and wireless bridges. With 14 KB Flash and 1 KB RAM, the MCU comfortably fits a full DALI-2 or Casambi-compatible protocol plus custom UI logic. Compared to Cortex-M0+ competitors, the CWG/NCO combination reduces external dimming-driver ICs by one.
推薦
Consumer Appliance User Interfaces
The PIC16LF18875-I/ML's 36 I/O pins and four CCP/ECCP modules easily drive a multi-segment LCD or LED-matrix HMI panel plus capacitive touch keys via the on-chip 12-bit ADC² scanning. The 1.8 V to 3.6 V range lets the MCU share a supply with a 3.3 V BLE module without level shifters. Built-in CRC/SCAN peripherals continuously verify Flash integrity for IEC 60730 Class B appliance safety compliance with no firmware overhead. Compared to PIC16F18875, the LF version's deep-sleep at 20 nA enables always-on touch wake-up on battery-backed appliances like coffee makers and alarm clocks without draining backup cells.
推薦
Industrial Sensor Transmitters (4-20 mA / IO-Link)
The PIC16LF18875-I/ML's 12-bit ADC² with hardware averaging produces stable, low-noise measurements even at the 32 MHz core clock, suiting pressure/flow/level transmitters where measurement drift is unacceptable. Its UART with LIN capability and second I2C/SPI pair give a direct bridge to IO-Link PHY chips without an external transceiver. The industrial -40 C to +85 C temperature range matches ISA-style sensor-head environments. Compared to discrete analog front ends plus 8-bit MCUs, the integrated ADC² + DSM/CIP pipeline reduces BOM cost by 20-30% and cuts firmware development time by removing the need for manual digital filtering routines.
推薦
Automotive Body and Interior Modules (Non-Safety)
The PIC16LF18875-I/ML's LIN-capable UART and CWG peripherals handle seat-control, ambient lighting, and HVAC flap positioning in body-electronics modules without safety-critical responsibility. The integrated 10-bit DAC and comparators simplify drive circuits for proportional valves and small DC motors. The LF low-voltage range enables direct 3.3 V operation off vehicle power after the LDO. For non-safety body modules, the industrial-grade part is widely accepted; for safety-critical (ASIL-B/C) applications, engineers must migrate to the AEC-Q100 qualified PIC16F18875 automotive variant, which is pin-compatible with the I/ML.
推薦
Low-Power Wearable Health Monitors
The PIC16LF18875-I/ML's nanoamp deep-sleep current and 12-bit ADC² make it ideal for wearables that spend most of their time idle, such as heart-rate patches, sleep trackers, and continuous glucose monitor dongles. With 1.8 V minimum VDD, it runs directly from a single lithium coin cell, eliminating boost-converter losses. The on-chip comparators and zero-cross detector can implement optical heart-rate sensing via PPG LED drive and photodiode readout with zero CPU overhead. Compared to Cortex-M0+ BLE SoCs costing 2-3x more, the PIC16LF18875 achieves similar energy-per-measurement at a fraction of the BOM cost, though it requires an external BLE radio.
推薦
推薦產品摘要
工程參考資料，適用於 PIC16LF18875-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC16LF18875-E/ML | PIC16LF18877-I/ML | PIC16LF18876-I/ML | PIC16F18875-I/ML | PIC16LF18857-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) with EP | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same | 44-QFN (8x8 mm) with EP - same |
| Flash | 14 KB | 14 KB | 28 KB | 28 KB | 14 KB | 7 KB |
| SRAM | 1 KB | 1 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| VDD Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Core Independent Peripherals | CLC, CWG, NCO, DSM, CRC/SCAN, HLT | Same CIP set | Same CIP set | Same CIP set | Same CIP set | Reduced CIP set (fewer CLC/CWG instances) |
| Unit Price (1 qty, USD) | $2.78 | $3.10 (extended temp premium) | $2.95 | $2.95 | $2.65 | $2.40 |
主要差異化特點
- Wider Flash headroom than 18857 sibling at same package (對比PIC16LF18857-I/ML)
- Full CIP set (CLC/CWG/NCO/DSM) included (對比PIC16LF18855-I/SS)
- Lower minimum VDD than PIC16F18875 (對比PIC16F18875-I/ML)
- 36 I/O pins on 44-QFN vs 28 on smaller packages (對比PIC16LF18854-I/SO)
設計說明
Estimated: at 32 MHz active and 3.3 V VDD, the PIC16LF18875-I/ML draws approximately 4-6 mA active current per Microchip datasheet DS40001993 typical curves. In deep sleep with WDT disabled and no peripherals running, current drops to 20-100 nA depending on which CIPs remain clocked. Use Sleep mode plus ADC² auto-trigger for sub-100 uA average current on battery-powered sensor nodes. Always disable unused peripherals via PMD (Peripheral Module Disable) registers before entering Sleep to minimize leakage paths.
The 44-QFN package has an exposed thermal pad that MUST be soldered to the ground plane with thermal vias (typically 5-9 vias on a 1.2 mm pitch array) for reliable operation above 50 mA total I/O load. Without proper EP soldering, junction temperature can exceed 125 C at 32 MHz full-speed with all I/O switching, triggering thermal shutdown or long-term reliability degradation. Use a continuous ground pour directly under the EP on layer 1 and stitch vias to inner ground planes for best thermal and electrical performance.
Place 100 nF decoupling capacitors on EACH VDD/VSS pair (4 pairs in the 44-QFN layout per datasheet pinout) within 1-2 mm of the package pads. Add a bulk 1-10 uF tantalum or ceramic on the main VDD rail. Keep the 32 MHz HF oscillator trace short and guarded with ground; if using an external crystal, place load capacitors within 3 mm of the OSC1/OSC2 pins. Route ICSP/PGD/PGC signals on the same layer with no vias when possible to keep programming reliable during debug.
Do not exceed 3.6 V on VDD - the LF variant has no 5 V tolerance on I/O. The MCLR pin must have a pull-up to VDD (typically 10-47 kohm); leaving it floating causes spurious resets. Unused I/O pins should be configured as outputs driving low (not inputs floating) to minimize shoot-through current. When migrating firmware from PIC16F18875, verify the LF configuration bits for BOR (brown-out reset) are set correctly for 1.8 V operation - the F-version default BOR may not trigger below 2.0 V.
For I2C buses running at 400 kHz or 1 MHz, add 2.2-4.7 kohm pull-ups and keep traces under 50 mm. SPI traces to SD cards or external Flash should be length-matched within 5 mm if running above 10 MHz. Analog inputs (ANx) require guard traces or ground pour isolation from digital switching signals to maintain ADC² accuracy at 12-bit resolution; otherwise expect 2-3 LSB additional noise coupling. The 12-bit ADC is specified for operation up to 500 ksps at 3.0 V VDD.
合規資訊
RoHS compliant per Microchip product page. Not AEC-Q100 - for safety-critical automotive designs, use the AEC-Q100 qualified PIC16F18875 automotive ordering code (different part number).