PIC18LF45K40-I/ML - 32KB Flash XLP 8-bit MCU | Microchip | 44-QFN
MPN： PIC18LF45K40-I/ML ✓ 啟用中PIC18LF45K40-I/ML 概覽
An 8-bit microcontroller (MCU) is a small computer-on-a-chip that integrates a CPU, program memory (Flash), data memory (RAM), and a rich set of peripherals into a single IC. It belongs to the hypernym hierarchy: microcontroller -> embedded processor -> integrated circuit -> semiconductor. The PIC18 family uses an enhanced Harvard RISC architecture with a modified instruction set optimized for C code density, while the LF prefix denotes the low-voltage process and XLP (eXtreme Low Power) family adds nanoWatt XLP peripherals and idle/doze/sleep modes engineered for sub-uA standby.
Key features include 32 KB (16K x 16) Flash, 256 B EEPROM, 2 KB SRAM, 36 configurable I/O pins with interrupt-on-change, a 10-bit ADC with computation (ADC2) up to 35 channels, up to 5 CCP/ECCP modules, two UART/USART with LIN support, two SPI, two I2C (MSSP), a windowed watchdog timer (WWDT), a CRC/SCAN module, and a Complementary Waveform Generator (CWG). Core Independent Peripherals such as CWG, WWDT, and CRC/Memory Scan allow hardware-driven tasks to run without CPU intervention, lowering active duty cycle.
The PIC18LF45K40 is built on Microchip's enhanced mid-range core with a 16-bit instruction word and 8-bit data path, executing most instructions in one cycle (4 clock cycles internally). At 64 MHz the core delivers up to 16 MIPS, which is sufficient for sensor fusion, simple state machines, and protocol bridging in IoT edge nodes. Internal voltage reference and zero-cross detect simplify mains-coupled designs without external components.
Typical applications include IoT sensor nodes, battery-powered wearables, home automation controllers, industrial sensor hubs, automotive body and interior modules, low-power remote controls, and consumer appliance user interfaces. The combination of XLP sleep current below 50 nA (typical) and rapid wake-up makes it well-suited for energy-harvesting and EnergyBLINK-style designs where quiescent drain dominates battery life.
When designing with this device, observe the 3.6V absolute-maximum on VDD and avoid back-powering through I/O pins. Place a 100 nF decoupling capacitor as close as possible to each VDD/VSS pair and follow Microchip AN585 for QFN thermal via layouts under the exposed pad. The -I (Industrial) suffix denotes -40C to +85C operating range; for -40C to +125C automotive, choose the -E or -Q1 variants.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten evaluation cycles and avoid common PIC18LF layout pitfalls.
直接替換替代品，適用於 PIC18LF45K40-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18LF45K40-I/ML （相同外形與佔位） — 差異在於 ADC, Package, Core, Operating Temperature, I/O Pins.
PIC18F45K40-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18LF45K40-E/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18LF45K40T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF46K40-I/ML
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
PIC18LF45K40-E/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF45K40-E/MV
✅ 直接替換聯絡詢價
查看資料表 →PIC18LF45K40-I/ML 最大額定值與電氣特性
| Core Architecture | PIC18 (Enhanced Mid-Range) 8-bit |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| Data Memory (SRAM) | 2 KB |
| Data EEPROM | 256 B |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| 工作溫度 | -40 C to +85 C (Industrial) |
| I/O Pins | 36 |
| ADC | 10-bit, up to 35 channels with ADC2 computation |
| Timers | Multiple 8/16-bit with WWDT |
| Communication | 2x UART (LIN), 2x SPI, 2x I2C (MSSP) |
| CCP/ECCP Modules | Up to 5 |
| 封裝 | 44-pin QFN (8x8 mm) with EP |
| 安裝類型 | Surface Mount |
| Low-Power Technology | nanoWatt XLP |
| RoHS 狀態 | Compliant |
PIC18LF45K40-I/ML 腳位配置
| 腳位 1 | RA2 — PORTA digital I/O / analog input |
| 腳位 2 | RA3 — PORTA digital I/O |
| 腳位 3 | RA4 — PORTA digital I/O / timer clock input |
| 腳位 4 | RA5 — PORTA digital I/O |
| 腳位 5 | RA6 — PORTA digital I/O / oscillator output |
| 腳位 6 | RA7 — PORTA digital I/O / oscillator input |
| 腳位 7 | VDD — Positive supply voltage (1.8V-3.6V) |
| 腳位 8 | VSS — Ground reference |
| 腳位 9 | RB0 — PORTB digital I/O / interrupt-on-change |
| 腳位 10 | RB1 — PORTB digital I/O / interrupt-on-change |
| 腳位 11 | RB2 — PORTB digital I/O / interrupt-on-change |
| 腳位 12 | RB3 — PORTB digital I/O / interrupt-on-change |
| 腳位 13 | RB4 — PORTB digital I/O / interrupt-on-change |
| 腳位 14 | RB5 — PORTB digital I/O / interrupt-on-change |
| 腳位 15 | RB6 — PORTB digital I/O / ICSPCLK |
| 腳位 16 | RB7 — PORTB digital I/O / ICSPDAT |
| 腳位 17 | VSS — Ground reference |
| 腳位 18 | VDD — Positive supply voltage |
| 腳位 19 | RC0 — PORTC digital I/O |
| 腳位 20 | RC1 — PORTC digital I/O / CCP |
| 腳位 21 | RC2 — PORTC digital I/O / CCP / PWM |
| 腳位 22 | RC3 — PORTC digital I/O / SCL |
| 腳位 23 | RC4 — PORTC digital I/O / SDA |
| 腳位 24 | RC5 — PORTC digital I/O / SDO |
| 腳位 25 | RC6 — PORTC digital I/O / TX |
| 腳位 26 | RC7 — PORTC digital I/O / RX |
| 腳位 27 | VSS — Ground reference |
| 腳位 28 | VDD — Positive supply voltage |
| 腳位 29 | RE0 — PORTE digital I/O / analog input |
| 腳位 30 | RE1 — PORTE digital I/O / analog input |
| 腳位 31 | RE2 — PORTE digital I/O / analog input |
| 腳位 32 | RE3 — PORTE digital I/O / MCLR/Reset |
| 腳位 33 | RD0 — PORTD digital I/O / PSP data |
| 腳位 34 | RD1 — PORTD digital I/O / PSP data |
| 腳位 35 | RD2 — PORTD digital I/O / PSP data |
| 腳位 36 | RD3 — PORTD digital I/O / PSP data |
| 腳位 37 | RD4 — PORTD digital I/O / PSP data |
| 腳位 38 | RD5 — PORTD digital I/O / PSP data |
| 腳位 39 | RD6 — PORTD digital I/O / PSP data |
| 腳位 40 | RD7 — PORTD digital I/O / PSP data |
| 腳位 41 | VSS — Ground reference |
| 腳位 42 | VOUT — Voltage regulator output (core) |
| 腳位 43 | VDD — Positive supply voltage |
| 腳位 44 | RA0 — PORTA digital I/O / analog input |
典型應用
PIC18LF45K40-I/ML 適用於 7 應用s: IoT Sensor Nodes, Battery-Powered Wearable Devices, Industrial Sensor Hubs, Automotive Body and Interior Modules, Low-Power Remote Controls, Consumer Appliance User Interfaces, Energy Harvesting Wireless Switches.
IoT Sensor Nodes
The PIC18LF45K40-I/ML is well-suited for battery-powered IoT sensor nodes thanks to its nanoWatt XLP technology, sub-50 nA typical sleep current, and 1.8 V-3.6 V wide operating range that accepts 2xAA or LiSOCl2 primary cells. The 64 MHz core with 16 MIPS handles simple sensor-fusion loops and BLE/Wi-Fi co-processor handshakes over UART or SPI. The 10-bit ADC with ADC2 computation offloads averaging, oversampling, and threshold detection in hardware so the CPU remains in sleep most of the time, extending coin-cell life to multiple years.
推薦
Battery-Powered Wearable Devices
Wearables such as fitness bands, medical patches, and smart watches benefit from the PIC18LF45K40-I/ML's XLP sleep modes below 50 nA typical, rapid wake-up, and compact QFN-44 footprint that fits inside 20 mm coin-cell enclosures. The CWG and ECCP modules drive PWM-controlled haptic actuators, while the ADC2 with computation enables low-power heart-rate and SpO2 photodiode readout without CPU intervention. Operating down to 1.8 V lets the design continue running as the Li-ion cell drops below 3.0 V, preserving usable runtime.
推薦
Industrial Sensor Hubs
Factory-floor sensor hubs benefit from the PIC18LF45K40-I/ML's wide 1.8-3.6 V supply, robust 10-bit ADC with up to 35 channels for multi-sensor acquisition, and LIN-compatible UART for industrial networking. The integrated CRC/Memory Scan and Windowed WDT (WWDT) module simplify functional-safety-aware diagnostics in IEC 61508-style designs, while the 36 I/O pins interface directly to 4-20 mA loops, opto-isolators, and relay drivers. Industrial -40 C to +85 C operation is guaranteed by the -I temperature grade.
推薦
Automotive Body and Interior Modules
Body controllers, lighting nodes, and interior climate modules use the PIC18LF45K40-I/ML for its automotive-grade temperature resilience and LIN/UART transceivers. The CWG module generates complementary PWM outputs up to 50 ns resolution for LED drivers and motor pre-drivers, while 5V-tolerant I/O interfaces directly to 12 V automotive rails through external resistive dividers. The -40 C to +125 C automotive-qualified /Q1 version (PIC18LF45K40-E/ML) is recommended for under-hood deployments where the standard -I grade's +85 C limit is insufficient.
推薦
Low-Power Remote Controls
Infrared or sub-GHz remote controls leverage the PIC18LF45K40-I/ML's sub-50 nA XLP sleep current so that a single CR2032 cell can power the unit for years of standby. The on-board 31 kHz LFINTOSC and Timer1 gate provide RTC-style wake-up intervals without external crystals, reducing BOM cost. CWG and CCP modules generate 38 kHz carrier waveforms for IR transmitters, while the USART with LIN support enables bidirectional remote communication in industrial pendant designs.
推薦
Consumer Appliance User Interfaces
User-interface boards in washing machines, refrigerators, and air conditioners benefit from the PIC18LF45K40-I/ML's segment-LCD support via the complementary waveform generator, up to 35 ADC channels for cap-touch buttons, and robust UART/SPI/I2C peripherals for main-MCU communication. The 1.8-3.6 V supply accepts 3.3 V regulated rails common in modern appliance designs. With 32 KB Flash, manufacturers can integrate full touch-sensing libraries and customizable UI logic without external memory.
推薦
Energy Harvesting Wireless Switches
Self-powered light switches and IoT push-buttons harvest energy from mechanical actuation and require an MCU that wakes up, transmits, and returns to sleep within microjoules of available energy. The PIC18LF45K40-I/ML's nanoWatt XLP technology offers wake-up times below 5 us from sleep and idle currents around 1.5 uA at 1.8 V, making it ideal for these constrained energy budgets. The integrated ADC monitors the harvester capacitor voltage to determine transmit timing, while the CWG generates the carrier for the radio companion.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18LF45K40-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18F45K40-I/ML | PIC18LF45K40-E/ML | PIC18LF46K40-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 4 KB |
| Operating Voltage | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| I/O Pins | 36 | 36 | 36 | 36 |
| 1k Price (USD) | 1.92 | 1.92 (similar) | 2.05 | 2.20 |
主要差異化特點
- Lowest-voltage operation in family at 1.8 V minimum (對比PIC18F45K40-I/ML)
- Higher Flash density than the K22 family (對比PIC18LF45K22-I/ML)
- Same package as 64 KB sibling, enables memory scaling on same PCB (對比PIC18LF46K40-I/ML)
- Extended-temperature option in same footprint (對比PIC18LF45K40-E/ML)
設計說明
The QFN-44 package exposes a thermal pad (EP) that must be soldered to a copper land on the PCB for both electrical ground and heat dissipation. The exposed pad reduces junction-to-ambient thermal resistance (theta_JA) by approximately 40% versus an unbonded QFN, so designers should follow Microchip AN585 (QFN Land Pattern and Thermal Management) when laying out the footprint. Use thermal vias (8-12 vias, 0.3 mm drill, 1.0 mm pitch) directly under the EP to the internal ground plane, and avoid signal traces crossing the EP area.
Place a 100 nF X7R ceramic decoupling capacitor as close as possible to each VDD/VSS pair (pins 7/8, 17/18, 27/28, 41/43) within 3 mm trace length. Add a single bulk 1 uF to 10 uF tantalum or ceramic bypass on the main VDD rail. The PIC18LF45K40-I/ML's nanoWatt XLP sleep current is below 50 nA typical only when all peripherals are disabled and the BOR is configured for low-power mode; consult the PIC18F45K40 datasheet section on power-saving modes for Sleep, Idle, and Doze configurations.
Avoid routing analog ADC signals (RA0-RA7, RE0-RE2) parallel to high-speed digital lines (SPI, PWM outputs) on adjacent layers to prevent coupling noise into ADC readings. Place a ground guard ring around sensitive analog traces and use a star-ground topology that ties the analog and digital grounds at a single point near the MCU's VSS pin. For 10-bit ADC accuracy at 3.3 V, ensure the reference voltage source impedance stays below 3 kOhm as recommended in Microchip AN1079.
Do not apply voltage to any I/O pin before VDD is present, as the PIC18LF45K40 can back-power through I/O clamping diodes and enter undefined states. Always tie the MCLR pin (RE3) high through a 10 kOhm pull-up to VDD, and place a 100 nF cap on MCLR to ground for noise immunity. The LF variant supports 1.8 V minimum VDD; programming the device below 2.0 V may fail during ICSP, so ensure VDD is at least 2.0 V during in-circuit programming.
When using the MSSP peripheral for I2C at 400 kHz or higher, place 2.2 kOhm to 10 kOhm pull-up resistors on SDA and SCL lines, and keep total bus capacitance below 400 pF. For SPI at 8 MHz or above, use controlled-impedance traces (typically 50 ohm) and series 33 ohm damping resistors near the source to reduce ringing. Avoid stubs by routing SPI as a single daisy chain rather than a star topology.
合規資訊
RoHS compliant per Microchip product page. Industrial -40C to +85C grade (suffix -I). For automotive AEC-Q100 qualified parts, choose the PIC18LF45K40-E/ML (extended temperature) or PIC18F45K40-E/ML.
