PIC24F16KA102-I/ML - 16KB Flash XLP 16-bit MCU | Microchip
MPN： PIC24F16KA102-I/ML ✓ 啟用中PIC24F16KA102-I/ML 概覽
A 16-bit microcontroller (MCU) is a microprocessor with a 16-bit data path, register width, and ALU. Within the semiconductor hierarchy, MCUs sit under microcontrollers -> embedded processors -> digital ICs. The PIC24F family targets ultra-low-power embedded applications where longer battery life and reduced energy budget dominate the design trade-off. The XLP technology stack adds deep-sleep peripherals such as DSBOR (deep-sleep brown-out reset), DSWDT (deep-sleep watchdog timer) and a retentive RTCC that maintains timekeeping while the core is asleep, enabling years of operation from a single coin cell.
Key features include a 16-channel 10-bit ADC, two analog comparators, four 16-bit timers, two UART, two SPI, two I2C, five CCP/SCCP modules configurable for PWM/capture/compare, real-time clock and calendar with alarm, and a charge time measurement unit (CTMU) for capacitive touch. The 32 MHz internal oscillator removes the external crystal on cost-sensitive boards, while the 28-QFN (6x6) exposed-pad package gives a typical thermal resistance of about 32 C/W for thermally constrained designs.
Internally the PIC24F16KA102 uses a 16-bit modified Harvard RISC core with single-cycle multiply, hardware stack, deterministic interrupt latency and a wide (3.0 V to 3.6 V) VDD range. The integrated 16 MIPS DSP engine plus zero-overhead loop control allows sensor-fusion math and digital-filter loops in firmware without an extra DSP chip.
Typical applications include battery-powered IoT nodes, wearables, e-metering, sensor hubs, remote controls, low-power wireless peripherals (sensor-side companion MCU), capacitive-touch user interfaces, and medical monitoring handhelds. Designers should evaluate sleep-mode current (deep sleep as low as tens of nA) and active current per MHz when comparing against newer Cortex-M0+ alternatives; PIC24F16KA102 is most attractive when the design needs low BOM cost, on-chip EEPROM and Microchip's MPLAB X toolchain.
直接替換替代品，適用於 PIC24F16KA102-I/ML — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC24F16KA102-I/ML （相同外形與佔位） — 差異在於 ADC, Timers, Package, Operating Temperature, Program Memory (Flash).
PIC24F16KA101-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24F16KA104-I/ML
✅ 直接替換📋 參考替代品（不在目錄中）
PIC24F08KA102-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F16KA102T-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F08KL302-I/ML
✅ 直接替換聯絡詢價
查看資料表 →PIC24F16KA102-I/ML 最大額定值與電氣特性
| Series | PIC® XLP™ 24F |
| Core | PIC24 16-bit RISC (modified Harvard) |
| Program Memory Type | Flash |
| Program Memory Size | 16 KB (5.5K x 24 instructions) |
| RAM Size | 1.5 KB |
| EEPROM Size | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS @ 3.3V) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 18 |
| ADC | 10-bit, up to 16 channels |
| Timers | 4 x 16-bit Timer/Counter |
| Communication Interfaces | 2 × UART, 2 × SPI, 2 × I²C |
| PWM / CCP Modules | 5 (CCP/SCCP) |
| Analog Comparators | 2 |
| Other Peripherals | RTCC, CTMU (capacitive touch), DSBOR, DSWDT |
| 封裝 | 28-QFN (6x6 mm) with exposed pad |
| 工作溫度 | -40 °C to +85 °C (Industrial) |
| 安裝類型 | Surface Mount |
| Oscillator | Internal 32 MHz (no external crystal required) |
| RoHS 狀態 | Compliant |
PIC24F16KA102-I/ML 腳位配置
| 腳位 1 | RA0 — Port A bit 0 / analog AN0 / CVREF- |
| 腳位 2 | RA1 — Port A bit 1 / analog AN1 / CVREF+ |
| 腳位 3 | RA2 — Port A bit 2 / analog AN2 |
| 腳位 4 | RA3 — Port A bit 3 / analog AN3 / VREF+ |
| 腳位 5 | RA4 — Port A bit 4 / analog AN4 |
| 腳位 6 | RA5 — Port A bit 5 / analog AN5 / VREF- |
| 腳位 7 | RA6 — Port A bit 6 / OSC2 |
| 腳位 8 | RA7 — Port A bit 7 / OSC1 |
| 腳位 9 | VDD — Positive supply voltage (1.8-3.6 V) |
| 腳位 10 | VSS — Ground reference |
| 腳位 11 | RB0 — Port B bit 0 / AN6 / PGED3 |
| 腳位 12 | RB1 — Port B bit 1 / AN7 / PGEC3 |
| 腳位 13 | RB2 — Port B bit 2 / AN8 |
| 腳位 14 | RB3 — Port B bit 3 / AN9 |
| 腳位 15 | RB4 — Port B bit 4 / AN10 |
| 腳位 16 | RB5 — Port B bit 5 / AN11 |
| 腳位 17 | RB6 — Port B bit 6 / AN12 |
| 腳位 18 | RB7 — Port B bit 7 / AN13 |
| 腳位 19 | RB9 — Port B bit 9 / AN14 |
| 腳位 20 | RC0 — Port C bit 0 |
| 腳位 21 | RC1 — Port C bit 1 |
| 腳位 22 | RC2 — Port C bit 2 |
| 腳位 23 | RC3 — Port C bit 3 / SCL1 |
| 腳位 24 | RC4 — Port C bit 4 / SDA1 |
| 腳位 25 | RC5 — Port C bit 5 |
| 腳位 26 | RC6 — Port C bit 6 / TX1 |
| 腳位 27 | RC7 — Port C bit 7 / RX1 |
| 腳位 28 | RC8 — Port C bit 8 / SDA2 |
| 腳位 EP | EP — Exposed thermal pad - tie to VSS for thermal/ground performance |
典型應用
PIC24F16KA102-I/ML 適用於 6 應用s: Battery-Powered IoT Sensor Node, Wearables and Fitness Bands, Electronic Metering / Smart Utility, Capacitive-Touch User Interface, Medical Monitoring Handhelds, Remote Controls and RF Companions.
Battery-Powered IoT Sensor Node
The PIC24F16KA102-I/ML fits battery-powered IoT sensor nodes because its nanoWatt XLP technology delivers ~20 nA deep-sleep current while keeping the RTCC and DSWDT active, allowing multi-year operation from a CR2032 coin cell. With 16 KB Flash and 1.5 KB RAM, the MCU can hold a LoRaWAN or BLE-stack-light sensor-firmware image plus a sensor-fusion DSP loop. The internal 32 MHz oscillator removes the external crystal, reducing BOM to a few passive components around the chip. The 28-QFN (6x6) exposed-pad package spreads heat across the PCB ground pour, which is critical for sealed nodes with no airflow.
推薦
Wearables and Fitness Bands
In wearables, the PIC24F16KA102-I/ML delivers the low active current and nanoamp-level sleep required for heart-rate, step-count and SpO2 sensor readouts. The 5 CCP/SCCP modules provide the PWM needed for LED-driver and haptic feedback control, while two UART/SPI/I²C peripherals interface to BLE radios, accelerometers and PPG sensors. The 10-bit ADC with up to 16 channels covers multiple biometric analog signals, and CTMU enables capacitive touch for button-less UI. The 28-QFN (6x6) 0.5 mm pitch fits a sub-15 mm PCB, and the -40 °C to +85 °C industrial range tolerates body-heat thermals.
推薦
Electronic Metering / Smart Utility
Electronic metering applications benefit from the PIC24F16KA102-I/ML's combination of 16 KB Flash for Modbus/DLMS protocol stacks, 512 bytes EEPROM for non-volatile tariff and calibration data, and the integrated 10-bit ADC for analog front-end current/voltage sampling. Deep-sleep current ~20 nA preserves battery backup during AC power loss, and the RTCC provides time-of-use billing accuracy. The on-chip CTMU enables capacitive tamper-detection buttons, while the 5 PWM channels drive metrology LED indicators. Operating from 1.8-3.6 V VDD allows direct connection to lithium-thionyl chloride backup cells used in gas and water meters.
推薦
Capacitive-Touch User Interface
Capacitive-touch user interfaces leverage the PIC24F16KA102-I/ML's CTMU peripheral, which measures capacitance change with sub-nA resolution and can drive up to 16 touch electrodes without an external touch controller IC. This reduces BOM and PCB area on consumer products such as kitchen appliances, white goods and remote controls. The PIC's 16 MIPS core runs Microchip's mTouch reference firmware with noise-immune proximity sensing, and the 5 PWM channels backlight the LED indicators. The 28-QFN (6x6) package's exposed pad provides good thermal dissipation for always-on white goods with sealed enclosures.
推薦
Medical Monitoring Handhelds
Medical monitoring handhelds such as portable pulse oximeters, glucometers and digital thermometers pair well with the PIC24F16KA102-I/ML because of its low active current (typ. <5 mA at 16 MIPS), 1.8-3.6 V VDD that aligns with 2xAA / Li-coin batteries, and 18 I/O for keypad, LCD, sensor and buzzer interfacing. The 10-bit ADC samples analog sensor outputs, and the 512-byte EEPROM stores calibration constants. MPLAB X IDE and PICkit 4 give a documented IEC 60730/IEC 62304 path for safety-critical firmware. The 28-QFN exposed pad simplifies thermal management in handhelds that may run from a warm charger cradle.
推薦
Remote Controls and RF Companions
Remote controls and RF companion MCUs benefit from the PIC24F16KA102-I/ML's deep-sleep current of about 20 nA, which preserves battery life in IR/BLE remotes that spend most of their life asleep. The two UART/SPI/I²C peripherals interface to sub-GHz transceivers or BLE modules, while the 5 CCP/PWM modules drive IR LED modulation or haptic feedback motors. The internal 32 MHz oscillator removes the external crystal, and the 1.8 V minimum VDD allows operation directly from a single AAA cell. The 28-QFN package fits slim remote housings with tight height constraints.
推薦
推薦產品摘要
工程參考資料，適用於 PIC24F16KA102-I/ML — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC24F16KA101-I/ML | PIC24F16KA104-I/ML | PIC24F08KA102-I/ML | PIC24F16KA102T-I/ML | PIC24F08KL302-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Flash Memory | 16 KB | 8 KB | 48 KB | 8 KB | 16 KB | 8 KB |
| RAM | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| XLP (Deep-Sleep) Technology | Yes | Yes | Yes | Yes | Yes | No (KL series) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
主要差異化特點
- On-chip 512-byte EEPROM for non-volatile data (對比PIC24F08KL302-I/ML)
- NanoWatt XLP with deep-sleep DSBOR/DSWDT/RTCC (對比PIC24F08KL302-I/ML)
- 16 KB Flash with full peripheral set (對比PIC24F16KA101-I/ML)
設計說明
Deep-sleep current on the PIC24F16KA102-I/ML is approximately 20 nA with RTCC and DSWDT running, per the family datasheet. To achieve this in practice, disable unused peripherals via their PMD (peripheral module disable) registers before entering Sleep, set all unused I/O to analog mode with the ANSELx registers to prevent digital-input leakage on floating pins, and confirm the BOR and PWRT settings match the application's VDD ramp. Surface-mount the exposed pad (EP) to a continuous VSS copper pour of at least 25 mm² for thermal dissipation.
The 28-QFN (6x6) package has a 0.5 mm pitch and a center exposed thermal pad that must be soldered to VSS for electrical and thermal performance. Use a land pattern with 5×5 thermal via array (0.2 mm drill, 0.5 mm pitch) under the EP tied to the ground plane. Decoupling: place a 100 nF X7R ceramic within 2 mm of VDD and a 10 µF bulk cap within 5 mm. Place the 32.768 kHz crystal as close to OSC1/OSC2 as possible (if external crystal is used) with guard traces to VSS.
Two common pitfalls: (1) configuring analog pins as digital I/O causes ~200 µA leakage on each pin - always set ANSELx to analog for ADC/CTMU pins and unused pins. (2) The internal 32 MHz oscillator has a 2% accuracy across temperature; designs requiring tight UART timing should use an external crystal or the FRC with auto-tuning block. Additionally, code-protect the Flash via ICSP if the firmware contains IP; once code-protect is enabled, it cannot be reversed without mass-erase.
Keep analog (ANx, VREF+, VREF-) traces short and isolated from digital switching signals (PWM outputs, oscillator). Place the analog ground reference directly at the VSS pin nearest the analog pins. For capacitive-touch (CTMU) applications, route touch electrodes as direct, short traces and surround them with a ground hatch to reduce EMI susceptibility. A 100 nF X7R should be placed at the MCU's VDD pin and a 10 µF tantalum or ceramic within 5 mm of the part.
合規資訊
RoHS and REACH compliant per Microchip product page. Industrial-grade (-I) part is not AEC-Q100 qualified - choose PIC24F16KA102-E for extended grade or PIC24F16KA102-H for automotive if needed. Halogen-free per Microchip green-compliance statement.
