PIC32MZ1064DAS169-I/6J - 200MHz 32-bit MCU 1MB Flash | Microchip
MPN： PIC32MZ1064DAS169-I/6J ✓ 啟用中PIC32MZ1064DAS169-I/6J 概覽
A 32-bit microcontroller (MCU) is a single-chip processor that combines a high-performance CPU core, on-chip Flash program memory, SRAM data memory, and a rich set of analog and digital peripherals (ADC, timers, communication controllers, GPIO). PIC32MZ DA devices sit at the upper end of the MCU hierarchy: they exceed traditional 8/16-bit MCU performance while retaining deterministic interrupt behaviour and low-power modes that distinguish MCUs from application processors. The DA sub-series further integrates a graphics LCD controller and a dedicated 2D GPU, simplifying HMI designs that previously required an external video co-processor.
Key features of the PIC32MZ1064DAS169-I/6J include the MIPS32 microAptiv core with DSP extensions and single-cycle MAC, an integrated DDR2 controller supporting up to 128 MB of stacked DRAM, a graphics LCD controller (up to WVGA), a 2D graphics processor with hardware overlays and alpha blending, a 12-bit 18 MSPS ADC with up to 45 analog channels, two CAN 2.0B modules, Hi-Speed USB 2.0 OTG, Ethernet MAC, six UART, four SPI, and an I2S audio interface. The on-chip DDR2 interface eliminates the need for an external SDRAM chip, reducing BOM and PCB complexity for graphics-rich systems.
Architecturally, the PIC32MZ1064DAS169-I/6J uses a 5-stage MIPS pipeline with branch prediction, hardware multiply-accumulate, and tightly-coupled SRAM. The integrated graphics pipeline can drive parallel TFT panels up to WVGA at 60 fps without CPU intervention, freeing the application processor for HMI logic, communication stacks, and real-time control loops.
Typical applications include industrial HMI panels with touch and graphics, graphical point-of-sale terminals, medical patient monitors with on-screen waveforms, building-automation control panels, automotive infotainment auxiliaries, and ruggedized handheld instruments that demand low BOM and deterministic MCU behaviour. The integrated DDR2 and graphics pipeline make it a strong fit when board space is constrained but display quality cannot be compromised.
When designing with the PIC32MZ1064DAS169-I/6J, use the MPLAB Harmony 3 software framework and follow the PCB layout guidelines in the PIC32MZ DA family datasheet for the DDR2 interface - matched-impedance routing and length matching are mandatory because the LFBGA 11x11 mm package requires microvia or HDI PCB technology.
This page synthesizes distributor pricing, drop-in alternatives within the PIC32MZ DA family, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 PIC32MZ1064DAS169-I/6J — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC32MZ1064DAS169-I/6J （相同外形與佔位） — 差異在於 Graphics Controller, Mounting Type, CAN, Operating Temperature, USB.
PIC32MZ1025DAS169-I/6J
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MZ1064DAB169-I/HF
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MZ1064DAA169-I/HF
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MZ1064DAS169-V/6J
✅ 直接替換📋 參考替代品（不在目錄中）
PIC32MZ1064DAB169T-I/HF
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →PIC32MZ1064DAS169-I/6J 最大額定值與電氣特性
| Core | MIPS32 microAptiv (32-bit RISC with DSP extensions) |
| Maximum Core Clock | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 controller, stacked 32 MB or 128 MB |
| Graphics Controller | Integrated LCD controller up to WVGA |
| Graphics Processor | Integrated 2D GPU with hardware overlays and alpha blending |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| CAN | 2x CAN 2.0B |
| USB | Hi-Speed USB 2.0 OTG |
| Ethernet | 10/100 Ethernet MAC |
| 封裝 | 169-LFBGA (11x11 mm) |
| 工作溫度 | -40C to +85C (Industrial, -I suffix) |
| 安裝類型 | Surface Mount (BGA, requires HDI PCB) |
| RoHS 狀態 | Compliant |
PIC32MZ1064DAS169-I/6J 169-lfbga (11x11 mm) 腳位配置指南
PIC32MZ1064DAS169-I/6J（169-lfbga (11x11 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： PIC32MZ1064DAS169-I/6J.
請參閱 資料表 以查看完整腳位配置。
典型應用
PIC32MZ1064DAS169-I/6J 適用於 6 應用s: Industrial HMI Control Panel, Medical Patient Monitor, Building Automation Touch Panel, Automotive Infotainment Aux Display, Point-of-Sale Terminal, Ruggedized Handheld Instrument.
Industrial HMI Control Panel
The PIC32MZ1064DAS169-I/6J is purpose-built for industrial human-machine interface panels that require a high-resolution TFT display, responsive touch, and real-time fieldbus communication. Its 200 MHz MIPS microAptiv core drives a hardware 2D GPU up to WVGA at 60 fps while leaving CPU headroom for Modbus TCP, EtherCAT, or CANopen stacks. The integrated DDR2 controller with stacked 32 MB or 128 MB DRAM provides double-frame buffers and font cache without external memory parts, reducing BOM cost. The 12-bit 18 MSPS ADC supports analog front-ends for temperature, pressure, and current sensing on the same MCU. Two CAN 2.0B ports are ideal for CANopen or DeviceNet master/slave nodes.
推薦
Medical Patient Monitor
The PIC32MZ1064DAS169-I/6J delivers the deterministic MCU behaviour and graphics throughput required for medical patient monitors displaying waveforms, numerics, and trends. The integrated LCD controller drives WVGA TFT panels directly, while the 2D GPU accelerates ECG/EKG waveform rendering at 200 Hz update rate without CPU load. The 12-bit 18 MSPS ADC digitizes ECG, SpO2, and respiration front-ends with up to 45 analog input channels supporting multi-lead acquisition. On-chip 640 KB SRAM plus DDR2 stacked DRAM holds waveform history buffers. Industrial temperature grade supports hospital environments. Medical IEC 60601-1 compliance requires isolation and additional circuitry external to the MCU.
推薦
Building Automation Touch Panel
The PIC32MZ1064DAS169-I/6J serves as the central processor in commercial building automation touch panels controlling HVAC, lighting, blinds, and access control. The integrated graphics LCD controller and 2D GPU render modern tile-based UIs with smooth animations at 60 fps. Ethernet MAC and Hi-Speed USB support BACnet/IP, KNX/IP, and Modbus TCP integration. Two CAN 2.0B interfaces connect to HVAC variable-speed drives. The 169-LFBGA 11x11 mm compact footprint enables slim in-wall mount designs. Industrial temperature range tolerates plenum environments behind walls. Real-time interrupt latency under 100 ns supports deterministic lighting-scene response.
推薦
Automotive Infotainment Aux Display
The PIC32MZ1064DAS169-I/6J drives secondary infotainment displays such as rear-seat entertainment, climate-control touch panels, and instrument-cluster auxiliaries. The integrated graphics GPU renders modern UI animations while the MIPS core handles CAN-FD communication with the central head unit. The 169-LFBGA 11x11 mm footprint fits behind a 7-inch TFT panel. Note that for full automotive qualification, the V-temp variant PIC32MZ1064DAS169-V/6J rated -40C to +105C is recommended - the I-temp variant operates only to +85C. Designers should also add AEC-Q100-qualified power and CAN transceivers around the MCU.
推薦
Point-of-Sale Terminal
The PIC32MZ1064DAS169-I/6J powers graphical point-of-sale terminals that integrate a touch display, magnetic-stripe or smart-card reader, and receipt printer. The integrated graphics pipeline drives the merchant-facing display and customer-facing display simultaneously. USB 2.0 Hi-Speed connects to printer, smart-card reader, and external peripherals. Ethernet MAC provides IP-based payment gateway connectivity. The 1 MB Flash stores full GUI assets, fonts, and application firmware without external memory. Industrial temperature range supports retail environment reliability. Real-time interrupt latency ensures responsive touch input and fast transaction confirmation feedback.
推薦
Ruggedized Handheld Instrument
The PIC32MZ1064DAS169-I/6J is well-suited to ruggedized handheld instruments such as portable test equipment, field diagnostics, and industrial data loggers. The 200 MHz core plus integrated graphics controller can drive a 4.3-inch or 5-inch TFT for waveform display and menu UIs. The 12-bit 18 MSPS ADC with 45 analog inputs supports multi-sensor signal conditioning. Hi-Speed USB OTG enables fast data offload to a host PC. The 169-LFBGA 11x11 mm footprint fits inside slim handheld enclosures. Industrial temperature grade -40C to +85C tolerates outdoor and field-service environments. Battery-powered designs benefit from PIC32 low-power sleep modes between acquisition bursts.
推薦
推薦產品摘要
工程參考資料，適用於 PIC32MZ1064DAS169-I/6J — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC32MZ1025DAS169-I/6J | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1064DAS169-V/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Graphics GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU |
| DDR2 Controller | Yes (32 MB or 128 MB stacked) | Yes | Yes | Yes | Yes (32 MB or 128 MB stacked) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | V-temp -40C to +105C |
主要差異化特點
- Integrated DDR2 controller with stacked DRAM support (對比PIC32MX795F512L-80I/PT)
- Higher clock speed and DMIPS performance (對比PIC32MX775F512L-80I/BG)
- Integrated 2D graphics GPU (對比PIC32MZ1024EFM144-I/PT)
設計說明
The 169-LFBGA 11x11 mm package requires HDI PCB technology with microvia or laser-drilled vias to fan out the BGA ball grid. The integrated DDR2 controller mandates matched-impedance (50 ohm single-ended, 100 ohm differential for clocks) and length-matched routing between the BGA balls and the stacked DDR2 DRAM die inside the package. Use the PIC32MZ DA family PCB layout application note and follow the reference design stack-up exactly. Without proper impedance control and length matching, the DDR2 interface will fail to calibrate, causing bus errors and bootloader failure.
Estimated: At 200 MHz with both CPU and 2D GPU active, the PIC32MZ1064DAS169-I/6J dissipates approximately 0.5-0.8 W typical depending on workload. The 169-LFBGA 11x11 mm package's thermal pad (centre ball array) should be soldered to a continuous ground plane with multiple thermal vias to a copper inner layer for heat spreading. Industrial temperature -40C to +85C operation is achievable without an external heatsink if the PCB thermal design follows the datasheet recommendations. For continuously high workloads driving both cores at full speed, derate junction-to-ambient by 30C/W from the typical 25 C/W theta_JA.
Do not assume the I-temp PIC32MZ1064DAS169-I/6J can substitute for V-temp -V/6J in automotive environments - I-temp tops out at +85C junction, which fails AEC-Q100 automotive stress profiles. Validate DDR2 initialization timing in MPLAB Harmony 3 configuration - the DDR2 calibration routine requires precise delays that are tuned per silicon revision. Do not skip the external reset supervisor; the PIC32MZ1064DAS169-I/6J requires proper POR sequencing for the integrated DDR2 PHY. Confirm the stack-up supports the DDR2 reference design before committing to PCB fabrication.
合規資訊
RoHS compliant per Microchip product page. Industrial temperature -I grade; not AEC-Q100 qualified - choose -V/6J variant for automotive. Reach SVHC compliant per Microchip declaration.