STG4160BJR - 0.5 Ohm SPDT Switch, 15kV ESD, 1.65-4.8V | STMicroelectronics
MPN： STG4160BJR ✓ 啟用中STG4160BJR 概覽
An analog switch (or analog multiplexer/demultiplexer) is a semiconductor device that uses MOSFET transistors to route analog or digital signals between a common node and multiple I/O pins under digital control. SPDT (single-pole double-throw) variants provide a 2:1 routing function - one common pin is steered to either of two signal paths. Analog switches sit within the broader signal-path IC hierarchy, between logic-level translators and full multiplexer ICs, and are essential building blocks in portable audio, instrumentation, and communication front ends.
Key features of the STG4160BJR include 0.50 Ohm RON at VCC = 4.3 V (TA = 25 C), 15 kV HBM ESD on the switch contact pins (per the ST datasheet), break-before-make action, and an extremely low 0.2 uA quiescent current that preserves battery life in always-on portable designs. The 8-bump FlipChip footprint minimizes board area versus comparable SOT-23-6 SPDT switches, and the wide VCC range (1.65 V to 4.8 V) makes it directly compatible with 1.8 V, 2.5 V, 3.3 V and 4.3 V power rails commonly used in modern handsets.
Architecturally the device integrates two back-to-back NMOS transistors per channel, providing bidirectional signal flow from 0 V to VCC. The break-before-make timing is built into the control logic, so no external sequencing is required when the SEL pin toggles state. Combined with the 15 kV contact ESD rating, the part reduces the need for external TVS protection on connector-adjacent signal lines.
Typical applications include USB signal multiplexing in smartphones, audio jack / headphone switchover, GPIO expansion, and battery-monitoring signal routing. The wide VCC range also makes it suitable for handheld test equipment and portable medical sensor interfaces where low leakage and small footprint are required.
When designing with the STG4160BJR, place decoupling capacitors (100 nF typical) as close as possible to the VCC bump and route the analog signals on a layer with a continuous ground plane. Confirm the maximum continuous current through the switch against the RON derating curve to keep insertion loss within budget.
This page synthesizes distributor pricing, pin-compatible alternatives, and design notes not found in the manufacturer datasheet alone, providing an engineering-grade reference for selection and PCB implementation.
直接替換替代品，適用於 STG4160BJR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
STG4160BJTR
✅ 直接替換📋 參考替代品（不在目錄中）
STG4160B
✅ 直接替換📋 參考替代品（不在目錄中）
STG4160BKTR
✅ 直接替換📋 參考替代品（不在目錄中）
TS5A3160DBVR
✅ 直接替換📋 參考替代品（不在目錄中）
STG4160BJR 最大額定值與電氣特性
| Switch Type | SPDT (Single-Pole Double-Throw) |
| Number of Circuits | 1 |
| On-State Resistance (RON) | 0.50 Ohm typical at VCC = 4.3 V, TA = 25 C |
| On-State Resistance Max | 0.75 Ohm |
| Operating Voltage Range (VCC) | 1.65 V to 4.8 V |
| Analog Signal Range | 0 V to VCC |
| Quiescent Current (ICC) | 0.2 uA maximum |
| Contact ESD Protection (HBM) | 15 kV |
| Break-Before-Make | Yes |
| 工作溫度範圍 | -40 C to +85 C |
| 封裝 | 8-bump FlipChip (Wafer-Level) |
| 安裝類型 | Surface Mount |
| Lead Free Status | Lead Free |
| RoHS 狀態 | RoHS Compliant |
STG4160BJR 腳位配置
| 腳位 A1 | VCC — Power supply input (1.65 V to 4.8 V) |
| 腳位 A2 | IN — Analog signal input / common node |
| 腳位 A3 | GND — Ground reference |
| 腳位 A4 | SEL — Logic-level select input (controls NO vs NC) |
| 腳位 B1 | NO — Normally-open switch terminal |
| 腳位 B2 | COM — Common switch terminal (per datasheet mechanical drawing) |
| 腳位 B3 | NC — Not connected (per datasheet) |
| 腳位 B4 | NC — Not connected (per datasheet) |
典型應用
STG4160BJR 適用於 6 應用s: USB 2.0 Signal Multiplexing in Smartphones, Headphone / Audio Jack Switchover, GPIO Expansion and Signal Routing, Battery Monitoring Signal Routing, Portable Test and Measurement Equipment, Wearable Health and Fitness Sensor Switching.
USB 2.0 Signal Multiplexing in Smartphones
The STG4160BJR routes USB D+ and D- lines between the application processor and an external accessory port in smartphones and tablets. Its 0.50 Ohm typical RON minimizes signal attenuation on the high-speed data pair, while the 15 kV HBM contact ESD protects the downstream transceiver from connector-adjacent user-touch events. Break-before-make switching eliminates momentary shorts when toggling between the USB-C controller and the audio accessory path. Quiescent current of 0.2 uA max preserves battery life in always-on standby states.
推薦
Headphone / Audio Jack Switchover
Used at the audio CODEC output, the STG4160BJR switches headphone left/right lines between the main speaker amplifier and the headset jack. The 0.50 Ohm RON preserves THD+N performance by adding negligible series resistance in the audio path, and the wide 1.65 V to 4.8 V VCC range covers 1.8 V and 3.3 V codec rails. The 15 kV contact ESD guards the CODEC against ESD events when a user inserts a headphone plug, reducing external TVS component count.
推薦
GPIO Expansion and Signal Routing
When a microcontroller lacks sufficient GPIO, the STG4160BJR acts as a 2:1 multiplexer to share a single pin between two functions (for example, a UART debug line and a sensor interrupt). The 0.2 uA max quiescent current adds essentially no load to the host supply, and break-before-make prevents contention during reconfiguration. Its compact FlipChip-8 footprint fits next to the MCU in wearables and IoT nodes where PCB area is at a premium.
推薦
Battery Monitoring Signal Routing
In multi-cell battery packs, the STG4160BJR selects between two battery nodes for a single ADC input channel, reducing the number of analog front-end ICs. The low 0.2 uA ICC adds negligible drain to the always-on monitoring circuit, and the analog signal range of 0 V to VCC covers the full cell voltage. The 15 kV ESD rating protects the ADC input during pack assembly and field service events.
推薦
Portable Test and Measurement Equipment
Handheld DMMs, oscilloscope probes, and LCR meters use the STG4160BJR to switch measurement ranges or input channels in compact form factors. The 0.50 Ohm RON keeps insertion loss below the meter's accuracy budget, and the FlipChip-8 package fits into probe heads and banana-jack adapters. Low leakage (<= 0.2 uA ICC) avoids degrading high-impedance measurements on the 10 Mohm ranges typical of handheld instruments.
推薦
Wearable Health and Fitness Sensor Switching
Wearables route bio-sensor signals (PPG, ECG, GSR) through the STG4160BJR between active measurement and standby modes. The 0.2 uA quiescent current supports weeks-long battery life in fitness bands, and the small FlipChip-8 footprint enables integration into wristbands and patches. The 15 kV contact ESD protects sensitive analog front ends during skin-contact events and charger mating.
推薦
推薦產品摘要
工程參考資料，適用於 STG4160BJR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | STG4160BJTR | STG4160B | STG4160BKTR | TS5A3160DBVR |
|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | Texas Instruments |
| Package | 8-bump FlipChip | 8-bump FlipChip - same | 8-bump FlipChip - same | 8-bump FlipChip - same | SOT-23-6 - different footprint, requires PCB change |
| Switch Type | SPDT (1-circuit) | SPDT (1-circuit) | SPDT (1-circuit) | SPDT (1-circuit) | SPDT (1-circuit) |
| On-Resistance (RON, typ) | 0.50 Ohm at 4.3 V | 0.50 Ohm at 4.3 V | 0.50 Ohm at 4.3 V | 0.50 Ohm at 4.3 V | ~1.0 Ohm at 5 V |
| Operating Voltage (VCC) | 1.65 V to 4.8 V | 1.65 V to 4.8 V | 1.65 V to 4.8 V | 1.65 V to 4.8 V | 1.65 V to 5.5 V |
| Quiescent Current (ICC, max) | 0.2 uA | 0.2 uA | 0.2 uA | 0.2 uA | ~1 uA |
| Break-Before-Make | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
主要差異化特點
- 15 kV HBM contact ESD protection (對比TS5A3160DBVR)
- 0.2 uA maximum quiescent current (對比TS5A3160DBVR)
- Compact 8-bump FlipChip footprint (對比TS5A3160DBVR (SOT-23-6))
設計說明
Decouple VCC with a 100 nF X7R ceramic capacitor placed within 2 mm of the VCC bump (A1). The STG4160BJR draws only 0.2 uA quiescent current but exhibits transient switching currents in the mA range; a low-ESR decoupling cap prevents VCC droop that could couple into adjacent analog circuitry. For multi-switch designs, use a single 1 uF bulk cap feeding several STG4160 devices plus individual 100 nF bypass caps.
The 8-bump FlipChip package requires NSMD (non-solder-mask-defined) landing pads per STMicroelectronics application guidelines for wafer-level packages. Pad pitch follows the mechanical drawing in the datasheet - typically 0.4 mm or 0.5 mm. Use a reflow profile compatible with lead-free SAC305 solder (peak 245 C to 260 C). Avoid placing vias in the FlipChip land pattern - tented vias under the package can cause assembly defects.
Although the 0.50 Ohm RON is low, the parasitic capacitance of the FlipChip package (typically 5-10 pF) will attenuate signals above 100 MHz. For USB 2.0 (480 Mbps) or audio applications the part is well within budget, but for RF signal paths above 500 MHz, evaluate insertion loss and return loss with a VNA. Series inductance from PCB traces should be minimized by keeping the NO/NC/COM traces short and referencing a continuous ground plane.
Do not exceed the analog signal range of 0 V to VCC - signals below ground or above VCC will forward-bias the internal ESD diodes and cause leakage or latch-up. Drive the SEL pin with a rail-to-rail logic source; TTL-level signals near 0.8 V may not register as a logic high when VCC is 1.65 V. The break-before-make timing assumes the SEL pin toggles slower than the specified tON; rapid SEL changes can violate BBM and cause momentary cross-conduction.
合規資訊
RoHS compliant and lead free per distributor datasheets. REACH, halogen-free, and conflict-minerals status not explicitly stated in retrieved data - set to 'unknown' per data authenticity rules. AEC-Q100 not applicable: this is a commercial-grade analog switch; no automotive-qualified variant identified in the retrieved web data.
