TLE75004EPDXUMA1 - 4-Ch Low-Side SPI Switch, 470mA | Infineon
MPN： TLE75004EPDXUMA1 ✓ 啟用中TLE75004EPDXUMA1 概覽
A low-side switch is a power distribution topology in which the MOSFET is placed between the load and ground, allowing the load to be tied to a permanent supply rail (e.g., the vehicle battery). This architecture belongs to the broader category of smart power switches (SPS), which combine a power transistor, gate driver, protection circuitry, and a digital diagnostic interface in a single IC. Smart low-side switches have largely replaced discrete MOSFETs + fuses in body electronics because they provide per-channel current limiting, overload shutdown, open-load detection, and thermal protection without external sense resistors.
Key features of the TLE75004EPDXUMA1 include per-channel current limiting, open-load detection in both on and off states, over-temperature shutdown with auto-restart, short-to-ground and short-to-battery protection, and reverse battery protection via an external resistor. The SPI interface operates at clock rates up to 5 MHz, allowing fast update of output states and rapid polling of fault registers. An IDLE pin enables the Limp Home mode where input pins directly drive the outputs without SPI intervention.
Typical applications include automotive body control modules (BCMs), door modules, seat controllers, and LED lighting drivers where multiple low-current relays, solenoids, or LEDs must be switched under microcontroller supervision. The PG-TSDSO-14-41 package provides an exposed thermal pad that keeps junction temperature low even when all four channels are delivering full current simultaneously.
When designing with this part, ensure the SPI lines are pulled up to VCC and the IDLE pin is tied high for normal SPI-controlled operation. The exposed pad must be soldered to a sufficiently large copper pour (at least 1 cm²) to achieve the datasheet thermal resistance. According to the manufacturer datasheet, the device is qualified to AEC-Q100 Grade 1, making it suitable for under-hood and other harsh automotive environments.
直接替換替代品，適用於 TLE75004EPDXUMA1 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： TLE75004EPDXUMA1 （相同外形與佔位） — 差異在於 Package, Operating Temperature Range, Topology, Product Type, Number of Channels.
TLE75080ESDXUMA1
✅ 直接替換聯絡詢價
查看資料表 →ITS4090QEPDXUMA1
✅ 直接替換聯絡詢價
查看資料表 →ITS4130QEPDXUMA1
✅ 直接替換聯絡詢價
查看資料表 →TLE94003EPXUMA1
✅ 直接替換聯絡詢價
查看資料表 →TLD700216ESXUMA1
✅ 直接替換聯絡詢價
查看資料表 →TLE75004EPDXUMA1 最大額定值與電氣特性
| Product Type | Low-side power switch |
| Number of Channels | 4 |
| Continuous Drain Current per Channel | 470 mA |
| 輸出數量 | 4 |
| Input Type | SPI (16-bit) + parallel input pins |
| SPI Clock Frequency | up to 5 MHz |
| 工作溫度範圍 | -40 °C to +150 °C |
| 封裝 | PG-TSDSO-14-41 (exposed pad) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 2A |
| Terminal Finish | Tin (Sn) |
| JEDEC / JESD-609 | e3 |
| Qualification | AEC-Q100 |
| Special Features | 3 V cranking, Limp Home (fail-safe) mode, open-load detection |
TLE75004EPDXUMA1 腳位配置
| 腳位 1 | OUT1 — Channel 1 low-side drain output |
| 腳位 2 | OUT2 — Channel 2 low-side drain output |
| 腳位 3 | OUT3 — Channel 3 low-side drain output |
| 腳位 4 | OUT4 — Channel 4 low-side drain output |
| 腳位 5 | GND — Ground return and thermal pad reference |
| 腳位 6 | IN1 — Parallel input for channel 1 (Limp Home) |
| 腳位 7 | IN2 — Parallel input for channel 2 (Limp Home) |
| 腳位 8 | IN3 — Parallel input for channel 3 (Limp Home) |
| 腳位 9 | IN4 — Parallel input for channel 4 (Limp Home) |
| 腳位 10 | IDLE — Limp Home mode enable (active low) |
| 腳位 11 | CSN — SPI chip select (active low) |
| 腳位 12 | SCLK — SPI clock input |
| 腳位 13 | SDI — SPI data input |
| 腳位 14 | SDO — SPI data output (daisy-chain capable) |
典型應用
TLE75004EPDXUMA1 適用於 6 應用s: Automotive Body Control Module (BCM), Door Module (Window/Lock/Mirror), Automotive LED Lighting Driver, Seat Control Module, HVAC Blower and Flap Control, Industrial Relay Driver Board.
Automotive Body Control Module (BCM)
The TLE75004EPDXUMA1's 4 low-side channels at 470 mA each are well matched to automotive BCM loads such as interior lamps, mirror heaters, and small relay coils. The 16-bit SPI interface allows the BCM microcontroller to read open-load and short-circuit diagnostics per channel, enabling OBD-II compliant fault reporting. The 3 V cranking capability ensures BCM functions remain available during engine start, while AEC-Q100 Grade 1 qualification supports underhood and dashboard mounting. Placed on the BCM PCB near the load connector with the exposed pad soldered to a copper pour of at least 1 cm², it dissipates up to roughly 1 W across all four channels at full load. Compared to a discrete MOSFET + fuse solution, it saves PCB area and provides digital fault readback without external ADCs.
推薦
Door Module (Window/Lock/Mirror)
Door modules require multiple low-current switched loads including door-lock actuators, mirror-fold motors, and puddle lamps, all of which fit comfortably within the TLE75004EPDXUMA1's 470 mA per-channel rating. The SPI-controlled outputs enable the door-module MCU to PWM-drive LED puddle lamps and read back fault status for each lock or fold actuator. Limp Home mode allows mechanical key operation to unlock the door even if SPI communication fails. Mounted near the door connector, the PG-TSDSO-14-41 exposed-pad package handles the thermal load of simultaneous mirror-fold and lock actuation. Per the Infineon datasheet, the SPI protocol supports daisy-chaining, which simplifies the wiring harness when multiple door modules are present in the vehicle.
推薦
Automotive LED Lighting Driver
The TLE75004EPDXUMA1 can drive up to 4 automotive LED strings (interior ambient lighting, daytime running light segments, or rear lamp clusters) at 470 mA each, providing PWM dimming via SPI command updates. The integrated open-load detection identifies failed LED strings without external sense circuitry, critical for ISO 26262 functional-safety lamp monitoring. Per-channel current limiting protects the LEDs and PCB traces during a wiring short, eliminating the need for series fuses. Compared to a discrete MOSFET LED driver, it reduces BOM and provides per-channel fault isolation. The exposed pad allows continuous operation with all four channels at full current within the 150 °C junction limit.
推薦
Seat Control Module
Seat control modules switch multiple solenoid valves for lumbar support, seat heating, and massage functions, where each solenoid typically draws 200-400 mA, well within the TLE75004EPDXUMA1's 470 mA per-channel limit. The 16-bit SPI enables the seat ECU to coordinate multiple solenoids simultaneously while monitoring each channel's current draw for blockage or short detection. AEC-Q100 Grade 1 qualification supports operation across the full automotive cabin temperature range. The exposed-pad package handles the combined thermal load when several seat heaters are active concurrently. Limp Home mode allows the seat to return to a safe default position if the ECU fails, satisfying OEM safety requirements.
推薦
HVAC Blower and Flap Control
HVAC modules use small DC motors and stepper-motor coils to drive air-mix flaps, mode doors, and recirculation valves. The TLE75004EPDXUMA1 can switch 4 such actuators at a time, with SPI-controlled direction sequencing and diagnostic feedback to detect jammed flaps (via current monitoring). The 3 V cranking capability ensures cabin climate control resumes immediately after engine start. Compared to discrete relay drivers, the integrated current limit prevents coil-driver burnout if a flap actuator stalls. The PG-TSDSO-14-41 exposed-pad package fits easily alongside the HVAC ECU microcontroller.
推薦
Industrial Relay Driver Board
Outside automotive, the TLE75004EPDXUMA1 serves as a 4-channel industrial relay driver for PLCs, machine controllers, and process automation, where each channel switches a 12-24 V relay coil at up to 470 mA. The 16-bit SPI allows an industrial MCU to control 4 relays with full diagnostic readback, useful for fault-tolerant factory automation. Open-load detection identifies burned-out relay coils or wiring breaks without manual inspection. The exposed pad handles sustained operation at elevated ambient temperatures typical of factory floors. Compared to ULN2803-style discrete Darlington arrays, it offers per-channel current limiting, lower on-resistance, and digital diagnostics in a smaller footprint.
推薦
推薦產品摘要
工程參考資料，適用於 TLE75004EPDXUMA1 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | TLE75080ESDXUMA1 | ITS4090QEPDXUMA1 | ITS4130QEPDXUMA1 | TLE94003EPXUMA1 | TLD700216ESXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TSDSO-14-41 | PG-TSDSO-24 | PG-TSDSO-14 | PG-TSDSO-14 | PG-TSDSO-24 | PG-TSDSO-24 |
| Number of Channels | 4 | 8 | 4 | 4 | 3 half-bridges | 16 |
| Interface | SPI 16-bit + parallel inputs | SPI 16-bit | SPI + parallel | SPI + parallel | SPI | SPI |
| Limp Home Mode | Yes | Yes | Yes | Yes | No | No |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Operating Temperature | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
| Topology | Low-side switch | Low-side switch | Low-side switch | Low-side switch | Half-bridge | LED driver (low-side) |
主要差異化特點
- Limp Home fail-safe mode with parallel inputs (對比TLD700216ESXUMA1)
- Smallest 14-pin SPIDER package in family (對比TLE75080ESDXUMA1)
- Per-channel open-load and short-circuit diagnostics (對比Discrete N-MOSFET + fuse solution)
設計說明
Estimated: at 470 mA per channel across all 4 outputs, total power dissipation approaches 1 W assuming an on-resistance in the typical SPIDER family range of approximately 1 Ω per channel. The PG-TSDSO-14-41 exposed pad requires at least 1 cm² of PCB copper pour (2 oz copper recommended) to keep junction temperature within the 150 °C limit. In designs where all four channels are continuously on, derate current per channel to roughly 350 mA to maintain thermal margin at 85 °C ambient.
Place the TLE75004EPDXUMA1 close to the load connector to minimize the high-current trace length and reduce EMI from switching transients. The exposed pad must be soldered to a continuous ground copper pour with thermal vias (recommended: 9 vias in a 3x3 array, 0.3 mm diameter) for heat transfer to the bottom layer. Per Infineon layout guidelines, keep SPI traces short and route them away from the OUTx switching nodes to avoid digital noise coupling into the diagnostic ADC.
Do not leave the IDLE pin floating; tie it to VIO (logic high) for normal SPI-controlled operation, or to GND only when intentionally entering Limp Home mode. Per the Infineon datasheet, floating IDLE pin can cause undefined behavior at startup. Also, the SPI SDO line requires a pull-up because it is open-drain in some SPIDER variants. Verify the CSN timing relative to SCLK per the datasheet's SPI timing diagram to avoid mis-framed commands.
合規資訊
RoHS and REACH compliant per Infineon product page; AEC-Q100 automotive qualified. Halogen-free status not stated in available data. Terminal finish per Partstack: Tin (JESD-609 e3).
