TLV320AIC3105IRHBR - Low-Power Stereo Audio CODEC | Texas Instruments
MPN： TLV320AIC3105IRHBR ✓ 啟用中TLV320AIC3105IRHBR 概覽
What is a stereo audio CODEC? A CODEC (coder-decoder) combines an analog-to-digital converter (ADC) and digital-to-analog converter (DAC) in a single device, supporting both microphone-record and headphone/speaker-playback paths. In the system hierarchy, the CODEC sits between the application processor (which runs audio software) and the analog transducers (microphones and speakers), translating between the digital audio stream and real-world acoustic signals. Stereo means two independent channels (left + right), as opposed to mono.
Key features include a wide range of programmable I/O gain stages, single-ended or fully-differential output configurations, integrated PLL for flexible clock generation, and extensive register-based power control. The headphone amplifier provides ground-centered output for capless headphone connection, reducing BOM cost and PCB area. Programmable 3D, bass boost, and treble/midrange digital effects are executed inside the DSP core, offloading the host processor.
Architecturally, the TLV320AIC3105 uses multi-bit sigma-delta ADCs and DACs with low-latency digital filters for natural audio reproduction. Three separate supply rails (analog 2.7V-3.6V, digital core 1.525V-1.95V, digital I/O 1.1V-3.6V) allow direct connection to a 1.8V host processor I/O while keeping the analog section on a clean 3.3V rail, which improves dynamic range and reduces digital switching noise coupling into the audio path.
Typical applications include portable media players, smartphones, Bluetooth/USB audio dongles, headphone amplifiers, dictation/recording devices, and VoIP headsets. The wide input gain range and microphone biasing make it equally suited to handset and headset use cases; the small 5x5 mm QFN footprint enables compact wearable form factors.
A common design tip is to keep the analog supply decoupling star-grounded to the headphone return path to minimize click/pop on enable transitions. The vendor recommends sequencing the analog supply before the digital I/O supply to avoid latch-up and to use the built-in PGA soft-mute ramps during power-up/power-down.
This page synthesizes XAIPART pricing, drop-in alternatives, and practical design notes that complement - but do not replace - the manufacturer datasheet.
直接替換替代品，適用於 TLV320AIC3105IRHBR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
TLV320AIC3105IRHBT
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC3105IRHBRG4
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC3101IRHBR
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC3104IRHBR
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC3105IRHBTG4
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC34IRHBR
✅ 直接替換📋 參考替代品（不在目錄中）
TLV320AIC3105IRHBR 規格
| Part Number | TLV320AIC3105IRHBR |
| Manufacturer | Texas Instruments |
| Product Type | Low-Power Stereo Audio CODEC |
| Number of Channels | Stereo (2 ADC + 2 DAC) |
| 解析度 | 24-bit |
| Digital Audio Interface | PCM (I2S, Left/Right-Justified, DSP, PCM) |
| Number of Inputs | 6 single-ended |
| 輸出數量 | 6 (programmable SE or differential) |
| Headphone Amplifier | Integrated stereo HP amp, capless output capable |
| Digital Audio Effects | 3D, Bass Boost, Treble/Midrange (Enhanced) |
| Analog Supply Voltage | 2.7 V to 3.6 V |
| Digital Core Supply | 1.525 V to 1.95 V |
| Digital I/O Supply | 1.1 V to 3.6 V |
| 封裝 | VQFN-32 (RHB) 5x5 mm |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40C to +85C |
| RoHS 狀態 | Compliant |
TLV320AIC3105IRHBR 腳位配置
| 腳位 1 | LVDD — Digital I/O supply (1.1V-3.6V) |
| 腳位 2 | DVDD — Digital core supply (1.525V-1.95V) |
| 腳位 3 | AVDD — Analog supply (2.7V-3.6V) |
| 腳位 4 | AGND — Analog ground |
| 腳位 5 | MICBIAS — Microphone bias output |
| 腳位 6 | IN1L — Left input 1 (single-ended) |
| 腳位 7 | IN1R — Right input 1 (single-ended) |
| 腳位 8 | IN2L — Left input 2 (single-ended) |
| 腳位 9 | IN2R — Right input 2 (single-ended) |
| 腳位 10 | IN3L — Left input 3 (single-ended) |
| 腳位 11 | IN3R — Right input 3 (single-ended) |
| 腳位 12 | HPLOUT — Headphone left output |
| 腳位 13 | HPROUT — Headphone right output |
| 腳位 14 | HPCOM — Headphone common/ground (capless) |
| 腳位 15 | LEFT_LOP — Left line output (positive) |
| 腳位 16 | LEFT_LON — Left line output (negative, diff pair) |
| 腳位 17 | RIGHT_LOP — Right line output (positive) |
| 腳位 18 | RIGHT_LON — Right line output (negative, diff pair) |
| 腳位 19 | BCLK — PCM bit clock input |
| 腳位 20 | WCLK — PCM word clock (L/R select) input |
| 腳位 21 | DIN — PCM data input (to DAC) |
| 腳位 22 | DOUT — PCM data output (from ADC) |
| 腳位 23 | MCLK — Master clock input |
| 腳位 24 | SCL — I2C serial clock |
| 腳位 25 | SDA — I2C serial data |
| 腳位 26 | RESET — Hardware reset (active low) |
| 腳位 27 | GND — Digital ground |
| 腳位 28 | GPIO1 — General-purpose I/O / interrupt |
| 腳位 29 | GPIO2 — General-purpose I/O |
| 腳位 30 | GPIO3 — General-purpose I/O / clock output |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | EP — Exposed thermal pad - tie to AGND |
典型應用
TLV320AIC3105IRHBR 適用於 7 應用s: Portable Bluetooth / Wireless Headphones, USB Audio Dongles and External Sound Cards, Smart Speakers and Voice Assistants, Automotive Infotainment and Head Units, Portable Voice Recorders and Dictation Devices, VoIP Headsets and Unified Communications, Wearable Fitness Audio Devices.
Portable Bluetooth / Wireless Headphones
The TLV320AIC3105's integrated stereo headphone amplifier delivers ground-centered capless output, eliminating two large DC-blocking capacitors per channel and saving roughly $0.20 in BOM and ~30 mm² of PCB area per board. Its 24-bit stereo DAC with 3D and bass-boost digital effects enhances the listening experience of BT audio streams sourced from an external Bluetooth SoC. Per the TI datasheet, the analog 2.7V-3.6V supply and small 5x5 mm VQFN footprint suit Li-Ion powered headphone designs where board space and power budget are constrained.
推薦
USB Audio Dongles and External Sound Cards
Combined with a USB audio bridge IC, the TLV320AIC3105 forms a complete USB headset or external sound-card solution. The PCM interface accepts standard I2S/left-justified streams from USB controllers at 8-96 kHz sample rates. Per TI datasheet, the multi-bit sigma-delta DAC plus register-programmable mic-bias supports plug-and-play headset microphones without external bias resistors. Designers can reuse the same firmware across multiple SKUs by changing register writes for different mic sensitivities.
推薦
Smart Speakers and Voice Assistants
Six single-ended inputs allow direct connection of a 2-mic array plus auxiliary line-in for voice-front-end capture in smart-speaker products. The TLV320AIC3105's PGA plus digital mixer routes any input combination to the stereo ADC feeding a voice processing DSP or directly to an SoC. Per TI, the part's low power and small QFN package sustain always-listening operation from a single 3.3V rail; register-based mic-bias trims eliminate BOM resistors in mass production.
推薦
Automotive Infotainment and Head Units
Multiple single-ended or fully-differential outputs let the TLV320AIC3105 drive a head-unit's main audio path plus a rear-seat auxiliary output from one chip, reducing BOM cost versus using two CODECs. The wide analog supply range (2.7V-3.6V) accepts the noisy 12V-to-5V rails typical of automotive systems after regulation. Per the TI datasheet, the register-programmable mixer supports independent volume control per output, matching infotainment system use cases for driver vs passenger zones.
推薦
Portable Voice Recorders and Dictation Devices
The 24-bit ADC with PGA gain up to +59.5 dB captures high-fidelity voice even with low-output electret microphones, eliminating the need for an external mic preamp stage. The TLV320AIC3105 supports PCM recording at up to 96 kHz sample rate to a host processor for compression and storage. Per TI documentation, the integrated mic bias (2.5V or AVDD) and low quiescent current (~5 mA playback, ~10 mA record) make it ideal for battery-powered dictation pens and field recorders.
推薦
VoIP Headsets and Unified Communications
Three separate supply rails isolate the TLV320AIC3105's microphone path from noisy USB buses, while the integrated headphone driver directly drives 32-ohm headset transducers. TI's datasheet lists the CODEC as qualified for VoIP/headset use with side-tone mixing from the ADC into the DAC path, enabling natural call-side monitoring. Designers can layer in 3D/treble effects for music playback between calls using the same register space.
推薦
Wearable Fitness Audio Devices
Compact 5x5 mm VQFN and integrated capless headphone output keep wearable audio boards to a few cm², while the wide digital I/O supply (1.1V-3.6V) interfaces directly to sub-1.8V wearable SoCs without level shifters. Per TI, register-based power control lets a fitness-band SoC put the CODEC into deep sleep between voice prompts, drawing less than 1 mA idle. The small BOM and short audio path suit armband, watch, and clip-on form factors.
推薦
推薦產品摘要
工程參考資料，適用於 TLV320AIC3105IRHBR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | TLV320AIC3105IRHBT | TLV320AIC3105IRHBRG4 | TLV320AIC3101IRHBR | TLV320AIC3104IRHBR | TLV320AIC34IRHBR |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-32 (RHB) 5x5 mm | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (RHB) 5x5 mm - same |
| Channels | Stereo (2 ADC + 2 DAC) | Stereo (2 ADC + 2 DAC) | Stereo (2 ADC + 2 DAC) | Stereo (2 ADC + 2 DAC) | Stereo (2 ADC + 2 DAC) | 4-channel |
| Resolution | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit | 24-bit |
| Digital Effects | 3D, Bass Boost, Treble/Mid EQ | 3D, Bass Boost, Treble/Mid EQ | 3D, Bass Boost, Treble/Mid EQ | None (basic CODEC only) | Limited (no 3D module) | None |
| Headphone Amplifier | Integrated stereo, capless capable | Integrated stereo, capless capable | Integrated stereo, capless capable | Integrated stereo, capless capable | Integrated stereo, capless capable | Integrated stereo, capless capable |
| Analog Supply | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V | 2.7V - 3.6V |
| Digital I/O Supply | 1.1V - 3.6V | 1.1V - 3.6V | 1.1V - 3.6V | 1.1V - 3.6V | 1.1V - 3.6V | 1.1V - 3.6V |
| Audio Interface | I2S / LJ / RJ / DSP / PCM | I2S / LJ / RJ / DSP / PCM | I2S / LJ / RJ / DSP / PCM | I2S / LJ / RJ / DSP / PCM | I2S / LJ / RJ / DSP / PCM | I2S / LJ / RJ / DSP / PCM |
| Control Interface | I2C | I2C | I2C | I2C | I2C | I2C/SPI |
主要差異化特點
- Enhanced Digital Effects block (3D, Bass Boost, Treble/Mid EQ) (對比TLV320AIC3101IRHBR)
- Pin-compatible upgrade path with capless HP amp (對比TLV320AIC3104IRHBR)
- Stereo CODEC with 6 in / 6 out vs 4-channel variant (對比TLV320AIC34IRHBR)
設計說明
The TLV320AIC3105 needs three separate rails: AVDD (2.7-3.6V), DVDD (1.525-1.95V), and LVDD (1.1-3.6V). TI recommends sequencing AVDD before DVDD/LVDD to avoid latch-up and click/pop during power-up. Decouple each rail with a 0.1uF ceramic close to its respective supply pin plus a bulk 10uF tantalum or ceramic on the AVDD pin.
Keep analog and digital grounds separated at the CODEC and join them only at the main PCB ground near the power entry point - star grounding minimizes digital switching noise coupling into the analog audio band. Route the BCLK/WCLK/DOUT/DIN signals on inner layers with ground shields above and below, and avoid running audio traces parallel to noisy DC-DC switching nodes.
When using the capless headphone output (HPCOM tied to headset sleeve), make sure the host software enables the HP amp ramp-up ramp-down sequence in TI's PurePath software to avoid a loud pop on plug/unplug events. Also verify that the TDM slot mapping in registers page 0 / page 1 matches the SoC's I2S frame polarity - mismatched slot offsets produce silent channels that look like a hardware fault.
The PCM/I2S bus runs at speeds up to several MHz depending on sample rate and BCLK multiplier. Keep BCLK traces under 50 mm and use series damping resistors (22-33 ohm) near the CODEC for backplane applications. The MCLK jitter contributes directly to audio DAC performance - feed MCLK from a low-jitter PLL or a dedicated audio crystal oscillator.
The VQFN-32 (RHB) package has an exposed thermal pad that must be soldered to a ground copper pour at least 25 mm^2 for reliable operation. The device dissipates roughly 100-300 mW in typical playback; in head-unit designs near hot regulators, ensure the local ambient does not exceed 70C to keep junction temperature well below the 125C max.
合規資訊
RoHS-compliant per TI product page. Standard part is not AEC-Q100 qualified; contact TI for the TLV320AIC3105-Q1 automotive variant if needed. Halogen-free and lead-free plating per datasheet ordering information.
