XC3S100E-4TQ144I - 2,160-Cell Spartan-3E FPGA | Xilinx
MPN： XC3S100E-4TQ144I ✗ 停產XC3S100E-4TQ144I 概覽
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and I/O behavior can be configured after manufacture. The XC3S100E belongs to the Spartan-3E FPGA family, which sits within the broader hierarchy of FPGA, programmable logic, digital semiconductor, and embedded-electronics components. This makes it suitable for designs requiring parallel logic, control, data acquisition, interface bridging, or programmable signal processing.
The device provides 50,000 system gates and 2,160 logic cells, providing a practical capacity for control logic, protocol interfaces, state machines, and small embedded signal-processing functions. Its 73,728 RAM bits can support data buffering, packet storage, lookup tables, and configuration or working memory. The 108 user I/O pins give a system designer substantial connectivity for buses, counters, serial links, and external data acquisition devices.
The XC3S100E-4TQ144I uses a 1.2 V CMOS core and is specified for an industrial temperature range of -40°C to +100°C. The -4 designation identifies its performance grade, while the 144-pin TQFP package provides a conventional leaded surface-mount format with exposed thermal and thermal-pad considerations that must be handled according to the package drawing. Its 90 nm Spartan-3E process generation emphasizes low-cost programmable logic rather than the very high performance of larger modern FPGA families.
Typical applications include industrial control and automation, data-acquisition front ends, communications protocol converters, embedded test equipment, instrumentation, and compact embedded-processing subsystems. The device can implement parallel-to-serial conversion, FIFO-based data movement, state-machine control, and custom peripheral functions while allowing firmware or logic revisions without changing the PCB.
When assigning this FPGA, verify the exact pin assignments, bank supply requirements, configuration interface, clock topology, and I/O standards against the Spartan-3E family data sheet. The industrial temperature grade makes the part appropriate for temperature-challenged equipment, but the legacy 90 nm process and 2,160-cell limit should be considered against system timing, memory, and current design requirements.
This product record combines manufacturer-family technical data with practical distinctions between temperature-grade, lead-free, and extended-temperature ordering variants. It also documents drop-in footprint considerations, configuration and design guidance, and application-specific fit so engineers can evaluate the XC3S100E-4TQ144I against other 144-pin Spartan-3E devices before committing to a design.
直接替換替代品，適用於 XC3S100E-4TQ144I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
XC3S100E-4TQ144C
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S100E-4TQG144C
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S100E-4TQ144CS1
✅ 直接替換📋 參考替代品（不在目錄中）
XC3S100E-4TG144I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S100E-4TG144C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC3S100E-4TQ144I 最大額定值與電氣特性
| Device Type | Spartan-3E field-programmable gate array (FPGA) |
| FPGA Family | Spartan-3E |
| System Gates | 50,000 gates |
| Logic Cells | 2,160 cells |
| Logic Blocks | 240 blocks |
| Embedded RAM | 73,728 bits |
| User I/O Pins | 108 pins |
| 最大時脈頻率 | 572 MHz |
| Core Supply Voltage, Nominal | 1.2 V |
| Core Supply Voltage Range | 1.14 V to 1.26 V |
| Process Technology | 90 nm CMOS |
| 工作溫度範圍 | -40°C to +100°C |
| Speed Grade | -4 |
| 封裝 | 144-pin TQFP |
| Total Pin Count | 144 pins |
| Package Mounting Type | Gull-wing leaded surface mount |
| Package Body Shape | Square |
| Temperature Grade | Industrial |
| Programmable Logic Type | SRAM-configured FPGA |
XC3S100E-4TQ144I square 腳位配置指南
XC3S100E-4TQ144I（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC3S100E-4TQ144I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC3S100E-4TQ144I 適用於 6 應用s: Industrial Automation and Machine Control, Data-Acquisition Front Ends, Communications Protocol Conversion, Programmable Instrumentation, Embedded Interface Controllers, Video and Image Data Conditioning.
Industrial Automation and Machine Control
The XC3S100E-4TQ144I fits compact machine-control logic where a programmable FPGA can coordinate sensors, actuators, interlocks, and timing functions. Its 108 user I/O pins provide substantial connectivity for discrete inputs, relay outputs, encoders, and bus peripherals, while 2,160 logic cells can host control state machines and parallel data processing. The -40°C to +100°C industrial temperature range supports unheated factory equipment better than a commercial-temperature variant. Designers should partition I/O by the bank-supply requirements in the family data sheet and verify timing margins against the -4 performance grade.
推薦
Data-Acquisition Front Ends
The XC3S100E-4TQ144I can implement acquisition sequencing, parallel-to-serial conversion, sample buffering, and FPGA-side digital filtering before data is transferred to a processor. The 73,728 RAM bits provide working storage for FIFOs, sample records, and lookup tables, while the 108 I/O pins can connect multiple converters or parallel data buses. Its 572 MHz stated maximum clock frequency supports timing-rich pipeline implementations, although actual throughput depends on routing, memory use, I/O standards, and design timing closure. Use the family data sheet to select compatible clock-capable pins and maintain clean, decoupled supply routing.
推薦
Communications Protocol Conversion
The XC3S100E-4TQ144I is suitable for legacy protocol bridges, parallel-to-serial adapters, and test equipment that must translate between incompatible digital interfaces. Its 2,160 logic cells and 73,728 RAM bits can implement protocol state machines, FIFOs, CRC engines, and bus-width converters in parallel. The broad I/O count allows simultaneous operation of parallel source and serial destination interfaces, while the -4 grade targets higher clock rates than slower Spartan-3E grades. The design must account for pin multiplexing, clock-domain crossing, I/O voltage compatibility, and timing constraints for each selected transceiver interface.
推薦
Programmable Instrumentation
In instrumentation, the XC3S100E-4TQ144I can implement timing generation, measurement control, pattern generation, waveform conditioning, and custom serial interfaces without requiring a dedicated microcontroller for every function. The 108 user I/O pins allow parallel counter, trigger, and status signals to coexist with serial data links, while the embedded RAM supports calibration tables and acquisition buffers. The industrial temperature range is useful for laboratory and test equipment expected to operate in uncontrolled ambient conditions. Validate every interface against the selected peripheral's voltage, timing, direction, and multiplexing constraints.
推薦
Embedded Interface Controllers
The XC3S100E-4TQ144I can serve as a dedicated interface controller when a system needs deterministic parallel logic, custom protocol behavior, or firmware-independent timing. Its SRAM-programmable architecture supports event capture, bus arbitration, watchdog-style monitoring, and data formatting around microcontrollers or DSPs. The 144-pin TQFP package offers enough I/O for multi-bridge or multi-counter designs without moving to a larger FPGA package. Keep critical paths short, use dedicated clock resources where required, and implement asynchronous input synchronization before using external control signals to alter internal state.
推薦
Video and Image Data Conditioning
The XC3S100E-4TQ144I can implement pixel timing, data alignment, color processing, test-pattern insertion, and interface conversion for compact imaging systems. Its 2,160 logic cells provide parallel datapath resources, while 108 I/O pins can accommodate parallel image data and control signals; the 73,728 RAM bits support line buffers when the design is small enough to meet timing constraints. At up to 572 MHz, the -4 grade supports demanding parallel logic, but real video bandwidth is governed by pixel rate, I/O standard, board routing, and memory depth. Use source-synchronous interfaces only after confirming package pin availability and timing margins.
推薦
推薦產品摘要
工程參考資料，適用於 XC3S100E-4TQ144I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC3S100E-4TQ144C | XC3S100E-4TQG144C | XC3S100E-4TQ144CS1 | XC3S100E-4TG144I | XC3S100E-4TG144C |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | 144-pin TQFP | 144-pin TQFP - same package | 144-pin TQFP - same package | 144-pin TQFP - same package | 144-pin TQFP - same package | 144-pin TQFP - same package |
| Device Family | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E | Spartan-3E |
| Logic Cells | 2,160 cells | 2,160 cells | 2,160 cells | 2,160 cells | 2,160 cells | 2,160 cells |
| Logic Blocks | 240 blocks | 240 blocks | 240 blocks | 240 blocks | 240 blocks | 240 blocks |
| Embedded RAM | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits |
| User I/O | 108 pins | 108 pins | 108 pins | 108 pins | 108 pins | 108 pins |
| Maximum Clock Frequency | 572 MHz | 572 MHz | 572 MHz | 572 MHz | 572 MHz | 572 MHz |
| Nominal Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40°C to +100°C | Commercial-temperature grade | Commercial-temperature grade | Extended-temperature S1 grade | Industrial-temperature grade | Commercial-temperature grade |
主要差異化特點
- Industrial temperature coverage (對比XC3S100E-4TQ144C)
- Lead-free ordering flexibility within the same footprint (對比XC3S100E-4TQ144C)
- Extended-temperature option for specialized environments (對比XC3S100E-4TQ144I)
設計說明
Assign configuration pins, clock inputs, power pins, grounds, and user I/O directly from the 144-pin package drawing before PCB routing. The 144-pin TQFP has a 0.5 mm lead pitch, so power and ground escapes require careful fanout planning. Place the device-side supply bypass components near their associated pins and route them on the same PCB layer where practical. Check the family data sheet for bank supply requirements before selecting the voltage and decoupling arrangement for every I/O group.
The core operates around a nominal 1.2 V, with a documented range of 1.14 V to 1.26 V. Do not design the power tree from the nominal value alone; include the tolerance, ripple, sequencing, and startup requirements for the specific Spartan-3E device and package. Configuration pins may impose additional supply or pull-up requirements. Review the recommended decoupling and power-source sequencing guidance in the AMD family data sheet before finalizing the power-supply component values.
Do not treat the C, G, I, or S1 suffix as a cosmetic packaging difference. The ordering code can change temperature grade, lead-free status, or extended-temperature qualification while preserving the underlying FPGA architecture. For a production substitution, compare the complete ordering table, programmed-device compatibility, package markings, and operating-temperature requirements. Also confirm that any alternative uses the same 144-pin footprint rather than another package with a similar lead count.
Keep clock traces short and route them away from high-speed I/O and switching-node connections. Use dedicated clock-capable pins when the design depends on predictable clock distribution, and place termination or series damping where the selected I/O standard or edge rate requires it. Treat configuration signals as timing-critical because startup behavior depends on their levels and sequencing. Validate the final layout with the FPGA vendor's pinout and configuration guidance rather than relying only on the functional block diagram.
合規資訊
The family documentation and lead-free ordering variants are identified, but no explicit RoHS, REACH, halogen-free, or conflict-minerals declaration was available for this exact ordering code. AEC-Q100 is not applicable to this general-purpose industrial FPGA.
