EP1AGX35DF780C6
EP1AGX35DF780C6 - 33,520-Cell Arria GX FPGA | Intel
Intel EP1AGX35DF780C6 is a field-programmable gate array from the Arria GX family, built on 90 nm process technology and supplied in a 780-pin FC-FBGA package. Verified specifications identify 33,520 logic cells, a 1.2 V supply, 341 I/O terminals, and a C6 speed grade. It is a programmable semiconductor that combines configurable logic, embedded memory, digital signal processing resources, and high-speed transceiver capability in one device. The package designation indicates a fine-pitch ball-grid array, making it appropriate for high-density printed-circuit designs rather than low-cost through-hole assembly.
An FPGA, or field-programmable gate array, is a programmable semiconductor that implements digital logic through a configurable matrix of logic elements, routing resources, memory blocks, and specialized I/O circuits. Unlike an application-specific integrated circuit, the FPGA configuration can be changed after manufacturing. In the system hierarchy, an FPGA sits between general-purpose processors and fixed-function ASICs: it can provide hardware parallelism, deterministic interfaces, protocol bridging, signal processing, and logic consolidation. The Arria GX family is designed for data-path and communications-oriented designs where programmable high-speed interfaces are important.
The verified headline characteristics are 33,520 cells, 1.2 V operation, 341 I/O pins, 90 nm technology, and a 780-pin FC-FBGA package. The 1.2 V supply supports low-voltage digital implementation, while 341 I/O terminals provide broad connectivity for parallel interfaces, memory controllers, custom logic, and data-conversion links. A 780-terminal BGA also provides high I/O density, but it requires controlled PCB escape routing, via structures, thermal analysis, assembly capability, and careful signal-integrity review.
The C6 suffix denotes the commercial C6 speed grade in the ordering information. Designers should treat the FPGA architecture as programmable hardware: logic functions are implemented through a device-specific configuration bitstream generated with supported Intel or Altera design tools. The configuration must match the exact device, package, speed grade, and design revision. Engineering sign-off should therefore include power estimation, pin assignment, timing closure, I/O standards, configuration scheme, and post-layout signal-integrity verification rather than relying on functional simulation alone.
Typical applications include communications equipment, data acquisition systems, industrial imaging, video and display processing, protocol conversion, test and measurement hardware, and embedded control. EP1AGX35DF780C6 is most suitable when a design needs substantial programmable logic and high I/O count in a compact BGA footprint. Its Arria GX positioning also makes it relevant to designs that benefit from high-speed serial connectivity, although exact transceiver counts, data rates, memory resources, and supported I/O standards are not included in the verified snippets and must be confirmed from the manufacturer datasheet before design release.
A primary design consideration is BGA implementation. Confirm the ball map, land pattern, stack-up, via-in-pad or dog-bone escape strategy, decoupling network, clock distribution, and thermal solution against the official manufacturer package documentation. Use the exact manufacturer datasheet for the device because distributor summaries can omit architecture and timing details. This page combines verified package, cell-count, process, supply, I/O, and speed-grade facts with a practical implementation checklist for procurement and PCB planning.
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