EP20K400EBC652-2X
EP20K400EBC652-2X - 400K Gates APEX-20KE FPGA 652-BGA | Altera/Intel
The Altera (Intel) EP20K400EBC652-2X is a high-density APEX-20KE Field-Programmable Gate Array (FPGA) IC delivering 400,000 system gates and 16,640 logic elements in a 652-ball BGA package. Per the manufacturer datasheet family for APEX 20KE, it integrates 212,992 bits of embedded memory, supports up to 488 user I/O pins, and operates from a 1.8V core supply with multi-voltage I/O support. The device uses a 0.22 µm CMOS process technology and is specified for 223 MHz internal performance.
An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader semiconductor category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the system hierarchy, the FPGA sits between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with software-level design flexibility. The APEX 20KE family pioneered MultiCore integration, combining Look-Up Table (LUT) logic, embedded memory blocks (ESBs), and distributed arithmetic capability in a single fabric to support system-on-a-programmable-chip (SOPC) designs.
Key differentiating features include 4 PLLs for clock management, 1,664 logic macrocells, support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and HSTL, and a dedicated high-speed interconnect called the FastTrack. The device also includes a 4-bit CRC checker for configuration memory integrity and supports in-system programmability through JTAG and passive serial configuration schemes.
Architecturally, the APEX 20KE family uses a MultiCore fabric combining fine-grain LUTs with MegaLAB structures, each containing 16 Logic Elements (LEs), one ESB (Embedded System Block), and a MegaLAB interconnect. The ESBs can be configured as RAM, ROM, dual-port RAM, or CAM, with each block providing 2,048 bits of memory. Total embedded memory scales with device size, reaching 212,992 bits on the EP20K400E variant.
Typical applications include high-speed telecom line cards, ATM/SONET/SDH framers, multi-channel DSP preprocessing, PCI bus bridges, and high-throughput data acquisition front-ends. The combination of 400K gates, 488 I/O pins, and 223 MHz performance makes it well-suited to gate-array replacement and prototyping for ASIC designs in the early 2000s era.
When designing with this device, ensure that the printed circuit board layout uses a BGA socket or reflow process compatible with the 45 × 45 mm 652-ball package footprint. Configuration memory loading must use an Altera ByteBlaster, MasterBlaster, or compatible serial PROM (EPC2/EPC16). Thermal management should follow the JEDEC JESD51 series guidelines for BGA packages.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes not found in the original manufacturer datasheet.
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