EP20K400EBC652-2 - APEX-20KE 400K Gates FPGA, 488 I/O | Intel / Altera
料号： EP20K400EBC652-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $109.51 | $109.51 |
| 10 | $95 | $950.00 |
| 100 | $78 | $7,800.00 |
| 250 | $68.5 | $17,125.00 |
| 500 | $60 | $30,000.00 |
EP20K400EBC652-2 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined by user-programmed configuration rather than fixed at the fab. APEX-20KE is a member of the APEX 20K family, which introduced the MultiCore architecture integrating LUTs with embedded memory blocks, putting FPGAs in the broader hierarchy of programmable logic devices (PLDs) and parallel computing accelerators used in digital signal processing, telecom, and embedded systems.
Key features include 1664 macrocells (Logic Elements), 488 user I/Os, 212,992 bits of total embedded RAM, 1.71V-1.89V VCCINT core supply, and a 652-ball BGA package that maximizes I/O density for high-bandwidth designs. The APEX-20KE family supports 2.5V supply operation and provides ample embedded memory and logic resources, making it suitable for high-performance glue logic, bus interface bridging, and moderate-complexity datapath acceleration.
The APEX-20KE series uses a CMOS process with MultiCore architecture, integrating up to 1664 logic elements with embedded system blocks (ESBs) that can serve as dual-port RAM, ROM, or content-addressable memory. The 652-ball BGA (45x45 mm) is the largest package in the family and is chosen when the design needs maximum I/O, supporting legacy parallel buses and high-pin-count peripherals.
Typical applications include telecom line cards, industrial control, ASIC prototyping, and high-density glue logic bridging. The wide 2.5V/3.3V I/O compatibility and large I/O count make it suitable for parallel bus interfaces, video processing pipelines, and pre-silicon validation of complex ASICs. Note that the APEX-20KE family is now in legacy/obsolete status; new designs should consult Intel's current Cyclone or Stratix equivalents.
When designing with this FPGA, plan for external configuration memory (EPC or compatible) since the SRAM-based configuration is volatile. Power sequencing must observe the 1.71V-1.89V VCCINT and 2.5V VCCIO ramp requirements, and JTAG access must be brought out for in-system programming and boundary-scan test.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers locate drop-in equivalents and verify supply chain availability as of 2026-09-08.
直接替换替代料： EP20K400EBC652-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K400EBC652-2 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Speed Grade, Total RAM Bits, Package, Series.
快速对比工具——选择替代料号进行并排对比：
EP20K400EBC652-1X
✅ 直接替换✓ 有现货
$92 / 个
查看数据手册 →EP20K400EBC652-1
✅ 直接替换✓ 有现货
$110 / 个
查看数据手册 →EP20K300EBC652-2
✅ 直接替换✓ 有现货
$384.08 / 个
查看数据手册 →EP20K300EBC652-1
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP20K300EBC652-2X
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →EP20K400BC652-2V
✅ 直接替换✓ 有现货
$260 / 个
查看数据手册 →EP20K400EBC652-2 最大额定值与电气特性
| Series | APEX-20KE |
| Family | APEX 20K |
| Logic Elements / Macros | 1664 macros |
| Total Gates | 400,000 gates |
| User I/Os | 488 |
| Total RAM Bits | 212,992 bits |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 2.5 V |
| Propagation Delay | 2.5 ns |
| 工作温度 | 0C to 85C |
| 封装 | 652-BGA (45x45 mm) |
| Ball Count | 652 |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| Logic Family | CMOS |
| 安装类型 | Surface Mount |
EP20K400EBC652-2 引脚配置
| 引脚 A1 | I/O — User I/O bank (function varies by configuration) |
| 引脚 A2 | VCCIO — I/O supply voltage 2.5 V |
| 引脚 B1 | GND — Ground |
| 引脚 B2 | I/O — User I/O bank |
| 引脚 C1 | VCCINT — Core supply voltage 1.71-1.89 V |
| 引脚 C2 | I/O — User I/O bank |
| 引脚 D1 | GND — Ground |
| 引脚 D2 | I/O — User I/O bank |
| 引脚 E1 | I/O — User I/O bank |
| 引脚 E2 | VCCIO — I/O supply voltage 2.5 V |
| 引脚 F1 | GND — Ground |
| 引脚 F2 | I/O — User I/O bank |
| 引脚 G1 | VCCINT — Core supply voltage 1.71-1.89 V |
| 引脚 G2 | I/O — User I/O bank |
| 引脚 H1 | GND — Ground |
| 引脚 H2 | I/O — User I/O bank |
| 引脚 J1 | I/O — User I/O bank |
| 引脚 J2 | VCCIO — I/O supply voltage 2.5 V |
| 引脚 K1 | TCK — JTAG test clock (boundary-scan) |
| 引脚 K2 | I/O — User I/O bank |
典型应用
EP20K400EBC652-2 适用于 6 应用s: Telecom Line Card Interface Bridge, ASIC Prototyping and Pre-Silicon Validation, Industrial Control and Factory Automation, Legacy Video Processing Pipeline, High-Density Glue Logic Bridging, Legacy Military/Aerospace Retrofit (Commercial Grade).
Telecom Line Card Interface Bridge
The EP20K400EBC652-2 is well suited for telecom line card designs that require a high count of parallel I/Os to bridge legacy TDM buses, framers, and serializer/deserializer (SerDes) glue logic. Its 488 user I/Os and 652-ball BGA footprint allow direct connection to 32-bit or 36-bit wide parallel buses, while the 212,992 bits of embedded RAM provide buffering for cell/packet payloads. With MultiCore architecture integrating LUTs with embedded system blocks (ESBs), the device can implement dual-port RAM and FIFOs alongside glue logic. Compared to a discrete ASIC, the APEX-20KE reduces NRE cost and accelerates time-to-market for low-volume line card variants.
推荐
ASIC Prototyping and Pre-Silicon Validation
The EP20K400EBC652-2 historically served as a vehicle for ASIC prototyping, where the 400K-gate logic capacity allowed designers to map mid-complexity ASICs for software development and system validation before tape-out. The 652-ball BGA provides high I/O count to expose ASIC boundary signals for bench test, while JTAG support enables in-system programming and boundary-scan verification. The 1.71V-1.89V core and 2.5V I/O match the voltage rails of many legacy ASICs. Modern alternatives such as Cyclone IV GX/V offer higher density, but the APEX-20KE remains useful in long-lifecycle programs where the design was already validated against this exact part.
推荐
Industrial Control and Factory Automation
Industrial control applications benefit from the EP20K400EBC652-2's wide I/O count to interface with multiple sensors, actuators, and fieldbus peripherals (Profibus, CAN, parallel discrete I/O). The 488 I/Os allow direct connection to 24V-tolerant opto-isolated input banks and PWM output modules, reducing external glue logic. Industrial temperature grades (0C to 85C) cover most factory-floor environments. The MultiCore architecture supports deterministic state-machine implementation critical for safety interlocks. Note: this part is obsolete, so retrofit/repair scenarios are the primary industrial use case rather than new designs.
推荐
Legacy Video Processing Pipeline
The EP20K400EBC652-2 was deployed in video processing pipelines where its high I/O count enabled direct connection to BT.656/BT.1120 parallel video buses, video DACs, and frame buffer memory. The 212,992 bits of embedded RAM serve as line buffers for de-interlacing and scaling algorithms. The 652-ball BGA supports 32-bit-wide video buses without external bus switches. Although modern Cyclone/Stratix devices deliver better DSP throughput, legacy broadcast and medical imaging equipment continues to use APEX-20KE parts for field replacements.
推荐
High-Density Glue Logic Bridging
For board-level designs that require bridging between incompatible buses (PCI to local bus, VME to processor local bus, or asynchronous SRAM to synchronous peripherals), the EP20K400EBC652-2 provides 1664 logic elements and 488 I/Os to absorb large amounts of glue logic in a single device. The MultiCore ESBs can implement dual-port FIFOs to bridge clock-domain crossings. The 652-BGA 45x45 mm footprint allows board designers to fan out to many peripheral devices without external buffers. Retrofit of legacy boards where this part is already qualified is the principal scenario today.
推荐
Legacy Military/Aerospace Retrofit (Commercial Grade)
Although the EP20K400EBC652-2 is commercial grade (0C to 85C), it appears in commercial-off-the-shelf (COTS) subsystems inside larger aerospace platforms where the platform's environmental control maintains the FPGA within its qualified range. The high I/O count and large gate capacity support avionics databus concentrators and redundant display processing. New aerospace designs now select radiation-tolerant or extended-temperature equivalents; this part is reserved for legacy sustainment. Source: distributor listings confirm 0C-85C operating range.
推荐
推荐产品汇总
工程参考数据： EP20K400EBC652-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K400EBC652-1X | EP20K400EBC652-1 | EP20K300EBC652-2 | EP20K300EBC652-2X | EP20K400BC652-2V |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-BGA (45x45 mm) | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same |
| Family | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KC |
| Logic Capacity (Gates) | 400,000 | 400,000 | 400,000 | 300,000 (-25%) | 300,000 (-25%) | 400,000 |
| User I/Os | 488 | 488 | 488 | 488 (approx) | 488 (approx) | 488 (approx) |
| Core Voltage (VCCINT) | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V | 1.71V to 1.89V |
| Speed Grade | -2 | -1X (faster) | -1 (slower) | -2 | -2X (faster) | -2V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest-density 652-BGA member of APEX-20KE family （对比 EP20K300EBC652-2)
- APEX-20KE (E suffix) enhanced feature set （对比 EP20K400BC652-2V (APEX-20KC))
- Speed grade -2 (mid-range timing) （对比 EP20K400EBC652-1X (faster -1X grade))
设计说明
Estimated: at typical 100 MHz operation with 50% toggle rate, the EP20K400EBC652-2 core current is approximately 500-800 mA from VCCINT (1.8 V), implying 0.9-1.4 W core dissipation. Add I/O bank current (~100-200 mA per bank from VCCIO 2.5 V) and total board-level dissipation can reach 2-3 W. The 652-BGA package requires a thermal pad or substantial inner copper pours for heat spreading; without these, junction temperature can exceed 100C in still air. Decouple each VCCINT pin with 0.1 uF X7R ceramic plus 10 uF bulk per bank.
The 45x45 mm 652-BGA requires at least 6-layer PCB stack-up with 0.5 mm pitch via-in-pad or dog-bone fan-out. Use 1 oz copper on outer layers for power planes and 0.5 oz on inner signal layers. Match trace lengths within each I/O bank to avoid skew on parallel buses. Reference the APEX 20K Device Datasheet Addendum for the recommended land pattern and via dimensions. Keep JTAG pins (TCK, TMS, TDI, TDO, TRST) accessible for in-system programming.
The 1.71V-1.89V VCCINT is sensitive to power-supply noise - use a linear regulator (not a switching converter) close to the BGA to avoid core logic glitches. Series ferrite beads or RC snubbers on each VCCIO bank isolate switching noise from I/O buffers. Source-synchronous interfaces (e.g., DDR, LVDS-like buses) require matched trace lengths within 50 ps. Place ground-return stitching vias every 200 mil along high-speed traces to control return-current path inductance.
Estimated: configuration time for an SRAM-based APEX-20KE FPGA is typically 50-200 ms depending on EPC configuration device. Power sequencing MUST observe VCCINT ramp before VCCIO to avoid I/O latch-up. Do not hot-plug the FPGA without proper hot-swap controllers. The MultiCore ESBs default to all-zeros at power-up; designs must include explicit initialization of memory blocks. Verify JTAG chain integrity before first power-up - a missing TRST pull-up can leave the TAP controller in an undefined state.
合规信息
Compliance status for obsolete Altera APEX-20KE parts is not consistently published; RoHS/lead-free status was not explicitly confirmed in the verified web data and is marked unknown. Refer to original manufacturer documentation for legacy compliance certificates.