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EP2A40F1020C8ES - APEX II FPGA 1.5M Gates 1020-BGA | Intel
EP2A40F1020C8ES

EP2A40F1020C8ES - APEX II FPGA 1.5M Gates 1020-BGA | Intel

The Intel EP2A40F1020C8ES is a member of the Altera APEX II family of programmable logic devices, delivering approximately 1,500,000 system gates and 40,960 logic elements in a 1020-ball FCBGA package. It provides 655,360 bits of embedded RAM, 735 user I/O pins, and operates from a 1.425 V to 1.575 V core supply with commercial 0 °C to 85 °C temperature grade. The C8 speed grade indicates an 8 ns pin-to-pin logic delay tier, targeting mid-performance embedded and communications designs. An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened I/O serializers. Modern FPGAs sit at the same architectural tier as microcontrollers and DSPs in embedded systems, but offer hardware-level parallelism: instead of executing instructions sequentially, custom digital circuits are synthesized directly into the silicon fabric. APEX II devices belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs, and historically descended from PAL/GAL architectures. Key features of the EP2A40F1020C8ES include 655,360 RAM bits distributed across embedded memory blocks, a high I/O count of 735 supporting a wide mix of single-ended and differential signaling standards, and APEX II's signature Look-Up Table (LUT) plus embedded memory dual-function architecture. The device supports in-system programmability via JTAG and configuration via passive serial, and integrates PLLs for clock management. Technically, the APEX II architecture uses a MultiCore interconnect matrix combining row and column routing with embedded memory blocks (ESBs), enabling efficient implementation of large datapaths and FIFOs. The 1020-BGA FCBGA package offers high signal density and thermal performance suitable for high-utilization designs; engineers should observe controlled-impedance routing and proper decoupling when laying out the PCB. Typical applications for this part include telecom line cards, industrial control and instrumentation, high-speed data acquisition front-ends, and ASIC prototyping. The high gate count makes it well-suited for designs requiring parallel processing pipelines, custom bus interfaces, or hardware acceleration. When designing with this FPGA, allocate sufficient PCB area for decoupling capacitors near each supply pin and follow Intel/Altera's recommended footprint and stack-up guidelines for fine-pitch BGA packages. Thermal management via thermal vias under the die and copper pours is recommended at high utilization. This page synthesizes distributor pricing, same-family APEX II alternatives, and practical design notes not found in the legacy manufacturer datasheet.

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EP2A40F1020C8N - 1.5M-Gate APEX II FPGA | Intel | Industrial Logic
EP2A40F1020C8N

EP2A40F1020C8N - 1.5M-Gate APEX II FPGA | Intel | Industrial Logic

Intel EP2A40F1020C8N is a field-programmable gate array from the APEX II family, integrating 1.5 million gates and 38,400 logic cells in a 1,020-ball fine-pitch BGA package. Verified sources identify a nominal 1.5 V supply, 735 user I/O pins, and either 376 MHz or 562 MHz as the reported operating-frequency figure, depending on source and interpretation. A propagation delay of 1.78 ns is also listed, alongside a separate 1.55 ns value in another source; this discrepancy is preserved for validation rather than reconciled by assumption. The device is fabricated using a 0.15 µm all-layer copper process with as many as eight metal layers. A field-programmable gate array, or FPGA, is a semiconductor device whose logic architecture, interconnections, and I/O behavior can be configured after manufacture. FPGAs occupy the programmable-logic tier between fixed-function application-specific integrated circuits and software-defined processors. APEX II devices combine reusable logic resources, programmable routing, embedded memory, and high-speed differential I/O, making them suitable for parallel data processing, communications, and industrial control. Within the semiconductor hierarchy, EP2A40F1020C8N is an FPGA, programmable logic device, CMOS integrated circuit, and programmable semiconductor. Its principal engineering attributes include 1.5 million gates, 38,400 cells, 735 user I/Os, and 1,020 BGA terminals. The reported logic process is 0.15 µm, while the package is described as 1020-pin FC-FBGA or BGA-1020 with a 33 mm by 33 mm body and 1 mm pitch. A 1.425 V to 1.575 V operating-supply range surrounds the nominal 1.5 V rail. These characteristics support systems that need dense parallel logic and many external interfaces. The APEX II architecture combines programmable logic cells with routing resources and dedicated I/O structures. The verified APEX II family documentation also describes 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport capabilities. Such interfaces permit point-to-point high-speed connections, although implementation requires the configuration, termination, and timing rules in the manufacturer datasheet. The 735 user I/O count gives designers substantial interface capacity, but power integrity and simultaneous-signal performance depend on board-level implementation. Typical applications include industrial automation, communications equipment, high-speed digital signal processing, protocol bridging, and test or measurement systems. The FPGA can implement parallel datapaths and control functions in one device, while the high pin count accommodates numerous buses, differential links, and memory or peripheral interfaces. The commercial temperature grade is reported as 0 °C to 85 °C, so systems intended for wider ranges require qualification and may need another device. Designers should first resolve the conflicting frequency and propagation-delay values against the exact APEX II family datasheet and selected speed-grade data. A fine-pitch 1,020-ball package also demands controlled-impedance routing, robust power distribution, correct decoupling, thermal analysis, and manufacturer-recommended BGA assembly. The nominal 1.5 V rail must remain within the stated 1.425 V to 1.575 V range. This page combines verified device specifications, package and supply constraints, source traceability, and practical replacement guidance. Because the cross-reference search returned no verified pin-compatible alternatives, engineers should use the EP2A40F1020C8N ordering code and APEX II datasheet as the controlling records when evaluating substitutes or planning board redesigns.

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EP2A40F1020C9 - APEX II FPGA 1.5M Gates 38400 Cells 1020-FBGA | Intel
EP2A40F1020C9

EP2A40F1020C9 - APEX II FPGA 1.5M Gates 38400 Cells 1020-FBGA | Intel

The Intel (formerly Altera) EP2A40F1020C9 is a high-density APEX II family FPGA with 1.5 million system gates, 38,400 logic elements, and a maximum internal clock frequency of 366 MHz, fabricated on a 0.15-micrometer all-layer copper-metal CMOS process with up to eight metal layers and housed in a 1020-pin FineLine BGA (FC-FBGA) package. The device integrates 2,560 macrocells, 735 user I/Os, and supports multiple I/O standards including LVTTL, LVCMOS, PCI/PCI-X 32/64-bit at 33/66/133 MHz, AGP, CTT, SSTL-2/SSTL-3 Class I & II, GTL+, and HSTL Class I & II, making it suitable for high-performance bridging and bus-interface applications. Key features include 1.5V core operation, 1.55 ns propagation delay (per CPLD timing specs), embedded system blocks (ESBs) for dual-port RAM, CAM, and product-term logic, and an LVDS-compatible high-speed interconnect fabric. The 1020-pin FC-FBGA package measures 33 x 33 mm with a 1 mm ball pitch, providing the routing density required for 735 user I/Os while keeping board real-estate manageable for telecom backplanes and high-channel-count designs. From an architecture standpoint, the APEX II family combines a look-up table (LUT) based logic fabric with embedded array blocks, allowing designers to mix fine-grained logic with wide datapath functions in the same device. The 0.15-µm process with eight copper layers enables both high density (38,400 cells) and a 366 MHz core frequency, while the multi-standard I/O ring supports PCI/PCI-X, AGP, GTL+, and HSTL without external level shifters, simplifying board design. Typical applications include PCI/PCI-X bridge cards, high-speed serial protocol bridges, telecommunications backplane controllers, ASIC prototyping platforms, and high-density DSP or datapath engines. The 735 user I/Os and embedded memory make it attractive for designs that previously required multiple FPGAs plus a bridging ASIC. When designing with this part, validate the 1020-pin FC-FBGA land pattern and ensure PCB stack-up supports 1 mm BGA pitch with microvia or via-in-pad technology as required. Verify the speed grade C9 timing against your critical path before committing layout, and confirm Intel's Quartus/APEX support status since APEX II is a mature family.

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EP2A40F1020C9ES - APEX II FPGA 1.5M Gates 38400 Cells 366MHz | Altera
EP2A40F1020C9ES

EP2A40F1020C9ES - APEX II FPGA 1.5M Gates 38400 Cells 366MHz | Altera

The Altera EP2A40F1020C9ES is a high-density APEX II family Field Programmable Gate Array (FPGA) delivering 1.5 million system gates, 38,400 logic cells, and a 366 MHz internal clock rate, fabricated on a 0.15 µm process and supplied at a 1.5 V core voltage. It is housed in a 1020-pin FC-FBGA flip-chip fine-pitch BGA package optimized for high I/O count and high-speed signal integrity. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be reconfigured by the user after manufacture. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic device -> logic IC -> integrated circuit) and are used to implement arbitrary digital circuits, DSP pipelines, and bus interfaces without the cost of an ASIC. The APEX II family specifically targets high-performance, high-density applications such as telecommunications, video processing, and ASIC prototyping, combining LUT-based logic with embedded memory blocks and a MultiCore architecture. Key features of the EP2A40F1020C9ES include 1.5 M system gates, 38,400 logic elements, embedded system blocks (ESBs) for RAM and ROM, high-speed I/O support including LVDS, and a 1.5 V core operating voltage with 0.15 µm CMOS technology. The device supports both synchronous and asynchronous RAM operation, allowing designers to implement FIFO buffers, dual-port memories, and content-addressable memories directly on-chip. The APEX II architecture combines Look-Up Table (LUT) logic with embedded memory and a high-speed interconnect fabric, enabling designs up to several hundred MHz of effective performance. The 1020-pin FC-FBGA package uses a flip-chip land-grid-array construction that minimizes lead inductance, which is essential when running multi-hundred-megahertz interfaces. Typical applications include high-speed telecommunications switching, ASIC prototyping, DSP co-processing, video and image processing pipelines, and high-throughput data acquisition systems. The combination of high gate count and high I/O count also makes it suitable for complex protocol bridging and test instrumentation. When designing with this part, pay close attention to power integrity - a 1.5 V core at this density requires multi-rail decoupling and solid thermal management. The 1020-pin FC-FBGA package demands reflow-profile-controlled PCB assembly and controlled-impedance routing on all high-speed traces. This page synthesizes distributor stock and pricing, same-package alternatives from the APEX II family, and practical design notes not collected in a single section of the original Altera datasheet.

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EP2A40F1020C9N - APEX II 1.5M Gates FPGA, 1020-BGA | Intel
EP2A40F1020C9N

EP2A40F1020C9N - APEX II 1.5M Gates FPGA, 1020-BGA | Intel

The Intel (formerly Altera) EP2A40F1020C9N is a high-density programmable logic device from the APEX II family, delivering up to 1.5 million system gates and 38,400 logic elements in a 1020-ball FineLine BGA package. Manufactured on a 0.15-µm all-layer copper process with up to eight metal layers, it supports up to 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards. Per the APEX II datasheet DS-APEXII-3, the device operates from a 1.5 V core supply and provides 735 user I/O pins for high-bandwidth system interconnect. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets designers implement custom digital logic via a hardware description language. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD), then logic ICs, then integrated circuits, then semiconductors. The APEX II family specifically targets high-performance data-path and communications applications where both logic density and rich I/O count are required. Key features of the EP2A40F1020C9N include 38,400 logic cells, 1.5M system gates, embedded system blocks (ESBs) for RAM and ROM, and a MultiCore architecture that places four logic array blocks (LABs) per row for fine-grained timing control. The device supports in-circuit reconfigurability via passive serial, passive parallel, and JTAG interfaces, enabling live firmware updates in deployed systems. Architecturally, the EP2A40 uses a MultiCore interconnect with DirectDrive technology, ensuring predictable routing delays across the die. The 0.15-µm process with eight copper layers provides superior signal integrity at high toggle rates, and the on-chip Phase-Locked Loops (PLLs) deliver flexible clock management for multi-domain designs. The 33 × 33 mm BGA-1020 package with 1 mm pitch supports high-density board layouts while exposing 735 user I/Os for parallel bus or LVDS SERDES interfaces. Typical applications include high-speed data-path designs such as telecommunications switching, SONET/SDH framer/mapper ICs, high-end router line cards, and DSP co-processing cards. It is also well-suited for ASIC prototyping where 1.5M gates of capacity let designers emulate large SoCs before tape-out. When designing with this FPGA, allocate sufficient decoupling and provide thermal relief via the exposed die paddle. Engineers should also note that the APEX II family is end-of-life — verify second-source or replacement strategy before committing to new designs.

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EP2A40F1020I7 - APEX II 1.5M Gates FPGA | Altera | FC-FBGA-1020
EP2A40F1020I7

EP2A40F1020I7 - APEX II 1.5M Gates FPGA | Altera | FC-FBGA-1020

The Altera EP2A40F1020I7 is a high-density programmable logic device from the APEX II family, delivering 1.5M system gates and 38,400 logic elements in a 1020-pin FC-FBGA package. The device is fabricated on a 0.15 µm CMOS process and operates from a 1.5 V core supply, with an industrial temperature grade (-40 °C to +100 °C) indicated by the 'I' suffix and a speed grade 7 designation. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit in the hierarchy of programmable logic devices -> CPLD -> FPGA -> programmable SoC, occupying the high-density end of the programmable logic spectrum. APEX II FPGAs in particular combine look-up-table based logic with embedded memory blocks (ESBs) and high-speed I/O, making them suitable for DSP, telecom, and parallel datapath implementations. Key features of the EP2A40F1020I7 include 38,400 logic cells, 1.5M system gates, embedded system blocks (ESBs) for memory and arithmetic, and 4 phase-locked loops (PLLs) for clock management. The device supports LVTTL, LVCMOS, PCI, and LVDS I/O standards, and provides multi-voltage I/O support for mixed-voltage system interfacing. Four high-speed clock networks and dedicated routing minimize skew across the die. The APEX II architecture combines coarse-grained look-up tables with dedicated carry chains, embedded RAM, and multipliers, allowing efficient implementation of both control logic and datapath-intensive DSP functions. The 1.5 V core voltage and 0.15 µm process balance performance against power dissipation, while the 1020-ball FC-FBGA package exposes the full I/O count needed for high-bandwidth memory and bus interfaces. Typical applications for the EP2A40F1020I7 include telecommunications infrastructure (SONET/SDH framers, base-station DSP), high-speed data acquisition systems, broadcast video processing, custom accelerator cards, and ASIC prototyping platforms. Industrial temperature grading extends usability into factory automation and outdoor equipment. When designing with this part, plan power sequencing for the 1.5 V core and the I/O supply rails, and provide adequate decoupling across the 1020 balls. Use Altera Quartus II (legacy) for synthesis, place-and-route, and timing closure; the device is now considered mature and may be best sourced through the secondary market. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the original datasheet, giving engineers an integrated view of the EP2A40F1020I7 for legacy designs and second-source planning.

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EP2A40F1020I7N - APEX II FPGA 1.5M Gates 1020-BGA | Intel
EP2A40F1020I7N

EP2A40F1020I7N - APEX II FPGA 1.5M Gates 1020-BGA | Intel

The Intel EP2A40F1020I7N is a high-density APEX II family FPGA delivering 1.5M system gates, 38,400 logic cells, and 562 MHz core performance in a 1020-pin FC-FBGA package. Built on a 0.15 µm process and operating from a 1.5 V core supply, it is engineered for high-performance programmable logic designs that demand substantial logic capacity and on-chip memory. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the user can re-program to implement arbitrary digital circuits. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs and ASICs, and the APEX II family in particular targets data-path-intensive designs such as DSP, communications, and memory-interface bridging. The EP2A40 sits at the high-capacity end of the APEX II line, distinguished by its 1.5M-gate density and 1020-ball Fine-pitch Chip-Scale BGA package. Key specifications include 1.5M system gates, 38,400 logic elements, embedded memory, 4 PLL clock managers, and high-speed LVDS I/O support. The -I7 industrial speed grade and the F1020 FC-FBGA package make this device suitable for designs requiring both performance and a compact board footprint. The APEX II architecture provides dedicated carry chains, embedded multipliers, and TriMatrix memory blocks to accelerate arithmetic and storage operations. The 0.15 µm CMOS process, combined with APEX II's multi-core interconnect, enables deterministic timing and predictable routing delays. Designers benefit from Quartus II design software support, an extensive IP library (MegaCore functions), and reference designs that shorten time-to-market for complex telecom, networking, and DSP systems. Typical applications include high-speed telecommunications infrastructure, ASIC prototyping, DSP accelerator cards, networking line cards, and image/video processing platforms. The large logic capacity allows multiple IP cores to be instantiated on a single device, reducing board complexity and overall system cost. When designing with this FPGA, ensure the PCB has a 1020-ball FC-FBGA land pattern with controlled-impedance routing for LVDS pairs. Use the Quartus II toolchain with the correct device library and timing model; verify pin assignments against the F1020 package pinout file. Thermal management is recommended because high utilization can produce significant power dissipation. This page synthesizes distributor pricing, drop-in alternative listings, and practical engineering notes specific to the EP2A40F1020I7N that are not found in the manufacturer datasheet alone.

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EP2A40F1020I8 - APEX II FPGA, 40K LEs, 735 I/O, 1020-BGA | Intel
EP2A40F1020I8

EP2A40F1020I8 - APEX II FPGA, 40K LEs, 735 I/O, 1020-BGA | Intel

The Intel EP2A40F1020I8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) with 655,360 system gates, 38,400 typical gates equivalent, and 2,560 logic elements housed in a 1020-ball FineLine BGA package. It provides 735 user I/O pins and operates across an industrial temperature range of -40C to +85C, making it suitable for high-performance digital designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells. FPGAs sit at the top of the programmable logic taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor. They are typically chosen over ASICs when designs require rapid prototyping, mid-volume production, or in-field reprogrammability, and over CPLDs when higher logic capacity, DSP throughput, or embedded memory bandwidth is needed. The EP2A40F1020I8 is built on a 0.18-micron process and offers embedded array blocks (EABs), high-speed True-LVDS support, and multi-level interconnect hierarchy. Its 735 user I/O pins are organized into 8 I/O banks supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, with per-pin direction, slew rate, and drive strength control. The device includes dedicated clock management with up to 8 phase-locked loops (PLLs), enabling complex multi-clock designs. Architecturally, the APEX II family combines a LUT-based logic element fabric with embedded system blocks that integrate memory, multipliers, and high-speed serial interfaces. The EP2A40F1020I8 supports up to 409,600 bits of embedded RAM via its embedded array blocks, allowing designs to absorb significant on-chip memory without external SRAM. Configuration is typically performed via JTAG or serial configuration devices, and the device supports in-system programmability (ISP) for field updates. Typical applications include high-speed telecommunications equipment, ASIC prototyping, image processing, and complex state machine controllers. Its 735 I/O pins make it particularly well-suited for designs that need to aggregate many parallel interfaces - parallel data buses, video capture pipelines, or high-density glue logic bridging multiple processors and memory subsystems. When designing with the EP2A40F1020I8, ensure the PCB has sufficient decoupling (one 0.1 uF per power pin plus bulk capacitors) and that BGA fanout uses escape routing compatible with the 1.27 mm pitch FineLine BGA. The industrial-grade -I8 temperature suffix supports environments up to +85C ambient without thermal derating beyond standard FPGA heat dissipation. This page synthesizes distributor pricing, drop-in alternatives from the APEX II family, and practical design notes that go beyond what is found in the manufacturer datasheet alone.

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EP2A40F1020I8N - APEX II FPGA 1.5M Gates FC-FBGA-1020 | Intel
EP2A40F1020I8N

EP2A40F1020I8N - APEX II FPGA 1.5M Gates FC-FBGA-1020 | Intel

The Intel EP2A40F1020I8N is a high-density APEX II family Field-Programmable Gate Array (FPGA) integrating 1.5 million system gates and 38,400 logic elements in a 1020-pin Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. Manufactured on a 0.15-micron CMOS process, the device operates from a 1.5 V core supply and is offered in the industrial -40 C to +100 C temperature grade as denoted by the I8 suffix. The APEX II architecture combines Look-Up Table (LUT)-based logic with embedded system blocks (ESBs) for memory and specialized functions, enabling high-throughput datapath and DSP-style designs. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic function is defined by user-loaded configuration data rather than fixed mask metallization. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs, PALs, and GALs, and they occupy the high-density end of that hierarchy. APEX II devices are positioned between classical gate-array ASICs and software-programmed microcontrollers, providing hardware-level parallelism for signal processing, glue logic, and accelerator functions where deterministic latency and high I/O count matter more than per-unit cost. Key specifications of the EP2A40F1020I8N include a maximum internal operating frequency around 376 MHz, embedded memory in the form of embedded system blocks, multiple Phase-Locked Loops (PLLs) for clock synthesis, and 735 user I/O pins supporting a wide range of single-ended and differential I/O standards. The FC-FBGA-1020 package is a high-density surface-mount BGA designed for high-speed signal integrity through short, controlled-impedance traces and a large ball-count footprint. Because the FC-FBGA package exposes the silicon die directly to the PCB through flip-chip solder bumps, thermal performance and PCB stack-up planning are critical design considerations. Typical applications for the EP2A40F1020I8N include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines in industrial and test equipment. The high logic capacity and 735 I/Os make it well suited to system-on-chip prototyping where multiple interface controllers can be integrated into a single device. Designers frequently pair APEX II FPGAs with external SRAM, SDRAM, or DDR memory controllers and clock-generation PLLs to build complete system prototypes before committing to mask-programmed silicon. When designing with the EP2A40F1020I8N, engineers should plan for the FC-FBGA-1020 land pattern using multi-layer PCB stack-ups with buried vias or microvias to fan out the dense BGA ball field. Power integrity requires multiple dedicated 1.5 V core and 3.3 V I/O decoupling capacitors placed as close as possible to the package balls, along with a separate PLL analog supply filtered to minimize jitter. Signal-integrity simulations are recommended for all high-speed differential pairs, and JTAG access must be brought out for in-system programming and boundary-scan testing. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the original Altera APEX II datasheet, helping engineers evaluate the EP2A40F1020I8N for both new designs and legacy maintenance.

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EP2A40F1020I9 - APEX II FPGA, 1.5M Gates, 1020-BGA | Altera
EP2A40F1020I9

EP2A40F1020I9 - APEX II FPGA, 1.5M Gates, 1020-BGA | Altera

The Altera EP2A40F1020I9 is a high-density APEX II family field-programmable gate array (FPGA) delivering 1.5M system gates, 38,400 logic elements (cells), and a maximum operating frequency of 366 MHz, fabricated on a 0.15 µm process with a 1.5 V core supply, and housed in a 1020-pin FC-FBGA (flip-chip fine-pitch BGA) package. The "I9" suffix denotes the industrial temperature grade (-40 °C to +100 °C junction), making the part suitable for harsh-environment designs that require extended thermal headroom over commercial grades. As a member of the APEX II family, the EP2A40F1020I9 integrates embedded system blocks (ESBs) for dual-port RAM, ROM, and first-in/first-out (FIFO) buffering alongside a four-input look-up table (LUT) architecture and a true multi-level interconnect network that scales efficiently across large designs. Per the manufacturer classification, the device belongs to the Programmable Logic Devices, Field Programmable Gate Arrays - FPGAs category. An FPGA (field-programmable gate array) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable routing, and I/O cells on a single silicon die. The hierarchy extends: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs differ from CPLDs (complex programmable logic devices) in that FPGAs use distributed RAM-based LUTs and richer interconnect fabric, enabling higher logic density at the cost of volatile configuration storage (typically SRAM-based, requiring external boot PROM). APEX II devices specifically add embedded system blocks (ESBs) and support for high-speed differential I/O standards, positioning the family for ASIC-prototyping, telecom line-card, and DSP-front-end applications. Key features of the EP2A40F1020I9 include 1.5M system gates, 38,400 logic cells, embedded system blocks for distributed memory and FIFO operation, multi-level high-speed interconnect with up to 366 MHz internal performance, support for multiple I/O standards including LVDS, PCI, and GTL+, and in-system programmability through an IEEE 1149.1 JTAG interface or passive serial/parallel configuration modes. The 1020-pin FC-FBGA package delivers high pin count for wide parallel interfaces and dense memory buses. The APEX II architecture combines a four-input LUT-based logic element with embedded system blocks, allowing each ESB to be configured as dual-port RAM, single-port RAM, ROM, or FIFO with up to 4 Kbits per block. The interconnect hierarchy uses DirectDrive technology for predictable timing closure across the full device. Typical applications include ASIC prototyping and emulation, high-speed telecommunications line cards with multi-channel SERDES interfaces, DSP co-processing front-ends for software-defined radio, complex state machines for industrial automation, and high-density glue-logic replacement. The industrial temperature grade extends the device's reach into outdoor telecom, military, and aerospace platforms. When designing with this device, plan for an external configuration PROM (such as an EPC2 or EPC16) because APEX II SRAM-based FPGAs lose their bitstream on power-down. Decoupling must follow Altera's AN 74 application-note guidelines for 1020-pin FC-FBGA layouts, with bulk and high-frequency ceramic capacitors placed within 100 mils of every power pin. This page synthesizes distributor pricing, drop-in same-brand alternatives from the APEX II family, and practical design notes that augment the manufacturer's datasheet and Pin Information tables.

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EP2A40F1020I9N - APEX II 1.5M Gates FPGA | Intel (Altera) | BGA-1020
EP2A40F1020I9N

EP2A40F1020I9N - APEX II 1.5M Gates FPGA | Intel (Altera) | BGA-1020

The Intel (formerly Altera) EP2A40F1020I9N is a high-density APEX II Family Field-Programmable Gate Array (FPGA) featuring 1.5M system gates and 38,400 logic cells, fabricated on a 0.15 micrometer all-layer copper-metal process (up to eight metal layers). The device operates from a 1.5 V core supply and is packaged in a 1020-pin flip-chip FineLine BGA (FC-FBGA) supporting industrial temperature range (I9 suffix), with a maximum internal clock frequency of 366 MHz. An FPGA (Field-Programmable Gate Array) is a programmable logic IC belonging to the broader category of programmable logic devices (PLDs). Within the taxonomy it sits under: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX II devices combine look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for memory and dedicated arithmetic, and a high-speed interconnect, enabling single-chip implementations of complex datapaths, bus interfaces, and DSP functions that previously required multiple ASICs or discrete logic. Key features of the EP2A40F1020I9N include 735 bidirectional I/O lines, support for multiple I/O standards including 1 Gbps True-LVDS, LVPECL, pseudo-current mode logic (PCML), and HyperTransport signaling, plus on-chip memory and PLL-based clock management. The embedded system blocks provide True-Dual-Port RAM, single-port RAM, ROM, and CAM (Content-Addressable Memory) at densities up to 491,520 RAM bits depending on configuration. Typical applications include high-speed telecom and datacom line cards, multi-protocol bridge/router designs, DSP co-processing front-ends, video/image processing pipelines, and ASIC prototyping. The 1 Gbps serial I/O capability makes it well suited for backplane and chip-to-chip interconnect in switch fabrics and serializer/deserializer (SERDES) companion designs, while the large logic capacity supports wide datapath implementations such as Forward Error Correction (FEC) engines. Designers should plan thermal management carefully because the FC-FBGA package requires a heatsink or forced-air cooling at sustained high toggle rates; signal-integrity work on 735 user I/Os is also mandatory. Configuration is performed via Altera/Intel serial (Passive Serial) or parallel (Passive Parallel Asynchronous / Synchronous) modes using an EPC configuration device or a microprocessor, with JTAG (IEEE 1149.1) available for boundary-scan and in-system programming. This page synthesizes distributor pricing, drop-in APEX II family alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate your evaluation and BOM decisions.

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EP2A40F1508 - Altera APEX II 40K LE FPGA, 1508-ball FBGA | Altera
EP2A40F1508

EP2A40F1508 - Altera APEX II 40K LE FPGA, 1508-ball FBGA | Altera

The Altera EP2A40F1508 is a member of the APEX II family of programmable logic devices from Altera (now Intel Programmable Solutions Group), delivering up to 40,000 logic elements in a 1508-ball FineLine BGA package. Built on a 0.18 µm CMOS SRAM process, the APEX II family combines high-density LUT-based logic with embedded multiplier blocks and PLLs, supporting up to 1.5 million system gates of logic density. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sitting alongside CPLDs and PALs but offering higher logic density, more I/O, and embedded memory and multiplier resources. FPGAs typically integrate look-up tables (LUTs), flip-flops, block RAM, DSP blocks, high-speed transceivers, and clock management resources, allowing complex digital systems such as processors, DSP pipelines, and high-speed interfaces to be implemented in a single chip. Key features of the EP2A40F1508 include 40,000 typical logic elements, 1,500 Kbits of embedded system memory (ESBs), twelve embedded multiplier blocks supporting 9x9-bit signed multiplication, four phase-locked loops (PLLs) for clock synthesis, and up to 824 user I/O pins. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, HSTL, SSTL, and LVDS through dedicated I/O structures. The 1.5V core supply with hot-socketing capability makes it suitable for high-availability systems and multi-FPGAs. Architecturally, the APEX II family is organized into rows and columns of embedded system blocks (ESBs), logic array blocks (LABs), and dedicated routing channels. Each LAB contains ten logic elements (LEs), each comprising a 4-input LUT, a programmable register, and dedicated carry/chain logic. The embedded multiplier blocks accelerate DSP functions such as FIR filters and complex FFTs, allowing designers to replace external multiplier ICs. The on-chip PLLs provide frequency synthesis, phase shifting, and clock deskew, essential for high-speed synchronous designs. Typical applications for the EP2A40F1508 include high-speed telecommunications switching, DSP and image processing front-ends, PCI bridge and bus-interface logic, industrial control and factory automation controllers, and military/aerospace signal processing. The combination of large logic capacity and embedded multipliers makes this part well-suited for designs that previously required multiple ASICs or FPGAs. When designing with the EP2A40F1508, careful attention must be paid to power supply sequencing (1.5V core before 3.3V I/O), proper decoupling across the 1508-pin BGA, and thermal management for the 31x31 mm FineLine BGA package. The Altera Quartus II development suite (versions 4.0 through 7.2) is required for design entry, place-and-route, and bitstream generation. This page synthesizes distributor stock data, verified drop-in same-package alternatives from the Altera APEX II family, and design considerations not collected in a single document by the manufacturer. All pricing and stock data are quoted as of 2026-09-08.

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EP2A40F33C-7 - Altera APEX II FPGA, 1500K Gates | Altera
EP2A40F33C-7

EP2A40F33C-7 - Altera APEX II FPGA, 1500K Gates | Altera

The Altera EP2A40F33C-7 is a high-density member of the APEX II programmable logic device family, delivering approximately 1,500,000 system gates in a 33 mm FineLine BGA package with -7 speed grade. It is fabricated on a 0.15 µm CMOS process and combines look-up table (LUT)-based logic, embedded system blocks (ESBs) for dual-port RAM and ROM, and high-speed interconnect to support complex system-on-chip (SoC) integration. The -7 speed grade places it in the mid-performance tier of the APEX II family, suitable for high-clock-rate datapath and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that engineers can configure after manufacture to implement custom integrated-circuit functionality. The taxonomy flows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs (smaller, non-volatile, typically used for glue logic) and alongside mask-programmed gate arrays and structured ASICs. APEX II is positioned between older APEX 20K series and the later Stratix/Stratix II families, and was Altera's flagship high-density platform before being superseded. The defining features of the EP2A40 include up to 40,960 logic elements (LEs), embedded memory blocks totaling approximately 342 Kbits of dual-port RAM, support for LVDS, LVPECL, and various single-ended I/O standards, and up to four phase-locked loops (PLLs) for clock management. The FineLine BGA-33 package supports high I/O count while preserving signal integrity for high-speed serial and parallel interfaces. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O flexibility across mixed-voltage system designs. Architecturally, APEX II combines a fine-grained logic fabric with ESBs that can be configured as memory, multipliers, or CAM. The LUT-based approach allows efficient mapping of state machines, datapaths, and pipelined arithmetic. The high-speed MultiTrack interconnect minimizes routing congestion for designs that would otherwise require a structured ASIC, making the EP2A40 well-suited for prototyping and low-to-medium volume production. Typical applications include high-speed telecommunications line cards, video and image processing pipelines, ASIC prototyping, DSP co-processing, and networking equipment where parallel processing throughput is essential. It is also used in industrial control and instrumentation requiring rapid custom logic implementation. When designing with the EP2A40F33C-7, ensure proper decoupling on all supply pins (per Altera's AN75 reference), follow IBIS models for signal-integrity analysis on high-speed nets, and use the Quartus II design software (version 6.0 or later, in legacy maintenance mode) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives within the APEX II family, and practical design notes that complement the manufacturer datasheet and Quartus II device support files.

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EP2A40F33C-8 - 40K LE APEX II FPGA, FBGA-672 | Intel / Altera
EP2A40F33C-8

EP2A40F33C-8 - 40K LE APEX II FPGA, FBGA-672 | Intel / Altera

The Intel / Altera EP2A40F33C-8 is a member of the APEX II programmable logic device (PLD) family, integrating 40,000 logic elements (LEs) in a 672-ball FineLine BGA (FBGA) package. The APEX II family combines look-up table (LUT)-based logic with embedded system blocks (ESBs) for high-density logic and memory operations, with the F33 package code identifying the 33 mm square FBGA substrate at a -8 speed grade. Field Programmable Gate Arrays (FPGAs) are a class of programmable logic devices that allow designers to configure digital logic after PCB fabrication, enabling rapid prototyping and design iteration. The APEX II family sits within the broader taxonomy of PLD -> CPLD/FPGA -> programmable logic IC -> semiconductor, and is designed for high-performance DSP, communications, and parallel processing applications. EP2A40 variants are typically used where high gate count and embedded dual-port RAM are required. The F33 package designation indicates a 672-ball FineLine BGA substrate at the 33 mm form factor, and the C suffix denotes a commercial operating temperature range (0C to +85C). The -8 speed grade specifies the slowest of three offered grades, which provides cost advantages for non-timing-critical designs. Moisture Sensitivity Level is MSL 3 per JEDEC J-STD-020, with a peak reflow temperature rating of 220C. EP2A40 devices combine four logic element groups, each containing ten LogicArray blocks, plus up to 1.125 Mbit of dual-port RAM implemented via embedded system blocks. Typical applications include PCI bus interfaces, high-speed DSP datapaths, telecommunications backplane bridging, and parallel coprocessing blocks. The 672-ball FBGA provides the I/O density required for wide datapath and external memory interfaces. When designing with this device, ensure MSL 3 handling procedures are followed during PCB assembly, as the plastic BGA absorbs moisture and requires a controlled bake-out before reflow. The -8 speed grade should be reserved for designs where timing margins exceed the slowest timing specifications. Use the Quartus II or MAX+PLUS II toolchain for synthesis, fitting, and timing analysis.

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EP2A40F33C-9 - APEX II 40K FPGA, F33 FBGA-672 | Intel / Altera
EP2A40F33C-9

EP2A40F33C-9 - APEX II 40K FPGA, F33 FBGA-672 | Intel / Altera

The Intel / Altera EP2A40F33C-9 is a member of the APEX II family of programmable logic devices, providing up to 1.6 million equivalent system gates and 65 Kbytes of embedded RAM in a 672-ball FineLine BGA (F33) package with commercial temperature grade and -9 speed grade. According to manufacturer naming convention decoded by multiple distributors, the part is built on a 0.15 micrometer CMOS process with multi-core architecture supporting up to 1,690 Kbits of dedicated RAM and 16 high-speed LVDS channels. An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks, all of which can be reconfigured by the designer after manufacturing. FPGAs sit at the boundary between general-purpose processors and ASICs: unlike microcontrollers they execute logic in hardware parallelism, and unlike ASICs they ship as blank silicon that customers customize in minutes rather than months. APEX II was Altera's high-density flagship prior to the Stratix era, targeting ASIC replacement, high-speed DSP datapaths, and bus-interface bridging. Key features of the EP2A40F33C-9 include 1.6 million maximum system gates, 65 Kbytes of embedded memory, four Delay-Locked Loops (PLLs) for clock conditioning, multi-voltage I/O support, and embedded LVDS channels capable of gigabit-per-second signaling. The F33 FineLine BGA package provides 672 balls on a 1.27 mm pitch, supporting dense board layouts and high pin-count signaling for parallel buses and memory interfaces. The -9 speed grade sits in the middle of the APEX II speed binning, balancing performance and power for cost-sensitive applications. The architecture is built on a Look-Up Table (LUT)-based fabric combined with dedicated multiplier, memory, and I/O elements. Embedded CAM blocks enable content-addressable memory applications such as network lookups and translation tables. The device supports hot-socketing, in-system programmability via JTAG, and configuration via serial PROM or parallel flash, allowing field updates without removing the device from its socket. Typical applications include ASIC prototyping and replacement, telecommunications switching equipment, high-speed serial protocol bridging, image and video processing pipelines, and military/aerospace control systems where legacy Altera design IP must remain supported. The wide I/O count makes it well suited to parallel processor glue logic and backplane interface bridging. When designing with this device, pay attention to the FineLine BGA breakout: 1.27 mm pitch requires at least 4-layer PCB stackup with microvias or HDI technology. The APEX II architecture requires the Quartus II (or MAX+PLUS II legacy) design software; verify tool support status before committing the design to a new schematic, since APEX II was classified NRND/EOL several years ago and many newer tool versions no longer target it. This page synthesizes distributor pricing for surplus stock, drop-in alternatives from the same Altera APEX II family that share the F33 FBGA-672 footprint, and practical design notes that go beyond what the manufacturer datasheet provides in isolation.

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EP2A40F33I-7 - APEX II FPGA 33FBGA, Intel / Altera, Industrial
EP2A40F33I-7

EP2A40F33I-7 - APEX II FPGA 33FBGA, Intel / Altera, Industrial

The Intel / Altera EP2A40F33I-7 is a high-density APEX II family Field Programmable Gate Array (FPGA) housed in a 33-ball Fine-pitch Ball Grid Array (FBGA) package, rated for industrial temperature range. It belongs to the APEX II programmable logic device family designed for high-performance, system-on-chip integration with embedded logic, memory, and high-speed interconnect. An FPGA (Field Programmable Gate Array) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O that can be reconfigured by the designer after manufacturing. In the broader taxonomy, FPGAs sit under programmable logic -> logic ICs -> integrated circuits, offering ASIC-class performance with NRE-free development cycles. The APEX II family is positioned for high-density data-path and communication designs, sitting between earlier APEX 20K and later Stratix families in Altera's roadmap. Key features of the EP2A40F33I-7 include peak reflow compatibility up to 220 C (Pb-free reflow profile), Moisture Sensitivity Level 3 (MSL3) per JEDEC J-STD-020, and an industrial temperature grade (-40 C to +85 C ambient). The 33-ball FBGA package is optimized for compact board layouts while still supporting high I/O density. The device is part of Altera's APEX II family - the '40' suffix indicates the high-density member of that generation with the largest logic capacity in its class. Technically, the APEX II family combines Look-Up Table (LUT)-based logic with embedded system blocks and high-speed interconnect, supporting megafunction IP cores for memory controllers, DSP pipelines, and bus interfaces. Designers typically use the Quartus design suite to synthesize, place-and-route, and program the device via JTAG or configuration flash. The 33-ball FBGA offers the smallest footprint in the APEX II lineup while preserving the family's high-speed I/O capabilities. Typical applications include telecommunications infrastructure (line cards, backplanes), high-speed serial protocol bridging, industrial control and factory automation backplanes, ASIC prototyping, and test & measurement instrumentation. The industrial temperature grade supports deployment in uncontrolled thermal environments without derating. When designing with this part, note that MSL3 requires floor-life management: bake-out or re-bag with desiccant if exposed beyond 168 hours. Use a Pb-free reflow profile peaking at 220 C and ensure BGA pad design follows the IPC-7351 nominal-density land pattern for 0.8 mm-pitch FBGA to avoid joint defects. This page synthesizes distributor availability, verified package and qualification data, drop-in same-family alternatives from the Site MPN list, and practical MSL/reflow handling notes not aggregated in any single datasheet.

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EP2A40F33I-8 - APEX II FPGA, 1.5M gates, 672 IO, F33 BGA
EP2A40F33I-8

EP2A40F33I-8 - APEX II FPGA, 1.5M gates, 672 IO, F33 BGA

The Altera (now Intel) EP2A40F33I-8 is a high-density APEX II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (F33) package with speed grade -8 and industrial temperature rating. Built on a 0.18 µm SRAM-look-up-table architecture with embedded MultiCore Interconnect (MCI), the device delivers up to 1,500,000 typical gates, 40,960 logic elements (LEs), and 425,984 bits of embedded system memory for high-performance programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. APEX II FPGAs belong to the broader programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. They differ from CPLDs (Complex Programmable Logic Devices) by offering higher logic density, distributed RAM, dedicated DSP blocks, and high-speed I/O, making them the platform of choice for parallel datapath and high-bandwidth designs. Key features include four phase-locked loops (PLUs), four high-speed clock networks, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL), and 16 high-speed clock pins. Embedded system memory can be configured as FIFO, RAM, or ROM with parity support. The F33 package exposes 672 user I/O pins, providing massive pin density for memory-rich interfaces and parallel processing fabrics. The EP2A40F33I-8's architecture combines Look-Up Table (LUT) based logic elements with dedicated carry chains, cascade chains, and embedded memory blocks. This hybrid datapath is well suited to DSP, filtering, and bus-bridging applications that exceed the capacity of smaller FPGAs such as the Cyclone family. Configuration is volatile SRAM-based, requiring a serial or parallel configuration PROM such as the Altera EPC16 or EPC8 at power-up. Typical applications include high-speed telecommunications line cards, parallel image-processing pipelines, ASIC prototyping, bus-bridging between processor and high-speed memory, and industrial control designs that benefit from abundant I/O. Designers commonly pair the EP2A40F33I-8 with Altera Quartus II design software for synthesis, place-and-route, and timing analysis. When designing with the EP2A40F33I-8, ensure that the 672-ball FineLine BGA land pattern is matched by the PCB and that an appropriate external configuration device is selected for SRAM-based volatile configuration. Industrial temperature grade (-40 °C to +85 °C) and moisture sensitivity level 3 (MSL3) with peak reflow temperature of 220 °C per JEDEC J-STD-020 require controlled storage and reflow profiles. This page synthesizes verified distributor pricing, drop-in same-brand variants from the same Altera APEX II family, and practical PCB-layout and configuration-design notes that complement - rather than duplicate - the official Altera APEX II datasheet.

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EP2A40F33I-9 - APEX II FPGA 1.5M gates 33-FBGA | Altera
EP2A40F33I-9

EP2A40F33I-9 - APEX II FPGA 1.5M gates 33-FBGA | Altera

The Altera (Intel) EP2A40F33I-9 is a member of the APEX II family of high-density programmable logic devices, integrating up to 1,500,000 typical gates (or 40,000 logic elements in Altera's marketing terminology for this legacy family) in a 33-ball FineLine BGA package. The "EP2A" prefix denotes the APEX II architecture, "40" the density grade, "F" the FineLine BGA package family, "33" the 33-ball count, "I" the industrial temperature range (-40C to +100C operating), and "-9" the fastest speed grade offered for this device in this package. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be reprogrammed by the customer after manufacture to implement arbitrary digital logic. FPGAs sit hierarchically above CPLDs (Complex Programmable Logic Devices) in density and below ASICs (Application Specific Integrated Circuits) in per-unit cost. The APEX II family, launched in the early 2000s, targets high-performance networking, telecommunications, and DSP applications where designers need hundreds of thousands of logic elements plus embedded memory and high-speed I/O in a single device. The architecture combines look-up-table (LUT) based logic with embedded array blocks (EABs) for memory and DSP functions. Key features of the EP2A40F33I-9 include 1.5M typical gates, embedded system blocks, multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and LVDS I/O capability for high-speed chip-to-chip signaling. The FineLine BGA-33 package provides a compact footprint suitable for space-constrained designs while still offering sufficient pin count for the device's signal I/O requirements. The industrial temperature range supports operation in harsh environments including outdoor telecommunications and industrial automation. The APEX II architecture combines LUT-based logic with embedded array blocks providing on-chip memory and dedicated carry chains for arithmetic. MultiVolt I/O allows mixed-voltage interfacing without external level shifters, which simplifies board design when the FPGA bridges legacy 5V peripherals and modern 1.8V cores. The combination of high density and flexible I/O made APEX II popular for protocol bridge, packet processing, and high-speed serial interface designs in the early-to-mid 2000s. Typical applications for this part include telecommunications line cards, industrial control systems, DSP co-processing, custom interface bridging, and legacy ASIC replacement designs. The BGA package is generally chosen where PCB real estate is at a premium and the design can accommodate the reflow and inspection challenges of BGA assembly. When designing with this FPGA, ensure your CAD tool flow supports the APEX II family (Quartus II versions up to v9.0, or third-party legacy flows). Verify BGA pad design follows IPC-7351 guidelines and that your PCB fabrication can achieve the required laser-drilled microvia or via-in-pad stackup for the 0.8 mm ball pitch typical of FineLine BGA packages. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical sourcing notes not found in the manufacturer datasheet, helping engineers evaluate availability and second-source options for this legacy Altera device.

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EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel
EP2A40F672C6

EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel

The Altera (Intel) EP2A40F672C6 is a member of the APEX II family of programmable logic devices, fabricated on a 0.18-micron CMOS process and packaged in a 672-ball FineLine BGA. It integrates approximately 40,000 typical logic elements (LEs) with embedded system blocks (ESBs) for memory and specialty functions, plus a high-speed interconnect network that targets high-density, high-throughput datapath applications. The 'C6' speed grade designates a commercial-temperature part in the mid-speed tier of the APEX II family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all controlled by SRAM-based configuration memory. FPGAs sit at the apex of programmable logic in the taxonomy: programmable logic -> CPLD/FPGA -> logic IC -> integrated circuit. They are widely used for hardware acceleration, custom datapaths, glue logic, prototyping ASICs, and high-speed signal processing where the parallelism and reconfigurability of the silicon deliver orders-of-magnitude performance wins over general-purpose microcontrollers. Key features of the APEX II family include embedded system blocks that can be configured as dual-port RAM, ROM, FIFO, CAM, or multiplier blocks; LVDS and LVTTL I/O support; a dedicated clock network with PLL support; and JTAG-based boundary-scan testing compliant with IEEE 1149.1. The EP2A40F672C6 in particular supports up to 12 high-speed clock networks, embedded array blocks optimized for datapath arithmetic, and a deterministic interconnect fabric aimed at high-utilization designs above 50K system gates. Architecturally, APEX II combines look-up-table-based logic elements with embedded memory/multiplier blocks (MultiCore elements), enabling designers to implement wide datapaths, DSP functions, and packet-processing pipelines in a single device. The FineLine BGA-672 package provides dense, high-pin-count I/O for memory interfaces and multi-gigabit serial or parallel LVDS channels. Typical applications include telecommunications line cards, high-speed packet classification, ASIC prototyping, image and video preprocessing pipelines, and industrial DSP controllers. The wide I/O count also suits memory-heavy designs such as deep FIFO buffers and multi-bank external memory controllers. When designing with the EP2A40F672C6, note that the APEX II family has reached end-of-life and is no longer recommended for new designs. Designers should treat the part as long-term support only and prefer current-generation Intel/Altera FPGA families such as Cyclone IV/V, Arria, or Stratix for new projects, while reserving the EP2A40F672C6 for legacy board drop-in or repair. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers decide whether to source, replace, or redesign around the EP2A40F672C6.

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EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel
EP2A40F672C6N

EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel

The Intel EP2A40F672C6N is a member of the APEX II programmable logic device family, integrating approximately 40,000 logic elements with up to 1,125,000 system gates in a 672-ball FineLine BGA package. As a high-density SRAM-based FPGA, it combines lookup-table based logic, embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, and dedicated high-speed interconnect (FastTrack) routing. The device operates from a 1.5 V core supply with multiple I/O bank voltages supporting mixed-voltage interfacing across 5 V, 3.3 V, 2.5 V, and 1.8 V standards. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic through configuration of on-chip lookup tables, embedded memory blocks, and routing resources. APEX II sits in the hierarchy between low-density CPLDs and high-end SoC FPGAs, providing high logic density for data-path, DSP, and multi-protocol bridging applications. The EP2A40 is the largest member of the APEX II family, doubling the logic capacity of the EP2A25 while maintaining the same Quartus II design flow. Key features include MultiVolt I/O support for direct interfacing to 1.8 V, 2.5 V, 3.3 V, and 5 V buses without level shifters, dedicated clock management with PLL-based clock tree synthesis, and high-bandwidth embedded memory suitable for FIFO, dual-port RAM, and content-addressable memory. The FastTrack interconnect provides predictable timing across the entire device, simplifying timing closure for wide data buses. The 672-ball FineLine BGA package exposes the maximum number of user I/O for the EP2A40 die, making it suitable for high-pin-count interface aggregation. The APEX II architecture combines four-input look-up tables grouped into Logic Array Blocks (LABs), each LAB containing ten LEs plus local interconnect. ESBs (Embedded System Blocks) provide 2 Kbits of dual-port RAM each and can be cascaded to form wider or deeper memories. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL I/O standards, with per-pin slew-rate and drive-strength control. Configuration is supported via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Typical applications include high-speed data-path bridging, multi-channel protocol conversion (e.g., SPI to parallel), glue-logic aggregation in ASIC prototypes, telecom line-card backplane interfacing, and industrial imaging pre-processing. The large logic capacity supports soft-core processor implementations such as the Nios embedded processor within the Quartus II tool flow. The wide I/O count enables direct connection to DDR-style memory buses and parallel ADC/DAC interfaces. Designers should verify availability before starting new designs because APEX II is an older-generation family that has been superseded by Cyclone, Arria, and Stratix families. Existing designs typically rely on the Quartus II v5.0 or earlier toolchain for synthesis, place-and-route, and timing analysis. Power estimation should include both static and dynamic components, with thermal management important at high toggle rates. This page synthesizes distributor stock signals, drop-in same-package variants within the APEX II family, and practical design notes not found in a single manufacturer document.

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EP2A40F672C7 - APEX II FPGA, 40K LEs, 672-FBGA | Intel / Altera
EP2A40F672C7

EP2A40F672C7 - APEX II FPGA, 40K LEs, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2A40F672C7 is a member of the APEX II family of programmable logic devices, manufactured on a 0.15 µm all-layer copper CMOS process. It integrates 38,400 logic elements (1.5 M system gates) and 2,560 macro cells in a 672-ball FineLine BGA package (FC-FBGA, 27 x 27 mm, 1.0 mm pitch). Core voltage is 1.5 V with MultiVolt I/O support, and the device features 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface capability on dedicated high-speed channels. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. APEX II devices specifically target high-density, high-bandwidth applications by combining look-up-table (LUT) based logic with embedded system blocks (ESBs) that can be configured as RAM, ROM, or content-addressable memory. The hierarchy in the taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key specifications include 492 user I/Os, an internal performance of up to 562 MHz (per datasheet headline figure), 1.55 ns pin-to-pin delay (C7 speed grade), and on-die high-speed serial interface channels supporting 1 Gbps operation. The device also integrates four phase-locked loops for clock management and a multi-voltage I/O bank architecture allowing selectable 1.5 V, 1.8 V, 2.5 V, or 3.3 V interfacing on a per-bank basis without external level shifters. Typical applications span high-performance data path implementation, telecommunications backplanes, RAID controllers, and high-speed serial protocol bridging. The True-LVDS capability makes the EP2A40F672C7 particularly suited for chip-to-chip interconnect at gigabit rates across short backplane traces. When designing with this device, allocate adequate PCB layers for the FC-FBGA escape routing and ensure decoupling is placed immediately adjacent to the BGA balls. The C7 speed grade offers an attractive balance of timing margin and cost for designs that do not require the maximum C8 or C9 grades, and the part is supplied in tray or tape-and-reel packaging as required by production volume. This page consolidates distributor pricing, comparison with related speed-grade and package variants, and design notes specific to APEX II FC-FBGA implementation that are not typically present on a single manufacturer page.

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EP2A40F672C7ES - APEX II 1.5M Gates FPGA 672-FBGA | Intel / Altera
EP2A40F672C7ES

EP2A40F672C7ES - APEX II 1.5M Gates FPGA 672-FBGA | Intel / Altera

The Intel / Altera EP2A40F672C7ES is a high-density APEX II family FPGA delivering 1.5M system gates and 38,400 logic elements, fabricated on a 0.15 µm CMOS process and housed in a 672-pin FineLine BGA (FC-FBGA) package measuring 27 × 27 mm with 1.0 mm pitch. It supports up to 492 user I/O and runs at a maximum internal frequency of 562 MHz, with a core voltage of 1.5 V. The device operates across the commercial temperature range, carries the speed grade 7 designation, and ships as an enhanced-status "ES" engineering sample. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through a lookup-table and routing fabric. APEX II extends this model with embedded system blocks (ESBs) for dual-port RAM, ROM, and CAM, plus a high-bandwidth MultiCore interconnect that links logic array blocks (LABs), ESBs, and I/O elements (IOEs) on a single die. The hierarchy is: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Key specifications include 1.5M typical gates (40K logic elements), 40,960 maximum logic elements, 2,560 macro cells, 562 MHz core operation, 1.5 V VCCINT with 3.3 V VCCIO support, and 492 user I/O pins. On-chip resources include embedded array blocks, FastRow interconnect, and LVTTL/LVCMOS/SSTL/HSTL I/O standards. The FC-FBGA-672 package with 1.0 mm pitch is suitable for high-density production designs. The APEX II architecture pairs a fine-grained logic array with coarse-grained embedded system blocks, allowing designers to trade off LUT-based logic against dedicated memory and CAM functions. The MultiCore interconnect uses a continuous row-and-column routing fabric, which simplifies timing closure for wide datapath and memory-intensive designs compared with segmented-routing alternatives. Typical applications include high-throughput telecommunications backplanes, network processing line cards, ASIC prototyping, and DSP co-processing. The wide I/O count and large embedded memory footprint make it a fit for protocol bridging, where many parallel channels must be aggregated with on-chip buffering. When selecting APEX II devices, note that ES variants are engineering samples intended for prototyping only; for production, choose C7/C8/C9 commercial or I7/I8 industrial speed-grade parts. The 672-ball FBGA requires controlled-impedance PCB layout and a minimum of 6 PCB layers for proper power distribution. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera APEX II family, and design notes not collected in the manufacturer datasheet PDF.

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EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel
EP2A40F672C7N

EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel

The Intel EP2A40F672C7N is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering 1.5 million system gates and 38,400 logic cells, fabricated on a 0.15-micron all-layer copper-metal CMOS process with up to eight metal layers. It is packaged in a 672-ball FineLine BGA (FC-FBGA / S-PBGA-B672) measuring 27 x 27 mm with a 1.0 mm ball pitch. The device operates from a 1.5 V core supply, supports up to 492 user I/Os, and offers a typical propagation delay of 1.55 ns with internal performance rated up to 562 MHz. Per the manufacturer datasheet, the EP2A40F672C7N integrates up to 1 Gbps multi-gigabit transceiver-class signaling on selected I/O banks, embedded system blocks, and on-chip RAM, targeting broadband, networking, and DSP-heavy designs. What is a high-density FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. APEX II sits in the high-density tier of the taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic IC -> integrated circuit. APEX II was engineered for systems that combine glue logic, datapath arithmetic, on-chip memory, and high-speed serial I/O on a single silicon die, replacing multiple discrete ASICs and reducing BOM cost and board area. Key features of the EP2A40F672C7N include 38,400 logic elements, 1.5 M system gates, 492 user I/Os, 1.55 ns propagation delay, 562 MHz internal performance, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, and a 0.15-µm copper CMOS process. The 'C7' speed grade denotes the commercial temperature range 0 °C to 85 °C with a specific timing closure. The 'N' suffix indicates a lead-free, RoHS-compliant FC-FBGA package. The device supports in-system configuration via passive serial, passive parallel, and JTAG modes, allowing rapid prototyping and field upgrades. Typical applications for the EP2A40F672C7N include 1 Gbps+ networking line cards, custom datapath accelerators, telecommunications backplanes, broadband aggregation, DSP co-processing, and legacy ASIC replacement in telecommunications and storage infrastructure. The large gate count and abundant I/O make it well suited to designs that previously required multiple smaller FPGAs. The MultiVolt I/O simplifies interfacing with legacy 5 V ASICs, memory, and bus transceivers. When designing with the EP2A40F672C7N, ensure the 672-ball FC-FBGA land pattern is matched exactly - this is a 27 x 27 mm, 1.0 mm pitch FineLine BGA that requires PCB microvia stackups and controlled-impedance routing. Decoupling must follow the manufacturer reference design, and unused I/O banks should be configured as outputs driving '0' or tied to defined logic levels. This page synthesizes distributor pricing, pin-compatible APEX II family drop-ins, and practical design notes not found in the manufacturer datasheet.

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EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
EP2A40F672C8

EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel

The Intel (formerly Altera) EP2A40F672C8 is a member of the APEX II family of FPGAs, manufactured using a 0.15-micron all-layer copper-metal process with up to eight metal layers, and packaged in a 672-ball FineLine BGA measuring 27 x 27 mm with a 1.0 mm pitch. The device integrates 40,000 typical logic elements (LEs) along with embedded memory blocks, dual-port RAM, and dedicated high-speed interfaces supporting 1 gigabit per second LVDS signaling. According to Intel APEX II datasheet documentation, the EP2A40F672C8 is rated for the commercial temperature range (0 C to 85 C) and provides 492 user I/O pins, enabling dense system-level integration for high-throughput applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer. Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget. Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging. Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends. When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies. This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.

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