EP2A40F1020C9N - APEX II 1.5M Gates FPGA, 1020-BGA | Intel
料号： EP2A40F1020C9N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 50 | $224 | $11,200.00 |
| 100 | $198 | $19,800.00 |
| 500 | $175 | $87,500.00 |
EP2A40F1020C9N 概述
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets designers implement custom digital logic via a hardware description language. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD), then logic ICs, then integrated circuits, then semiconductors. The APEX II family specifically targets high-performance data-path and communications applications where both logic density and rich I/O count are required.
Key features of the EP2A40F1020C9N include 38,400 logic cells, 1.5M system gates, embedded system blocks (ESBs) for RAM and ROM, and a MultiCore architecture that places four logic array blocks (LABs) per row for fine-grained timing control. The device supports in-circuit reconfigurability via passive serial, passive parallel, and JTAG interfaces, enabling live firmware updates in deployed systems.
Architecturally, the EP2A40 uses a MultiCore interconnect with DirectDrive technology, ensuring predictable routing delays across the die. The 0.15-µm process with eight copper layers provides superior signal integrity at high toggle rates, and the on-chip Phase-Locked Loops (PLLs) deliver flexible clock management for multi-domain designs. The 33 × 33 mm BGA-1020 package with 1 mm pitch supports high-density board layouts while exposing 735 user I/Os for parallel bus or LVDS SERDES interfaces.
Typical applications include high-speed data-path designs such as telecommunications switching, SONET/SDH framer/mapper ICs, high-end router line cards, and DSP co-processing cards. It is also well-suited for ASIC prototyping where 1.5M gates of capacity let designers emulate large SoCs before tape-out. When designing with this FPGA, allocate sufficient decoupling and provide thermal relief via the exposed die paddle. Engineers should also note that the APEX II family is end-of-life — verify second-source or replacement strategy before committing to new designs.
直接替换替代料： EP2A40F1020C9N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A40F1020C9N （相同外形与封装尺寸） ——差异在于 Package, Process Technology, System Gates, Operating Temperature, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP2A40F1020C8N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2A40F1020C7N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP2A40F1020C6N
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$198 / 个
查看数据手册 →EP2A40B724C9N
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$99.5 / 个
查看数据手册 →EP2A40B724C8N
✅ 直接替换✓ 有现货
$199.5 / 个
查看数据手册 →EP2A40F1020C9N 最大额定值与电气特性
| Family | APEX II |
| Series | EP2A40 |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Logic Family | CMOS |
| System Gates | 1.5 M |
| Logic Cells / Elements | 38,400 |
| Maximum Operating Frequency | 366 MHz |
| Propagation Delay | 1.55 ns |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) |
| User I/O Pins | 735 |
| Total Pins | 1020 |
| 封装 | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine |
| 工作温度 | 0 °C to 85 °C |
| I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| On-chip Memory | Embedded System Blocks (ESB) for RAM/ROM |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | unknown |
EP2A40F1020C9N 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch, fineline 引脚配置指南
EP2A40F1020C9N（1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch, fineline 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A40F1020C9N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A40F1020C9N 适用于 6 应用s: Telecommunications Switching, SONET/SDH Framer and Mapper, ASIC Prototyping and Emulation, High-End Router Line Cards, DSP Co-Processing Cards, Industrial Test and Measurement.
Telecommunications Switching
The EP2A40F1020C9N's 1.5M system gates and 735 user I/Os make it well suited to high-density telecom switching fabrics. Per the APEX II datasheet DS-APEXII-3, the device's 1 Gbps True-LVDS and LVPECL capability delivers the parallel interconnect required by crossbar switches and TDM backplanes. Compared with discrete logic implementations, an FPGA fabric lets designers change port counts and arbitration policies through firmware rather than board rework. Use the device's embedded system blocks for connection-memory lookup tables and dedicate LAB rows to high-priority traffic for deterministic latency.
推荐
SONET/SDH Framer and Mapper
The EP2A40F1020C9N supports SONET/SDH framers and mappers that require precise clock recovery and high parallel lane count. According to the APEX II datasheet DS-APEXII-3, the 0.15 µm all-layer copper process gives the timing margin needed for OC-192-class designs, while on-chip PLLs clean up recovered clocks. The 38,400 logic elements hold full STS-1/STS-3 path and section overhead processing, while 735 user I/Os expose 10-bit or 16-bit parallel bus interfaces to PHY devices. Compared with ASICs, the FPGA's reconfigurability lets designers update framing as standards evolve.
推荐
ASIC Prototyping and Emulation
The EP2A40F1020C9N's 1.5M gates of capacity make it ideal for ASIC prototyping of large SoC designs before tape-out. Per distributor specifications, 38,400 logic elements hold substantial portions of a multi-million-gate ASIC, while in-circuit reconfigurability via JTAG and passive serial modes accelerates iteration cycles. The 735 user I/Os expose wide parallel buses for memory and peripheral emulation. Compared with smaller FPGAs, the EP2A40 reduces multi-chip partitioning overhead and lets designers validate timing closure in silicon rather than simulation alone.
推荐
High-End Router Line Cards
The EP2A40F1020C9N delivers the parallel logic and I/O bandwidth needed in router line cards handling 10 Gbps Ethernet, POS, and ATM. According to the APEX II datasheet DS-APEXII-3, the 1 Gbps True-LVDS interfaces handle SFI-4 connections to network processors, and 735 user I/Os expose packet-classification and traffic-management datapaths. The 1.5 V core reduces per-bit switching power relative to older 2.5 V families. Compared with ASIC NPU designs, the EP2A40 lets designers add new protocols and QoS features through firmware updates without respinning line-card hardware.
推荐
DSP Co-Processing Cards
The EP2A40F1020C9N's 38,400 logic elements and embedded system blocks make it well suited to DSP co-processing, where the FPGA accelerates FIR filters, FFTs, and baseband signal processing. Per the APEX II datasheet DS-APEXII-3, the on-chip ESB memory provides local coefficient and sample storage, while the 0.15 µm process supports the toggle rates required for high-throughput DSP datapaths. The 366 MHz internal clock rate is sufficient for many baseband and intermediate-frequency processing tasks. Compared with dedicated DSP chips, the FPGA's parallel fabric can process multiple streams simultaneously with deterministic latency.
推荐
Industrial Test and Measurement
The EP2A40F1020C9N's parallel architecture and rich I/O count make it valuable in industrial test equipment such as protocol analyzers, bit-error-rate testers, and boundary-scan controllers. Per Jotrin Electronics specifications, the device's 735 user I/Os expose enough parallel channels for multi-lane bus monitoring, while embedded system blocks buffer captured transactions. Compared with discrete logic, an FPGA-based design lets test vendors add protocol updates and customer-specific features without reworking hardware, shortening time-to-market for new compliance standards.
推荐
推荐产品汇总
工程参考数据： EP2A40F1020C9N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A40F1020C8N | EP2A40F1020C7N | EP2A40F1020C6N | EP2A40B724C9N | EP2A40B724C8N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 × 33 mm) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 724-ball BGA - different | 724-ball BGA - different |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | C9 | C8 | C7 | C6 | C9 | C8 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest speed grade in the APEX II EP2A40 family （对比 EP2A40F1020C8N)
- Maximum user I/O count via 1020-ball BGA （对比 EP2A40B724C9N)
- Direct replacement for same-package speed-grade alternatives （对比 EP2A40F1020C7N)
设计说明
The EP2A40F1020C9N is housed in a 33 × 33 mm FC-FBGA package without an exposed die paddle. For designs in 0 to 85 °C environments, provide thermal relief through PCB copper pour under the device, ideally a 6 × 6 grid of thermal vias to internal ground planes. At 366 MHz toggle rates the device draws measurable core current; thermal analysis should include worst-case junction temperature under sustained traffic patterns.
Route the 1020-ball BGA with microvia technology on at least the top two signal layers to fan out the 1 mm pitch balls. Use a four-layer or six-layer stackup with continuous power planes adjacent to the BGA breakout zone to maintain signal integrity for 1 Gbps True-LVDS interfaces. Decouple every VCCIO bank with 0.1 µF and 10 µF capacitors placed within 100 mil of the balls per the APEX II datasheet DS-APEXII-3.
The APEX II family requires Quartus II version 9.0 or earlier for bitstream generation; newer Quartus versions do not support APEX II. Configuration via JTAG must respect the VCCINT ramp sequence; do not assert nCONFIG until VCCINT and VCCIO are within tolerance. Mismatched bank voltages between JTAG and configuration pins can permanently damage the device — review bank voltage assignments before PCB layout finalization.
合规信息
APEX II family is obsolete as of late 2000s; original Altera/Intel datasheets do not explicitly state RoHS or REACH compliance. AEC-Q100 does not apply to FPGAs.
