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EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel
EP2AGZ225FF35I4G

EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ225FF35I4G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, integrating approximately 224,000 logic elements with 554 user I/Os in a 1152-ball FineLine BGA (FBGA) package and rated for industrial (-40C to +100C) operation. The 'I4' speed/temperature grade, 'GZ' series designation, and 1152-FBGA package code 'FF35' together identify the largest-density member of the cost-optimized Arria II family, which pairs a programmable logic engine with embedded transceivers and DSP blocks for mid-range signal-processing designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family. Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals. Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software. Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments. When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.

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EP2AGZ225FF35I4N - 224K LE Arria II GZ FPGA, 1152-FCBGA | Intel
EP2AGZ225FF35I4N

EP2AGZ225FF35I4N - 224K LE Arria II GZ FPGA, 1152-FCBGA | Intel

The Intel EP2AGZ225FF35I4N is a high-density, high-performance Arria II GZ family field programmable gate array (FPGA) delivering 224,000 logic elements (LEs), 14,248,960 bits of embedded memory, and 8,960 LABs/CLBs in a 1152-ball flip-chip BGA (FC-FBGA) package operating at 500 MHz on a 40 nm process with 0.9 V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing fabric, with embedded memory, DSP blocks, and high-speed transceiver/IO resources. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) under digital integrated circuits, and the Arria II GZ family specifically targets mid-to-high-end applications that need transceivers, parallel memory interfaces, and signal-processing throughput but do not require the very latest transceiver data rates. Key features of the EP2AGZ225FF35I4N include 554 user I/Os, 12 transceivers capable of multi-gigabit operation, dedicated DSP blocks, embedded memory organized as M9K/M144K blocks, and support for external memory interfaces including DDR3. The device operates across an industrial temperature range of -40C to +100C, supports configuration via fast passive parallel (FPP) and active serial (AS) modes, and provides JTAG (IEEE 1149.1) and SignalTap embedded logic analysis. Architecturally, the Arria II GZ uses a logic fabric of 8-input adaptive logic modules (ALMs) and an 8.96 Mbit distributed+block memory hierarchy. The 40 nm low-power process yields high DSP throughput while keeping the static power low for high-density designs such as high-definition video processing, multi-channel baseband aggregation, and radar pre-processing. Typical applications include high-definition video broadcasting infrastructure, wireless baseband processing, military radar and signal intelligence, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, CPRI), and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to data-pump designs that previously required a discrete DSP + memory + ASIC combination. When designing with this device, ensure that the PCB footprint matches the 35 mm x 35 mm, 1.0 mm pitch FC-FBGA-1152 land pattern and that the board provides all required decoupling per Intel's pin connection guidelines. Power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails must follow the datasheet power-on-reset (POR) requirements to avoid configuration failure. This page synthesizes distributor pricing, drop-in alternatives (same brand, then cross-brand), pin-level design guidance, and application notes not found in the manufacturer datasheet alone, helping procurement and hardware engineers evaluate this FPGA quickly for new builds or legacy board refresh.

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EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel
EP2AGZ225HF40C3G

EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel

The Intel (formerly Altera) EP2AGZ225HF40C3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process, delivering 225,000 logic elements (LE) and 734 user I/O in a 1517-ball flip-chip BGA package. It targets mid- to high-bandwidth digital signal processing, high-speed serial interconnect, and memory-intensive designs that need more logic density than Arria II GX parts and more transceiver/PCIe capability than Cyclone-class devices. The HF40 device suffix denotes the 1517-ball FBGA package, a commercial temperature grade (C3), and the Altera/Intel ordering scheme used for Arria II GZ. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all of which can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs sit hierarchically under programmable logic devices (PLD) and above ASICs in flexibility-versus-ASIC NRE trade-off; they are widely used as hardware accelerators, protocol bridges, and pre-silicon prototyping platforms. The Arria II GZ family is positioned in Intel's mid-range portfolio, between the lower-power Cyclone series and the high-end Stratix series. Key features of the EP2AGZ225HF40C3G include 225,000 logic elements, embedded memory in the multi-megabit range, embedded DSP blocks with hardware multipliers, high-speed transceivers supporting multi-gigabit serial protocols, and PCI Express (PCIe) hard IP blocks. The 1517-ball FBGA package supports 734 user I/O pins, providing generous connectivity for parallel memory buses (DDR3), high-speed ADC/DAC interfaces, and backplane transceivers. The C3 speed grade trades timing margin for power savings relative to the faster C4/C5/C6 grades. The Arria II GZ architecture combines hard IP for PCIe Gen2, multi-gigabit transceivers, and variable-precision DSP blocks, allowing system designers to consolidate functions that previously required an FPGA plus a companion ASSP. Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar and signal-intelligence front ends, medical imaging pipelines, and high-performance computing acceleration cards. The 734 I/O count in particular suits designs that aggregate many parallel channels. When designing with this part, engineers must respect the flip-chip BGA PCB requirements: controlled-impedance stackup, microvia or via-in-pad construction, and matched-length routing for the DDR3 memory interface. Designers should also consult the Arria II GZ device handbook for transceiver channel placement and PLL configuration. The C3 speed grade is appropriate when timing margin can be traded for power, while C6 is used for the most demanding timing closure.

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EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA
EP2AGZ225HF40C3N

EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA

The Intel (formerly Altera) EP2AGZ225HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 224,000 logic elements, 14,248,960 embedded memory bits, and 734 user I/O pins in a 1517-ball flip-chip BGA (FBGA, package code HF40) package. Built on a 40 nm low-power process, the Arria II GZ family targets mid- to high-end applications requiring transceivers, DSP blocks, and high memory bandwidth. What is a Field-Programmable Gate Array (FPGA)? An FPGA is a reconfigurable integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, DSP slices, and block memory. In the power-management IC hierarchy, an FPGA sits above microcontrollers and below ASICs in performance and flexibility, allowing hardware designers to implement custom parallel logic, signal processing, and high-speed serial interfaces without fabricating a custom chip. Key features include 8,960 Logic Array Blocks (LABs), high-speed transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for fixed- and floating-point arithmetic, and a rich clock management network with phase-locked loops. The device supports 1.0 V core operation with on-chip regulators and offers multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. The architecture combines logic fabric with hard IP such as PCI Express Gen1/Gen2 hard IP blocks, 6.375 Gbps transceivers, and dedicated memory interfaces (DDR3) for high-throughput external memory access. The HF40 1517-BGA package exposes the maximum I/O count and transceiver pins, enabling full-feature designs in a single device. Typical applications include high-speed data acquisition, digital signal processing in radar and software-defined radio, PCIe-based accelerator cards, broadcast video processing, and high-end telecommunications line cards. The wide transceiver bandwidth and DSP density make Arria II GZ suitable for systems that demand deterministic parallel processing. Designers should plan power sequencing across the 0.9 V core, 1.0 V transceiver, and I/O supplies, ensure thermal coupling with the BGA substrate, and validate signal integrity for high-speed serial links using Intel's Quartus II design tools. This page synthesizes distributor pricing, drop-in pin-compatible Arria II GZ variants, and practical FPGA design notes not consolidated in the manufacturer datasheet.

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EP2AGZ225HF40C4G - 225K LE Arria II GZ FPGA, 1517-FBGA | Intel
EP2AGZ225HF40C4G

EP2AGZ225HF40C4G - 225K LE Arria II GZ FPGA, 1517-FBGA | Intel

The Intel (formerly Altera) EP2AGZ225HF40C4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) providing 225,000 logic elements, embedded transceivers, and rich on-chip memory in a 1517-ball FineLine BGA package. Built on a 40 nm low-power process, the device integrates 12.5 Mbits of embedded memory, 1,224 18x18 multipliers, and 734 user I/O pins for high-throughput digital designs. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit in the programmable-logic layer of the digital design hierarchy, above general-purpose microcontrollers and below fixed-function ASICs, and are widely used for hardware-acceleration, prototyping, and time-to-market-sensitive designs. Key features of the EP2AGZ225HF40C4G include 8 dedicated 3.125 Gbps transceivers (C4 speed grade, commercial, 0.85V Vcc), 1,224 18x18 hardware multipliers for high-performance DSP, 12.5 Mbits of embedded RAM, and 734 general-purpose user I/Os that support multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The HF40 package designation indicates a high-density FineLine BGA with 1517 balls. The Arria II GZ architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, achieving an optimal balance between logic density, performance, and power. Transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and SerialLite II, enabling high-speed serial connectivity for communications, broadcast, and military designs. Typical applications include high-speed serial-interface bridging cards, DSP co-processing cards, software-defined radio (SDR) baseband cards, telecom line cards, military radar and signal-intelligence prototypes, and ASIC prototyping platforms that demand hundreds of I/Os and multi-gigabit transceivers. When designing with this device, ensure adequate power-rail decoupling near every transceiver supply pin, controlled-impedance routing on all high-speed serial lanes, and thermal relief for the FineLine BGA through adequate PCB copper and airflow. This page synthesizes distributor pricing, drop-in Arria II GZ alternatives, and practical board-design notes not found in the manufacturer datasheet alone.

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EP2AGZ225HF40C4N - Arria II GZ FPGA 224K LE 1517-FCBGA | Intel
EP2AGZ225HF40C4N

EP2AGZ225HF40C4N - Arria II GZ FPGA 224K LE 1517-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ225HF40C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 RAM bits, and 734 user I/O pins in a 1517-ball FineLine BGA package with a -40C to +85C commercial operating temperature grade. The Arria II GZ family targets mid-range, high-bandwidth applications that require a balance of logic density, on-chip memory, and transceiver capability without moving to the more expensive Stratix tier. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that the designer configures after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which are a sub-category of digital integrated circuits. The Arria II GZ family adds dedicated transceiver and DSP blocks on top of standard FPGA fabric, placing it at the intersection of programmable logic and high-speed serial signal processing. Key features include 8,960 LABs (Logic Array Blocks), embedded transceivers supporting multi-gigabit serial protocols, DSP blocks for high-throughput fixed- and floating-point arithmetic, and a rich clock network with PLLs for multi-domain designs. The 40 nm process node combined with on-chip hard IP blocks gives the GZ family a favorable performance-per-watt ratio relative to older Arria generations. Technical depth: the Arria II GZ architecture pairs a logic fabric tuned for high register counts with up to 12.5 Gbps transceivers, hardened PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM II), and dedicated DSP slices optimized for FFTs, FIR filters, and baseband modulation. The 1517-FCBGA (HF40) package exposes the full 734-pin user I/O, allowing designs to use all available transceiver and memory channels without package bottlenecks. Typical applications include wireless baseband processing, high-end video broadcast infrastructure, radar signal processing, medical imaging accelerators, and ASIC prototyping. Its combination of logic density and 6.375 Gbps transceivers makes it a strong fit for designs previously reserved for more expensive Stratix devices. Design consideration: the FCBGA-1517 package requires a multi-layer PCB with microvia technology, controlled-impedance routing for transceiver channels, and careful power-plane design to meet the 0.9 V core / 1.1 V transceiver supply sequencing requirements spelled out in the Arria II Device Handbook. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GZ family, and practical design notes not collected in the manufacturer datasheet, giving engineers a single reference for sourcing, second-source planning, and PCB bring-up decisions.

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EP2AGZ225HF40I3G - 224K-Cell 500 MHz FPGA | Altera
EP2AGZ225HF40I3G

EP2AGZ225HF40I3G - 224K-Cell 500 MHz FPGA | Altera

Altera EP2AGZ225HF40I3G is a high-density Arria II GZ field-programmable gate array built on 40 nm technology, integrating 224,000 logic cells, supporting a 500 MHz device frequency, and supplying 734 user I/O in a 1517-pin FC-FBGA package. Its listed core supply voltage is 0.9 V. The industrial-grade device belongs to a programmable-logic family used where deterministic hardware parallelism, high pin count, and reconfigurable interfaces must coexist in one component. An FPGA is a semiconductor containing configurable logic blocks, routing resources, memory, and programmable I/O. In the hierarchy of electronic components, an FPGA sits between conventional programmable logic and higher-density application-specific system integration. Engineers configure these resources to implement processors, interface bridges, signal-processing datapaths, and control logic, then revise the design after fabrication without replacing the entire IC. The EP2AGZ225HF40I3G headline parameters are 224,000 cells, 500 MHz operation, and 734 I/O. Its 1517-pin FC-FBGA package supports the large number of external connections required by data-intensive systems. The 0.9 V core-voltage entry and 40 nm process indicate the process node and nominal operating point available from the verified product listing. The I3G suffix is reported as the industrial ordering option, while the exact associated temperature rating and speed-grade limits require manufacturer documentation before production use. Technically, the device combines a substantial programmable fabric with hundreds of general-purpose I/O. That combination allows parallel protocol handling, custom arithmetic, state-machine control, and data-format conversion within the same device. Board-level power integrity becomes important because a large BGA has many simultaneous switching outputs, short return paths, controlled impedance traces, and local decoupling must be designed together. Configuration storage, clock distribution, and I/O-bank planning also affect deterministic behavior. Typical applications include telecommunications switching and protocol conversion, industrial imaging and machine-vision processing, test and measurement equipment, high-performance networking equipment, digital-signal-processing systems, and aerospace or defense prototyping. Its 734 I/O and 224,000-cell capacity make it relevant when fixed-function controllers lack required parallelism or when system requirements are expected to evolve. The principal trade-off is integration and flexibility versus design complexity, power, pin escape, and verification effort. A 1517-pin FC-FBGA requires a carefully planned multilayer PCB, complete ball assignment, signal-integrity review, robust power delivery, thermal analysis, and an appropriate device-programming flow. The 500 MHz figure should not be treated as a guarantee for every user design because actual performance depends on routing, logic utilization, timing constraints, and the selected configuration. This page combines the verified manufacturer-family parameters, current distributor availability, explicit data gaps, and drop-in screening rules to support engineering research. It distinguishes searchable facts from parameters that must be confirmed from the complete manufacturer datasheet or device documentation before schematic sign-off, PCB release, or substitution approval.

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EP2AGZ225HF40I3N - Arria II GZ FPGA, 224K LE, 1517-FBGA | Intel
EP2AGZ225HF40I3N

EP2AGZ225HF40I3N - Arria II GZ FPGA, 224K LE, 1517-FBGA | Intel

The Intel (formerly Altera) EP2AGZ225HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 bits of embedded memory, and 734 user I/Os in a 1517-ball Flip-Chip BGA (FCBGA) package. It belongs to the Arria II GZ family, which targets mid- to high-bandwidth applications requiring transceivers up to 6.375 Gbps, dedicated DSP blocks, and high-speed external memory interfaces. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs allow hardware engineers to implement custom digital logic, signal-processing pipelines, and interface protocols by writing hardware description language (HDL) code rather than fabricating a custom silicon die. Arria II GZ parts in particular bridge the gap between the lower-cost Cyclone and high-end Stratix families, making them common in mid-range communications, broadcast, and ASIC prototyping workloads. Key features of the EP2AGZ225HF40I3N include 8,960 LABs (Logic Array Blocks) and 736 embedded multipliers (18x18) for DSP, along with PCIe Gen1/Gen2 hard IP blocks, multiple PLLs, and high-speed transceivers capable of 6.375 Gbps operation. The 1517-FCBGA package uses flip-chip land-grid technology that supports the device's high I/O count and signal-integrity requirements for multi-gigabit interfaces. The "I3" speed grade and industrial temperature rating make it suitable for thermally and electrically demanding environments beyond standard commercial ranges. Typical applications include high-speed serial protocol bridging, ASIC and ASSP prototyping, broadcast video processing, test and measurement instrumentation backplanes, and PCIe-based add-in cards. Engineers choose this device when they need more logic density than Cyclone V can offer but do not require the transponder counts and memory bandwidth of Stratix IV/V. The HF40 suffix designates a specific BGA package and pinout, which must be matched exactly when designing a PCB footprint. When designing with this part, plan for multi-layer PCB stack-ups with controlled-impedance routing for the transceiver channels, multiple decoupling capacitors near the balls, and a robust thermal management strategy - the flip-chip BGA dissipates significant power under heavy utilization. Quartus II is the primary development environment; only specific Quartus versions support Arria II GZ, and the latest service packs should be installed before tape-out. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGZ225HF40I4G - 225K LE Arria II GZ FPGA, 1517FBGA | Intel
EP2AGZ225HF40I4G

EP2AGZ225HF40I4G - 225K LE Arria II GZ FPGA, 1517FBGA | Intel

The Intel (formerly Altera) EP2AGZ225HF40I4G is a high-density Arria II GZ field-programmable gate array (FPGA) with 225,000 logic elements, housed in a 1517-ball Flip-Chip BGA (FBGA) package. Built on a 40nm process, this FPGA delivers up to 734 user I/O pins, 12.5 Gbps transceiver support, and embedded transceivers for high-speed serial connectivity in communications, broadcast, and high-performance compute systems. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacture to implement arbitrary digital functions - bridging the flexibility of software and the performance of dedicated hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> SoC FPGA, and are used wherever parallelism, low latency, or hardware-level customization is required. Key features of the EP2AGZ225HF40I4G include 8.4 Mbits of embedded memory, 1,158 embedded 18x18 multipliers (DSP blocks), up to 734 user I/O supporting LVDS, LVTTL, LVCMOS, and HSTL/SSTL standards, and PCIe Gen1/Gen2 hard IP blocks. The HF40 package code indicates a flip-chip BGA at the industrial temperature grade. The integrated 8.5 Gbps transceivers make it suitable for chip-to-chip and backplane serial links. The Arria II GZ architecture combines a logic array, M20K memory blocks, variable-precision DSP blocks, and dedicated PHY hard IP, allowing designers to implement high-throughput pipelines without consuming fabric for I/O serialization. Compared with smaller Cyclone or older Stratix devices, the EP2AGZ225HF40I4G targets mid-to-high bandwidth applications where transceiver count and logic density matter more than absolute lowest cost. Typical applications include wireless baseband processing, high-speed data acquisition, video broadcast and pro-AV pipelines, military and aerospace signal processing, and ASIC prototyping. The 1517-FBGA package provides high signal and power pin density but requires multi-layer PCB design with controlled-impedance routing for the transceiver lanes. When designing with this device, use the Quartus Prime design software and the Arria II GZ device handbook for transceiver channel modeling, pin-out assignments, and power estimation. Thermal management is critical at full transceiver utilization - the FBGA substrate must be paired with a heatsink or cold plate rated for the calculated junction-to-ambient thermal resistance. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet.

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EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA
EP2AGZ225HF40I4N

EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA

The Intel EP2AGZ225HF40I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) IC with 734 user I/Os, 14,248,960 bits of embedded memory, 224,000 logic elements, and a 40 nm low-power process node. It is housed in a 1517-ball FC-FBGA (FCBGA) package at 0.9V core. The Arria II GZ is part of Intel's (formerly Altera's) cost-optimized mid-range transceiver FPGA family targeting high-speed serial and memory-rich designs. Key features include up to 1.5 GHz internal clocking, embedded 18x18 multipliers, hardware DSP blocks, and high-speed transceivers up to 6.375 Gbps. The device is designed specifically for ease-of-use with a cost-optimized 40 nm low-power programmable logic engine and streamlined transceivers and I/Os. The 'I4' speed grade, industrial operating temperature range (-40C to +100C), and 'N' lead-free designation make this part the highest-density member of the Arria II family for data-acquisition and DSP-heavy cards. Typical applications include wireless infrastructure baseband cards, 4G/LTE protocol processing, military signal-intelligence accelerators, broadcast video processing, and high-speed serial backplane interface cards. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGZ300FF35C3G - Arria II GZ FPGA, 300K LE, 35mm FCBGA | Intel
EP2AGZ300FF35C3G

EP2AGZ300FF35C3G - Arria II GZ FPGA, 300K LE, 35mm FCBGA | Intel

The Intel EP2AGZ300FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering up to 300,000 logic elements, 17,133 Kbit embedded memory, and sixteen 6.375 Gbps transceivers in a 1152-ball flip-chip BGA package. Housed in the FF35 FCBGA (35mm body), the device is built on a 40 nm process and is intended for high-bandwidth communication, signal processing, and PCIe Gen2 endpoint/root-port designs. Commercial temperature grade (C suffix) is supported at 0 C to 85 C junction, while speed grade 3 positions it in the mid-performance bin of the family. A field-programmable gate array (FPGA) is a programmable logic device whose architecture is dominated by an array of configurable logic blocks (CLBs), embedded RAM blocks (M9K/M144K), DSP blocks, clock networks, and programmable I/O. FPGAs sit above microcontrollers and fixed-function ASICs in flexibility, allowing designers to implement arbitrary digital logic, parallel datapaths, and high-speed serial protocols while retaining the ability to re-spin functionality in firmware. The Arria II GZ family specifically targets mid-range transceiver-rich applications that previously required custom ASICs, providing hardened PCI Express Gen2, 10 Gigabit Ethernet XAUI, and DDR3 memory controllers. Key features include sixteen 6.375 Gbps transceivers, twelve embedded PCIe Gen2 controllers, support for DDR3 at up to 800 MHz, and 8-input adaptive logic modules (ALMs) for fine-grained arithmetic. The device integrates 1,288 user I/Os distributed across 12 I/O banks, providing flexible voltage and signaling standards support including LVDS, LVCMOS, SSTL, and HSTL. Hard IP blocks for PCIe Gen2 x8 and 10GbE XAUI accelerate protocol implementation while preserving logic resources for application code. Architecturally the EP2AGZ300FF35C3G implements a multi-track routing fabric with a Quartus Prime place-and-route toolchain. Hard memory controllers and transceiver PCS/PMA blocks deliver deterministic performance, while the device's 28 nm-equivalent geometry (40 nm) balances static and dynamic power for air-cooled deployments. The flip-chip BGA package exposes a full land grid that maps all transceivers and most user I/Os to the PCB without wire-bond parasitics, enabling clean 6 Gbps signaling. Typical applications include 10 GbE line cards, LTE baseband processing, software-defined radio (SDR) platforms, medical imaging accelerators, and broadcast video processing. Designers can pair this FPGA with companion DDR3 memory (e.g., MT41J256M16), clock generators (e.g., CDCE62005), and power management ICs (e.g., TPS54xxx series) to assemble a complete high-throughput system. When designing with the EP2AGZ300FF35C3G, engineers must consider 64-channel GT power sequencing requirements, controlled-impedance routing for 6 Gbps transceivers, and thermal management of the FF35 FCBGA under sustained switching load. Reference Quartus Prime pin planning, transceiver toolkit, and SignalTap II for bring-up. This page synthesizes Intel datasheet specifications, distributor pricing and stock, same-brand drop-in alternatives from the Arria II GZ family, and practical design notes not found in any single source document.

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EP2AGZ300FF35C3N - 298K LE Arria II GZ FPGA 1152-BGA | Intel
EP2AGZ300FF35C3N

EP2AGZ300FF35C3N - 298K LE Arria II GZ FPGA 1152-BGA | Intel

The Intel (formerly Altera) EP2AGZ300FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 298,000 logic elements, 18,854,912 bits of embedded RAM, and 1,152 user I/Os in a 1152-ball FineLine BGA (FCBGA) package. Built on a 40 nm process, the EP2AGZ300FF35C3N supports core voltage of 0.9 V with transceiver and I/O banks optimized for high-speed serial and parallel interfaces, targeting mid-to-high bandwidth applications including telecommunications backplanes, broadcast video processing, and high-performance DSP pipelines. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital circuits without the cost of ASIC tooling. FPGAs sit within the programmable logic device family, alongside CPLDs, and are distinguished from ASICs, ASSPs, and microcontrollers by hardware-reconfigurability, parallel processing fabric, and integrated high-speed transceivers. Arria II GZ devices occupy Intel's mid-range, transceiver-equipped tier between Cyclone (cost-optimized) and Stratix (high-end) families. Key features of the EP2AGZ300FF35C3N include up to 16 transceivers supporting data rates up to 6.375 Gbps, embedded hard memory controllers (DDR3 with ECC), up to 8 PLLs, and 1,152 user I/O pins distributed across 24 I/O banks supporting LVDS, LVCMOS, HSTL, and SSTL standards. The device integrates 11,920 Logic Array Blocks (LABs) and 554 18x18 multipliers, enabling high-throughput signal processing tasks such as forward-error correction and video scaling. Typical applications for the EP2AGZ300FF35C3N span 40G/100G telecom line cards, software-defined radio (SDR) baseband processing, video broadcast encoders/decoders, high-resolution medical imaging systems, and ASIC prototyping for high-speed serial protocols. The 6.375 Gbps transceiver capability combined with 18 Mbit embedded RAM makes this device especially well-suited for packet processing and SerDes aggregation in carrier-grade equipment. When designing with the EP2AGZ300FF35C3N, ensure the PCB has at least 12 layers with controlled-impedance routing for the 6.375 Gbps serial links, and provision multiple decoupling capacitors (0.1 uF, 0.01 uF, and bulk) near every power pin. Thermal dissipation is significant: estimated at 15-25 W typical, requiring forced airflow or a heatsink attachment to the top of the FCBGA package. Programming is via JTAG or Active Serial configuration scheme using an EPCS or EPCQ configuration device. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single source for sourcing the EP2AGZ300FF35C3N.

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EP2AGZ300FF35C4G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel
EP2AGZ300FF35C4G

EP2AGZ300FF35C4G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ300FF35C4G is a high-density Arria II GZ FPGA delivering 300,000 logic elements with 16,624 Kbit embedded memory, packaged in a 1152-ball FineLine BGA at industrial temperature grade C4 (0°C to 85°C), speed grade 4. Built on a 40 nm TSMC low-power process, it integrates 8.1 Gbps transceivers, DDR3 memory controllers, and DSP blocks for high-bandwidth signal processing in communications, broadcast, and military systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, dedicated DSP slices, and on-chip memory that engineers can reconfigure post-manufacturing to implement custom digital circuits, parallel processing pipelines, or hardware accelerators. Within the system hierarchy, the FPGA sits between ASICs (high NRE, fixed function) and microcontrollers (sequential, software-driven), offering hardware-level parallelism with software-like design flexibility. The Arria II GZ family specifically targets mid-range applications requiring transceivers, DSP, and high-speed memory interfaces without the cost of Stratix-class FPGAs. Key specifications include 300,000 logic elements, 16,624 Kbits of embedded memory (M9K + M144K blocks), 736 embedded 18x18 multipliers, 16 global clock networks, and up to 554 user I/O pins. The device integrates 12 transceivers supporting data rates up to 6.375 Gbps (C4 speed grade) for chip-to-chip, backplane, and optical module interfaces. It features a hard PCIe Gen2 controller, hardened DDR3 memory interface up to 800 MHz, and up to 4 PLLs per quadrant. Architecturally, the EP2AGZ300FF35C4G uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, providing higher logic utilization than 4-input LUT architectures. The 40 nm process delivers static power reduction through variable voltage scaling (0.85V core to 1.1V I/O) and supports partial reconfiguration, allowing live logic swap without halting operation. Typical applications include wireless baseband processing, broadcast video encoders, military radar signal processing, and high-speed serial protocol bridging. Designers select the Arria II GZ when they need transceiver-rich, DSP-heavy FPGAs below Stratix IV cost points, typically above 200K logic elements where Cyclone V becomes resource-limited. When designing with this device, plan power integrity early: a 300K-LE Arria II GZ at full utilization can draw 15-20W, requiring multi-rail VRM design with proper decoupling. Quartus II software is mandatory for synthesis, place-and-route, and configuration bitstream generation. Lead time for engineering samples is typically 8-12 weeks through authorized distributors. This page synthesizes distributor pricing, verified Arria II GZ family specifications, and practical design notes not consolidated in any single manufacturer datasheet.

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EP2AGZ300FF35C4N - Arria II GZ FPGA 298K LE 1152-FCBGA | Intel
EP2AGZ300FF35C4N

EP2AGZ300FF35C4N - Arria II GZ FPGA 298K LE 1152-FCBGA | Intel

The Intel (Altera) EP2AGZ300FF35C4N is a high-density Arria II GZ field-programmable gate array (FPGA) integrating 298,000 logic elements, 18,854,912 bits of embedded memory, and 554 user I/O in a 1152-ball flip-chip BGA package, fabricated on a 40 nm low-power process and specified for industrial-grade operating conditions. A field-programmable gate array (FPGA) is a class of programmable logic device that combines configurable logic blocks (LBs), programmable interconnect, dedicated memory, and hardened I/O serializers on a single die. Within the broader semiconductor hierarchy, an FPGA sits between a general-purpose microcontroller and a fully custom ASIC: it offers ASIC-level parallelism and throughput with mask-set reprogrammability, placing it in the family of programmable logic devices (PLDs) that includes CPLDs and SPLDs as smaller-density counterparts. The Arria II GZ family specifically targets mid- to high-bandwidth applications requiring transceivers, moderate DSP throughput, and low static power. Key headline specifications include 298,000 logic elements distributed across 11,920 logic array blocks (LABs), 18,854,912 bits (approximately 17.9 Mbit) of embedded SRAM, integrated PLLs, and high-speed transceivers capable of multi-gigabit serial links. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with user-selectable drive strength and slew rate. Internal configuration memory is SRAM-based, requiring a configuration flash or controller at power-up. The 1152-ball FCBGA package exposes the full I/O count and provides a low-inductance power/ground distribution network. Architecturally, the EP2AGZ300FF35C4N combines the Altera Adaptive Logic Module (ALM) with 8-input fracturable look-up tables, dedicated multiplier blocks, and MLAB memory blocks. The 40 nm process delivers static power roughly 50% lower than the prior 65 nm Arria GX generation while supporting enhanced logic packing and faster timing closure. Built-in transceivers, PCI Express hard IP, and external memory interfaces (DDR2/DDR3) reduce external component count for typical designs. Typical applications include high-definition video broadcasting, wireless baseband processing, military radar signal processing, industrial machine vision, and high-speed serial protocol bridging. The combination of large logic capacity and integrated transceivers suits designs that would otherwise require a discrete processor plus external PHY. Designers should plan power sequencing early - Arria II GZ requires multiple supply rails (core, I/O, transceiver, auxiliary) with specific monotonicity and ramp-rate constraints. The 1152-ball FCBGA also demands multi-layer PCB stack-up with buried vias and matched-length trace routing for the DDR3 interface, so floorplanning and signal-integrity simulation should begin before schematic capture. This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GZ family, and practical PCB design guidance that complements the manufacturer datasheet.

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EP2AGZ300FF35I3G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel
EP2AGZ300FF35I3G

EP2AGZ300FF35I3G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ300FF35I3G is a high-density Arria II GZ family Field-Programmable Gate Array (FPGA) delivering approximately 300K logic elements (LE), 554 maximum user I/Os, and 8 high-speed transceivers, housed in a 1152-ball FineLine BGA (FBGA-1152) package. It is built on a 40 nm low-power process, operates over the industrial temperature range, and targets performance-critical applications such as high-speed serial interfaces, video bridging, and digital signal processing. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the larger integrated circuit family. FPGAs sit alongside ASICs and CPLDs in the digital logic hierarchy and consist of an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory (BRAM), and high-speed serial transceivers. The Arria II GZ family is positioned in Intel's mid-to-high-end portfolio between Cyclone (low-power, low-cost) and Stratix (highest performance), offering a balance of density, transceiver speed, and price. Key features include up to 8 transceivers supporting data rates up to 6.375 Gbps, 16.4 Mbits of embedded memory, dedicated hardware DSP blocks for high-throughput arithmetic, support for external memory interfaces including DDR3, QDRII+, and RLDRAM II, and a wide operating frequency range. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offers a PLL-per-region architecture for precise clock management. The Arria II GZ architecture integrates dedicated hardware multipliers, variable-precision DSP blocks, and TriMatrix memory blocks for efficient implementation of signal processing pipelines. Its transceiver blocks support PCIe Gen1/Gen2, XAUI, CEI-6G, and serial RapidIO protocols. Designers can configure the device via Intel Quartus II design software, which supports Verilog, VHDL, and SystemVerilog through a synthesis-based flow. Typical applications include high-definition video processing and bridging, telecommunications infrastructure (baseband and backhaul), test and measurement equipment, medical imaging systems, and high-performance computing accelerators. The combination of high logic density and multi-gigabit transceivers makes it well suited for designs requiring both heavy parallel processing and chip-to-chip serial connectivity. When designing with this device, pay close attention to PCB layout for BGA breakout routing and power distribution network (PDN) design. The 1152-ball FBGA package requires multi-layer PCB stack-up (typically 12+ layers) with controlled-impedance traces for the 6.375 Gbps transceiver channels. Decoupling capacitors must be placed directly under the BGA balls to maintain signal integrity. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, package-specific design considerations, and a structured FAQ not found in the manufacturer datasheet alone, all verified against Intel's official EP2AGZ300 family datasheet and current distributor inventory as of 2026-09-08.

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EP2AGZ300FF35I3N - 298K LE Arria II GZ FPGA, 554 I/O, FC-FBGA-1152
EP2AGZ300FF35I3N

EP2AGZ300FF35I3N - 298K LE Arria II GZ FPGA, 554 I/O, FC-FBGA-1152

The Altera (Intel) EP2AGZ300FF35I3N is a high-density, high-performance Arria II GZ Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 554 user I/O in a 1152-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA-1152) package. Core voltage is 0.9 V, and the part is graded for the industrial temperature range (the trailing I3 in the part number) and ships in tray packaging. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor hierarchy of integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened IP blocks such as transceivers and DSP slices that engineers can reconfigure after manufacture. The Arria II GZ family sits between the lower-cost Cyclone series and the high-end Stratix series in the Altera/Intel portfolio, targeting mid-to-high bandwidth applications that need transceivers and DSP but where the absolute highest logic density or transceiver count is not required. Key differentiating features of the EP2AGZ300FF35I3N include its 298,000 logic elements, 11,920 Logic Array Blocks (LABs), dedicated on-chip transceivers capable of multi-gigabit serial I/O, embedded DSP blocks for high-throughput signal processing, and 18.85 Mbits of distributed and block RAM. The 40 nm process node balances static and dynamic power, while the FC-FBGA-1152 package provides the high pin count required to expose 554 user I/O plus the dedicated configuration, power, and JTAG pins. Architecturally, Arria II GZ devices combine a fabric of adaptive logic modules (ALMs) with hard IP for transceivers, external memory interfaces (DDR3 controllers), and PCI Express Gen2 endpoints. The 35 in FF35 indicates a 35 mm x 35 mm package body with a 1.0 mm ball pitch, which is the largest package option in this family and is required to accommodate the 554 I/O count. Typical applications include high-speed data acquisition, wireless baseband processing, radar and electronic warfare front-ends, broadcast video processing, military and aerospace signal processing, and high-performance computing accelerators. Designers choose this part when they need a large logic and memory budget with industrial-grade temperature support. When designing with the EP2AGZ300FF35I3N, pay close attention to PCB layer stack-up and BGA breakout routing because the 1.0 mm ball pitch demands HDI technology (microvias, sequential lamination). Use the Altera Quartus II design suite (or its modern equivalent for legacy device support) for synthesis, place-and-route, and bitstream generation. The 0.9 V core must be supplied by a multi-rail PMIC or DC-DC solution with adequate decoupling. This page synthesizes distributor inventory, lifecycle context, drop-in same-package alternatives drawn from the same Arria II GZ family, and practical design notes not consolidated in a single manufacturer document.

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EP2AGZ300FF35I4 - Arria II GZ FPGA, 298K LE, 1152-BGA | Intel
EP2AGZ300FF35I4

EP2AGZ300FF35I4 - Arria II GZ FPGA, 298K LE, 1152-BGA | Intel

The Intel EP2AGZ300FF35I4 is a high-density Field Programmable Gate Array (FPGA) from the Arria II GZ family, featuring 298,000 logic elements and 11,920 configurable logic blocks (LABs/CLBs), manufactured on a 40 nm TSMC process and operating from a 0.9 V core supply. Housed in a 1152-pin FC-FBGA (FF35) package at industrial temperature grade (-40 C to +100 C), it delivers up to 500 MHz core fabric performance with 554 user I/O pins and integrated 12.5 Gbps transceivers. What is an FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected via programmable interconnect, surrounded by hard I/O blocks such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs, offering ASIC-class performance and density combined with full reprogrammability. The Arria II GZ family targets mid- to high-end transceiver-based applications requiring a balance of logic capacity, DSP throughput, and serial bandwidth without the power envelope of the high-end Stratix family. Key features include 298,000 logic elements (LEs), 11,920 LABs/CLBs, 554 maximum user I/O pins, embedded 12.5 Gbps transceivers, dedicated hardware DSP blocks for high-throughput signal processing, and on-chip M20K memory blocks distributed across the fabric. The 40 nm process node delivers higher logic density at lower static power than the preceding 65 nm Stratix IV family. The industrial temperature grade and 1152-ball flip-chip BGA package make this part suitable for harsh-environment embedded systems. Architecture-wise, the Arria II GZ device combines a sea-of-LABs programmable fabric with column-based DSP and memory resources, hard PCIe Gen2 IP blocks, and up to 16 transceivers capable of 12.5 Gbps operation. The fabric supports partial reconfiguration, allowing portions of the design to be reprogrammed while other sections remain active - a capability leveraged in software-defined radio, in-system upgrade, and fault-tolerant compute. Typical applications include high-speed serial protocol bridging (PCIe Gen2, XAUI, CEI-6G, CPRI), software-defined radio and digital front-end processing, test and measurement instrumentation, broadcast video processing, radar and remote sensing front-end processing, and defense/aerospace signal processing payloads. When designing with this device, ensure proper PCB stack-up and power-rail decoupling for the 0.9 V core and 1.5 V/2.5 V/3.3 V auxiliary supplies; refer to the Altera/Intel Arria II GZ handbook for pin connection guidelines. The transceiver channels require careful impedance-controlled routing and AC-coupling capacitor selection for jitter compliance. This page synthesizes distributor pricing tiers, drop-in package-compatible alternatives from the Arria II GZ family, and practical design notes not consolidated in the manufacturer datasheet.

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EP2AGZ300FF35I4G - 300K LE Arria II GZ FPGA | Intel | 1152-FBGA
EP2AGZ300FF35I4G

EP2AGZ300FF35I4G - 300K LE Arria II GZ FPGA | Intel | 1152-FBGA

The Intel (formerly Altera) EP2AGZ300FF35I4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering approximately 300K logic elements, 18.16 Mbits of embedded memory, and 554 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 40nm low-power process, the device integrates transceiver, DSP, and memory subsystems for high-throughput wireline and signal-processing applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit in the programmable-logic family of digital ICs, sitting alongside ASICs and CPLDs, and contain arrays of programmable logic blocks, interconnects, and I/O cells that designers can wire up to implement custom digital functions, glue logic, signal processing, or even soft processor cores. The Arria II GZ family is positioned as a mid-range transceiver-enabled FPGA, between the low-power Cyclone family and the high-end Stratix family. Key features include 8.55 Gbps transceivers with PCS/PMA support, dedicated fractional PLLs, hardware DSP blocks for high-performance fixed- and floating-point math, variable-precision DSP, 12.92 Mbits MLAB, and hard PCIe Gen2 and Gen1 controllers. The device also integrates high-speed external memory interfaces supporting DDR3, DDR2, and QDRII+/QDRII SRAM at up to 800 MHz. The FBGA-1152 package provides high I/O density in a moderate footprint suitable for performance-critical line cards. The architecture combines a fabric of adaptive logic modules (ALMs) with up to 21 transceiver channels, variable-precision DSP blocks, and embedded memory blocks. Hard PCIe Gen2 controllers ease protocol implementation, while the transceiver physical coding sublayer supports multiple protocols including PCIe, CEI-6G, CPRI, and OBSAI, making the EP2AGZ300 well-suited to telecom infrastructure. Typical applications include 40G/100G optical line cards, wireless backhaul, military radar processing, video broadcast infrastructure, and high-performance DSP coprocessors. Compared to a Cyclone V SoC, the Arria II GZ delivers roughly 3x the logic and 5x the transceiver bandwidth; compared to a Stratix V, it consumes less power at the cost of lower logic density. When designing with the EP2AGZ300FF35I4G, plan thermal dissipation carefully - 40nm transceivers at 8.5 Gbps require a properly designed multi-layer PCB stack-up with continuous GND planes, controlled-impedance transceiver traces, and adequate cooling (often forced air) for industrial temperature operation at -40C to +100C. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGZ300FF35I4N - Arria II GZ FPGA, 298K LE, 1152-FBGA | Intel
EP2AGZ300FF35I4N

EP2AGZ300FF35I4N - Arria II GZ FPGA, 298K LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ300FF35I4N is a high-density Arria II GZ field-programmable gate array (FPGA) with 298,000 logic elements, 11,920 LABs/CLBs, and 18,854,912 bits of embedded memory, housed in a 1152-ball fine-pitch BGA (FC-FBGA) package measuring 35 mm x 35 mm. It operates across an industrial temperature range of -40C to +100C and supports up to 554 user I/O pins for high-bandwidth system integration. Built on a 40 nm process with 0.9 V core voltage, the device also integrates dedicated transceivers and DSP blocks for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing configurable logic blocks (LBs), programmable interconnects, and dedicated hard IP such as transceivers, memory controllers, and DSP slices. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and they are typically positioned between general-purpose microcontrollers and ASICs in terms of performance, parallelism, and design flexibility. The Arria II GZ family specifically targets mid- to high-performance applications where designers need transceiver-based serial connectivity and significant DSP throughput. Key features of the EP2AGZ300FF35I4N include 298,000 logic elements, 18,854,912 bits of embedded RAM, support for high-speed serial transceivers, dedicated DSP blocks for fixed- and floating-point arithmetic, and a 0.9 V core supply with on-chip voltage regulation. The device also features configuration via active serial, passive serial, JTAG, and Fast Passive Parallel modes, plus multi-cycle PLL support for clock synthesis. Hard PCIe and external memory controller IP reduce soft-logic overhead and accelerate time-to-market for bandwidth-intensive designs. The Arria II GZ architecture pairs a logic fabric with hardened transceivers operating up to 6.375 Gbps, enabling protocols such as PCIe Gen2, SATA, and 10 GbE (XAUI). On-board DSP blocks deliver up to 8 TFLOPs of single-precision throughput, while the 1152-ball package provides extensive I/O including LVDS, DDR3, and SERDES-capable pins. Together these resources support designs that require simultaneous high-throughput DSP and high-speed serial I/O. Typical applications include high-end communications infrastructure, broadcast video processing, defense radar and signal intelligence, medical imaging acceleration, ASIC prototyping, and test & measurement instrumentation. Industrial-grade operating temperature and the 1152-FBGA package make the part suitable for ATCA and AMC modules in telecommunications equipment. When designing with this device, ensure the PCB supports the fine-pitch 35 mm x 35 mm FC-FBGA with appropriate microvia stack-up, and follow Intel power-up sequencing guidelines. Use the Quartus II design software (version 13.0 or later with service pack) for synthesis, place-and-route, and timing closure; the 0.9 V core requires careful power plane design to meet transceiver jitter specifications. This page synthesizes distributor availability, drop-in same-package alternatives within the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.

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EP2AGZ300FH29C3G - Arria II GZ FPGA, 281 I/O, 780-HBGA | Intel
EP2AGZ300FH29C3G

EP2AGZ300FH29C3G - Arria II GZ FPGA, 281 I/O, 780-HBGA | Intel

The Intel EP2AGZ300FH29C3G is a high-density Arria II GZ field-programmable gate array (FPGA) housed in a 780-ball FineLine BGA package (HBGA, 29 mm), delivering 281 user I/O pins and a speed grade 3, commercial temperature grade designation. The Arria II GZ family targets high-bandwidth data-path applications that require transceivers, embedded transceivers, and abundant logic and memory resources on a single device, while the 300K logic-element (LE) density in this specific part places it in the upper mid-range of the family for memory-rich, transceiver-rich designs. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital circuits through configuration memory rather than fixed silicon. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> PLD -> programmable logic -> digital IC) and are used wherever ASIC NRE costs cannot be justified, where time-to-market is critical, or where post-deployment field updates are required. The Arria II GZ series in particular extends this definition by integrating multi-gigabit transceivers and dedicated DSP blocks alongside general-purpose logic. Key features include 300,000 logic elements, embedded transceiver support for multi-gigabit serial interfaces, embedded memory blocks distributed across the fabric, and dedicated DSP blocks for high-throughput signal processing. The 780-ball FineLine BGA package supports the high pin density required to expose the part's I/O and supply pins, and the speed grade 3 commercial bin balances timing margin and unit cost for non-extended-temperature deployments. The Arria II GZ architecture is built on a 40 nm low-power process and combines 8B/10B-capable transceivers with the fabric's adaptive logic modules (ALMs) and M9K/M144K memory blocks, giving designers a heterogeneous compute fabric. The part supports common FPGA design entry through Altera/Intel Quartus II, with the device supported in both legacy Quartus II releases and the current Quartus Prime design software. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, video broadcast processing, and DSP-intensive test and measurement. The 281 user I/O count combined with the high LE count also makes it suitable for data-acquisition front-ends and protocol conversion cards in industrial and defense systems. As a logic-only FPGA on a 40 nm process, the device is commonly paired with DDR2/DDR3 external memory and external clock-generation PLLs for timing distribution. When designing with this part, ensure the PCB land pattern is laid out for a 780-ball FineLine BGA with proper via-in-pad or microvia escape. Decoupling strategy should follow the Quartus II pin connection guidelines for the Arria II GZ family, and JTAG access must be reserved for boundary-scan and in-system programming. Designers moving from the older Stratix II GX family to the GZ family should revalidate their I/O assignments because pin functions differ between the two families. This page synthesizes distributor stock, application notes, and drop-in speed-grade alternatives not found in the manufacturer datasheet alone, giving procurement and design engineers a single source for the part's commercial and engineering context.

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EP2AGZ300FH29C3N - Arria II GZ FPGA, 298K LE, 780-FCBGA | Intel
EP2AGZ300FH29C3N

EP2AGZ300FH29C3N - Arria II GZ FPGA, 298K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300FH29C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) integrating 298,000 logic elements, 18,854,912 bits of embedded memory, and 281 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. It is built on a TSMC 40 nm low-power process and operates with a core voltage of 0.9 V, targeting mid- to high-end ASIC prototyping, high-speed serial bridging, and digital signal processing applications. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O serdes can be programmed by the designer after manufacture. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: more flexible than an ASIC, but more deterministic and parallel than a CPU. The Arria II GZ family is Intel's mid-range, transceiver-rich family optimized for applications that need 6.375 Gbps transceivers, moderate logic density, and hardened memory/DSP blocks without paying Stratix-class cost. Key features include 11,920 Logic Array Blocks (LABs), up to 16 global clock networks, 8 PLLs, 736 embedded multipliers (18x18), and 12 transceiver channels capable of up to 6.375 Gbps data rate. The device also provides partial reconfiguration support and a hard PCI Express Gen2 IP block, simplifying high-bandwidth serial interface integration. The 780-pin FCBGA package offers an exposed die pad for thermal dissipation, supporting industrial-grade thermal envelopes. Architecturally, the EP2AGZ300FH29C3N is implemented in a 40 nm CMOS process with embedded SRAM, hard PCML transceivers, and dedicated memory interface circuitry for DDR3 SDRAM. The -3 speed grade denotes the fastest available timing closure for this device, and the 'C' suffix indicates the commercial temperature range (0 C to +85 C), while 'N' denotes lead-free / RoHS compliance. The 'I' temperature grade (-40 C to +100 C) and 'I4' / 'I3' speed options are also available in the same 780-FCBGA footprint, enabling system designers to migrate performance tiers without re-spinning the PCB. Typical applications include high-speed serial interface bridging (PCIe Gen2, SATA, SRIO), broadcast and professional video processing, radar and electronic warfare baseband, software-defined radio (SDR) front-end preprocessing, and ASIC prototyping. The combination of high logic density, embedded transceivers up to 6.375 Gbps, and DDR3 memory controller hard IP makes the EP2AGZ300FH29C3N well-suited for data aggregation and protocol conversion cards in telecom and industrial imaging systems. When designing with this device, ensure the PCB land pattern follows Intel's 780-FCBGA (29 mm x 29 mm, 1.0 mm ball pitch) footprint and that the transceiver reference clock jitter meets the data-rate requirement. Power estimation should be done with the Intel Early Power Estimator (EPE) tool, because at full transceiver utilization the core and IO rails together can draw tens of watts. JTAG, AS, and PS configuration schemes are all supported; choose configuration mode based on board boot-time targets. This page synthesizes distributor pricing, package-level drop-in alternatives within the Arria II GZ family, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGZ300FH29C4G - Arria II GZ FPGA 300K LE FBGA-780 | Intel
EP2AGZ300FH29C4G

EP2AGZ300FH29C4G - Arria II GZ FPGA 300K LE FBGA-780 | Intel

The Intel (formerly Altera) EP2AGZ300FH29C4G is a high-density Arria II GZ field-programmable gate array (FPGA) integrating approximately 300,000 logic elements in a 780-ball fine-pitch BGA (FBGA-780) package. As a member of Intel's Arria II GZ family, it delivers a balance of logic density, embedded transceiver capability, and DSP throughput for mid-range high-performance applications such as high-speed serial interfaces, video bridging, and DSP-intensive baseband processing. An FPGA is a programmable logic device that allows engineers to implement custom digital circuits, signal processing functions, and complex state machines through hardware description languages such as Verilog or VHDL. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function ASICs and general-purpose processors: they deliver ASIC-like performance and parallelism while retaining the flexibility of software-configurable logic, making them ideal for prototyping, low-volume production, and applications requiring frequent hardware updates. Key features of the EP2AGZ300FH29C4G include embedded 18x18 multipliers for DSP workloads, dedicated high-speed transceivers supporting multi-gigabit serial protocols, embedded memory blocks (M9K/M144K), and high-performance LVDS and DDR external memory interfaces. The device also integrates PLL and transceiver clocking infrastructure suitable for high-bandwidth system designs. The architecture leverages a 40 nm low-power process combined with hard IP blocks to provide deterministic, low-latency data-path acceleration. Hardened PCIe, memory controllers, and embedded transceivers free up programmable fabric, allowing more application logic to be implemented within the 300K logic-element budget while keeping dynamic power consumption manageable. Typical applications include high-definition video processing and bridging, wireless baseband signal processing, test and measurement instrumentation, image processing pipelines, military and aerospace signal processing, and high-speed serial protocol bridging. Designers also deploy Arria II GZ devices in network interface cards and software-defined radio platforms. When designing with this part, ensure PCB layout supports high-speed transceiver routing with controlled impedance and length matching. Use the Quartus II design suite (or Quartus Prime for newer toolchains) for synthesis, place-and-route, and timing closure; verify pin assignments against the FBGA-780 ball map and the package thermal management plan. This page synthesizes distributor pricing, lifecycle status, FBGA-780 package pinout, and drop-in alternatives within the Arria II GZ family that are not assembled in a single place on the manufacturer datasheet.

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EP2AGZ300FH29C4N - Arria II GZ 298K LE FPGA 780-FCBGA | Intel
EP2AGZ300FH29C4N

EP2AGZ300FH29C4N - Arria II GZ 298K LE FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300FH29C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 298,000 logic elements in a 780-ball FC-HFBGA package with 281 user I/O pins and 18,854,912 bits of embedded memory. Built on a 40 nm process node, it provides up to 11,920 Logic Array Blocks (LABs) with 500 MHz core fabric performance for high-bandwidth signal processing and protocol bridging designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs occupy the same architectural family as programmable logic devices (PLDs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs), but unlike ASICs they are fully reconfigurable in the field, accelerating parallel DSP, high-speed serial I/O, and custom interface logic. Key features include 28 transceivers up to 6.375 Gbps, up to 17 embedded transceivers supporting protocols such as PCIe Gen2, Serial RapidIO, and XAUI, integrated PCI Express hard IP, dedicated PLL and global clock networks, and 24 DSP blocks per LAB column. The device also integrates high-speed external memory interfaces (DDR3, QDRII+, RLDRAM II) and a 0.9 V core supply with 1.1 V/2.5 V/3.3 V selectable I/O standards. The Arria II GZ architecture pairs a 40 nm low-power process with transceiver-rich peripherals, enabling designers to replace multiple discrete ASSPs plus an ASIC while keeping power budgets aligned with mid-range signal processing. The -C4N speed grade and 780-pin FCBGA make this particular device suited for production boards requiring industrial temperature tolerance and high pin-count routing density. Typical applications include high-definition video broadcast equipment, wireless baseband processing, military radar, medical imaging pipelines, and high-speed serial protocol bridging. The combination of transceivers, embedded memory, and DSP blocks also suits test and measurement, ASIC prototyping, and high-performance computing acceleration in the mid-density tier. When designing with this device, plan PCB layer stack-up for the FCBGA escape routing and provision clean analog supplies for the transceiver PLLs. Use Altera's Quartus II design suite with the Arria II GZ device library for synthesis, place-and-route, and timing closure; power estimation should be performed with the Quartus PowerPlay analyzer prior to PCB layout. This page synthesizes distributor pricing, drop-in FPGA alternatives from the same Arria II GZ family, and practical design notes not found in the manufacturer datasheet. Specifications below are excerpted from the Intel Arria II GZ device datasheet and Mouser/DigiKey product listings.

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EP2AGZ300FH29I3G - 300K LE Arria II GZ FPGA | Intel | 780-FBGA
EP2AGZ300FH29I3G

EP2AGZ300FH29I3G - 300K LE Arria II GZ FPGA | Intel | 780-FBGA

The Intel (formerly Altera) EP2AGZ300FH29I3G is a 300K logic-element Arria II GZ FPGA with 18,520 Kbits embedded memory and 720 multiplier blocks, housed in a 780-pin FineLine BGA (FH29, 29x29 mm) package. Operating at -40C to +100C industrial temperature grade with -3 speed bin, it targets high-bandwidth signal-processing and serial-interface applications. Arria II GZ FPGAs are mid-to-high-density programmable-logic devices that combine a high-performance logic fabric, on-chip SRAM, DSP blocks, and multi-gigabit transceivers. They sit in the broader taxonomy of FPGA & CPLD devices within the programmable-logic IC category. Arria II GZ devices use a TSMC 40 nm process and are designed for system-on-chip designs where hardware parallelism, deterministic latency, and high-throughput serial I/O are required in a single silicon device. Key features of the EP2AGZ300FH29I3G include 300,000 logic elements (LEs), 18,520 Kbits of embedded memory arranged in M9K blocks, 720 18x18 multipliers for high-throughput DSP, and 24 transceivers supporting data rates up to 6.375 Gbps. The device supports DDR3 external-memory interfaces up to 800 MHz and offers high-speed serial connectivity with multiple PCIe hard-IP blocks for protocol acceleration. The Arria II GZ architecture integrates a fine-grained logic fabric with 8-input adaptive look-up tables (ALUTs), dedicated memory blocks, DSP blocks optimized for fixed- and floating-point arithmetic, and clock-management tiles (PLLs). Multi-gigabit transceivers are hardened PMA blocks supporting CPRI, OBSAI, PCIe, XAIG, and SRIO protocols for efficient ASIC replacement in line-card and baseband designs. Typical applications include telecom baseband processing, wireless backhaul aggregation, high-resolution video broadcasting, military radar front-end processing, and PCIe Gen2 endpoint or root-port designs. The combination of 6.375 Gbps transceivers and high DSP count makes it well suited to multi-carrier LTE channel cards and digital-IF processing. When designing with the EP2AGZ300FH29I3G, ensure the FPGA is powered from a properly sequenced multi-rail supply (typically 0.9V core, 1.1V transceiver, 2.5V/3.3V auxiliary). Use Quartus II design software for place-and-route and signal-tap debug. Industrial-grade temperature screening is verified at -40C to +100C operating range per the I3 industrial suffix. This page synthesizes distributor pricing, drop-in same-package alternatives, and design guidance not found in the manufacturer datasheet alone.

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