EP2AGZ300FF35C3N - 298K LE Arria II GZ FPGA 1152-BGA | Intel
料号： EP2AGZ300FF35C3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1540 | $385,000.00 |
| 500 | $1480 | $740,000.00 |
EP2AGZ300FF35C3N 概述
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital circuits without the cost of ASIC tooling. FPGAs sit within the programmable logic device family, alongside CPLDs, and are distinguished from ASICs, ASSPs, and microcontrollers by hardware-reconfigurability, parallel processing fabric, and integrated high-speed transceivers. Arria II GZ devices occupy Intel's mid-range, transceiver-equipped tier between Cyclone (cost-optimized) and Stratix (high-end) families.
Key features of the EP2AGZ300FF35C3N include up to 16 transceivers supporting data rates up to 6.375 Gbps, embedded hard memory controllers (DDR3 with ECC), up to 8 PLLs, and 1,152 user I/O pins distributed across 24 I/O banks supporting LVDS, LVCMOS, HSTL, and SSTL standards. The device integrates 11,920 Logic Array Blocks (LABs) and 554 18x18 multipliers, enabling high-throughput signal processing tasks such as forward-error correction and video scaling.
Typical applications for the EP2AGZ300FF35C3N span 40G/100G telecom line cards, software-defined radio (SDR) baseband processing, video broadcast encoders/decoders, high-resolution medical imaging systems, and ASIC prototyping for high-speed serial protocols. The 6.375 Gbps transceiver capability combined with 18 Mbit embedded RAM makes this device especially well-suited for packet processing and SerDes aggregation in carrier-grade equipment.
When designing with the EP2AGZ300FF35C3N, ensure the PCB has at least 12 layers with controlled-impedance routing for the 6.375 Gbps serial links, and provision multiple decoupling capacitors (0.1 uF, 0.01 uF, and bulk) near every power pin. Thermal dissipation is significant: estimated at 15-25 W typical, requiring forced airflow or a heatsink attachment to the top of the FCBGA package. Programming is via JTAG or Active Serial configuration scheme using an EPCS or EPCQ configuration device.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single source for sourcing the EP2AGZ300FF35C3N.
直接替换替代料： EP2AGZ300FF35C3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGZ300FF35C3N （相同外形与封装尺寸） ——差异在于 Transceivers, Package, Logic Elements, Speed Grade, Logic Elements (LE).
快速对比工具——选择替代料号进行并排对比：
EP2AGZ300FF35C3G
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP2AGZ225FF35C3N
✅ 直接替换✓ 有现货
$2200 / 个
查看数据手册 →EP2AGZ225FF35C3G
✅ 直接替换✓ 有现货
$868.4 / 个
查看数据手册 →EP2AGZ300FF35C3N 最大额定值与电气特性
| Family | Arria II GZ |
| Logic Elements (LE) | 298,000 |
| Logic Array Blocks (LABs) | 11,920 |
| Embedded Memory (Bits) | 18,854,912 |
| User I/Os | 554 |
| Maximum User I/O Pins (Package) | 1,152 |
| 18x18 Multipliers | 554 |
| Transceivers | Up to 16 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| PLLs | 8 |
| 封装 | 1152-ball FCBGA (FF35) |
| 安装类型 | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial |
EP2AGZ300FF35C3N 1152-ball fcbga (ff35) 引脚配置指南
EP2AGZ300FF35C3N（1152-ball fcbga (ff35) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGZ300FF35C3N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGZ300FF35C3N 适用于 6 应用s: Telecom Line Card Aggregation, Broadcast Video Processing, Software-Defined Radio Baseband, ASIC Prototyping Platform, High-Speed Medical Imaging, Test and Measurement Instrumentation.
Telecom Line Card Aggregation
The EP2AGZ300FF35C3N's 16 transceivers at 6.375 Gbps are an exact match for telecom backplane aggregation where multiple 6G CPRI or gigabit Ethernet links must be merged before uplink. With 298K logic elements and 18.85 Mbit embedded RAM the device can host packet classification, QoS queuing, and forward-error correction in a single fabric, eliminating an external TCAM in mid-density line cards. Designers can place the FPGA between PHY devices and a network processor, achieving wire-speed line-rate forwarding while leaving headroom for OAM counters and MACSec encryption. Compared with a Stratix V it is more power-efficient at this transceiver count, making it the cost-optimized sweet spot for 40G-class line cards. Source: Altera Arria II GZ Device Handbook.
推荐
Broadcast Video Processing
Broadcast video encoders and frame-rate converters benefit from the EP2AGZ300FF35C3N's 554 18x18 multipliers and large embedded RAM, which enable real-time 3D motion estimation, scaling, and color-space transforms for SD/HD/3G-SDI pipelines. The 1,152-ball FCBGA exposes enough LVDS pairs to drive multi-channel SDI I/O and HDMI bridges simultaneously, while the 8 PLLs allow independent video-clock generation for transmit and receive paths. At typical broadcast chassis temperatures the commercial-grade EP2AGZ300FF35C3N sustains operation without throttling, but designers should plan heatsink attachment for closed-cabinet chassis. Source: Arria II GZ video reference designs.
推荐
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing leverages the EP2AGZ300FF35C3N's combination of 6.375 Gbps transceivers (for ADC/DAC JESD204B link aggregation), 554 DSP multipliers, and 18.85 Mbit of fast embedded RAM to implement multi-channel digital down-conversion, FFT, and channelization in real time. The 0.9 V core combined with 40 nm process keeps dynamic power manageable in deployed radio units, while the 1,152-ball FCBGA gives 554 user I/Os for control-plane peripherals. Estimated: typical baseband design consumes 12-18 W at full DSP utilization. Source: Arria II GZ DSP design examples.
推荐
ASIC Prototyping Platform
ASIC prototyping requires FPGAs with high logic density, abundant transceivers, and large embedded memory - all delivered by the EP2AGZ300FF35C3N. The 298K LE fabric is large enough to map mid-complexity ASICs (1-3M gates) through multi-FPGA partitioning, while the 16 transceivers at 6.375 Gbps model high-speed serial ASIC IO accurately. Compared with ASIC emulation platforms built from multiple Stratix V devices, an Arria II GZ-based prototyping rig offers a better $/LUT ratio for designs up to 5M gates. Source: Altera ASIC Pro design methodology guide.
推荐
High-Speed Medical Imaging
Medical imaging systems such as ultrasound beamformers and CT reconstruction pipelines benefit from the EP2AGZ300FF35C3N's 554 DSP multipliers and high-bandwidth transceivers. The 18.85 Mbit embedded RAM holds channel-data buffers for beamforming, while 6.375 Gbps transceivers aggregate ADC data from multiple front-end boards. With 554 user I/Os the FPGA can fan out to display controllers, image storage, and host interfaces. For FDA/IEC 60601 compliance, pair the FPGA with isolated power and signal conditioning - the FPGA itself is commercial-grade, so system-level safety isolation is required. Source: Altera medical imaging reference designs.
推荐
Test and Measurement Instrumentation
Test and measurement instruments - protocol analyzers, BERT testers, arbitrary waveform generators - require precise timing, abundant DSP, and high-speed serial IO, all of which the EP2AGZ300FF35C3N delivers. The 8 PLLs provide independent clock domains for multiple instrument channels, while 298K logic elements host pattern-generation state machines and protocol decoders. The 16 transceivers enable multi-lane protocol analysis (PCIe, USB 3.0, SATA) in a single FPGA. Commercial operating temperature is adequate for lab environments, but industrial-grade -I variants should be chosen for field-deployed testers.
推荐
推荐产品汇总
工程参考数据： EP2AGZ300FF35C3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGZ300FF35C3G | EP2AGZ225FF35C3N | EP2AGZ225FF35C3G |
|---|---|---|---|---|
| Package | 1152-ball FCBGA (FF35) | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 298,000 | 298,000 | 225,000 (-24%) | 225,000 (-24%) |
| Max Transceiver Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS / Lead-Free | Standard lead finish (N) | Pb-free / RoHS (G) | Standard lead finish (N) | Pb-free / RoHS (G) |
关键差异点
- Highest-density Arria II GZ in the FF35 1152-ball FCBGA package （对比 EP2AGZ225FF35C3N)
- Pb-free / RoHS-compliant lead finish option (same die) （对比 EP2AGZ300FF35C3G)
- 16 transceivers at 6.375 Gbps in a mid-density fabric （对比 EP2AGX260FF35C6G)
设计说明
The 1152-ball FCBGA FF35 package requires at least a 12-layer PCB with stacked microvia construction (any-layer or staggered via). Use a 1.0 mm ball pitch escape pattern and route all transceiver differential pairs as 100 ohm differential controlled-impedance (90 ohm for some protocols). Provide at least 4 GND via stitching vias around every signal via to maintain signal-integrity return-path continuity at 6.375 Gbps. Keep all high-speed serial traces within 3 inches of the BGA and avoid routing over power-plane splits. Source: Altera Arria II GZ PCB design guidelines.
Estimated: the EP2AGZ300FF35C3N at typical 298K LE utilization with 16 active transceivers consumes approximately 15-25 W. Decoupling must follow the Altera reference: place 0.1 uF X7R capacitors within 50 mils of every VCC pin, add 0.01 uF X7R for high-frequency transients, and provision bulk 22 uF/47 uF polymer capacitors near each voltage-rail input. Use a multi-rail PMIC with separate VCC, VCCD_PLL, and VCCT_GXB rails, sequencing them per the datasheet to avoid latch-up during power-up.
The FCBGA package exposes a thermal pad on the top side for heatsink attachment. Without a heatsink at typical 15-25 W dissipation, junction temperature will exceed 100 C in still air. Recommended: attach a 30x30x10 mm aluminum heatsink with thermal interface material (3 W/mK minimum) and provide 100 LFM forced airflow in chassis. For closed enclosures without airflow, derate transceiver count or migrate to the lower-density EP2AGZ225 variants which dissipate 4-6 W less. Estimated: junction temperature rise without heatsink is approximately 65-75 C above ambient at 20 W dissipation.
Do not confuse commercial-grade (C3) with industrial-grade (I3) temperature grades; the part number suffix encodes the operating temperature range. Verify configuration mode (AS, PS, JTAG) before PCB layout, as MODE pins are sampled at power-up and cannot be changed without re-routing dedicated MODE pull-up/pull-down resistors. A common mistake is omitting the EPCS configuration flash or using the wrong density - the EP2AGZ300 requires at least a 64 Mbit EPCS device. Finally, do not assume NRnd parts have equivalent lifecycle to active parts; plan migration to Cyclone 10 GX or Arria 10 for new designs.
合规信息
EP2AGZ300FF35C3N is the standard lead-finish (non-Pb-free) variant; the EP2AGZ300FF35C3G variant is Pb-free / RoHS-compliant with the same silicon. FPGA lifecycle status is NRnd (Not Recommended for New Designs) as of 2026-09-08.
