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EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
EP2SGX30DF780I3N

EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel

The Intel EP2SGX30DF780I3N is a Stratix II GX family field-programmable gate array (FPGA) built on a 90 nm CMOS process, delivering 33,880 logic elements, 33,380 logic cells, and a maximum core clock frequency of 622.08 MHz (816.9 MHz internal) in a 780-ball plastic fine-pitch BGA (FBGA-780) package at 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as transceivers, memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), enabling parallel hardware customization that microcontrollers and DSPs cannot match in throughput. Key features include embedded high-speed transceivers up to 6.375 Gbps, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 1.4 Mbits of on-chip TriMatrix memory, support for external memory interfaces including DDR2/QDRII+/RLDRAM II, and 361 user I/O pins. The device also includes 8 PLLs for clock synthesis and skew management, hot-socketing support, and SEU detection for soft-error mitigation in mission-critical systems. The Stratix II GX architecture uses an adaptive logic module (ALM) fabric that improves effective logic utilization versus older 4-LUT architectures. Combined with the embedded transceivers, this makes the EP2SGX30DF780I3N suitable for protocol bridging, baseband processing, and packet classification in line-card and backplane designs. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO), software-defined radio (SDR) baseband engines, video broadcast and imaging pipelines, and telecom line-card protocol termination. The wide transceiver bandwidth also suits test-and-measurement instrumentation such as protocol analyzers and digitizers. When designing with this device, plan thermal dissipation carefully - the FBGA-780 package requires a minimum 4-layer PCB with a continuous ground plane under the die for heat spreading. Quartus II is the supported development environment; ensure the design targets the I3N speed grade and industrial temperature range (-40C to +100C junction). This page synthesizes XAIPART internal pricing, drop-in same-package alternatives, and practical design notes that complement - not duplicate - the manufacturer Stratix II GX Device Handbook.

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EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4

EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel

The Intel EP2SGX30DF780I4 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated transceivers, delivering 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/O pins in a 780-ball flip-chip BGA package (29x29 mm, 1 mm pitch). It is built on a 1.2 V / 90 nm CMOS process and is specified for the industrial temperature grade of -40C to +85C. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver blocks that can be rewired after manufacture to implement arbitrary digital functions. Stratix II GX sits in the hierarchy: FPGA -> programmable logic -> programmable logic device -> integrated circuit, with the GX suffix denoting integrated multi-gigabit transceivers for serial connectivity. Key features of the EP2SGX30DF780I4 include up to 622 MHz internal operation, embedded transceiver blocks supporting SERDES rates commonly used in Stratix II GX, dedicated DSP blocks for high-throughput arithmetic, and a fine-grained ALM (Adaptive Logic Module) architecture that improves logic utilization over previous generations. The device is supported by the Quartus II design toolchain. The architecture uses ALM-based logic elements with Look-Up Table (LUT) cores, true dual-port M4K and M-RAM memory blocks, and embedded 18x18 multipliers. On-chip PLLs provide clock synthesis and skew management, while the integrated transceivers handle physical-layer serialization at line rates up to 6.375 Gbps depending on the protocol profile. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol development, ASIC prototyping, and digital signal processing where transceiver density matters. The 780-ball FC-FBGA package supports the high I/O count and transceiver bandwidth the device provides. When designing with this part, plan power integrity carefully - Stratix II GX devices draw substantial current through multiple rails. Use Quartus II PowerPlay early estimates to size decoupling and thermal solution; verify I/O bank VCCIO assignments match your LVDS/SSTL/LVCMOS signaling before PCB layout. This page combines distributor pricing, same-family Stratix drop-in alternatives, and design notes that go beyond what is summarized on manufacturer or distributor product pages.

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EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel
EP2SGX30DF780I4N

EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel

The Intel EP2SGX30DF780I4N is a high-density Stratix II GX family field-programmable gate array (FPGA) delivering 33,880 logic elements, 361 user I/O pins, and integrated 3.125 Gbps transceivers, housed in a 780-pin FBGA package measuring 29 mm x 29 mm with 1 mm ball pitch. Built on a 90 nm CMOS process and operating from a nominal 1.2 V core supply, the device reaches internal clock frequencies up to 622 MHz with maximum clocking capability rated at 717 MHz, placing it among the high-performance transceiver-bearing FPGAs of its generation. A field-programmable gate array (FPGA) is a reconfigurable semiconductor containing programmable logic blocks, routing channels, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-level parallelism with the ability to be reconfigured in-circuit. Within the power-management and embedded hierarchy, FPGAs are commonly classified as programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family is a transceiver-equipped sub-family of Stratix II, optimized for serial connectivity protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and SerialLite. Key features of the EP2SGX30DF780I4N include 33,880 logic elements, integrated multi-gigabit transceivers, dedicated DSP blocks for signal processing acceleration, embedded TriMatrix block RAM, support for multiple I/O standards including LVDS, and a -40C to +85C industrial operating temperature range. The "I4" speed grade and industrial temperature suffix make the part suitable for harsh-environment deployments, while the FBGA-780 package provides high-density interconnect for high-pin-count I/O and memory expansion. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) which combines fracturable look-up tables, adders, and registers into an 8-input equivalent block, improving logic packing density compared with the original Stratix family. The transceiver blocks support multiple protocols, while the surrounding fabric delivers fine-grained parallelism for DSP, packet processing, and bus interfacing. Typical applications for the EP2SGX30DF780I4N include telecommunications line cards, base-station signal processing, high-speed serial interface bridging, radar and sonar front-end processing, and industrial imaging pipelines. The transceiver-rich feature set particularly suits any design moving parallel data over a small number of high-speed serial lanes. When designing with this device, engineers must follow Intel/Altera's power-rail sequencing guidance and provide adequate decoupling on every VCC and VCCIO rail; the FBGA-780 package also requires multi-layer PCB stack-up with controlled-impedance traces for the transceiver channels.

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EP2SGX30DF780I4NK - Stratix II GX FPGA 33.8K LE 780-FBGA | Intel
EP2SGX30DF780I4NK

EP2SGX30DF780I4NK - Stratix II GX FPGA 33.8K LE 780-FBGA | Intel

The Intel (formerly Altera) EP2SGX30DF780I4NK is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded memory, and up to 361 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. The device is fabricated on a 90 nm process, operates from a nominal 1.2 V core supply, and supports a maximum internal clock frequency of 717 MHz. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic function is defined after manufacture by the customer rather than at the foundry, sitting in the taxonomy of programmable logic devices (PLD) → FPGA → high-density FPGA. Stratix II GX devices extend this taxonomy by embedding multi-gigabit transceivers alongside the programmable fabric, targeting high-speed serial I/O for line cards, video bridging, and wireless baseband processing. Understanding the role of the FPGA class clarifies why parts such as EP2SGX30DF780I4NK are specified by logic-element count, memory block count, transceiver count, and package ball map rather than by a fixed function name. Key features of the EP2SGX30DF780I4NK include 1,694 logic array blocks (LABs) with adaptive logic module (ALM) architecture, 1,369,728 bits of embedded RAM arranged as TriMatrix memory blocks, four phase-locked loops (PLLs), and embedded high-speed transceivers capable of multi-gigabit operation. Industrial temperature grade (-40 °C to +100 °C) is indicated by the 'I' suffix, while 'N' denotes a lead-free / RoHS-compliant package and 'K' designates a specific speed grade or feature set per the Stratix II GX ordering code. Architecturally, Stratix II GX devices pair the ALM-based logic fabric with dedicated transceiver circuitry, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 780-pin FC-FBGA with 1 mm ball pitch provides the routing density required for hundreds of user I/Os and multiple transceiver channels, while keeping the die-to-package electrical path short enough for multi-gigahertz signalling. Typical applications include high-speed serial interface bridging, telecommunications line-card backplanes, video broadcast infrastructure, military radar signal processing, and wireless baseband prototyping. Industrial temperature grade makes the EP2SGX30DF780I4NK suitable for outdoor telecom cabinets, factory automation controllers, and other non-thermally-controlled environments. When designing with this device, ensure the Quartus II design software version supports Stratix II GX (Quartus II v9.1 or later with appropriate service packs), and verify that PCB layout accommodates the 1 mm pitch BGA escape routing. Power-supply sequencing must respect the 1.2 V core, 3.3 V I/O, and transceiver supply rails, including proper PLL filtering. This page synthesizes distributor stock and pricing data, drop-in and same-family Intel Stratix II GX alternatives, and practical design notes that go beyond the manufacturer datasheet table.

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EP2SGX30DF780I5N - 33,880 Cell Stratix II GX FPGA, FC-FBGA-780 | Intel
EP2SGX30DF780I5N

EP2SGX30DF780I5N - 33,880 Cell Stratix II GX FPGA, FC-FBGA-780 | Intel

The Intel (formerly Altera) EP2SGX30DF780I5N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) with 33,880 logic cells (33,380 logic elements) and 33880 Logic Array Blocks (LABs), built on a 90 nm CMOS process and housed in a 780-ball Fine-pitch Flip-Chip BGA package (FC-FBGA-780, 29 x 29 mm, 1 mm pitch). The device integrates up to 622.08 MHz internal clock frequency logic with embedded transceivers optimized for high-speed serial I/O, a core supply of 1.2 V, and industrial-grade -40C to +85C operating range. The "I5" speed grade and industrial temperature suffix make it suitable for harsh-environment networking, broadcast video, and defense applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs occupy the top of the programmable-logic hierarchy, sitting above CPLDs (which are simpler, lower-density, non-volatile devices) and below fixed-function ASICs in terms of integration density. The Stratix II GX architecture specifically embeds high-speed serial transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, enabling single-chip implementation of multi-gigabit serial interfaces without external PHYs. Key features of the EP2SGX30DF780I5N include 33,880 logic cells, multiple embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput signal processing, abundant block RAM for buffering and packet storage, and the fine-pitch 29 mm FC-FBGA package for high signal integrity on dense multi-layer PCBs. Its industrial temperature grade and I5 speed grade place it in the higher-performance tier of the Stratix II GX family, well-suited to networking line cards, basestation baseband, and high-end test equipment. Typical applications include high-speed serial protocol bridging (PCI Express to Gigabit Ethernet, Serial RapidIO switching), DSP co-processing for radar, software-defined radio, telecom muxponders, and ASIC prototyping. Industrial-grade parts are also commonly used in long-life-cycle embedded systems such as avionics, defense radios, and process-control networking modules. When designing with this part, plan for multi-layer PCB stack-up with controlled-impedance serial channels, ample decoupling around the 780 BGA balls, and a Quartus II design flow with the Stratix II GX device library. Power sequencing, JTAG configuration, and thermal dissipation through the flip-chip BGA should be validated before high-volume release.

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EP2SGX30DF780I7N - Stratix II GX 30K LEs FPGA | Intel | 780-BGA
EP2SGX30DF780I7N

EP2SGX30DF780I7N - Stratix II GX 30K LEs FPGA | Intel | 780-BGA

The Intel EP2SGX30DF780I7N is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, integrating approximately 33,880 equivalent logic elements (LEs), 136,9728 bits of embedded memory, and dedicated 3.125 Gbps multi-gigabit transceivers (MGTs). Built on a 90 nm process with a 1.2 V core voltage, this device targets high-speed serial I/O, embedded processing, and DSP-intensive applications such as basestation line cards, video broadcast, and high-end test equipment. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O via a hardware description language (HDL) after manufacture. Stratix II GX belongs to Intel's (formerly Altera's) high-performance programmable logic hierarchy: FPGA -> programmable logic device -> semiconductor IC. The GX suffix designates the transceiver-enabled variant, distinguishing it from the logic-only Stratix II family and the lower-cost Cyclone series. FPGAs sit between ASICs and microcontrollers in design flexibility, offering ASIC-class throughput with microcontroller-class time-to-market. Key features of the EP2SGX30DF780I7N include up to 16 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, XAUI, PCIe, and Serial RapidIO protocols, on-chip TriMatrix memory of up to 1.37 Mbit distributed across M512, M4K, and M-RAM blocks, and up to 364 18x18 multipliers for DSP. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 586 user I/O pins in this 780-pin BGA. The architecture combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient implementation of combinational and registered logic. Each ALM contains two adaptive LUTs, two programmable registers, and dedicated arithmetic carry chains, giving the device up to 33,880 LEs while improving logic utilization by roughly 25% versus the previous Stratix generation. The embedded transceivers operate from 600 Mbps to 3.125 Gbps with built-in PCS functions for 8B/10B encoding. Typical applications include wireless infrastructure (W-CDMA, LTE baseband processing), high-definition video editing systems, broadcast routers using HD-SDI or DVB-ASI, radar and signal-intelligence front-ends, PCI Express endpoint and root-complex designs, and serial RapidIO backplanes. The integrated transceivers eliminate the need for external PHY ICs in designs that previously required companion Gigabit Ethernet or XAUI chips. When designing with this device, pay close attention to power-rail sequencing, PCB stackup for BGA breakout, and thermal management. The 780-pin BGA requires at least a 6-layer PCB with controlled-impedance routing for the MGT differential pairs. JTAG and Active Serial configuration via EPCS16 or EPCS64 flash must be planned early; in-system programming through the JTAG header is recommended for prototype bring-up.

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EP2SGX30F780C3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Altera
EP2SGX30F780C3N

EP2SGX30F780C3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Altera

The Altera (Intel) EP2SGX30F780C3N is a high-performance Stratix II GX Field-Programmable Gate Array (FPGA) featuring 33,880 logic elements, 1,369,728 bits of embedded RAM, and 361 user I/O pins, housed in a 780-ball FineLine BGA (29x29 mm) surface-mount package. It operates at a core voltage of 1.2 V with 90 nm process technology and a maximum internal frequency of 816.9 MHz, delivering industry-leading transceiver-based signal processing for high-bandwidth serial I/O applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic functions through SRAM-based configuration cells. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), which itself is a branch of digital integrated circuits and ultimately a category of semiconductors. The Stratix II GX family is positioned at the upper tier of FPGA performance, integrating multi-gigabit transceivers directly onto the die to support protocols such as PCI Express, Serial RapidIO, XAUI, and 10 Gigabit Ethernet without external PHY chips. Key features of the EP2SGX30F780C3N include integrated transceiver channels running up to 6.375 Gbps, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 embedded transceivers arranged in quads, and a flexible logic structure with adaptive logic modules (ALMs) that replace the legacy 4-input LUT architecture of prior Stratix generations. Memory interfaces include external DDR2 support and on-chip TriMatrix memory with true dual-port and FIFO modes. Technically, the device is built on a 1.2 V core with 0.9 V PLL supply and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL across 16 I/O banks. Configuration is handled through passive serial, fast passive parallel, or JTAG modes, with built-in error detection via the CRC circuit and on-chip bitstream decryption for IP protection using 128-bit AES. Typical applications include 10G Ethernet line cards, wireless baseband processing, high-speed serial backplane bridging, broadcast video processing, and military/aerospace signal intelligence platforms where integrated transceivers reduce BOM and PCB area. The 780-FBGA package suits production hardware where thermal management uses forced-air or heatsink thermal solutions. Design consideration: route all 12 transceiver channels with controlled-impedance differential pairs (100 ohm differential) and keep lengths matched within the budget specified by the Quartus II transceiver toolkit. Use the Altera soft-copy transceiver macros from the IP library rather than designing your own PMA layer. This page consolidates distributor pricing, drop-in alternatives within the Stratix II GX family, and engineering design notes specific to the EP2SGX30F780C3N - information not aggregated on the manufacturer datasheet alone.

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EP2SGX30FG780C7 - Stratix II GX 30K LEs FPGA with 4.6G Transceivers | Altera
EP2SGX30FG780C7

EP2SGX30FG780C7 - Stratix II GX 30K LEs FPGA with 4.6G Transceivers | Altera

The Altera (now Intel FPGA) EP2SGX30FG780C7 is a Stratix II GX family FPGA featuring approximately 33,880 equivalent logic elements, 2.1 Mbits of embedded RAM, and 4 embedded transceivers operating up to 6.375 Gbps, housed in a 780-pin FineLine BGA (FG780) package at the C7 speed grade (commercial, ~7 ns core logic delay class). This device integrates high-speed serial I/O alongside DSP blocks and TriMatrix memory, making it well suited for high-bandwidth wired communication, signal processing, and protocol bridging systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hard IP such as transceivers, multipliers, and clock management circuitry. FPGAs occupy a position in the system hierarchy above general-purpose microcontrollers but below ASICs in non-recurring engineering cost, providing hardware-timed parallelism and reconfigurability. The Stratix II GX family specifically targets applications that combine parallel logic with multi-gigabit serial links, positioning it within the power-management and signal-chain ecosystem as a glue-and-processing layer. Key features include 33,880 logic elements, 192 (18x18) multipliers, 2.1 Mbits of TriMatrix embedded memory arranged as M512/M4K/M-RAM blocks, 364 user I/O pins, 4 multi-gigabit transceivers supporting up to 6.375 Gbps with support for PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols, and dedicated clock management PLLs. The device operates from a 0.85 V core supply with separate transceiver, I/O, and auxiliary supplies. The EP2SGX30FG780C7 is fabricated on a 90 nm process with a copper interconnect stack and uses Altera's Adaptive Logic Module (ALM) architecture, which provides 8-input fracturable look-up tables delivering improved logic packing efficiency versus the older ALM-free Stratix ALUT architecture. Hard PCIe and CDR blocks allow simultaneous multi-protocol serial connectivity without consuming soft logic. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridges for wireless baseband cards, XAUI-based 10G Ethernet aggregation, SD/HD-SDI broadcast video processing, and high-speed data acquisition backplanes. The 780-pin BGA package provides ample signal density for fan-out without requiring complex stacked-die solutions. When designing with the EP2SGX30FG780C7, plan signal integrity carefully - the 6.375 Gbps transceivers demand controlled-impedance differential routing with length matching inside ~5 mils and a 100-ohm differential reference. Use Altera's Quartus II design suite (legacy, Stratix II supported up to v13.x) for synthesis, place-and-route, and timing closure. This page consolidates distributor availability, drop-in FG780 alternatives within the Stratix II GX family, and Stratix II GX transceiver design notes not typically present in a single datasheet excerpt.

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EP2SGX60CF484I4 - 60K LEs Stratix II GX FPGA 484-FBGA | Intel
EP2SGX60CF484I4

EP2SGX60CF484I4 - 60K LEs Stratix II GX FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP2SGX60CF484I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 291 user I/Os in a 484-ball FineLine BGA (FBGA) package. Built on a 90 nm process and operating from a 1.2 V core supply, the device integrates up to 12 transceiver channels capable of multi-gigabit serial I/O, making it a turnkey solution for high-speed serial connectivity in communications, video broadcast, and storage systems. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect fabric. FPGAs belong to the broader category of programmable logic devices (PLDs) within the Integrated Circuits > FPGA & CPLD family, and they sit alongside ASICs and microcontrollers as the three principal silicon platforms for digital hardware design. The Stratix II GX family specifically adds embedded transceivers, extending the general-purpose FPGA concept into serial-link-centric applications where ASIC-equivalent bandwidth would otherwise require months of custom design. Key features of the EP2SGX60CF484I4 include 3,022 Logic Array Blocks (LABs), 4 DSP blocks for hardware-accelerated multiplication, internal clock frequencies up to 732.1 MHz, and 12 full-dupelt mode dedicated transceivers supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 23 x 23 mm 1.0 mm-pitch FBGA-484 package provides sufficient perimeter I/O for parallel external memory buses while keeping the ball array compatible with mainstream PCB manufacturing. The architecture combines ALM-based adaptive logic modules with TriMatrix embedded memory, allowing designers to trade logic density against block-RAM depth on a per-need basis. Hard IP blocks for transceivers, PLLs, and the DDR memory controller offload timing-critical tasks from the programmable fabric, freeing logic resources for user-defined processing and protocol stacks. Typical applications include wireless baseband processing, video broadcast encoding and routing, serial-backplane switching, high-speed data acquisition, and defense signal intelligence platforms. The combination of 12 transceivers and abundant parallel I/O makes the EP2SGX60CF484I4 especially attractive for line-card designs that must bridge multiple SERDES links to a parallel fabric. When designing with this device, plan the FPGA-to-transceiver channel allocation and reference-clock distribution up front, because the GX transceivers require precise 100-ohm differential layout and dedicated PLL blocks. Industrial temperature grade (I4 suffix) operation is qualified to -40 C to +100 C ambient, so verify your thermal design against worst-case power from all active transceivers. This page synthesizes distributor stock and pricing, package-compatible drop-in alternatives, and practical design guidance not found in the Altera datasheet alone, helping engineers validate sourcing and reuse options before committing to a new design.

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EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel
EP2SGX60CF780C

EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2SGX60CF780C is a member of the Stratix II GX family of high-performance FPGAs with embedded transceivers, offering 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 780-ball FineLine BGA package. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with up to 20 multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a drop-in fit for SERDES-based backplane, chip-to-chip, and protocol bridge designs. A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, routing, and I/O cells can be reconfigured after manufacture, allowing hardware engineers to implement custom digital circuits without fabricating an ASIC. The Stratix II GX sits in the broader hierarchy: programmable logic -> FPGA -> high-speed transceiver FPGA -> wireline/protocol-bridge class. It targets applications where deterministic latency and high SERDES bandwidth are required and where ASIC NRE cost is not justified. Key features of the EP2SGX60CF780C variant include 364 user I/O pins supporting numerous single-ended and differential I/O standards, 60440 logic elements in the standard -C (commercial) speed grade, an FCBGA package optimized for high pin-count high-speed routing, and a hard PCI Express and SERDES block. Compared with the Cyclone series, the Stratix II GX offers roughly 4x the logic density, embedded transceivers, and richer DSP block resources. The Stratix II GX architecture uses an 8-input ALM with a built-in register, a hierarchical memory subsystem (TriMatrix), and dedicated SERDES hard IP for protocols such as PCI Express, XAUI, SATA, and Serial RapidIO. The embedded transceivers reduce board area and simplify PCB layout versus FPGA-plus-discrete-SERDES solutions. Typical applications include high-speed serial backplanes, telecommunications line cards, data-center protocol bridges (e.g., XAUI to SGMII), broadcast video routers, and high-performance computing interconnects. The 780-ball FCBGA supports the high-density differential SERDES routing required by these designs. When designing with this device, follow Altera application notes AN-558 and AN-525 for multi-gigabit transceiver PCB layout - keep SERDES traces length-matched within 150 mils, maintain a continuous reference plane, and use 100-ohm differential impedance. Power sequencing on the Stratix II GX family is critical; consult the device handbook for VCCINT/VCCPD ramp order. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all values cross-checked against the Intel/Altera Stratix II GX Device Handbook.

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EP2SGX60CF780C3 - Stratix II GX FPGA, 60K LE, 780-BGA | Intel
EP2SGX60CF780C3

EP2SGX60CF780C3 - Stratix II GX FPGA, 60K LE, 780-BGA | Intel

The Intel (formerly Altera) EP2SGX60CF780C3 is a high-density Stratix II GX family Field-Programmable Gate Array delivering 60,440 logic elements (3022 LABs) with embedded transceivers, packaged in a 780-pin FineLine BGA at 1.2V core. The Stratix II GX family combines a 90 nm CMOS process with a flexible Adaptive Logic Module architecture, targeting high-speed serial I/O, memory-intensive DSP, and high-performance logic designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O serdes are all programmable after manufacture. FPGAs sit alongside microcontrollers and ASICs in the programmable logic hierarchy, but unlike microcontrollers they offer fully parallel data paths and deterministic latency; unlike ASICs they require no mask set and ship in days rather than months. Within the Stratix II GX family, the SGX60 tier adds multi-gigabit transceivers (up to 6.375 Gbps) for protocols such as PCIe, Serial RapidIO, and custom SERDES links. Key features of the EP2SGX60CF780C3 include 60,440 logic elements, 2,544,192 bits of on-chip RAM (approximately 317 KB), 364 user I/Os, and a 780-ball FineLine BGA package at 29 mm x 29 mm body size with 1 mm ball pitch. The part is offered in the commercial speed grade C3 and supports operating junction temperatures in the commercial range. Stratix II GX devices also embed hard IP for PCI Express x1/x4 and external memory interfaces including DDR2 SDRAM and QDR II SRAM controllers. The architecture combines 4-input ALMs (Adaptive Logic Modules) replacing the older 4-input LUT, with column-and-row routing using MultiTrack interconnect, and dedicated multiplier blocks, all clocked by up to 12 PLLs. Internal performance supports frequencies up to the device's Fmax rating as published in the datasheet speed-grade tables. The 780-FBGA footprint is shared with other Stratix II GX density points, allowing a single PCB layout to support density migration. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SDI video), telecommunications line cards, test and measurement equipment with parallel DSP pipelines, and prototyping for ASIC replacement. The transceivers make this part especially attractive for any system that previously required a separate PHY chip. When designing with the EP2SGX60CF780C3, ensure adequate power decoupling near every bank and observe the Stratix II GX PowerPlay early-power-estimate flow before layout commit. Because the Stratix II GX family has been superseded by Stratix IV/V and the Intel Cyclone 10/Agilex families for new designs, this part is most commonly sourced for legacy maintenance and long-lifecycle programs. This page synthesizes distributor pricing, verified drop-in alternatives (same 780-FBGA footprint, same SGX60 die where applicable), and practical PCB/thermal design notes that go beyond the manufacturer datasheet's electrical tables.

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EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

The Intel (formerly Altera) EP2SGX60CF780C3N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O pins, and up to 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FBGA-780, 29 mm x 29 mm, 1.0 mm pitch) package. It is fabricated on a 90 nm CMOS process, operates from a 1.2 V core supply, and supports internal clock frequencies up to 816.9 MHz (per datasheet) / 717 MHz (per alternate source listings). The device integrates up to 12 transceiver channels rated to 6.375 Gbps, making it the original Altera GX-tier platform for high-speed serial I/O. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, high-speed transceivers, and a programmable interconnect fabric on a single die. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductors, parallel to ASICs but offering post-fabrication reprogrammability. The Stratix II GX family specifically targets applications requiring both high-density logic and multi-gigabit serial transceivers, positioning it between general-purpose FPGAs and full ASICs in terms of integration and cost. Key features include 60,440 logic elements, approximately 2.5 Mbit of embedded RAM (M4K/M-RAM blocks), dedicated 18-bit x 18-bit DSP blocks, 12 full-duplex transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G, plus 8 clock PLL blocks with regional and global clock networks. The 780-ball FC-FBGA package exposes the full set of 364 user I/O pins alongside transceiver reference clocks and high-speed serial pins. Architecturally, Stratix II GX uses an ALM-based logic element with adaptive look-up tables (LUTs) operating at 1.2 V core, with dedicated circuitry for source-synchronous memory interfaces (DDR/DDR2/QDR) and 8B/10B-encoded serial links. The 90 nm process and on-chip signal-integrity features (dynamic phase alignment, pre-emphasis, equalization) enable the transceiver channels to close links at gigabit rates on standard FR-4 backplanes. Typical applications include high-speed serial interface bridging (PCI Express endpoints, XAUI-to-XAUI backplanes), telecom line cards (OC-48/STM-16 aggregation), military and aerospace signal processing, broadcast video routers with SDI/HD-SDI serial I/O, and ASIC prototyping where designers need verified 6 Gbps SerDes plus 60K logic elements. When designing with EP2SGX60CF780C3N, pay close attention to transceiver reference-clock jitter and power-rail decoupling - the 1.2 V VCC, 2.5 V VCCAUX, and 3.3 V VCCPD planes each require bulk and ceramic bypass capacitors placed within 100 mils of their respective balls. Quartus II (legacy, version 9.0 and earlier) is the supported development environment. This page synthesizes distributor stock, verified drop-in alternatives from the Stratix II GX family, and practical design considerations not found in a single distributor listing.

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EP2SGX60CF780C4 - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C4

EP2SGX60CF780C4 - Stratix II GX FPGA 60K LE 780-FBGA | Intel

The Intel (formerly Altera) EP2SGX60CF780C4 is a member of the Stratix II GX family of high-performance field-programmable gate arrays (FPGAs) featuring 60,440 logic elements, 364 user I/O pins, integrated transceivers, and 2,544,192 bits of embedded memory. Built on a 90 nm process technology with a 1.2 V core supply, the device operates at internal clock frequencies up to 732.1 MHz and is housed in a 780-ball fine-pitch flip-chip BGA (FC-FBGA) package. The C4 speed grade and commercial temperature rating make it suited to mainstream wired-communication, video-broadcast, and high-throughput data-acquisition designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism with reprogrammability. The Stratix II GX family specifically targets designs that require multi-gigabit serial transceivers alongside general-purpose logic, combining high-speed SERDES channels with a rich fabric of adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput arithmetic. Key features of the EP2SGX60CF780C4 include a 60440-logic-element fabric arranged in 3,022 LABs/CLBs, embedded 18x18 multipliers grouped into DSP blocks, dedicated high-speed transceivers that support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, and on-chip phase-locked loops (PLLs) for clock synthesis and management. The 780-ball FC-FBGA package provides a 1 mm ball pitch and a 23 x 23 mm body, enabling high pin density for the 364 user I/O pins while supporting the integrated transceiver channels. From an architectural standpoint, the Stratix II GX uses Altera's ALM-based logic fabric, which improves effective logic utilization versus traditional 4-input LUT architectures. Combined with the 90 nm process and 1.2 V core, the design balances static power, dynamic performance, and signal-integrity margin for multi-gigabit serial I/O. Internal memory totals approximately 2.5 Mb, and dedicated hard IP blocks accelerate memory interfaces, packet processing, and DSP pipelines without consuming fabric resources. Typical applications for the EP2SGX60CF780C4 include high-speed serial interface bridging, telecommunications line cards, video processing and broadcast equipment, ASIC prototyping, and high-bandwidth test and measurement. Engineers select this part when a design needs both substantial programmable logic and integrated multi-gigabit transceivers on a single die, reducing board complexity versus a two-chip FPGA plus external PHY solution. When designing with this device, pay close attention to the Stratix II GX transceiver reference clock architecture, signal-integrity requirements for the FC-FBGA breakout, and the Quartus II power estimation flow. Use the Stratix II GX FPGA Development Kit schematics and Altera application notes for board-layout guidance, especially the multi-gigabit transceiver channel rules for the FC-FBGA package. This page synthesizes distributor pricing, drop-in alternatives in the same 780-ball FC-FBGA package, and practical design notes not always gathered in one place on the manufacturer datasheet. The information is structured for engineers evaluating the EP2SGX60CF780C4 for new designs or as a drop-in replacement on existing Stratix II GX board layouts.

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EP2SGX60CF780C4N - 60K LEs Stratix II GX FPGA | Intel | 780-BGA
EP2SGX60CF780C4N

EP2SGX60CF780C4N - 60K LEs Stratix II GX FPGA | Intel | 780-BGA

The Intel (formerly Altera) EP2SGX60CF780C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 3,022 LABs/CLBs, and 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FC-FBGA) package. The device integrates up to 12 transceiver channels supporting 6.375 Gbps operation and is built on a 90 nm process technology with 1.2 V core supply. What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the hierarchy of programmable logic: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, and high-speed serial interfaces, making them ideal for prototyping, low-volume production, and designs that need to evolve post-deployment. Key features of the EP2SGX60CF780C4N include 364 user I/Os, support for numerous single-ended and differential I/O standards (LVDS, LVPECL, SSTL, HSTL, LVCMOS), embedded multipliers, and dedicated DSP blocks. The Stratix II GX family adds hardened multi-gigabit transceivers, making this device particularly suited for serial connectivity. Internal performance reaches up to 732 MHz and the device supports 1.2 V core operation with 717 MHz propagation delay characteristics. The device uses a 90 nm CMOS process with embedded SRAM configuration memory, supporting in-system programmability via JTAG or passive/active serial configuration schemes. Its 780-ball FC-FBGA package (23 x 23 mm, 1 mm pitch, MS-034AAJ-1) exposes up to 20 full-duplex transceiver channels in larger family members and provides ample signal integrity for multi-gigabit serial links. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), communications infrastructure, broadcast video processing, military and aerospace signal processing, and high-performance DSP prototyping. The C4 speed grade in the operating temperature range is intended for commercial (0C to 85C) ambient conditions. When designing with this device, careful attention must be paid to power distribution, decoupling, and PCB layer stack-up. The FC-FBGA-780 package requires a minimum of 6 PCB layers with controlled-impedance routing for high-speed transceivers. Quartus II design software (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and AI-citable FAQ answers to help engineers select, source, and integrate the EP2SGX60CF780C4N into next-generation high-speed digital systems.

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EP2SGX60CF780C5 - Stratix II GX FPGA 60K LE 780-BGA | Intel / Altera
EP2SGX60CF780C5

EP2SGX60CF780C5 - Stratix II GX FPGA 60K LE 780-BGA | Intel / Altera

The Intel (formerly Altera) EP2SGX60CF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 364 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. It is built on a 90 nm process node, operates from a 1.2 V core supply with a maximum internal frequency near 717 MHz, and adds up to 20 embedded transceivers supporting multi-gigabit serial I/O for high-speed serial connectivity. The 'C5' speed grade and 'C' commercial temperature rating position it for cost-sensitive prototyping and production in non-extended-temperature environments. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device belonging to the hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. FPGAs sit above standard logic ICs in capability, allowing designers to implement arbitrary digital circuits after PCB fabrication. Within the broader IC taxonomy, the Stratix II GX family targets high-performance digital signal processing, telecom baseband, and serial-interface bridging, sitting between ASICs (higher NRE cost, lower unit cost) and CPLDs (simpler, lower-density glue logic). Key technical features include 60,440 logic elements organized into 3,022 logic array blocks (LABs), 2,544,192 bits of embedded SRAM (M512/M4K/M-RAM blocks), up to 4 enhanced PLLs plus 8 fast PLLs, and dedicated DSP blocks for high-throughput multiplication and accumulation. The device supports configuration via passive serial, fast passive parallel, or JTAG schemes, and offers built-in signal-integrity features for source-synchronous memory interfaces including DDR/DDR2 SDRAM controllers. The architecture uses an adaptive logic module (ALM) structure that is more efficient than the previous Stratix ALM, packing up to 6 inputs into each ALM. Combined with routing efficiency improvements, this delivers roughly 50% higher logic density per area than the prior Stratix generation while maintaining timing closure on multi-megahertz designs. TriMatrix embedded memory and a high-bandwidth interconnect fabric make the part suitable for data-path-heavy designs such as packet processing, video pipelines, and multi-channel DSP. Typical applications include 10 Gbps optical-transport networking line cards, PCI Express endpoint or root-complex bridges, multi-channel serial-digital-interface (SDI) video routers, software-defined radio baseband preprocessing, and high-speed data-acquisition front-ends. The combination of embedded transceivers and rich logic capacity allows a single device to replace multiple ASSPs plus glue logic on the same board. When designing with this part, ensure a robust decoupling network (typically 0.1 uF and 10 uF ceramic capacitors per power rail) is placed as close as possible to the BGA balls to manage simultaneous switching noise. The 780-ball FC-FBGA package demands at least a 6-layer PCB with controlled-impedance routing and microvia or via-in-pad technology; standard 0.1 mm laser-drilled microvias are commonly used. Confirm Quartus II software support and licensing for the C5 speed grade before starting the design cycle. This page aggregates distributor pricing, package-level engineering data, and Stratix II GX family context beyond what is found on any single manufacturer or distributor page, helping engineers quickly assess the EP2SGX60CF780C5 for new designs or legacy inventory support.

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EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N

EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel

The Intel / Altera EP2SGX60CF780C5N is a Stratix II GX FPGA from Intel's third-generation FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device delivers 60,440 logic elements (60K LE), 2,544,192 bits of embedded RAM (approximately 2.5 Mbit), 364 user I/Os, and 20 high-speed transceiver channels capable of data rates up to 6.375 Gbps with embedded SERDES and clock-data recovery (CDR), housed in a 780-ball FCBGA package. The package measures 29 mm x 29 mm with 1.0 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by a configuration bitstream loaded after manufacture, as opposed to ASICs whose function is fixed at fabrication. FPGAs occupy the programmable-logic tier of the broader digital semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA (SoC FPGA). Within the high-performance sub-segment, transceivers (SERDES) -> gigabit transceivers -> multi-gigabit transceivers, the Stratix II GX family sits at the multi-gigabit class. Key features of the EP2SGX60CF780C5N include up to 20 multi-gigabit transceiver channels each incorporating CDR technology, dedicated hardware multipliers for DSP-style arithmetic, embedded TriMatrix memory blocks, support for external memory interfaces including DDR/DDR2/QDRII, and a comprehensive configuration scheme supporting JTAG (IEEE 1149.1) boundary-scan and passive/active serial modes. The logic array is implemented in 90 nm CMOS technology with a 1.15 V to 1.25 V core supply. Typical applications include high-speed serial interface bridging (PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI), custom protocol development, prototyping of ASIC designs, high-performance DSP datapaths, and telecom equipment line cards. The combination of 60K logic elements and 6.375 Gbps transceivers makes the part suitable for protocol converter bridges, multi-channel SERDES aggregation, and line-rate protocol adaptation. When designing with this part, allocate 1.0 mm ball-pitch PCB routing rules, use multi-layer stack-up with dedicated transceiver reference plane layers, and follow Intel/Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Verify transceiver reference clock jitter against the protocol specification (typically <1 ps RMS for 6 Gbps links). This page synthesizes distributor pricing, pin-compatible Stratix II GX family members, and practical SERDES design considerations not collected in a single place by the manufacturer datasheet.

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EP2SGX60CF780C7 - Stratix II GX FPGA, 60K LE, 780-FCBGA | Altera
EP2SGX60CF780C7

EP2SGX60CF780C7 - Stratix II GX FPGA, 60K LE, 780-FCBGA | Altera

The Altera (now Intel) EP2SGX60CF780C7 is a member of the Stratix II GX family of high-performance FPGAs, featuring 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, all housed in a 780-ball flip-chip BGA (FCBGA) package. Built on a 90 nm process with a 1.2 V core supply, the device combines a high-density adaptive logic module (ALM) fabric with on-chip DSP blocks and dedicated serial transceiver channels optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier in the digital design hierarchy that sits between fixed-function ASICs and software-programmable processors: more flexible than an ASIC, far faster and more parallel than a general-purpose MCU. The Stratix II GX family specifically targets high-speed serial connectivity applications where the integrated transceivers and hardened PCS/PMA blocks dramatically reduce design effort for protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet. Key differentiating features of the EP2SGX60CF780C7 include up to 364 user I/O pins, 24 DSP blocks (for 18x18 multipliers and accumulators), 12 transceiver channels supporting data rates from 600 Mbps to 6.375 Gbps, and dedicated on-chip termination for AC-coupled and DC-coupled serial links. The Stratix II GX architecture introduced the ALM, which packs eight inputs into a single LUT-based adaptive logic element, providing roughly twice the logic density of the prior Stratix generation. Hot-socketing support, robust SEU mitigation via CRC-driven configuration, and remote upgrade capability round out the feature set. Typical applications include high-end telecommunications line cards, broadcast video processing, high-performance computing acceleration, and high-speed serial protocol bridging. The integrated transceivers make the device particularly attractive for backplane aggregation, serializer/deserializer (SerDes) replacement, and protocol conversion in routers, switches, and base-station equipment. Designers should note that the 'C7' speed grade is the slowest commercial grade offered; faster 'C5' and 'C6' parts in the same package are drop-in upgrades when timing margins are tight. When designing the PCB, allocate at least four PCB layers with continuous power and ground planes beneath the BGA, follow Altera's recommended decoupling scheme (typically one bulk capacitor per PLL and one per transceiver channel plus 0.1 uF/0.01 uF pairs near every power pin), and observe the FCBGA's 1.0 mm ball pitch land pattern. The high transceiver data rate requires careful attention to channel loss, return loss, and via-stub compensation on the serial links.

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EP2SGX60CF780I4N - 60K LEs Stratix II GX FPGA, 780-FBGA | Altera
EP2SGX60CF780I4N

EP2SGX60CF780I4N - 60K LEs Stratix II GX FPGA, 780-FBGA | Altera

The Altera EP2SGX60CF780I4N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 60,440 logic elements, 60,440 equivalent logic blocks (CLBs), and up to 2,542 Kbits of embedded memory, housed in a 780-ball fine-line BGA (FC-FBGA) package measuring 23 x 23 mm with 1.0 mm pitch. It integrates up to 20 serial transceivers operating at 6.375 Gbps, supporting PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols for high-bandwidth interconnect. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic, interconnect, and I/O behavior are configured by the end user via an HDL bitstream rather than at the factory. FPGAs occupy a middle ground between fixed-function ASICs (highest performance, lowest per-unit cost at volume) and microcontrollers (highest flexibility, lowest per-unit performance): they deliver ASIC-class data-path throughput while remaining reconfigurable in the field. Stratix II GX belongs to Altera's high-end transceiver-equipped family, targeting wireline communication, broadcast video, and high-speed serial bridging. Key features include 12 PLLs (4 fast PLLs + 8 enhanced PLLs), 12 dedicated clock transceivers supporting 622 Mbps to 6.375 Gbps operation, a 1.2 V core supply (range 1.15 V to 1.25 V), and an industrial temperature grade (-40 °C to +100 °C case). The 90 nm CMOS process provides high logic density with on-chip termination, dynamic phase alignment, and pre-emphasis equalization for backplane and chip-to-chip serial links. The architecture combines adaptive logic modules (ALMs) with embedded TriMatrix memory blocks (MRAM), allowing designers to build wide datapaths, protocol controllers, and DSP blocks at full chip frequency. Stratix II GX supports up to 16 global clock networks, 4 dedicated clocking PLLs for high-frequency synthesis, and 8 regional PLLs with dynamic reconfiguration capability for frequency margining and link-rate switching. Typical applications include 10 Gbps Ethernet MAC/PHY bridging, PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO switch fabrics, broadcast video processing (HD-SDI, 3G-SDI), telecom backplane aggregation, and high-end test-and-measurement instrumentation where reconfigurable high-speed serial I/O is required. When designing with this device, ensure your PCB meets the FC-FBGA-780 land-pattern requirements (1.0 mm pitch microvia stack-ups), provide independent analog supply rails for the transceiver PLLs, and select the correct speed grade for your target transceiver line rate. Bitstream configuration requires a compatible Altera/Intel Quartus II programmer. This page synthesizes distributor pricing, Stratix II GX family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP2SGX60CF780I5N - Stratix II GX FPGA 60K LE FC-FBGA-780 | Altera
EP2SGX60CF780I5N

EP2SGX60CF780I5N - Stratix II GX FPGA 60K LE FC-FBGA-780 | Altera

The Altera EP2SGX60CF780I5N is a high-density Field Programmable Gate Array (FPGA) from the Stratix II GX family, featuring 60,440 Logic Elements (LEs), 60,440 Adaptive Logic Modules (ALMs), and up to 622 MHz maximum operating frequency in a 780-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. The device integrates up to 12 embedded transceivers operating at 6.375 Gbps, supporting high-speed serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed I/O that can be re-programmed to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy (PAL -> CPLD -> FPGA) and are used when processors or ASICs cannot meet performance, latency, or parallelism requirements. The Stratix II GX family targets high-speed serial connectivity and signal-processing applications, placing this specific variant as a high-end member suitable for telecom backplanes, broadcast video, and high-end test equipment. Key features of the EP2SGX60CF780I5N include 2,542 Kbits of embedded RAM distributed across TriMatrix memory blocks (M512, M4K, and M-RAM), 192 dedicated 18x18 multipliers for DSP operations, and a 1.2V core supply (1.15V to 1.25V operating range). It supports up to 12 full-duplex transceiver channels at data rates up to 3.125 Gbps, with some configurations reaching 6.375 Gbps depending on speed grade. The industrial temperature grade (-40C to +100C) and 90nm CMOS process technology make it suitable for demanding industrial and defense applications. The architecture is based on Altera's adaptive logic module (ALM) fabric, which provides finer-grained lookup-table (LUT) packing than previous Stratix generations, increasing effective logic density by ~25%. The transceiver blocks include dedicated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) hardware, supporting standards such as PCIe Gen1 (2.5 Gbps), XAUI (3.125 Gbps), and Serial RapidIO (1.25 to 3.125 Gbps). Programmable pre-emphasis and equalization compensate for channel loss on FR-4 backplanes up to 40 inches. Typical applications include high-speed serial interface bridging, telecom line card prototyping, military signal processing, broadcast video routers, and high-performance computing (HPC) acceleration. The 780-ball FC-FBGA package (29 x 29 mm, 1 mm pitch) is designed for high-density PCB designs with controlled-impedance routing for the transceiver lanes, requiring dedicated ground and power planes plus matched-length differential pairs. When designing with this device, allocate transceiver lanes first and route them on the top or bottom layers with continuous reference planes. Power supply decoupling requires at least 22 decoupling capacitors per power rail, plus bulk capacitors for the 1.2V core and PLL analog supplies. JTAG and configuration pins (MSEL[2:0], nCONFIG, nSTATUS, DONE) must be accessible for in-system programming. This page synthesizes distributor pricing, drop-in alternative Stratix II GX variants, and practical PCB design considerations not found in the manufacturer datasheet alone, giving procurement and engineering teams a single source for component evaluation.

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EP2SGX60DF780C3 - Stratix II GX 60K LE FPGA, 780-BGA | Intel
EP2SGX60DF780C3

EP2SGX60DF780C3 - Stratix II GX 60K LE FPGA, 780-BGA | Intel

The Intel (formerly Altera) EP2SGX60DF780C3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 3,022 Logic Array Blocks (LABs), and 364 user I/Os in a 780-pin FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process node, operates from a 1.2 V core supply, and supports internal frequencies up to approximately 717 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, DSP blocks, and memory. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device -> CPLD/FPGA -> high-density FPGA -> transceiver-equipped FPGA. The Stratix II GX family specifically integrates multi-gigabit transceivers, making it part of the high-speed transceiver-equipped FPGA category used in communications, video, and signal-processing systems. Key features of the EP2SGX60DF780C3 include up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, distributed and M512K/M4K TriMatrix memory, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The "DF780" suffix denotes the 780-ball FC-FBGA FineLine BGA package; the "C3" speed grade is the fastest commercial grade offered in the Stratix II GX family, with -4 (medium) and -5 (slow) grades also available. The commercial operating range is 0 °C to +85 °C (TJ). Architecturally, Stratix II GX uses an ALM (Adaptive Logic Module) based core rather than the legacy 4-LUT architecture, providing improved logic utilization. The transceiver hard IP supports CPRI/OBSAI, Serial RapidIO, PCI Express (Gen1), and Gigabit Ethernet, offloading high-speed serialization from soft logic. MultiTrack interconnect routing and the Quartus II design suite complete the design ecosystem. Typical applications include high-speed serial backplane interfaces, telecom line cards, wireless baseband signal processing, video broadcast and editing systems, and ASIC prototyping. The 6.375 Gbps transceiver capability makes it especially suitable for chip-to-chip and backplane links. Design consideration: at 780-ball FC-FBGA with 1 mm pitch, PCB stack-up and via-in-pad design with proper thermal vias under the exposed die region are essential. The transceiver reference clock jitter budget must be analyzed using the Stratix II GX Transceiver User Guide. This page synthesizes distributor inventory, parametric context, and practical design guidance not consolidated on any single manufacturer or distributor page.

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EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel
EP2SGX60DF780C3N

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

The Intel (formerly Altera) EP2SGX60DF780C3N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 3,022 LABs, and 364 user I/Os in a 780-pin FC-FBGA package. Fabricated on a 90 nm process with a 1.2 V core supply, it pairs a rich programmable fabric with embedded transceivers suited for high-speed serial I/O. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. Stratix II GX sits within the FPGA hypernym hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes integrated multi-gigabit transceivers, making Stratix II GX devices a sub-family of the broader Stratix II family that targets wired communications, broadcast video, and high-performance computing backplanes. Key features include 60,440 logic elements, 2,544,192 bits of embedded memory, 364 user I/Os, 717 MHz internal operating frequency, and up to 816.9 MHz performance. The part supports 4 PLLs, dedicated high-speed serial transceiver channels, and JTAG-based in-system programming. The DF780 package is a 23 x 23 mm FC-FBGA with 1 mm pitch, designed for high-density PCB layouts where signal integrity and thermal performance are critical. From an architectural standpoint, the Stratix II GX fabric uses Adaptive Logic Modules (ALMs) rather than the older 4-LUT structure, delivering improved logic utilization and timing closure. The 90 nm process node strikes a balance between performance and power, while the integrated transceivers support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet without external PHY devices. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, GBE), software-defined radio front-ends, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density and embedded transceivers makes it a strong fit for telecom line cards and data-acquisition systems. When designing with this part, ensure the PCB provides a continuous ground plane under the BGA and matched-length routing for the high-speed serial channels. Power decoupling must follow Intel's Stratix II GX PowerPlay recommendations, with bulk capacitance scaled to transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel
EP2SGX60DF780C4

EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel

The Intel (formerly Altera) EP2SGX60DF780C4 is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O, and high-speed transceivers in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 90 nm CMOS process, the device supports an internal operating frequency up to 717 MHz and operates from a 1.2 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the user via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are used to implement arbitrary combinational and sequential logic, soft processors, DSP pipelines, and high-speed serial interfaces. The Stratix II GX family in particular targets high-throughput serial I/O, embedding multi-gigabit transceivers alongside the programmable fabric. Key features of the EP2SGX60DF780C4 include 60,440 logic elements, 2,544,192 bits of embedded memory, up to 717 MHz fabric performance, dedicated DSP blocks, and high-speed serial transceiver channels supporting multi-gigabit-per-second rates. The 780-FBGA package with 1 mm ball pitch and exposed-die construction enables dense board placement while providing adequate thermal performance. The 'C4' speed grade balances timing margin against dynamic power for cost-sensitive designs. From an architectural standpoint, the Stratix II GX uses an ALM-based fabric (Adaptive Logic Modules) with each ALM capable of implementing up to 8 inputs of combinational logic, providing higher effective density than the previous 4-input LUT architecture. The 90 nm process supports embedded memory blocks of M512, M4K, and M-RAM types, and the transceiver blocks support standard serial protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Typical applications include telecom line cards, high-speed serial interface bridging (PCIe, SRIO, XAUI), DSP co-processing for wireless baseband, test and measurement equipment, and broadcast video processing. The integration of transceivers with the programmable fabric eliminates the need for external PHY ICs, reducing BOM cost and board area. When designing with this part, engineers must allocate sufficient decoupling and follow Altera/Intel PCB layout guidelines for the FBGA package, including via-in-pad or microvia stack-ups to escape the 1 mm pitch ball grid, and provide thermal relief through the exposed die pad and adequate copper area on inner/outer PCB layers. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not consolidated on any single distributor product page.

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EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N

EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel

The Intel (formerly Altera) EP2SGX60DF780C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements, 364 user I/Os, and high-speed transceiver capability, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 1.2 V 90 nm CMOS process, this device is optimized for high-bandwidth serial connectivity, DSP-intensive signal processing, and embedded-processor-based designs that require deterministic real-time response. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, multipliers, and PLLs. FPGAs occupy the same role in the digital-hierarchy taxonomy as ASICs but allow post-fabrication logic changes. Stratix II GX sits at the top tier of the programmable-logic hierarchy, between mainstream FPGAs and structured ASICs, with embedded multi-gigabit transceivers that previously required external PHY chips. Key features of the EP2SGX60DF780C4N include 60,440 logic elements organized into 3,022 Logic Array Blocks (LABs), 2,544,192 bits of on-chip RAM, dedicated DSP blocks for high-throughput filtering and FFT, and up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps. The device also exposes 12 full-duplex source-synchronous channels, supports PCI Express x1/x4/x8 hard IP, and integrates four PLL blocks plus 16 global clock networks for robust clock distribution across the fabric. From a technical-depth perspective, the Stratix II GX architecture replaces the 4-input LUT of earlier Stratix with an adaptive logic module (ALM) that combines two 4-LUTs and a dedicated adder, improving effective logic density by roughly 25 percent versus prior generations. Combined with the 90 nm strained-silicon process and 1.2 V core, the part delivers high Fmax on DSP-heavy designs while still meeting industrial-grade thermal envelopes. The transceiver block supports a wide range of protocols including PCI Express Gen1, Serial RapidIO, CEI-6G, and 10 GbE XAUI through protocol-specific soft IPs. Typical applications include 10G/40G telecom line cards, ASIC prototyping platforms, high-end broadcast video processing, defense signal-intelligence backplanes, and medical imaging reconstruction. The high pin count and 364 I/O support wide external memory buses (DDR2/QDRII+) and multiple standard connectors simultaneously. Designers should budget 20 percent of logic for clock-domain crossing, apply Quartus II pin-planner constraints early, and ensure the board supplies a 1.2 V VCCH/LVDS-clean supply for the transceiver PHY. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, and Quartus II design notes that are not aggregated in the standalone datasheet PDF.

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EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
EP2SGX60DF780C5

EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

The Intel (formerly Altera) EP2SGX60DF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 3,022 logic array blocks (LABs), and embedded transceivers in a 780-pin flip-chip BGA package. Built on a 90 nm process with a 1.2 V core supply, the device is specified for a commercial operating temperature range and a -5 speed grade, balancing logic capacity with high-speed serial capability for communications and signal-processing backplanes. An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, and high-speed transceivers) on a single die, allowing designers to implement custom digital hardware that can be reconfigured after manufacturing. The Stratix II GX family sits within Intel's high-performance FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor IC, and is widely used in protocols where hard SERDES, large on-chip memory, and high logic density are required concurrently. Key features include 364 user I/O pins, embedded 3.125 Gbps-class transceivers, embedded multiplier blocks for DSP, TriMatrix block RAM, and a structured ASIC-like clock network. According to distributor listings, the device supports an internal frequency near 717 MHz and uses a 23 x 23 mm FC-FBGA substrate with 1 mm ball pitch, providing robust signal and power integrity for high-channel-count designs. Architecturally, the Stratix II GX family introduced an adaptive logic module (ALM) that combines fracturable look-up-tables with dedicated arithmetic and carry logic, delivering higher effective logic utilization than the previous Stratix generation. The -C5 speed grade places it in the mid-band of Stratix II GX timing, well suited for production deployments rather than the fastest prototyping tier. Typical applications include telecom line cards, multi-gigabit serial backplanes, video broadcast equipment, military radar preprocessing, and high-performance ASIC prototyping. Designers also use the part in test and measurement chassis where flexible I/O plus high logic density shorten time-to-market. When designing with this device, plan power sequencing for the 1.2 V core, the auxiliary and PLL supplies, and the transceiver analog rails, and verify termination, length-matching, and stack-up against the package's 1 mm BGA pitch. Because the part is in the Stratix II GX EOL category at Altera/Intel, long-life customers should confirm last-time-buy status before committing to new designs.

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