EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel
料号： EP2SGX60CF780C ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $365 | $3,650.00 |
| 100 | $340 | $34,000.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2SGX60CF780C 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, routing, and I/O cells can be reconfigured after manufacture, allowing hardware engineers to implement custom digital circuits without fabricating an ASIC. The Stratix II GX sits in the broader hierarchy: programmable logic -> FPGA -> high-speed transceiver FPGA -> wireline/protocol-bridge class. It targets applications where deterministic latency and high SERDES bandwidth are required and where ASIC NRE cost is not justified.
Key features of the EP2SGX60CF780C variant include 364 user I/O pins supporting numerous single-ended and differential I/O standards, 60440 logic elements in the standard -C (commercial) speed grade, an FCBGA package optimized for high pin-count high-speed routing, and a hard PCI Express and SERDES block. Compared with the Cyclone series, the Stratix II GX offers roughly 4x the logic density, embedded transceivers, and richer DSP block resources.
The Stratix II GX architecture uses an 8-input ALM with a built-in register, a hierarchical memory subsystem (TriMatrix), and dedicated SERDES hard IP for protocols such as PCI Express, XAUI, SATA, and Serial RapidIO. The embedded transceivers reduce board area and simplify PCB layout versus FPGA-plus-discrete-SERDES solutions.
Typical applications include high-speed serial backplanes, telecommunications line cards, data-center protocol bridges (e.g., XAUI to SGMII), broadcast video routers, and high-performance computing interconnects. The 780-ball FCBGA supports the high-density differential SERDES routing required by these designs.
When designing with this device, follow Altera application notes AN-558 and AN-525 for multi-gigabit transceiver PCB layout - keep SERDES traces length-matched within 150 mils, maintain a continuous reference plane, and use 100-ohm differential impedance. Power sequencing on the Stratix II GX family is critical; consult the device handbook for VCCINT/VCCPD ramp order.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all values cross-checked against the Intel/Altera Stratix II GX Device Handbook.
直接替换替代料： EP2SGX60CF780C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX60CF780C （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Internal Frequency (max), Operating Temperature, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP2SGX60CF780C5N
✅ 直接替换✓ 有现货
$485 / 个
查看数据手册 →EP2SGX60CF780C4N
✅ 直接替换✓ 有现货
$220 / 个
查看数据手册 →EP2S60F780C4N
✅ 直接替换📋 参考替代料（不在目录中）
EP2SGX90F780C5N
✅ 直接替换📋 参考替代料（不在目录中）
EP2S90F780C5N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP2SGX60CF780C 最大额定值与电气特性
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Total Memory Bits | 2,544,192 |
| Number of LABs/CLBs | 3022 |
| Number of User I/O | 364 |
| 封装 | 780-BBGA, FCBGA |
| Speed Grade | C (commercial) |
| 安装类型 | Surface Mount |
| Embedded Transceivers | Multi-gigabit SERDES blocks (per family) |
| 工作温度 | Commercial (0C to +85C) per -C suffix |
| I/O Standards | Numerous single-ended and differential |
| Series Prefix | EP2SGX |
EP2SGX60CF780C 780-bbga, fcbga 引脚配置指南
EP2SGX60CF780C（780-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX60CF780C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX60CF780C 适用于 6 应用s: High-Speed Serial Backplane, Telecommunications Line Card, Data Center Protocol Bridge, Broadcast Video Router, High-Performance Computing Interconnect, Industrial Control and Test Equipment.
High-Speed Serial Backplane
The EP2SGX60CF780C is well suited for multi-gigabit serial backplane designs that aggregate several line-card SERDES channels. Its embedded multi-gigabit transceivers operate from 600 Mbps to 6.375 Gbps and the 780-FCBGA package preserves signal-integrity headroom for 4-level pre-emphasis and receive equalization needed on FR-4 backplanes. The 60,440 logic elements comfortably fit a 4-channel XAUI or 8-lane Serial RapidIO aggregation block plus traffic management fabric. Use this part when the design has settled on 60K LE and the 780-ball footprint is already laid out. For higher port counts, step up to the EP2SGX90 in the same 780-FBGA package.
推荐
Telecommunications Line Card
In telecom line-card designs, the EP2SGX60CF780C functions as the central aggregation FPGA between framer/serializer devices and the network processor. The 364 user I/O is sufficient for parallel connections to external PHYs, while the embedded transceivers support OC-192 / STM-64 (9.953 Gbps is family-capable) and 10 Gigabit Ethernet XAUI (4x3.125 Gbps). The FCBGA package also helps manage thermal density under continuous traffic load. The part's NRND status makes it a strong fit for sustaining legacy deployed line cards but new designs should target Stratix IV/V.
推荐
Data Center Protocol Bridge
The EP2SGX60CF780C is a natural fit for protocol-bridge cards in data centers - e.g., converting between 10G KR, XAUI, SGMII, and PCIe. Its hard SERDES channels support XAUI/PCIe Gen1 with low latency, and the TriMatrix memory (2.5 Mbit) handles packet buffering for cut-through forwarding. The 780-FCBGA's dense SERDES escape routing minimizes PCB layer count versus a discrete SERDES solution. Choose this part for cost-sensitive bridge cards where 60K LE is sufficient; for full 40G/100G bridging, migrate to Stratix V or Stratix 10.
推荐
Broadcast Video Router
Broadcast video routers benefit from the EP2SGX60CF780C's combination of SERDES bandwidth and parallel DSP logic for SDI de-embedding and re-embedding. The 60K LE supports 8-12 ports of HD-SDI (1.485 Gbps) or 4 ports of 3G-SDI (2.97 Gbps) with on-chip crosspoint switching, while the 2.5 Mbit embedded memory handles line-buffer storage for clean switching. The 780-FCBGA's thermal performance is adequate for fan-cooled router chassis. Designers of new routers should consider Cyclone 10 GX or Stratix 10 for new builds.
推荐
High-Performance Computing Interconnect
For HPC interconnect cards, the EP2SGX60CF780C provides low-latency SERDES for cluster fabrics such as Serial RapidIO or proprietary LVDS-based topologies. The 364 user I/O drives HPC baseboard connections, while the embedded memory handles packet queuing and credit management. The 780-FCBGA package supports the controlled-impedance SERDES routing required at multi-gigabit speeds. This is a drop-in fit for HPC designs built on Stratix II GX reference designs; new programs should evaluate Stratix 10 or Agilex.
推荐
Industrial Control and Test Equipment
Industrial test and measurement equipment uses the EP2SGX60CF780C for parallel logic acquisition plus SERDES-based communication back to a host controller. The 60K LE supports DSP blocks for FIR/FFT processing, while the multi-gigabit transceivers drive high-speed ADC/DAC data links. The commercial 0-85C temperature grade suits factory-floor and lab environments; for outdoor or extended-temperature applications, an -I (industrial) speed grade variant is required. The 780-FCBGA footprint is well supported by standard JTAG and AS programming tools.
推荐
推荐产品汇总
工程参考数据： EP2SGX60CF780C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX60CF780C5N | EP2SGX60CF780C4N | EP2S60F780C4N | EP2SGX90F780C5N | EP2S90F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | ~60K (Stratix II) | 90,720 (+50%) | 90,720 (Stratix II) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | ~2.5 Mbit | ~4.5 Mbit | ~4.5 Mbit |
| User I/O | 364 | 364 | 364 | Similar 780-ball class | Similar 780-ball class | Similar 780-ball class |
| Embedded Transceivers | Yes (Stratix II GX SERDES) | Yes (Stratix II GX) | Yes (Stratix II GX) | No (Stratix II non-GX) | Yes (Stratix II GX) | No (Stratix II non-GX) |
| Speed Grade | C (commercial base) | -5 (faster) | -4 | -4 | -5 | -5 |
| Lifecycle Status | NRND | NRND | NRND | EOL | NRND | EOL |
关键差异点
- Faster speed grade option in identical footprint （对比 EP2SGX60CF780C5N)
- Higher logic density drop-in upgrade available （对比 EP2SGX90F780C5N)
- Non-GX variant available for cost reduction when SERDES unused （对比 EP2S60F780C4N)
设计说明
For multi-gigabit SERDES channels on the EP2SGX60CF780C, keep TX and RX differential traces length-matched within 150 mils, maintain a continuous ground reference plane directly under the traces, and target 100-ohm differential impedance. Per Altera application note AN-558, avoid routing SERDES over plane splits or stitching vias; the FCBGA escape region should use laser-drilled microvias for fan-out. Series AC-coupling capacitors must be placed within 600 mils of the FPGA RX pins to meet compliance eye masks.
Power sequencing on the EP2SGX60CF780C must follow the Stratix II GX Device Handbook's VCCINT/VCCPD ramp order to avoid latch-up. Estimated: VCCINT (core) must reach 90% of nominal before VCCPD (I/O pre-driver) and VCCIO (I/O driver) ramp. Use a multi-rail power supervisor with monotonic tracking. Decoupling requires 0.1uF and 0.01uF MLCCs placed within 100 mils of every VCCINT/VCCPD pin pair on the FCBGA, plus bulk capacitors on each power plane.
Estimated: the EP2SGX60CF780C at full utilization (60K LE @ 80% toggle, all SERDES active) dissipates approximately 6-9 W. The 780-FCBGA package has a typical theta_JA of 8-12 C/W with a properly designed 4-layer PCB thermal pad array. Provide at least 1 square inch of continuous inner-plane copper under the die, plus 25-30 thermal vias (0.3 mm drill, 0.5 mm pitch) stitched through the FCBGA's thermal balls. Without thermal management, junction temperature can exceed 100C in still air, triggering thermal throttling.
The 780-FCBGA ball escape region is the most critical signal-integrity challenge on the EP2SGX60CF780C. Use a 4-6 layer stack-up with the top layer dedicated to fan-out from the BGA, then a continuous ground plane on layer 2 to provide a return path for the breakout traces. Per Altera AN-525, length-match within 25 mils all DDR/Source-Synchronous interface groups (e.g., external memory bus) and within 50 mils for general-purpose LVDS pairs. Use IBIS models from the Intel/Altera website for SI simulation.
Three pitfalls to avoid on the EP2SGX60CF780C: (1) Do not assume NRND parts have unlimited inventory - validate with a confirmed distributor quote before committing to production. (2) Do not substitute the bare -C suffix part for the -C5N if your timing closure depends on -5 speed grade timing; Quartus timing models differ between speed grades. (3) Do not route SERDES through the FCBGA's center balls - reserve the center for ground/power only and route SERDES through the outer ball rings for the shortest controlled-impedance path.
合规信息
Compliance data not present in the verified web data for the bare -C suffix; the N-suffix variants (-C5N, -C4N) are typically Pb-free per JEDEC J-STD-020 and RoHS-compliant, but explicit statements must be verified against the lot-specific manufacturer documentation