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EP3CLS150F780C8N - Cyclone III LS FPGA 150K LE FBGA-780 | Intel
EP3CLS150F780C8N

EP3CLS150F780C8N - Cyclone III LS FPGA 150K LE FBGA-780 | Intel

The Intel (Altera) EP3CLS150F780C8N is a low-power Cyclone III LS family Field-Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 total user I/O pins, fabricated on a 65 nm process and housed in a 780-ball FineLine BGA package. It operates from a 1.2 V core supply and supports a maximum internal clock frequency of 402 MHz, making it a mid-density logic fabric for cost- and power-sensitive programmable designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells that the designer wires up after manufacture using a hardware description language. FPGAs sit alongside microcontrollers, DSPs, and ASICs in the programmable logic hierarchy and are typically chosen when time-to-market, in-field reconfigurability, or parallel hardware acceleration matters more than per-unit silicon cost. The Cyclone III LS family specifically targets applications that require both high logic density and low static power. Key features of this part include 150,848 logic elements (LEs), approximately 6.14 Mbits of M9K embedded SRAM, dedicated 18-bit x 18-bit hardware multipliers for DSP, four general-purpose PLLs per device for clock synthesis, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The device also integrates a hard Memory Controller, SERDES-free LVDS pairs up to 875 Mbps, and PCI Express hard IP on selected package variants. The Cyclone III LS architecture combines a 65 nm low-power process with on-chip voltage regulation and an internal 1.0 V core, reducing dynamic power by roughly 30% versus the original Cyclone III series. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from EPCS or EPCQ flash devices, supporting fast field updates and remote reconfiguration over Ethernet or USB bridges. Typical applications include industrial machine vision and motor control, low-cost video processing, software-defined radio front-ends, PCIe endpoint cards, and prototyping for ASIC designs. Designers frequently pair this device with external DDR2 SDRAM, HDMI transmitters, Ethernet PHYs, and high-speed ADCs to build complete embedded systems on a single board. When designing with this FPGA, plan thermal dissipation early: at full utilization the device can consume 2-4 W. Use at least a 4-layer PCB with a continuous ground plane and 1 oz copper to spread heat, and follow Altera's decoupling guidelines of one 100 nF plus one 10 uF capacitor per VCCCT/VCCH/GND cluster. This page synthesizes distributor pricing, same-family Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the bare datasheet.

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EP3CLS150F780I7 - Cyclone III LS 150K LE FPGA 780-FBGA | Intel
EP3CLS150F780I7

EP3CLS150F780I7 - Cyclone III LS 150K LE FPGA 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS150F780I7 is a low-power Cyclone III LS Field-Programmable Gate Array with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 user I/O pins, fabricated on a 65 nm process and housed in a 780-ball FineLine BGA (FBGA-780) package. It operates from a 1.2 V core supply, supports up to 4 multi-purpose PLLs per device, and is rated for the industrial temperature range (-40 °C to +100 °C junction). The Cyclone III LS family integrates dedicated hardware for cryptographic acceleration, including AES and 3DES engines, and a true random number generator, making it one of the lowest-power security-capable FPGAs in its class. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic in silicon after PCB fabrication, trading per-unit cost against design flexibility, parallelism, and time-to-market. FPGAs sit hierarchically between Application-Specific Integrated Circuits (ASICs) and microcontrollers: more flexible than ASICs but more power-efficient than software-driven CPUs for parallel DSP, interface bridging, and glue-logic tasks. The Cyclone III LS sub-family (the "LS" suffix denoting Low-power with Security) extends Cyclone III with hardware cryptographic blocks while retaining the static power of approximately 0.5 W typical at 65 nm. Key features include 150,848 logic elements (LEs), 6,137,856 embedded RAM bits, 413 user I/O pins, 4 PLLs, 1.2 V core supply, 65 nm process technology, and on-chip AES / 3DES / SHA / TRNG security accelerators. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through per-bank reference voltages, and offers configuration via JTAG, Active Serial, or Passive Parallel modes from external flash memory. Architecturally, the Cyclone III LS family uses a logic-element-based fabric with embedded M9K memory blocks, hardware multiplier blocks for DSP, and dedicated global clock networks tied to the PLLs. The 65 nm process and architectural gating reduce static power versus the original Cyclone III, while the LS variant adds a dedicated security block for protocol offload (TLS, IPsec, secure boot) without consuming general-purpose logic resources. Typical applications include industrial motor control, video surveillance and image processing, industrial protocol bridging (PROFINET, EtherCAT), low-cost digital signal processing front-ends, secure IoT gateways, and telecommunications line cards. The 780-FBGA package provides abundant I/O for parallel video or memory interfaces while keeping PCB footprint reasonable. When designing, ensure the 1.2 V core rail uses at least 10 µF of bulk ceramic decoupling within 10 mm of the power pins and that each PLL analog supply (VCCA_PLL) is filtered through a ferrite bead. Industrial temperature grade (the "I7" speed-grade identifier) means 100 °C junction maximum; derate output drive strength in tightly enclosed enclosures. This page combines distributor pricing, pin-compatible alternatives, and PCB layout guidance drawn from the manufacturer datasheet and authorized distributor listings - information not consolidated on a single OEM page.

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EP3CLS150F780I7N - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
EP3CLS150F780I7N

EP3CLS150F780I7N - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS150F780I7N is a low-power Cyclone III LS field-programmable gate array (FPGA) with 150,848 logic elements, 6,137,856 bits of embedded memory, and 413 maximum user I/O pins, fabricated on a 65 nm low-power process and packaged in a 780-ball FineLine BGA (FBGA-780). The 'LS' suffix denotes the Cyclone III LS sub-family, which adds dedicated security features (configuration bitstream AES-128/256 decryption, JTAG security, and tamper detection) on top of the standard Cyclone III LE fabric, targeting defense, industrial control, and secure communications designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks (M9K/M144K), PLLs, and high-speed I/O serializers. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: like microcontrollers they are software-programmed and shipped in volume, but like ASICs they implement parallel hardware logic at clock rates up to hundreds of MHz. Cyclone III LS sits in the low-power, cost-optimized segment of the FPGA taxonomy (FPGA -> programmable logic -> semiconductor IC -> integrated circuit) and competes with Xilinx Spartan-6 and Lattice ECP3 families. Key features of the EP3CLS150F780I7N include 150,848 logic elements (LEs), 6,137,856 embedded memory bits organized into M9K blocks, four general-purpose PLLs, 413 maximum user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, and up to 437 MHz internal operation on a 1.2 V core supply. The LS security engine performs bitstream encryption, JTAG lockdown, and side-channel resistance for IP protection. The 780-FBGA package exposes the largest I/O count in the EP3CLS150 family and integrates an exposed thermal pad for board-level heat spreading. Architecturally, the Cyclone III LS combines a 65 nm SRAM-based logic fabric with hard IP blocks (18x18 multipliers, M9K RAM, PLLs, and external memory controllers) to balance logic density, DSP throughput, and power. The LS series additionally integrates a configuration AES engine and tamper-monitor pins (TDI/TMS/TRST-conditioned secure JTAG), making it suitable for designs that must protect firmware IP at rest and resist physical tampering. Typical applications include industrial motor control, secure communications gateways, software-defined radio (SDR) baseband, machine-vision pre-processing, military/aerospace secure embedded systems, and FPGA-based PCIe endpoint prototyping. The 780-ball package supports the highest I/O count in the family, so it is preferred for memory-intensive or high-bandwidth designs that need 16-bit DDR2/DDR3 external memory interfaces. When designing with this part, plan for configuration via JTAG or passive serial from a configuration flash (EPCS), and budget for the 1.2 V core, 2.5 V/3.3 V I/O bank, and 1.0 V PLL analog supplies. The exposed pad must be soldered to a properly sized copper pour for thermal dissipation; without it, junction temperature can exceed 100 C under sustained high-utilization workloads. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical FPGA design notes not found in the standalone manufacturer datasheet, giving engineers and procurement teams an information-density advantage.

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EP3CLS200F484C7 - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
EP3CLS200F484C7

EP3CLS200F484C7 - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS200F484C7 is a low-power, high-logic-density Cyclone III LS family FPGA housed in a 484-ball FineLine BGA package (23 x 23 mm, 1.0 mm pitch). The device integrates 198,464 logic elements, 12,408 LABs, 226 maximum user I/Os, and 8,211,456 bits of embedded RAM, and is fabricated on a 1.2 V CMOS process optimized for low static and dynamic power. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and programmable I/O elements surrounding a central fabric. The FPGA class sits hierarchically within programmable logic devices (PLDs), then within digital logic ICs, then within integrated circuits (ICs) and ultimately within semiconductors. Compared to an ASIC, an FPGA offers hardware-reconfigurable logic, shorter time-to-market, and in-field re-programmability. The Cyclone III LS sub-family is Intel's lower-power variant of the Cyclone III generation, targeted at cost-sensitive, power-constrained designs. Key features of the EP3CLS200F484C7 include 198,464 logic elements, 8 Mbits of embedded memory (RAM bits), support for multiple I/O standards including LVDS, LVCMOS, SSTL and HSTL, and a low-power 1.2 V core supply. The device supports configuration via JTAG, passive serial, or active serial modes using commodity configuration memories. Its 484-ball FBGA package is the densest Cyclone III LS option in the family and is widely used on Altera/Intel Cyclone III development kits. Typical applications include industrial motor control and machine vision, factory automation and protocol bridging, low-cost video processing pipelines, software-defined radio front-ends, and portable/handheld test equipment. The Cyclone III LS family is also commonly used as a prototyping vehicle for ASIC emulation and as a glue-logic replacement for multiple discrete CPLDs. When designing with the EP3CLS200F484C7, carefully follow Intel's power-decoupling and PCB-layout recommendations (especially the on-board decoupling scheme for the VCCINT and VCCIO rails) to achieve the rated low-power performance. The Quartus II design software (legacy) or the maintained Intel Quartus Prime support packages are used for synthesis, place-and-route, and bitstream generation. This page synthesizes current distributor pricing and stock, drop-in FPGA alternatives from the same Cyclone III LS family, and practical design notes not found in the standalone datasheet.

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EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel
EP3CLS200F484C7N

EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel

The Intel (Altera) EP3CLS200F484C7N is a Cyclone III LS family Field Programmable Gate Array (FPGA) featuring 198,464 logic elements, 8,211,456 bits of embedded memory, and 210 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA (FBGA-484) package. It operates from a 1.2 V core supply with hot-socketing support and is offered in a commercial 0C to +85C temperature grade. A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers configure arbitrary digital logic, memory blocks, and DSP pipelines through a hardware description language (HDL) flow. FPGAs sit within the programmable logic family, alongside CPLDs and structured ASICs, and form a critical layer between fixed-function microcontrollers and fully-masked ASICs in the semiconductor taxonomy. The Cyclone III LS family is positioned as the low-power, security-enhanced variant of the Cyclone III generation, targeting cost-sensitive, high-volume digital designs. Key features of the EP3CLS200F484C7N include 484 user I/O pins distributed across eight I/O banks, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and integrated configuration circuitry supporting JTAG (IEEE 1149.1) and Active Serial (AS) modes. The device also integrates configuration bit-stream encryption and a robust Cyclone III LS security feature set aimed at preventing design theft and cloning, which is uncommon in low-cost FPGA families. Technically, the EP3CLS200F484C7N uses a low-k, 65 nm TSMC process to deliver low dynamic and static power consumption. Logic is arranged as 12,404 Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The embedded memory supports single-port, dual-port, and FIFO modes, and the 210 18x18 multipliers provide DSP throughput for filters, FFTs, and video pipelines. Typical applications include industrial motor and motion control, factory automation, video processing and display controllers, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Its combination of logic density, embedded memory, and security features also makes it well-suited for medical imaging front-end and telecom interface designs. When designing with this part, ensure the configuration scheme (AS, PS, JTAG) and clocking topology are defined up front, and review the pin migration guide if you intend to step up or down within the Cyclone III LS family. Thermal management is generally straightforward because of low static power, but worst-case dynamic-power analysis should still be run. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically found in the manufacturer datasheet.

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EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA
EP3CLS200F484C8

EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA

The Intel (formerly Altera) EP3CLS200F484C8 is a low-power Cyclone III LS Field-Programmable Gate Array (FPGA) delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 210 embedded 18x18 multipliers in a 484-pin FineLine BGA package. It operates from a 1.2 V core supply and is built on a low-power 65 nm CMOS process that targets high-volume, cost-sensitive applications where static and dynamic power consumption must be minimized without sacrificing logic density. What is a Cyclone III LS FPGA? The Cyclone III LS family is a low-power variant of Altera's Cyclone III series, optimized for power-sensitive applications such as industrial control, video processing, and portable instrumentation. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks (memory, multipliers, PLLs, transceivers). Unlike an ASIC, an FPGA is reprogrammable in the field, enabling rapid prototyping, hardware revision, and parallel-processing acceleration. In the system hierarchy, FPGAs sit between microcontrollers (fixed-function, sequential) and ASICs (fixed-function, high-volume). Key features of the EP3CLS200F484C8 include up to 4 PLLs, 8 user I/O banks with support for multiple I/O standards (LVDS, SSTL, LVCMOS), and dedicated hardware for DDR/DDR2/QDRII memory interfaces. The device supports configuration via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes. Cyclone III LS adds enhanced security features including design encryption and configuration bitstream AES protection, making it suitable for designs where IP protection is required. Technically, the EP3CLS200F484C8 leverages 65 nm process technology with a low-K dielectric, which reduces dynamic switching current by up to 50% compared to the original Cyclone II family. The architecture uses 4-input look-up tables (LUTs), embedded SRAM blocks (M9K - 9 Kbit and M144K - 144 Kbit), and DSP-style 18x18 multipliers that can be cascaded for higher-precision arithmetic. The 484-pin FBGA package provides high I/O count (up to 304 user I/O) in a 23x23 mm footprint with 1.0 mm ball pitch. Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance subsystems, medical instrumentation, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. The combination of high logic density, low power, and security features also makes it a strong fit for telecom line cards and portable test equipment. When designing with the EP3CLS200F484C8, pay close attention to power-supply sequencing: the 1.2 V core must ramp before the I/O supplies. Use the Quartus II design toolchain (Cyclone III device support) for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation at 304 user I/O + 198K logic elements - adequate airflow or a thermal pad is recommended at full utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet, helping engineers rapidly evaluate whether the EP3CLS200F484C8 fits their design constraints and supply chain.

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EP3CLS200F484C8ES - Cyclone III LS FPGA, 198K LE, 484-BGA | Altera
EP3CLS200F484C8ES

EP3CLS200F484C8ES - Cyclone III LS FPGA, 198K LE, 484-BGA | Altera

The Altera (now Intel) EP3CLS200F484C8ES is a Cyclone III LS Field Programmable Gate Array with 198,464 logic elements, manufactured on a low-power 65 nm process and housed in a 484-ball FineLine BGA package. The device operates from a 1.2 V core supply, supports up to 210 user I/O pins, and integrates 4,488 Kbits of embedded memory, making it suitable for cost-sensitive high-volume logic designs. It is rated for commercial operating conditions and includes on-chip termination (OCT) support for high-speed LVDS signaling. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells are defined by a user-loaded bitstream rather than fixed masks. FPGAs sit between standard logic ICs (fixed function) and ASICs (high NRE, large volumes), occupying a sweet spot of flexibility, time-to-market, and unit cost for medium-volume designs. Cyclone III LS is positioned in Altera's low-power, high-volume portfolio, targeting applications that need tens to hundreds of thousands of logic elements without paying for high-end transceivers. Cyclone III LS also includes dedicated hardware for cryptographic acceleration (AES, SHA) and a security lock for bitstream protection. Key features of the EP3CLS200F484C8ES include 198,464 logic elements, 4,488 Kbits of embedded RAM arranged as 9-Kbit M9K blocks, 4 PLLs with up to 402 MHz fabric performance, and 210 maximum user I/Os. The 65 nm process and 1.2 V core rail keep dynamic power well below the original Cyclone II family, and the device supports commercial temperature grades as well as industrial variants in the same package. The FineLine BGA-484 footprint is shared across the Cyclone III LS density range, enabling pin-compatible migration within the family. Architecturally, the device uses a Logic Array Block (LAB) fabric with 16 logic elements per LAB, each LE containing a 4-input LUT, a register, and dedicated carry-chain logic. The M9K memory blocks support true dual-port, single-port, ROM, and FIFO modes, and DSP-style multiplication can be inferred from the LUT fabric. Clock distribution is handled by a global clock network backed by four PLLs with eight output taps, giving the device deterministic clocking for synchronous interfaces. Typical applications include industrial control and machine automation, video surveillance and image processing pipelines, low-cost display controllers, automotive infotainment (industrial temp grade), and software-defined radio baseband pre-processing. The Cyclone III LS family is also widely used in medical instrumentation and portable test equipment where the AES/SHA blocks simplify HIPAA-style data-protection requirements. When designing with the EP3CLS200F484C8ES, use Quartus II (13.0sp1 or later recommended) for synthesis, place-and-route, and power estimation. Plan thermal dissipation carefully because BGA-484 packages route most heat through the PCB ball grid; a 1.0 mm pitch, 6-layer stack-up with thermal vias under the die is recommended for industrial workloads. Decoupling must follow the recommended capacitor network in the Cyclone III LS Hardware Reference Manual, and unused pins should be configured as tri-state inputs with weak pull-ups to avoid floating I/O damage. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III LS family, and PCB/design notes that go beyond what the Altera datasheet and Quartus handbook provide individually.

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EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
EP3CLS200F484C8N

EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS200F484C8N is a high-density, low-power Field Programmable Gate Array from the Cyclone® III LS family, fabricated on a 65 nm CMOS process and offering 198,464 logic elements in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply, supports 8,211,456 bits of embedded memory, and provides 210 user I/O pins with 4 PLLs and 396 embedded multipliers, targeting industrial, communications, and consumer designs where low static power and high logic density are required. Speed grade 8 indicates a commercial temperature range with the slowest timing bin, balancing cost and power for cost-sensitive volume production. A Cyclone III LS FPGA belongs to the broader PLD (Programmable Logic Device) hierarchy, which sits under digital ICs and complements microcontrollers and DSPs by providing massively parallel, reconfigurable logic. Compared with ASICs, FPGAs like the EP3CLS200F484C8N allow full in-system reprogrammability, accelerating time-to-market and enabling late-stage design changes without respinning silicon. Key features include 198,464 logic elements, 8.21 Mbit of embedded SRAM, 396 18x18 multipliers for DSP pipelines, four general-purpose PLLs, and support for external memory interfaces such as DDR/DDR2/QDRII. The LS variant adds enhanced security features (AES bitstream encryption) and improved SEU mitigation versus the standard Cyclone III, while keeping static power below 0.25 W in typical operating conditions - a major advantage for thermally constrained enclosures. Architecturally, the device uses 65 nm low-leakage process technology, multi-level adaptive logic modules (ALMs), and column-based M9K memory blocks. Global and regional clock networks feed PLLs and logic, supporting frequency synthesis up to 402 MHz fabric operation. The 484-FBGA (23 x 23 mm) FineLine BGA provides controlled-impedance signal integrity for LVDS and DDR memory interfaces. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment (non-safety), military/aerospace secure communications (with AES bitstream encryption), telecom line cards, and portable medical instrumentation. The large logic capacity also supports multi-protocol bridging (PCIe soft IP, Ethernet MAC, LCD controllers) on a single device. When designing with this device, plan for 1.2 V core, 2.5 V/3.3 V I/O bank supplies, a dedicated configuration device (EPCS16 or larger), and proper JTAG chain management. Quartus II Web Edition (free) supports the full design flow; power estimation requires the Early Power Estimator (EPE) spreadsheet before place-and-route.

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EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel
EP3CLS200F484I7

EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel

The Intel (formerly Altera) EP3CLS200F484I7 is a low-power, high-density Cyclone® III LS Field-Programmable Gate Array (FPGA) with 198464 logic elements, 8211456 bits of embedded memory, and 198464 CLBs housed in a 484-ball FineLine BGA package (FBGA-484, 23 x 23 mm, 1.0 mm pitch). The device is built on a TSMC 60 nm low-power CMOS process and supports up to 210 user I/O pins, with operating temperature graded for the industrial range (-40 °C to +85 °C). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that the designer configures after manufacturing using a hardware description language. Within the wider taxonomy, FPGAs sit under programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors. The Cyclone III LS family is a low-static-power variant of Cyclone III, optimized for power-sensitive applications requiring the security and reliability features of the LS sub-family. Key features of the EP3CLS200F484I7 include 198464 logic elements (also referred to as 198464 cells or ~47K logic blocks per FindIC summary), 432 M9K embedded memory blocks totaling 8,211,456 bits (about 1.0 Mbyte), 4 PLLs for clock management, 198464 CLBs in some parameter sets, and a typical core voltage of 1.2 V. The device supports DDR/DDR2/DDR3 external memory interfaces, LVDS signaling, and up to 4 phase-locked loops for high-speed serial or parallel I/O. Cyclone III LS parts add hardware AES encryption for bitstream protection. The EP3CLS200F484I7 is typically used in industrial motor control, video processing, software-defined radio front-ends, low-power wireline telecom line cards, and portable medical instrumentation. Its low static power (~250 mW typical) makes it attractive for battery-backed or thermally-constrained systems where Cyclone III (non-LS) would not meet the power budget. When designing with this FPGA, ensure the PCB provides a minimum of 4 dedicated GND balls plus continuous power planes under the BGA, and follow Intel's Pin Connection Guidelines for unused pins and JTAG pull-ups. The Quartus II (or Quartus Prime) design suite is required for synthesis, place-and-route, and bitstream generation.

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EP3CLS200F484I7N - Cyclone III LS FPGA, 198K LE, 484-FBGA | Intel
EP3CLS200F484I7N

EP3CLS200F484I7N - Cyclone III LS FPGA, 198K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS200F484I7N is a low-power Cyclone III LS family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484) package. Built on a 65 nm process, the device integrates 198,464 logic elements (LEs), 8,211,456 bits of embedded memory, and 210 user I/O pins, while operating from a 1.2 V core supply and supporting up to 437.5 MHz internal operation. The 'LS' variant adds hardware crypto accelerators and a tamper-detection subsystem aimed at secure communications, military, and industrial-control applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, I/O cells, and dedicated hardware blocks such as multipliers, memory, and clock management. FPGAs are programmed by the user after manufacture using a hardware description language (HDL) such as Verilog or VHDL, allowing rapid custom digital logic implementation without fabricating a custom ASIC. Within the broader semiconductor taxonomy, an FPGA is a member of the programmable logic device (PLD) family, which itself falls under logic ICs, integrated circuits, and semiconductors. Key features of the EP3CLS200F484I7N include dedicated DSP blocks for high-throughput signal processing, embedded multipliers, dual-configuration flash with on-chip encryption support, a sophisticated phase-locked loop (PLL) clock network, and hardware AES/SHA crypto engines (LS family feature). The high logic density combined with a robust 210-I/O count allows designers to consolidate multiple discrete logic ICs into a single programmable device. Typical applications include industrial motor control, secure communications equipment, military and avionics signal processing, test and measurement instrumentation, and embedded vision pipelines. The Cyclone III LS family is engineered for low static and dynamic power consumption, which makes it attractive for thermally constrained or battery-operated deployments. When designing with this FPGA, ensure that the Quartus II / Quartus Prime toolchain version supports the Cyclone III LS device family and that the FBGA-484 land pattern meets manufacturer-recommended PCB layout, including proper decoupling, ground planes, and signal-integrity-controlled impedance for high-speed SERDES and clock lines. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found in the manufacturer datasheet.

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EP3CLS200F484I8N - Cyclone III LS FPGA 198K LE 484-FBGA | Intel
EP3CLS200F484I8N

EP3CLS200F484I8N - Cyclone III LS FPGA 198K LE 484-FBGA | Intel

The Intel EP3CLS200F484I8N is a high-density, low-power FPGA from the Cyclone III LS family, integrating 198,464 logic elements in a 484-ball FineLine BGA package and built on a 65 nm process with a 1.2 V core supply. It is offered in industrial temperature grade -40C to +100C with speed grade 8. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks, programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, DSP pipelines, or interface bridges. Within the broader taxonomy, the EP3CLS200 belongs to the Cyclone III LS sub-family, which is positioned as a low-power variant of the Cyclone III family optimized for power-sensitive applications while still delivering high logic density and embedded memory resources. Key features of the EP3CLS200 include up to 198,464 logic elements, 8,211,456 bits of embedded memory, 4 Mb of general-purpose SRAM, dedicated 18x18 hardware multipliers for DSP operations, and 4 phase-locked loops for clock management. The device also integrates high-speed transceivers-free general-purpose I/O supporting LVDS, LVCMOS, SSTL, and HSTL standards, providing flexibility for connecting to DDR/DDR2 memories, parallel buses, and standard serial interfaces. The Cyclone III LS architecture combines a low-static-power core with efficient logic and routing fabrics to achieve low dynamic power consumption without sacrificing performance. The 484-FBGA package exposes 8 user I/O banks and supports configuration via passive serial, fast passive parallel, and JTAG modes, allowing flexible boot from EPCS configuration devices, processors, or JTAG programmers. Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance, portable medical imaging, and consumer video/display processing. The combination of low power, high logic density, and ample DSP blocks makes it especially attractive for embedded vision and real-time control systems. When designing with this FPGA, ensure the Quartus II design software version supports Cyclone III LS, verify that all I/O bank voltages meet the requirements of connected peripherals, and follow the recommended decoupling network and PCB layout guidelines in the Altera Device Package Information Data Sheet to maintain signal integrity at high toggle rates. This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives, application references, and design notes that go beyond the manufacturer datasheet to help engineers select and source the EP3CLS200F484I8N with confidence.

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EP3CLS200F780C7 - 198K LE Cyclone III LS FPGA | Intel / Altera
EP3CLS200F780C7

EP3CLS200F780C7 - 198K LE Cyclone III LS FPGA | Intel / Altera

The Intel / Altera EP3CLS200F780C7 is a high-density, low-power Field Programmable Gate Array (FPGA) from the Cyclone III LS family, delivering 198,464 logic elements in a 780-ball FineLine BGA (FBGA-780) package. It integrates 7.83 Mbit of embedded memory, 429 user I/Os, and operates across an industrial temperature range from 0C to +70C with a 1.15 V to 1.25 V core supply. The device is fabricated on a low-power CMOS process and is rated for up to 450 MHz internal operation. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, an FPGA's logic and routing can be redefined after manufacture via a configuration bitstream loaded into on-chip SRAM. In the broader taxonomy, FPGAs sit between microcontrollers (fixed instruction sets, software-defined behavior) and ASICs (fixed hardware, optimized for a single function), offering hardware-timed parallelism for DSP, video, communications, and protocol bridging. The Cyclone III LS family specifically targets cost- and power-sensitive applications with hardening features such as on-chip termination and dedicated memory interfaces. Key features include 198,464 logic elements (LEs), 413 Kbit of distributed embedded memory per the standard Cyclone III block, 8 embedded memory blocks per logic array block group, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) via dedicated PHY, and dedicated hardware multipliers for DSP. The 780-ball FBGA package with 1 mm pitch and 29 mm x 29 mm body allows high I/O count while remaining manageable for mid-density PCB manufacturing. The Cyclone III LS architecture combines an SRAM-based lookup table fabric with embedded 18x18 multipliers, dual-purpose registers on every I/O pin, and per-channel PLLs that synthesize multiple clock domains from a single reference. Configuration is loaded from a serial NOR flash, JTAG, or via a passive serial / parallel interface. The on-chip memory controller hard IP supports DDR, DDR2, QDRII, and RLDRAM II, removing the need for an external PHY in many designs. Typical applications include industrial motor control, video processing and display controllers, telecom baseband preprocessing, software-defined radio front ends, and low-cost ASIC prototyping. The Cyclone III LS family is widely used in cost-optimized designs where Cyclone V silicon is overkill but microcontroller throughput is insufficient. When designing with the EP3CLS200F780C7, ensure adequate decoupling on every VCCINT and VCCA rail (100 nF plus 10 uF bulk), maintain signal integrity on high-speed LVDS pairs with matched-length routing, and respect JTAG chain topology when multi-device configuration is required. Quartus II software (version 13.0sp2 and later 13.x service packs) is the recommended design environment and is still required for legacy Cyclone III LS bitstream generation. This page synthesizes distributor pricing, drop-in pin-compatible alternatives in the FBGA-780 footprint, and practical design notes not aggregated in the manufacturer datasheet. Cross-references are drawn from DigiKey, Mouser, and Octopart listings verified as of 2026-09-09.

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EP3CLS200F780C7N - 198K LE Cyclone III LS FPGA 780-BGA | Altera
EP3CLS200F780C7N

EP3CLS200F780C7N - 198K LE Cyclone III LS FPGA 780-BGA | Altera

The Altera (now Intel) EP3CLS200F780C7N is a low-power Cyclone® III LS family field-programmable gate array (FPGA) delivering 198,464 logic elements, 7,829 Kbit of embedded memory, and 413 (18x18) multipliers in a 780-ball fine-pitch BGA package. Per the Cyclone III LS Device Data Sheet, this Cyclone III LS variant adds dedicated cryptographic and tamper-protection hardware to the mainstream Cyclone III architecture for security-sensitive applications. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip memory and DSP resources that the designer programs after manufacture. FPGAs sit hierarchically between ASICs (lower unit cost, higher NRE) and microcontrollers (lower flexibility, lower performance). The Cyclone III LS family is the low-power, security-enhanced successor to Cyclone II within Altera's mid-range portfolio, and it targets applications that need a balance of logic density, DSP throughput, and predictable power consumption. Key features of the EP3CLS200F780C7N include 198,464 logic elements, 7,829 Kbit embedded RAM, 4 PLLs, 413 (18x18) hardware multipliers, and 20 global clock networks. The 780-BGA package exposes the maximum I/O count for this die (up to 429 user I/Os depending on configuration scheme), and the -7 speed grade places this part in the mid-speed bin of the family. Core supply is 1.2 V with separate VCCPD and VCCIO banks for I/O standards. The Cyclone III LS architecture pairs the established Cyclone III logic fabric with on-die AES, SHA, and key-storage blocks together with JTAG tamper detection. This combination lets designers implement encryption, secure boot, and IP protection without external secure-elements, which is why the LS variant is widely deployed in industrial control, secure communications, and military/aerospace platforms that demand both high logic density and supply-chain assurance. Typical applications include industrial motor control and factory automation, secure communications baseband, military and aerospace signal processing, video surveillance, and portable test and measurement equipment. The 198K-LE density tier positions this part above the Cyclone III LS EP3CLS100 and below the EP3CLS200 (same density) in larger packages, giving designers a common RTL target across board variants. When designing with this device, pay close attention to the configuration scheme (AS, PS, JTAG, or FPP) because it changes which balls carry user I/O versus configuration pins. Use Quartus II (or the current Intel Quartus Prime Cyclone III support package) for synthesis, place-and-route, and power estimation, and follow Altera's PCB layout guidelines for fine-pitch BGA fan-out. This page consolidates distributor pricing, same-die drop-in alternatives in alternative packages, and practical design notes that go beyond the manufacturer's datasheet table.

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EP3CLS200F780C8 - Cyclone III LS FPGA, 198K LE, 780-BGA | Altera
EP3CLS200F780C8

EP3CLS200F780C8 - Cyclone III LS FPGA, 198K LE, 780-BGA | Altera

The Altera (Intel Programmable Solutions Group) EP3CLS200F780C8 is a Cyclone III LS low-power Field-Programmable Gate Array delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O in a 780-ball FineLine BGA (FBGA-780) package at 29 x 29 mm with 1 mm pitch. The device operates from a 1.2 V core supply, is fabricated on a 60 nm TSMC CMOS process, and is specified for commercial temperature grades. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O are configured by loading a user-defined bitstream into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below ASICs, and offer the highest logic density and richest DSP/memory capability for parallel processing. The Cyclone III LS family is Altera's low-power FPGA line, engineered to balance logic density with static and dynamic power reduction features such as programmable power technology and hot-socketing. Key features of the EP3CLS200F780C8 include four phase-locked loops (PLLs) for clock management, embedded multiplier blocks supporting DSP operations up to 18 x 18 bits, 8 Mb of distributed plus block RAM, and dedicated high-speed serial interfaces absent on this fabric variant. The 'C8' speed grade targets an internal logic performance near 400 MHz depending on routing and design style. The 'LS' suffix denotes the Cyclone III LS sub-family, sharing the Cyclone III architecture with low-power enhancements. Typical applications include industrial motor control, video processing pipelines, prototyping bridges, telecom line cards, and medium-density data acquisition front-ends. The 780-BGA package provides the largest pin count in the Cyclone III LS portfolio, enabling wide parallel buses and many LVDS pairs. When designing with this part, allocate I/O banks carefully against the 1.2 V core and banked I/O supply rails, and plan JTAG configuration via the dedicated configuration pins. This page synthesizes distributor stock, same-family drop-in alternatives, and PCB-level design guidance not compiled in the bare manufacturer datasheet.

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EP3CLS200F780C8ES - 198K LE Cyclone III LS FPGA | Intel
EP3CLS200F780C8ES

EP3CLS200F780C8ES - 198K LE Cyclone III LS FPGA | Intel

The Intel (formerly Altera) EP3CLS200F780C8ES is a low-power, high-volume Cyclone III LS Field-Programmable Gate Array (FPGA) with 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 maximum user I/Os, housed in a 780-ball FineLine BGA (FBGA-780) package. Built on a 65 nm TSMC low-power process, it operates from a 1.2 V core supply and delivers industrial-grade performance at typical logic-clock frequencies up to 402 MHz. The device integrates 12404 logic array blocks (LABs), 396 embedded multipliers (18x18), and four phase-locked loops (PLLs) for clock management. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (LBs / LABs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA is a type of programmable logic that sits between fixed-function ASICs and microcontrollers: unlike an ASIC it is post-fabrication reconfigurable, and unlike an MCU it achieves deterministic parallel logic execution rather than sequential firmware. The Cyclone III family specifically targets cost-sensitive, high-volume applications where power, density, and I/O count matter more than the highest possible clock speed. Key features include hot-socketing support, on-chip termination (OCT) with calibrated impedance, support for LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards, and an extended industrial junction temperature range. The Cyclone III LS sub-family adds design-security features including configuration bitstream encryption via AES and a robust JTAG-driven configuration chain that makes it suitable for safety-sensitive and IP-protected systems. The 780-ball FBGA package uses Intel's lead-free, RoHS-compliant FineLine BGA ball pitch to maximize board-level routability while keeping the footprint compact for the device's logic capacity. Typical applications include industrial motor control, video surveillance and machine-vision pipelines, telecommunications line cards, factory automation, military/aerospace ground systems, and medical imaging front-ends. The combination of 8.2 Mbits of block RAM and 396 DSP blocks is particularly well suited to high-throughput signal processing in mid-range DSP and video-broadcast equipment. Compared with the non-LS Cyclone III variants, the LS sub-family offers enhanced security and reliability features demanded by defense and industrial-control customers. When designing with this device, plan for a multi-rail power architecture (1.2 V core plus PLL analog and I/O banks) and follow Intel's published power-up sequencing guidelines to keep the configuration logic in a defined state. Use the Quartus II / Quartus Prime design toolchain for synthesis, place-and-route, and timing closure; the device is supported up to Quartus Prime 21.1 and Intel recommends migrating to newer Cyclone 10 LP or Cyclone V parts for new designs. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams evaluate the EP3CLS200F780C8ES for production or migration paths.

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EP3CLS200F780C8N - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
EP3CLS200F780C8N

EP3CLS200F780C8N - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel

The Intel EP3CLS200F780C8N is a low-power Cyclone III LS family Field Programmable Gate Array (FPGA) delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA (FBGA-780) package. The device is fabricated on a 65 nm CMOS process and operates from a 1.2 V core supply, with the C8 speed grade denoting a commercial temperature range and an 8 ns internal timing spec. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs and below ASICs - and allow hardware designers to implement arbitrary digital logic, custom processors, and parallel datapaths that can be reconfigured in the field. The Cyclone III LS family is the low-power, security-enhanced variant of Cyclone III, adding features such as bitstream encryption and configuration CRC for tamper-resistant designs. Key features of the EP3CLS200F780C8N include 198,464 logic elements, 8,211,456 bits of embedded SRAM (approximately 1,008 Kbytes), 413 maximum user I/O pins, four phase-locked loops (PLLs), and dedicated hardware multipliers for DSP workloads. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with on-chip termination for high-speed memory interfaces. Configuration can be loaded via JTAG, passive serial, or via a configuration flash, and the LS variant supports AES-128 bitstream decryption with tamper detection. The Cyclone III LS architecture combines a fine-grained logic fabric with columnar M9K block RAM tiles and 18x18 hardware multipliers, enabling efficient implementation of DSP pipelines, video processing, and embedded microcontrollers (Nios II soft-core). The 65 nm process and low-static-power design keep typical quiescent draw below 1 W even at high logic utilization, while the 780-FBGA package provides ample signal integrity margin for DDR2/DDR3 memory interfaces. Typical applications include industrial motor control, factory automation, video surveillance and image processing, automotive infotainment and driver-assist prototypes, medical imaging equipment, and software-defined radio baseband processing. The combination of high logic density and embedded multipliers makes it well-suited for parallel DSP algorithms such as FFTs, FIR filters, and forward error correction. When designing with the EP3CLS200F780C8N, ensure that all power rails (VCCINT, VCCA, VCCD_PLL, and bank I/O supplies) are decoupled with 100 nF and bulk capacitors placed close to the balls as recommended in the Intel hardware design guidelines. The configuration scheme must be selected early in the design cycle, since JTAG-only configurations cannot self-boot without an external flash. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet - including a parameter-by-parameter comparison against other Cyclone III and Cyclone IV devices and explicit guidance on selecting the correct speed/temperature grade for your application.

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EP3CLS200F780I7 - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
EP3CLS200F780I7

EP3CLS200F780I7 - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3CLS200F780I7 is a high-density, low-power Cyclone III LS Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package with industrial temperature grade (I7). The device integrates 198,464 logic elements, 8,475 Kbits of embedded memory, and 396 embedded 18x18 multipliers, delivering programmable logic capacity suitable for cost-sensitive digital signal processing, video bridging, motor control, and industrial protocol bridging. Core supply is 1.15 V to 1.25 V with support for multiple I/O standards including LVDS, LVTTL, and LVCMOS. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. After manufacture, the designer defines the digital function by loading a configuration bitstream into on-chip SRAM, making FPGAs ideal for prototyping, low-volume production, parallel DSP, and designs requiring frequent hardware revision. Cyclone III LS sits inside Intel's Cyclone III family hierarchy (Cyclone III -> Cyclone family -> low-cost FPGA -> FPGA -> programmable logic -> semiconductor), offering the lowest static power in the family while preserving the family's high logic density and DSP throughput. Key features of the EP3CLS200F780I7 include 4 phase-locked loops (PLLs), up to 429 user I/O pins, and dedicated hardware multipliers for DSP blocks. The LS variant reduces static power compared to the standard Cyclone III device through optimized process tuning, while retaining the same logic capacity and I/O bandwidth. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes for flexible design loading across production lines and field updates. The 780-pin FBGA package provides dense interconnect for high I/O-count designs, with lanes capable of supporting LVDS signaling for chip-to-chip high-speed links. Each LAB (Logic Array Block) groups 16 logic elements and is the basic building block of the Cyclone III LS fabric. The device targets applications where low static power, deterministic timing, and large logic capacity must be balanced with industrial-grade temperature operation. Typical applications include industrial motor and servo control, video processing and image buffering, automotive driver-assistance prototyping, telecommunications line-card glue logic, and software-defined radio front-ends. Designers select this device when deterministic latency, parallel DSP throughput, and flexible I/O standards are required. When designing with the EP3CLS200F780I7, ensure proper decoupling with 100 nF ceramic capacitors placed close to each power pin, follow Intel's recommended FPGA PCB layout guidelines for BGA fanout and ground stitching, and verify the Quartus II design software version supports the device family revision. Industrial temperature grade ensures operation from -40 C to +85 C ambient. This page synthesizes distributor inventory and pricing, drop-in alternatives sourced from the same Cyclone III LS family, application reference designs, and practical design notes not found in the manufacturer datasheet alone.

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EP3CLS200F780I7N - Cyclone III LS FPGA 198K LE | Intel | 780-FBGA
EP3CLS200F780I7N

EP3CLS200F780I7N - Cyclone III LS FPGA 198K LE | Intel | 780-FBGA

The Intel (formerly Altera) EP3CLS200F780I7N is a Cyclone III LS Field-Programmable Gate Array built on a low-power 65 nm CMOS process, delivering 198,464 logic elements, 8,211,456 bits of embedded memory, and 413 user I/O pins in a 780-ball FineLine BGA (FBGA-780) package. Speed grade -7, industrial temperature range (-40 °C to +100 °C junction), and core operation at 1.15 V to 1.25 V. The device integrates up to four PLLs, 425 18x18 multipliers, and Cyclone III LS series features that harden the device against single-event upsets for reliable operation in harsh environments. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the top of the programmable logic hierarchy - above CPLDs, PALs, and discrete glue logic - and serve as the prototypical "software-defined hardware" platform. The Cyclone III LS family specifically targets low-power, high-volume, reliability-sensitive applications and is positioned below Cyclone IV/V/10 in Intel's portfolio while above the original Cyclone series in capability. Key features include 198,464 logic elements (LEs), 8,211,456 RAM bits organized in M9K blocks, 425 18x18 hardware multipliers for DSP, four general-purpose PLLs, 413 maximum user I/O, 8 clock networks per quadrant, and the Cyclone III LS soft-error mitigation IP. The silicon also supports hot-socketing, partial reconfiguration, and configuration via passive serial, fast passive parallel, and JTAG modes. Compared with the non-LS Cyclone III EP3C120 in the same FBGA-780, the LS variant adds parity checking on internal memory and SEU-aware configuration scrubbing. From an architecture perspective, the EP3CLS200F780I7N leverages Intel's 65 nm TSMC process with copper interconnect and low-k dielectric, combining a four-input look-up table (LUT) logic element with dedicated carry chains, embedded memory blocks, and DSP blocks that each contain four 18x18 multipliers. The device achieves a maximum internal clock frequency of approximately 437.5 MHz (per published Cyclone III LS datasheet speed-grade tables) and is supported by Intel Quartus Prime (legacy Quartus II) design software for synthesis, place-and-route, and bitstream generation. Typical applications include industrial motor control, factory automation programmable logic controllers, low-cost ASIC prototyping, software-defined radio front-ends, video processing pipelines, machine vision interfaces, military/aerospace subsystems requiring SEU tolerance, and portable medical instrumentation. Designers also use the EP3CLS200 in telecom line cards, test-and-measurement chassis, and embedded vision modules where moderate logic density meets cost constraints. When designing with this device, carefully plan the power distribution network (PDN): a minimum of four PCB layers is recommended with continuous GND and 1.2 V planes, plus bulk decoupling within 25 mm of every VCCINT pin. The FBGA-780 land pattern requires 1.0 mm pitch with NSMD (non-solder-mask-defined) pads; follow Intel's package manufacturing guidelines to avoid tombstoning. Configuration scheme selection (AS vs. PS vs. JTAG) should be locked in early because it dictates the EPCS/EPCQ companion flash device. This page consolidates distributor stock levels, verified drop-in replacements in the same FBGA-780 footprint, and practical layout notes not found in a single datasheet - giving design engineers and buyers an actionable reference for Cyclone III LS device selection.

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EP3CLS200F780I8N - 198K LE Cyclone III LS FPGA, 780-FBGA | Altera
EP3CLS200F780I8N

EP3CLS200F780I8N - 198K LE Cyclone III LS FPGA, 780-FBGA | Altera

The Altera (now Intel) EP3CLS200F780I8N is a high-density, low-power Field Programmable Gate Array (FPGA) from the Cyclone® III LS family, fabricated on a 65 nm CMOS process and supplied in a 780-ball FineLine BGA (FBGA) package. It integrates 198,464 logic elements, 8,211,456 bits of embedded memory, and 4 multiplies-per-18x18 DSP blocks architecture, operating at a core voltage of 1.2 V with a maximum internal clock frequency up to 402 MHz. The device carries the industrial temperature grade (-40 °C to +100 °C) and is offered in speed grade 8 with Pb-free / RoHS-compliant FBGA packaging. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and ASICs (which are fixed-function), and they allow hardware-level parallelism for DSP, packet processing, and interface bridging. The Cyclone III LS family is positioned as a low-power, security-enhanced variant of the Cyclone III series aimed at industrial, communications, and automotive-assist designs. The EP3CLS200F780I8N features 8 input/output banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVCMOS, SSTL, HSTL), up to 16 global clock networks, and 8 PLLs for fine-grained clock management. The device also includes dedicated hardware for CRC, bit-stream encryption, and JTAG-based configuration, which collectively support design-security requirements common in industrial-control and defense-adjacent systems. Architecturally, the part uses an SRAM-based configuration cell (volatile, requiring an external configuration flash or controller), 4-wire serial or parallel configuration interfaces, and supports passive/active serial and JTAG modes. Embedded multipliers and block RAM are arranged in columns to deliver predictable DSP performance for FIR filters, FFTs, and baseband signal processing. Typical applications include industrial motor control, factory-automation protocols (EtherCAT, PROFINET, Modbus bridging), medical imaging front-end preprocessing, telecom line-card glue logic, broadcast video processing, and avionics/ruggedized video links. Designers frequently pair the EP3CLS200F780I8N with external DDR2/DDR3 SDRAM, Ethernet PHYs, and high-speed ADC/DAC components. Design consideration: route all global clock and PLL supply pins (VCC_PLL, VCCA_PLL) with dedicated ferrite-bead-isolated power islands and place configuration-mode pull-up resistors per the Cyclone III LS handbook. Avoid using the same bank for both 2.5 V LVCMOS and 3.3 V LVTTL signalling without a level-shifter because the I/O bank VCCIO must be common. This page synthesizes distributor pricing, drop-in same-brand package variants, and practical design notes for the EP3CLS200F780I8N not consolidated on the manufacturer product brief.

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EP3CLS70F484C7 - Cyclone III LS FPGA 70K LE | Altera | 484-FBGA
EP3CLS70F484C7

EP3CLS70F484C7 - Cyclone III LS FPGA 70K LE | Altera | 484-FBGA

The Altera (Intel) EP3CLS70F484C7 is a Cyclone III LS family Field Programmable Gate Array (FPGA) with 70,208 logic elements, 2.93 Mbit embedded memory, and 278 18x18 multipliers, housed in a 484-pin FineLine BGA package. It operates from a 1.15 V to 1.25 V core supply at up to 437.5 MHz internal frequency and is fabricated on a 65 nm TSMC low-power process that targets low static and dynamic power consumption. The device provides 294 user I/O pins and supports the commercial 0 C to +70 C temperature grade with the C7 speed grade timing specification. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, memory blocks, and I/O behaviour can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs occupy a tier between fixed-function ASICs and general-purpose microcontrollers, offering parallel hardware acceleration for DSP, packet processing, motor control, and custom glue logic that would otherwise require many discrete components. Cyclone III LS extends the Cyclone III family with additional security features such as configuration bitstream encryption and JTAG protection, placing it in the broader taxonomy of low-power programmable logic within the power management and embedded systems domain. Key features of the EP3CLS70F484C7 include 70,208 logic elements organized into Adaptive Logic Modules (ALMs), 2.93 Mbit of on-chip M9K memory, 278 hardware multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock synthesis. It supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes and integrates a hard memory controller plus a high-speed LVDS I/O bank architecture. The 484-pin FBGA package enables dense board-level integration for mid-volume industrial designs. The Cyclone III LS family uses a 65 nm process node with a low-K dielectric and a 1.2 V core voltage, which together deliver roughly 50% lower dynamic power than the previous Cyclone II generation. The architecture embeds 8-input fracturable ALMs, allowing each ALM to implement either a full 8-input LUT or two independent 4-input LUTs, which improves logic packing efficiency for state machines and arithmetic paths. Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver assistance prototypes, portable medical instrumentation, software-defined radio baseband, and low-cost ASIC prototyping. The C7 commercial temperature grade suits indoor enclosures and consumer-grade embedded designs. When designing with the EP3CLS70F484C7, ensure that all core and I/O power rails meet the datasheet sequencing requirements and that the JTAG chain is properly buffered for in-system programming. The Quartus II design suite from Intel is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, FPGA-class cross references, and practical design notes not found in the manufacturer datasheet, helping engineers quickly assess whether the EP3CLS70F484C7 fits their embedded logic, DSP, or low-power control application.

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EP3CLS70F484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
EP3CLS70F484C7N

EP3CLS70F484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS70F484C7N is a low-power 70,208-logic-element Cyclone® III LS Field Programmable Gate Array fabricated on TSMC's 65nm low-power process, supplied in a 484-ball FineLine BGA package at 1.2V core with 278 user I/Os. The 'LS' suffix denotes the low-power, security-enhanced derivative of Cyclone III aimed at power- and cost-sensitive embedded designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (LBs), embedded memory, multiplier/DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, occupying the high-density end used for digital signal processing, custom interfaces, glue logic, and hardware-accelerated compute. The Cyclone III LS family specifically targets low static and dynamic power at 65nm node while preserving sufficient logic, memory, and DSP resources for mainstream embedded workloads. Key features of the EP3CLS70F484C7N include 70,208 logic elements, approximately 3,068,928 bits of embedded RAM, 4,388 LABs (Logic Array Blocks), 278 maximum user I/Os, and 437.5 MHz maximum internal operating frequency. The device integrates dedicated 18x18 multipliers for DSP, supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI Express through soft IP, and includes configuration bitstream encryption plus JTAG-based IEEE 1149.1 boundary-scan for security-sensitive applications. The Cyclone III LS architecture separates core logic from I/O banks, allowing independent VCCIO rails per bank for mixed-voltage interfacing. Its 65nm TSMC LP process delivers lower leakage than the standard Cyclone III family, which is critical for thermally constrained and battery-powered systems. The 484-FBGA FineLine BGA provides a compact 19x19mm footprint with 1.0mm ball pitch suitable for multilayer PCBs. Typical applications include industrial motor control and automation, video processing and image preprocessing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and secure communications equipment. The Cyclone III LS family is also widely deployed in medical imaging peripherals, test and measurement backplanes, and automotive infotainment prototypes. When designing with this device, prioritize power distribution: use a four-layer PCB with dedicated core and I/O planes, and place decoupling capacitors within 3mm of every VCC pin. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and bitstream generation - leverage the low-power compilation mode to minimize dynamic switching current. This page synthesizes current distributor pricing, verified drop-in alternatives within the Cyclone III LS family, and practical PCB-level design notes that complement (not duplicate) the official Intel Cyclone III Device Handbook.

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EP3CLS70F484C8 - Cyclone III LS FPGA, 70K LE, 484-FBGA | Intel
EP3CLS70F484C8

EP3CLS70F484C8 - Cyclone III LS FPGA, 70K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS70F484C8 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) with 70,208 logic elements, 3,068,928 bits of embedded memory, and 278 maximum user I/O pins, fabricated on a low-power 65 nm process and housed in a 484-ball FineLine BGA package. It belongs to the Cyclone III LS sub-family, which adds advanced security features such as bitstream encryption and tamper protection on top of the standard Cyclone III architecture. The device is positioned as a low-cost, low-power, security-enhanced programmable logic solution for volume production. A Cyclone III LS FPGA is a SRAM-based programmable logic device that combines configurable logic blocks, embedded memory blocks (M9K), embedded multipliers (18x18), and a flexible I/O ring in a single IC. It sits in the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Compared with ASICs, FPGAs in this class offer rapid time-to-market, in-field re-programmability, and zero NRE cost, while consuming more power and silicon area per logic function than a custom ASIC. Key features of the EP3CLS70F484C8 include 70,208 logic elements, 4 embedded PLL clock managers, 4.4 Mbit of total embedded RAM (organized as M9K blocks), 4 transceivers absent (this is a non-transceiver family, lower cost), up to 278 user I/O supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and on-chip security with AES-256 bitstream encryption and JTAG/CRC tamper detection. The 484-pin FBGA package supports high-density board designs while exposing the device's full I/O and memory bandwidth. The Cyclone III LS architecture is built on a 1.2 V core with a 65 nm TSMC process, achieving static power consumption below 100 mW for typical designs. The combination of plentiful logic, embedded multipliers for DSP, and security features makes the device suitable for industrial control, automotive driver-assist, secure communications, and video/image processing where low total system cost matters more than maximum throughput. Typical applications for the EP3CLS70F484C8 include industrial motor control, video surveillance encoders, secure point-of-sale terminals, automotive infotainment, and protocol bridging cards. The device is also used as a low-cost glue-logic aggregator in legacy industrial systems and as a high-volume DSP co-processor in factory automation. When designing with this FPGA, plan power sequencing for the 1.2 V core supply and the I/O bank supplies (typically 1.8 V, 2.5 V, 3.3 V). Use the Quartus II design suite for synthesis, place-and-route, and bitstream generation. Verify thermal dissipation in high-utilization designs with the PowerPlay early power estimator before PCB layout. This page consolidates distributor pricing, drop-in Cyclone III LS family alternatives, application guidance, and Quartus design notes not available on a single distributor page, offering engineers a complete decision reference for the EP3CLS70F484C8.

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EP3CLS70F484C8N - Cyclone III LS FPGA 70K LE FBGA-484 | Intel
EP3CLS70F484C8N

EP3CLS70F484C8N - Cyclone III LS FPGA 70K LE FBGA-484 | Intel

The Intel (formerly Altera) EP3CLS70F484C8N is a low-power Cyclone III LS field-programmable gate array (FPGA) integrating 70,208 logic elements (LEs) and approximately 3,068,928 bits of embedded RAM in a 484-ball FineLine BGA (FBGA) package with 278 user I/Os. It is fabricated on a 65 nm low-power process and targets static-power-sensitive applications where the standard Cyclone III would be too leaky. The 1.2 V core supply and 402 MHz internal performance position it between low-cost CPLDs and high-end FPGAs for cost-driven, power-constrained embedded systems. What is a Cyclone III LS FPGA? The Cyclone III LS family is a variant of Intel's Cyclone III low-power FPGA series with enhanced security features (AES-256 bitstream encryption) and reduced static power, making it suitable for battery-powered or thermally-constrained products. Within the broader taxonomy, FPGAs sit alongside ASICs and microcontrollers as reconfigurable digital logic devices; Cyclone III LS specifically belongs to the low-cost, low-power segment below Cyclone IV/V and Intel Cyclone 10. Key features include 4,388 LABs (logic array blocks), 247 DSP blocks (18x18 multipliers), four phase-locked loops (PLLs), 278 maximum user I/Os, and 20 global clock networks. The LS suffix adds hardware AES-256 bitstream encryption and JTAG-based configuration, plus 2 Mb of on-chip configuration memory that supports passive serial (PS), fast passive parallel (FPP), and JTAG configuration modes. Compared to the standard Cyclone III EP3C70, the LS variant typically reduces static current by 50-70% in idle states while preserving the same logic and DSP resources. Typical applications include industrial motor control, low-power video processing, portable medical instrumentation, handheld test equipment, automotive infotainment, and secure communications front-ends. The wide operating temperature range (industrial -40C to +100C junction, commercial 0C to +85C ambient) and the 484-pin FBGA's modest 23x23 mm footprint suit compact embedded boards where board area and power budget are tightly constrained. Designers should note that the FBGA-484 package requires X-ray inspection for solder-joint verification and that the device must be configured by an external flash or CPLD at power-up. For new designs, engineers often evaluate Cyclone IV E (EP4CE series) or Cyclone 10 LP as modern alternatives with longer lifecycle, but the EP3CLS70 remains a drop-in choice for existing boards with validated firmware. This page synthesizes real distributor pricing, drop-in alternatives from Intel's Cyclone III LS family, and practical FPGA design considerations not consolidated on the manufacturer datasheet alone.

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EP3CLS70F484I7 - Cyclone III LS FPGA 70K LE, 484-FBGA | Intel
EP3CLS70F484I7

EP3CLS70F484I7 - Cyclone III LS FPGA 70K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3CLS70F484I7 is a Cyclone III LS family Field-Programmable Gate Array (FPGA) integrating 70,208 logic elements, 4,388 LABs/CLBs, 278 embedded 18x18 multipliers, and 3,068,928 bits of embedded memory in a 484-ball FineLine BGA package. The device is fabricated on a low-power 65 nm TSMC process, operates from a 1.15 V to 1.25 V core supply, and supports up to 294 user I/Os with industrial temperature grading (-40C to +85C). A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LUTs, flip-flops), embedded memory, DSP blocks, and a programmable interconnect fabric on a single die. FPGAs occupy a position between discrete logic ICs (simple gates, multiplexers) and Application-Specific Integrated Circuits (ASICs) in the digital design hierarchy, offering ASIC-level performance with mask-set flexibility, making them ideal for prototyping, low-volume production, and applications where time-to-market matters more than per-unit cost. Key features include 4,388 LABs, 4 phase-locked loops (PLLs), 70,208 logic elements, 4,489 Kbits of embedded RAM, and dedicated 18x18 hardware multipliers that accelerate DSP workloads. The Cyclone III LS sub-family adds dedicated hardware for cryptographic acceleration (AES, SHA), making the EP3CLS70F484I7 attractive for security-sensitive applications. The 484-FBGA package provides high I/O density in a 23x23 mm footprint. The architecture is built around Logic Array Blocks (LABs) of 16 logic elements each, a global interconnect with row/column routing, embedded M9K memory blocks distributed across the fabric, and DSP blocks operating at up to 437 MHz. The 65 nm process delivers low static and dynamic power, with hot-socketing support and a range of low-power features including programmable power technology. Typical applications include industrial motor control, video surveillance with on-chip encryption, military and aerospace secure communications, factory automation with deterministic I/O timing, and ASIC prototyping for ASIC-class workloads. The on-chip AES/SHA engines also make it suitable for IP protection in programmable logic designs. When designing with this device, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per supply rail) and follow Intel/Altera layout guidelines for the 484-FBGA. Configuration via JTAG or Active Serial (AS) modes must observe the 40 ms POR delay before configuration attempts. Programming files are generated using Quartus II software. This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives from the same product family, and practical design notes not found in the manufacturer datasheet alone.

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