EP3CLS200F780C8ES - 198K LE Cyclone III LS FPGA | Intel
料号： EP3CLS200F780C8ES ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $228.4 | $57,100.00 |
| 500 | $215 | $107,500.00 |
EP3CLS200F780C8ES 概述
A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (LBs / LABs), programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA is a type of programmable logic that sits between fixed-function ASICs and microcontrollers: unlike an ASIC it is post-fabrication reconfigurable, and unlike an MCU it achieves deterministic parallel logic execution rather than sequential firmware. The Cyclone III family specifically targets cost-sensitive, high-volume applications where power, density, and I/O count matter more than the highest possible clock speed.
Key features include hot-socketing support, on-chip termination (OCT) with calibrated impedance, support for LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards, and an extended industrial junction temperature range. The Cyclone III LS sub-family adds design-security features including configuration bitstream encryption via AES and a robust JTAG-driven configuration chain that makes it suitable for safety-sensitive and IP-protected systems. The 780-ball FBGA package uses Intel's lead-free, RoHS-compliant FineLine BGA ball pitch to maximize board-level routability while keeping the footprint compact for the device's logic capacity.
Typical applications include industrial motor control, video surveillance and machine-vision pipelines, telecommunications line cards, factory automation, military/aerospace ground systems, and medical imaging front-ends. The combination of 8.2 Mbits of block RAM and 396 DSP blocks is particularly well suited to high-throughput signal processing in mid-range DSP and video-broadcast equipment. Compared with the non-LS Cyclone III variants, the LS sub-family offers enhanced security and reliability features demanded by defense and industrial-control customers.
When designing with this device, plan for a multi-rail power architecture (1.2 V core plus PLL analog and I/O banks) and follow Intel's published power-up sequencing guidelines to keep the configuration logic in a defined state. Use the Quartus II / Quartus Prime design toolchain for synthesis, place-and-route, and timing closure; the device is supported up to Quartus Prime 21.1 and Intel recommends migrating to newer Cyclone 10 LP or Cyclone V parts for new designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams evaluate the EP3CLS200F780C8ES for production or migration paths.
直接替换替代料： EP3CLS200F780C8ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3CLS200F780C8ES （相同外形与封装尺寸） ——差异在于 Speed Grade, RoHS Status, Package, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3CLS200F780C8N
✅ 直接替换✓ 有现货
$943.88 / 个
查看数据手册 →EP3CLS200F780C8
✅ 直接替换✓ 有现货
$1995 / 个
查看数据手册 →EP3CLS200F780C7N
✅ 直接替换✓ 有现货
$199.5 / 个
查看数据手册 →EP3CLS200F780C7
✅ 直接替换✓ 有现货
$102.4 / 个
查看数据手册 →EP3CLS200F780I7N
✅ 直接替换✓ 有现货
$240 / 个
查看数据手册 →EP3CLS200F780I7
✅ 直接替换✓ 有现货
$142.5 / 个
查看数据手册 →EP3CLS200F780C8ES 最大额定值与电气特性
| Series | Cyclone III LS |
| Family | Cyclone III LS |
| Logic Elements (LE) | 198,464 |
| Logic Array Blocks (LABs) | 12,404 |
| Embedded Memory (bits) | 8,211,456 |
| Maximum User I/O | 413 |
| Embedded 18x18 Multipliers | 396 |
| PLLs | 4 |
| Process Technology | 65 nm CMOS (low-power) |
| Core Supply Voltage | 1.2 V |
| 工作结温 | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | 402 MHz (typical) |
| 封装 | 780-ball FBGA (FineLine BGA) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant (lead-free FBGA) |
| Configuration Encryption | AES bitstream encryption (LS feature) |
| Speed Grade | 8 |
| On-Chip Termination (OCT) | Yes (calibrated) |
| Hot Socketing | Supported |
EP3CLS200F780C8ES 780-ball fbga (fineline bga) 引脚配置指南
EP3CLS200F780C8ES（780-ball fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3CLS200F780C8ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3CLS200F780C8ES 适用于 7 应用s: Industrial Motor Control, Video Surveillance and Machine Vision, Telecommunications Line Cards, Military and Aerospace Ground Systems, Medical Imaging Front-End, Factory Automation and Robotics, Broadcast Video Processing.
Industrial Motor Control
The EP3CLS200F780C8ES fits industrial motor control because its 396 embedded 18x18 multipliers and 4 PLLs can execute field-oriented control (FOC) loops for multiple 3-phase motors in parallel, while the 8.2 Mbits of block RAM store reference frames and current-loop coefficients. Its 1.2 V low-power core reduces total board power versus older 90 nm FPGAs by roughly 30 percent, which is critical in enclosed IP54 enclosures with limited thermal headroom. Designers can implement Sigma-Delta ADC interfaces, resolver-to-digital conversion, and CANopen/EtherCAT MACs in the same fabric.
推荐
Video Surveillance and Machine Vision
In multi-channel video surveillance systems, the EP3CLS200F780C8ES handles 4-8 channels of D1 or 2-4 channels of 720p H.264 encode/decode pipelines thanks to its 8.2 Mbits of embedded memory and 396 DSP blocks. The 780-ball FBGA exposes 413 user I/Os, enough to fan out multiple MIPI-CSI, LVDS, or parallel CMOS image sensor interfaces simultaneously. The LS sub-family's AES bitstream encryption protects manufacturer IP and camera calibration tables from being read out in deployed field units.
推荐
Telecommunications Line Cards
Telecom line cards for legacy PDH/SDH aggregation and CPRI fronthaul benefit from the EP3CLS200F780C8ES's abundant block RAM (for packet buffering), high LVDS I/O count (for SERDES-less low-speed serial links), and four PLLs that generate jitter-clean clocks for upstream ASICs. The device can implement 32-64 channels of E1/T1 framing or several CPRI links up to 614 Mbps using soft SERDES in the fabric. Industrial temperature grade (-40C to +100C) supports outdoor cabinet deployments.
推荐
Military and Aerospace Ground Systems
The EP3CLS200F780C8ES's AES bitstream encryption, robust JTAG configuration chain, and enhanced SEU mitigation make it a common choice for radar signal pre-processing, electronic warfare subsystems, and avionics ground-test equipment. Designers can implement fast Fourier transforms (FFTs) of up to 64k points using the 396 DSP blocks, while the 8.2 Mbits of block RAM hold complex twiddle factors and intermediate spectra. The 780-ball FBGA is a hermetically-compatible package footprint that supports standard land-side capacitor decoupling schemes.
推荐
Medical Imaging Front-End
Ultrasound beamformers, MRI receive arrays, and CT front-end processing boards use the EP3CLS200F780C8ES to perform per-channel digital down-conversion, decimation filtering, and image reconstruction. The 396 18x18 multipliers deliver sufficient throughput for 64-128 channel ultrasound front-ends at typical 40 MHz sampling rates. The device's low static power (under 0.5 W quiescent at 1.2 V) simplifies thermal management in cart-based portable ultrasound units where battery life is critical.
推荐
Factory Automation and Robotics
Factory automation controllers and multi-axis robotic systems use the EP3CLS200F780C8ES to host EtherCAT, PROFINET, or EtherNet/IP MACs alongside motion-control logic and safety-state machines in a single device. The 8.2 Mbits of block RAM buffer high-speed process I/O and store lookup tables for non-linear control laws, while 396 DSP blocks execute multiple PID loops at microsecond rates. Hot-socketing support simplifies field-replacement of controller cards in live 24V industrial backplanes without interrupting neighboring modules.
推荐
Broadcast Video Processing
The EP3CLS200F780C8ES supports broadcast video processing functions such as SD/HD upconversion, frame-rate conversion, and color-space transcoding. The 8.2 Mbits of embedded memory is sufficient to buffer at least four full HD lines at 10 bits per component, and the 396 DSP blocks can sustain 3-tap or 5-tap polyphase scaling filters at 148.5 MHz pixel clocks. Designers use the on-chip PLLs to generate stable video clocks (27 MHz, 74.25 MHz, 148.5 MHz) directly from the device's reference oscillator.
推荐
推荐产品汇总
工程参考数据： EP3CLS200F780C8ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3CLS200F780C8N | EP3CLS200F780C8 | EP3CLS200F780C7N | EP3CLS200F780I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 | 8,211,456 | 8,211,456 | 8,211,456 |
| Speed Grade | 8 (fastest) | 8 | 8 | 7 (slower) | 7 (slower) |
| Operating Temperature | Commercial (0C to +85C, ES screening) | Industrial -40C to +100C | Commercial | Industrial | Industrial |
| AES Bitstream Encryption | Yes (LS feature) | Yes | Yes | Yes | Yes |
| Approx Unit Price (qty 1) | USD 285 | USD 260-295 | USD 270-310 | USD 220-255 | USD 235-270 |
关键差异点
- AES bitstream encryption for IP protection （对比 EP3C120F780C7 (non-LS Cyclone III))
- Same-package, lower-cost speed grade 7 option （对比 EP3CLS200F780C8N (speed grade 8 industrial))
- Eight times the embedded memory versus Cyclone III LE （对比 EP3C25F324C8N (older Cyclone III, smaller die))
设计说明
The EP3CLS200F780C8ES requires a 1.2 V core supply, a separate analog PLL VCCA (typically 2.5 V), and one or more I/O bank supplies between 1.2 V and 3.3 V. Use a multi-rail sequencer such as the Intel EN5360 or Texas Instruments LM3880 to bring rails up in the datasheet-mandated order (typically 3.3 V I/O first, then 2.5 V PLL, then 1.2 V core) so that I/O pins do not drive into an unpowered core. Decoupling: place 0.1 uF and 10 uF ceramics within 5 mm of every VCC pin pair to suppress transient currents during simultaneous switching events on the 413 user I/Os.
The 780-ball FineLine BGA requires a 4-layer minimum stack-up with a continuous ground plane directly under the package to provide low-impedance current return paths. Use 1 oz copper on outer layers for high-current VTT rails, and escape via-in-pad or micro-via arrays to route signals between balls without necking. Signal-integrity simulations should be run for DDR2/3 controller interfaces routed from the FPGA because the LVDS outputs can introduce simultaneous switching noise (SSN) that violates the receiver's setup/hold budget if the reference planes are not properly stitched.
Estimated: do not assume configuration will reload automatically after a brownout on the 1.2 V core - the Cyclone III LS family latches into an undefined state if the core drops below 0.8 V mid-configuration. Add a dedicated supervisor IC (such as TPS3808) to drive the nCONFIG pin low and force a re-load. Also, the 'ES' suffix indicates a commercial-temperature enhanced-screening variant: do NOT substitute the EP3CLS200F780I7N for an industrial-rated design and vice versa, because the silicon temperature characterization differs. Always use the latest Quartus II 13.0 sp1 or Quartus Prime 21.1 service pack to avoid known configuration-bitstream bugs.
Estimated: at full utilization (198K LE switching at 50 percent toggle rate, 396 DSP blocks at 200 MHz), the EP3CLS200F780C8ES dissipates approximately 4-5 W of dynamic power plus a 0.4 W quiescent floor. The 780-ball FBGA junction-to-ambient thermal resistance theta_JA is around 16 C/W with a properly designed 4-layer JEDEC test board, giving a ~80 C rise above ambient at 5 W. Forced airflow or a bottom-side thermal pad array is recommended if the ambient exceeds 60 C. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to validate thermal budgets before PCB fabrication.
合规信息
RoHS and lead-free per Intel product page and FineLine BGA packaging. AEC-Q100 not applicable - this is a non-automotive FPGA family. REACH compliance declared by Intel product declarations. Halogen-free status not explicitly listed in provided data - marked as unknown.