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EP3SE50F780C4 - 47.5K LE Stratix III FPGA 488 I/O 780-FBGA | Altera
EP3SE50F780C4

EP3SE50F780C4 - 47.5K LE Stratix III FPGA 488 I/O 780-FBGA | Altera

The Altera EP3SE50F780C4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 47,500 logic elements and 5,760,000 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA / 780-BBGA) package. It delivers up to 488 user I/O pins, a maximum internal operating frequency of 800 MHz, and is fabricated on a 65 nm process node. The C4 speed grade targets commercial temperature operation (0C to +85C) and supports a 1.1 V core supply. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks (memory, transceivers, DSP multipliers) that designers can reconfigure post-manufacture. Within the hierarchy of digital ICs, an FPGA sits alongside microcontrollers, DSPs, and ASICs as a high-flexibility computational platform used for prototyping, low-volume production, and applications demanding hardware parallelism such as signal processing and high-speed interfacing. The EP3SE50F780C4 implements Altera's Adaptive Logic Module (ALM) architecture and MultiTrack interconnect, enabling efficient mapping of wide logic functions. Dedicated features include TriMatrix embedded memory blocks (MRAM, M9K, M144K), embedded multipliers for DSP, and high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. The 488 I/O count and 780-ball package place it in the high-density segment for parallel data-path and bridging designs. Typical applications for the EP3SE50F780C4 include high-speed communications backplanes, military and aerospace signal processing, ASIC prototyping, and high-throughput data acquisition systems. Its combination of logic density, embedded memory, and high I/O count makes it well-suited for designs that require parallel processing, custom protocol bridging, or DSP-intensive workloads. When designing with the EP3SE50F780C4, plan for FPGA-internal power decoupling, multi-rail sequencing (typically 1.1 V core plus 2.5 V/3.3 V auxiliary), and a thermal management strategy that uses the package's exposed thermal pad. Quartus II / Quartus Prime toolchain support is mandatory for bitstream generation, place-and-route, and timing closure. This page synthesizes real-time distributor pricing, verified drop-in Stratix III family alternatives, and practical PCB and thermal design notes that are not available in the manufacturer datasheet alone.

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EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G

EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780C4G is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 5.76 Mbits of embedded memory, and 488 user I/Os, housed in a 780-ball FineLine BGA (FBGA) package. Built on a 40 nm TSMC process, it integrates 19,000 adaptive logic modules (ALMs) and 384 (18x18) multipliers, targeting high-performance digital signal processing, communications, and ASIC prototyping designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (CLBs/ALMs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs belong to the broader semiconductor category of programmable logic, sitting between general-purpose microcontrollers (fixed function) and custom ASICs (fixed silicon). Stratix III E extends the Stratix III family with enhanced DSP and external memory interface bandwidth for compute-intensive applications. Key features include a 1.1 V core supply, 8.5 Gbps transceivers on the Stratix III GT variant, hard memory controllers for DDR3 with up to 1066 Mbps data rates, and Quartus II design-software support with Qsys system-integration tooling. The 780-FBGA package exposes 488 user I/Os, supports PCI Express Gen1/Gen2 hard IP, and offers SEU mitigation via CRC and parity on configuration memory. The transceiver-rich architecture (when using the GT variant) and abundant DSP blocks make the EP3SE50F780C4G well suited to high-throughput baseband processing, video broadcast infrastructure, and high-speed serial protocol bridging. The 5.76 Mbit embedded memory bank supports wide datapath buffering, eliminating the need for external SRAM in many designs. Typical applications include wireless base-station channel cards, military radar signal processing, ASIC prototyping platforms, medical imaging pipelines, and high-end video switching fabrics. Designers also use it in wire-speed packet processing and high-frequency trading acceleration where deterministic latency and parallel DSP resources dominate the design constraint set. When designing with this device, pay close attention to power-rail sequencing: the core (VCC), auxiliary (VCCAUX), and I/O banks each require specific ramp rates defined in the datasheet. Decoupling must follow the reference design pattern, and unused transceiver channels must be powered down with the correct bias network to avoid back-powering the die. This page synthesizes distributor pricing, drop-in alternatives, and design guidance not found in the manufacturer datasheet alone. Specifications below are extracted from the Stratix III device family datasheet and current distributor inventory data.

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EP3SE50F780C4L - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
EP3SE50F780C4L

EP3SE50F780C4L - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA

The Intel (formerly Altera) EP3SE50F780C4L is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, integrating 47,500 logic elements (LEs), 5,760,000 bits of embedded memory, 488 user I/Os, and 304 (19x16) 18x18-bit multipliers inside a 780-ball flip-chip BGA (FCBGA) package. The 'C4' speed grade targets commercial timing with a 4-speed designator, the 'L' suffix indicates a lead-free / Pb-free terminal finish, and the 'F780' package code denotes the 780-pin FCBGA variant used for high-I/O-density designs. An FPGA is a reprogrammable digital logic device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM (BRAM/M9K/M144K), high-speed transceivers, and programmable I/O cells connected by a routing fabric. Stratix III E parts are positioned as mid-density, transceiver-equipped FPGAs in the Intel FPGA portfolio, sitting between low-cost Cyclone families and high-end Stratix V/Arria families, used when applications require a balance of logic density, memory bandwidth, DSP throughput, and I/O count. Key features include 6 input/output banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, on-chip PLLs for clock generation and conditioning, hard PCI Express and external memory interface controllers, configuration via passive serial, fast passive parallel, JTAG, or Altera-enhanced configuration devices, and a wide industrial operating temperature range depending on the speed-grade suffix. Stratix III E FPGAs use a programmable power technology that intelligently manages static and dynamic power across logic, memory, and routing resources, reducing total power consumption by up to 50% versus prior generations. The 40 nm process combined with a 1.1 V core voltage (Stratix III core voltage plane) allows dense designs to operate within typical board power budgets. The high transceiver count and DSP density make the device suitable for DSP-intensive signal processing pipelines. Typical applications include high-speed wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, broadcast video processing, test and measurement instrumentation, and high-performance computing accelerators. The 780-ball FCBGA package supports dense board layouts with controlled-impedance signal routing for multi-gigabit interfaces. When designing with this device, ensure the FPGA configuration scheme is selected and a proper JTAG chain is laid out. The Quartus II design software is the primary development environment; verify timing closure using TimeQuest with the 'C4' speed-grade timing models. Thermal dissipation grows with utilization - use thermal vias and a sufficient copper pour under the FCBGA for high-utilization designs. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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EP3SE50F780C4LG - 47.5K LE Stratix III E FPGA, 488 I/O, FBGA-780 | Intel
EP3SE50F780C4LG

EP3SE50F780C4LG - 47.5K LE Stratix III E FPGA, 488 I/O, FBGA-780 | Intel

The Intel (formerly Altera) EP3SE50F780C4LG is a high-density, low-power Stratix III E family Field-Programmable Gate Array (FPGA) featuring 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbit of embedded memory in a 780-ball FineLine BGA (FBGA-780) package. It is the -4 speed grade, commercial (0C to +85C) variant with Pb-free (LG) lead finish and is supplied on tape-and-reel (L = large reel). What is a Stratix III E FPGA? The Stratix III E (Enhanced) family sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Built on TSMC's 40 nm low-power process, the E variants add more logic, memory, and DSP resources versus the Stratix III L (low-power) variants, while the programmable power technique (selectable core logic voltage per tile) and hard PCIe Gen1/Gen2, multi-Gbps transceivers, and dedicated DSP blocks make Stratix III E a preferred platform for high-throughput DSP, high-speed serial I/O, and memory-intensive designs. Key features include up to 488 user I/Os, hard memory controllers (DDR/DDR2/DDR3), up to 5.49 Mbit embedded RAM, 304 multiplier blocks (18x18), support for 1066 Mbps DDR3 memory interfaces, integrated PCIe Gen1/Gen2 hard IP blocks, and configurable LVDS/HSUL/LVTTL/LVCOMS I/O standards. The -4 speed grade is the fastest commercially available Stratix III E speed bin, while the FBGA-780 package provides a 1.0 mm ball pitch suitable for high-layer-count PCBs. Architecturally, the device uses an ALM (Adaptive Logic Module) as its basic logic unit - each ALM contains two combinational adaptive LUTs and two registers that can be split into smaller ALMs for high packing efficiency. Hard IP blocks (transceivers, PCIe, memory controllers, DSP, PLLs) reduce soft-logic overhead and lower latency for critical functions. The programmable power technology can switch tiles between high-speed and low-power mode, trading timing margin for static power. Typical applications include high-end wireline telecom line cards, ASIC prototyping, broadcast video processing, military radar signal processing, medical imaging (ultrasound beamforming, CT reconstruction), and high-performance computing accelerators. The combination of high logic density and rich DSP/memory resources makes Stratix III E a fit for compute-intensive, I/O-heavy designs. When designing with this device, plan for power-rail sequencing (VCCINT, VCCA, VCCIO, VCCD_PLL, VCCBAT), a multi-layer PCB with continuous ground and power planes, and thermal management under typical Stratix III E power densities of 0.5-1.5 W/cm^2. This page synthesizes distributor pricing, same-brand drop-in speed-grade alternatives, and practical design notes not collected in any single manufacturer datasheet.

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EP3SE50F780C4LN - 47.5K LE Stratix III E FPGA 780-FBGA | Intel
EP3SE50F780C4LN

EP3SE50F780C4LN - 47.5K LE Stratix III E FPGA 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780C4LN is a high-density, low-power Stratix III E family Field Programmable Gate Array (FPGA) offering 47,500 logic elements, 5,760,000 bits of embedded memory, and 488 user I/Os in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 65 nm process node with a 0.9 V core voltage, the device operates across the commercial 0°C to 85°C temperature range and supports configuration via passive, fast passive, active serial, and active parallel modes. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit that combines programmable logic blocks, configurable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between general-purpose CPUs/ASICs and DSPs: they offer hardware parallelism and custom logic that microcontrollers cannot match, while preserving post-shipment reprogrammability that ASICs lack. Stratix III E variants are the enhanced-logic-density member of the Stratix III generation, optimized for logic-rich DSP, video, and high-throughput datapath applications rather than transceiver-rich protocol bridging. Key features include 1,900 LABs (Logic Array Blocks), 12 transceiver channels at up to 375 MHz, embedded multipliers arranged in DSP blocks, and partial reconfiguration support. The C4 speed grade designates the slowest Stratix III timing bin, traded for lower dynamic power and lower cost, while the L suffix indicates a lead-free, RoHS-compliant package. The 780-FBGA delivers a large user-IO budget (488 I/Os) and a thermal/electrical path suited to mid-density prototyping and production platforms. Architecturally, the EP3SE50F780C4LN integrates a logic-rich fabric with embedded SRAM organized in M9K and M144K block RAM blocks, hardware DSP slices for multiply-accumulate operations, and on-chip PLLs for clock management. The 65 nm low-power process combines adaptive voltage scaling with multiple programmable power-saving modes, allowing unused logic and I/O banks to enter near-zero quiescent state during idle intervals. Typical applications include high-speed digital signal processing, ASIC prototyping, video broadcast and image processing pipelines, industrial control and motor drive, MIL/AERO electronics where legacy Altera toolchains are entrenched, and high-density parallel compute platforms. Designers choose the C4 speed grade when throughput budgets allow slower Fmax targets in exchange for lower BOM cost and reduced cooling. Design considerations include Quartus II tool compatibility (Stratix III devices are supported by Quartus II v9.0 SP2 and later, including Quartus Prime with legacy device support), the need for a dedicated configuration controller or JTAG loader, multi-rail power sequencing between core (0.9 V), PLL analog (1.1 V), and I/O banks, and careful BGA PCB layout with microvia stack-ups for the 780-ball package. This page consolidates real-time distributor pricing, drop-in Stratix III alternatives that share the 780-FBGA footprint, and design notes not aggregated on a single OEM page.

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EP3SE50F780C4N - 49KLE Stratix III E FPGA 780-FBGA | Intel / Altera
EP3SE50F780C4N

EP3SE50F780C4N - 49KLE Stratix III E FPGA 780-FBGA | Intel / Altera

The Intel (formerly Altera) EP3SE50F780C4N is a high-performance Stratix III E field-programmable gate array (FPGA) built on a 40 nm process, integrating 47,500 logic elements (LEs) and 5,760,000 bits of embedded memory in a 780-ball fine-pitch BGA (FBGA) package. Operating at up to 717 MHz fabric performance, it delivers 488 user I/Os and 1900 LABs, targeting real-time signal processing, programmable logic, communications, and industrial automation designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. The Stratix III E family belongs to the high-end Altera/Intel FPGA taxonomy, positioned between Cyclone low-cost families and Stratix V high-end families, and was designed to balance logic density, transceivers, and power efficiency for mid-2000s to early-2010s system designs. Key features of the EP3SE50F780C4N include up to 12 transceiver channels (per Stratix III E family capability), 432 DSP blocks (18x18 multipliers), hard PCIe, DDR2/DDR3 memory controllers, and a Programmable Power Technology that reduces dynamic power by up to 30%. The device also offers comprehensive configuration support via JTAG, passive serial, and Fast passive parallel modes. Architecturally, the Stratix III E fabric uses adaptive logic modules (ALMs) of 8-input fracturable look-up tables, enabling efficient packing of arithmetic, multiplexer, and register functions. Combined with 8-input fracturable LUTs, dedicated memory and DSP blocks, the EP3SE50F780C4N achieves 1.6 Gbps LVDS performance and supports high-speed external memory interfaces including DDR3 SDRAM up to 800 MHz. Typical applications include high-speed DSP pipelines in telecom base stations, ASIC prototyping, broadband channel cards, industrial motor control and automation, and PCIe-accelerated compute cards. Designers typically pair this FPGA with DDR3 memory, high-speed ADCs/DACs, and SFP/SFP+ optical transceivers. Designers should note that Stratix III is a legacy family (NRND/EOL at Intel). New designs should consider Cyclone V or Stratix V/V10 families, while legacy replacements should verify pin and bitstream compatibility. The 780-FBGA package uses 1.0 mm ball pitch and requires PCB design rules for fine-pitch BGA fanout. This page consolidates pricing, lifecycle, parametric, and drop-in cross-references for the EP3SE50F780C4N - data not found in any single distributor listing or even the manufacturer datasheet - to support both procurement and engineering decisions for legacy Stratix III designs.

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EP3SE50F780I3 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780I3

EP3SE50F780I3 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780I3 is a Stratix III Enhanced (E) family Field-Programmable Gate Array (FPGA) integrating 47,500 logic elements, 488 user I/O pins, and 5,760,000 bits of embedded memory in a 780-ball FineLine BGA package. The device is built on a 65 nm process and supports core voltages from 0.86 V to 1.13 V with PLL-driven clocking up to 800 MHz (internal frequency). The 'I3' suffix indicates the industrial temperature grade from -40 C to +100 C junction. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacturing to implement custom digital functions. FPGAs sit in the broader semiconductor hierarchy between fixed-function ASICs and software-driven processors, offering hardware-timed parallelism with the flexibility of reprogrammability. The Stratix III family targets high-performance, high-bandwidth DSP, datapath, and transceiver-based designs. Key features of the EP3SE50F780I3 include 1,900 Logic Array Blocks (LABs), MultiTrack interconnect for predictable timing closure, and embedded TriMatrix memory blocks supporting true dual-port RAM, FIFO, and ROM modes. The device supports up to 488 general-purpose I/O with multiple I/O standards (LVDS, SSTL, HSTL, LVCMOS) and includes up to 8 PLLs with fractional-N synthesis for jitter-clean clock generation. The architecture combines Adaptive Logic Modules (ALMs) with carry-chain and register-chain routing, enabling both fine-grained state machines and wide datapath arithmetic. Per-block DSP blocks accelerate multipliers and MAC operations, making the device well-suited for high-sample-rate baseband processing. Configuration is loaded through passive serial, fast passive parallel, or JTAG modes into SRAM cells, allowing in-system reconfiguration for prototyping and field updates. Typical applications include high-speed data acquisition front-ends, telecom baseband signal processing, radar and software-defined radio (SDR) preprocessing, ASIC prototyping, video broadcast infrastructure, and high-performance industrial imaging pipelines. The Stratix III E variant adds enhanced 12.5 Gbps-capable transceiver support in higher-density members of the family, although the EP3SE50 is transceiver-less and optimized for parallel I/O bandwidth. When designing with this part, ensure PCB layout follows Intel/Altera BGA escape and decoupling guidelines: 1 to 4 low-ESR ceramic decoupling capacitors per power rail, matched-length traces for LVDS pairs, and a multi-layer stackup with dedicated ground and power planes. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the part is fully supported in Quartus versions 13.1 and earlier for legacy flows. This page synthesizes distributor inventory, lifecycle context, drop-in and same-family pin-compatible variants, and practical design notes not found in the standalone manufacturer datasheet.

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EP3SE50F780I3G - Stratix III E FPGA 47.5K LE | 780-FBGA | Intel
EP3SE50F780I3G

EP3SE50F780I3G - Stratix III E FPGA 47.5K LE | 780-FBGA | Intel

The Intel EP3SE50F780I3G is a high-density, low-power FPGA from the Stratix III E family, delivering 47,500 logic elements (LEs) in a 780-pin FC-FBGA package with 1.1 V core voltage and industrial temperature grade. Designed on TSMC's 40 nm process, the device integrates 8.7 Mbits of embedded memory, 264 DSP blocks (18x18 multipliers), and 12 transceivers operating up to 3.75 Gbps, targeting bandwidth-intensive applications such as high-speed serial interfaces and DSP pipelines. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the designer after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> high-density FPGA with transceivers and DSP. The Stratix III E variant specifically addresses systems that demand a balance of logic density, transceiver throughput, and DSP throughput without the cost premium of the largest Stratix V-class parts. Key features of the EP3SE50F780I3G include programmable power technology that dynamically adjusts logic and routing power based on operating frequency, partial reconfiguration support for in-system logic updates, and dedicated hard IP for memory controllers (DDR3 up to 800 MHz) and PCI Express Gen1 x8. The 780-pin FC-FBGA (29x29 mm) package supports 488 user I/O pins distributed across 12 banks, enabling flexible voltage and clock-domain partitioning at the PCB level. Architecturally, the device leverages the Stratix III adaptive logic module (ALM) which combines 8-input fracturable look-up tables with dedicated adder/subtractor carry chains, improving effective logic utilization over the previous Stratix II generation. Memory is organized as M9K and M144K blocks, allowing efficient mapping of FIFO buffers, packet descriptors, and DSP coefficient storage. The transceiver blocks (GXB) support multiple protocols including PCIe Gen1, XAUI, Serial RapidIO, and CEI-6G with integrated PCS and PMA. Typical applications include 10G/40G telecom line cards, wireless baseband processing, military radar front-ends, medical imaging pipelines, and high-performance ASIC prototyping. The 47.5K LE capacity comfortably holds 8-lane PCIe endpoints, custom DDR3 controllers, and 24-bit DSP dataplanes simultaneously, making it a strong fit for mid-tier system-on-chip emulation. When designing with this device, pay close attention to power sequencing requirements: 1.1 V core, 2.5 V/3.0 V auxiliary, and 1.2 V/2.5 V transceiver supplies must ramp in a defined order documented in the Stratix III handbook. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in Stratix III family alternates, and practical design guidance not found in the manufacturer datasheet alone.

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EP3SE50F780I3N - Stratix III E FPGA, 47.5K Logic Elements, 780-FBGA | Intel
EP3SE50F780I3N

EP3SE50F780I3N - Stratix III E FPGA, 47.5K Logic Elements, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780I3N is a high-performance Stratix III E Field-Programmable Gate Array (FPGA) IC built on a 65 nm process, integrating 47,500 logic elements, 488 user I/O pins, and 5,760,000 bits of embedded memory in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. According to the Altera/Intel datasheet, the device operates at a core voltage of 0.9 V with industrial temperature grade support and is qualified to deliver the world's highest performance and highest density 65-nm FPGA combined with the lowest possible power consumption in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, M20K memory blocks, transceivers, and PLLs. FPGAs sit within the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit, and serve as the highest-density reconfigurable digital fabric between microcontrollers and custom ASICs. Stratix III devices specifically target high-bandwidth signal processing, high-speed serial connectivity, and embedded-processor integration. Key features of the EP3SE50F780I3N include 47,500 logic elements, 488 user I/Os (the highest pin-count variant in the Stratix III E family at 780-BGA), 5,760,000 bits of embedded RAM, full Boundary-Scan Test (BST) support per JTAG IEEE Std. 1149.1, and DSP blocks tuned for high-throughput fixed- and floating-point arithmetic. The FC-FBGA package supports high-speed I/O and offers signal-integrity advantages for memory and transceiver interfaces. Architecturally, the Stratix III E family uses Altera's adaptive logic modules (ALMs), an 8-input fracturable LUT, dedicated 18x18 multipliers, M20K memory blocks, and a programmable power management engine (Altera's Programmable Power Technology) that reduces dynamic power by up to 30% versus the previous Stratix II generation. Device configuration is supported through JTAG IEEE 1149.1 and Altera's passive serial, fast passive parallel, and active serial configuration schemes. Typical applications for the EP3SE50F780I3N include high-performance digital signal processing, wireline telecom line cards, software-defined radio, ASIC prototyping, military/aerospace image processing, and high-end test and measurement. When designing with this part, allocate sufficient decoupling on each power rail, use 1.0 V core and 0.9 V analog supplies per the datasheet, and verify the JTAG chain against the 1149.1 boundary-scan architecture before board bring-up. This page synthesizes distributor pricing, same-family and cross-family drop-in alternatives, lifecycle guidance, and practical design notes not found in the manufacturer datasheet alone, supporting engineers who must replace, second-source, or qualify the EP3SE50F780I3N for new programs.

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EP3SE50F780I4 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SE50F780I4

EP3SE50F780I4 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel / Altera

The Intel / Altera EP3SE50F780I4 is a high-performance Stratix III E FPGA from the Stratix III Enhanced family, delivering 47,500 logic elements, 488 user I/Os, and 5.76 Mbits of on-chip memory in a 780-ball fine-pitch BGA (FC-FBGA) package. Manufactured on a 65nm process node with a 1.1V core voltage, the device operates across the industrial temperature range (-40C to +100C) as indicated by the I4 speed/temperature grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than by a fixed mask set. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the design hierarchy: ASIC > FPGA > Microcontroller > discrete logic, providing hardware-level parallelism and reconfigurability for compute-intensive, high-throughput, or rapidly evolving designs. Key features of the EP3SE50F780I4 include 1,900 adaptive logic modules (ALMs) organized into LABs, integrated high-speed transceivers, embedded DSP blocks, embedded memory blocks totaling 5,760 Kbits, and a programmable power technology that minimizes dynamic power. The part supports up to 488 user I/Os distributed across 12 user I/O banks, with MultiVolt I/O support for interfacing to 1.5V, 1.8V, 2.5V, 3.3V logic families. Architecturally, the Stratix III E family introduced an Altera-innovative programmable power technology combined with 12.5 Gbps transceivers, an enhanced memory hierarchy, and the ALM (Adaptive Logic Module) which can be configured as either 6-input LUT logic or dual 4-input LUTs, raising effective logic density over earlier Stratix generations. This makes the EP3SE50F780I4 well suited to wireline communication, DSP, and signal processing designs. Typical applications include high-end ASIC prototyping, wireline communication line cards, broadcast video processing, military/aerospace signal processing, and high-performance DSP acceleration. Industrial designers also use Stratix III E FPGAs in medical imaging and test-and-measurement instrumentation. When designing with this device, verify power budget using the Altera PowerPlay early power estimator before PCB layout, and follow Altera's Stratix III Hardware Reference for decoupling, transceiver routing, and configuration scheme selection. The I4 industrial temperature grade and high I/O count make PCB fanout and stackup planning critical.

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EP3SE50F780I4G - Stratix III E FPGA 47.5K LE 780-FBGA | Intel
EP3SE50F780I4G

EP3SE50F780I4G - Stratix III E FPGA 47.5K LE 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780I4G is a Stratix III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 5,760,000 embedded memory bits, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FBGA-780) package. It operates from a 1.1 V core supply across the industrial -40C to +100C temperature range. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and embedded memory that can be re-programmed to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA, providing higher logic density and richer IP than CPLDs. Stratix III E devices target high-performance digital signal processing, memory-intensive processing, and high-speed serial interconnect. Key features include 488 user I/Os, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through dedicated I/O banks, embedded transceivers for high-speed serial protocols, dedicated DSP blocks for fixed- and floating-point math, and up to 5.76 Mbits of embedded RAM (tri-memory distributed + block RAM + MLAB). The device supports configuration via JTAG, passive serial, fast passive parallel, and active serial schemes. The EP3SE50F780I4G is built on a 40 nm low-power CMOS process with 12-layer metal interconnect, leveraging Stratix III's programmable power technology (PPT) that dynamically adjusts logic and interconnect performance to reduce dynamic power. Programmable Power Technology combined with hard IP for PCI Express Gen1/Gen2, multi-port memory controllers (DDR/DDR2/DDR3) and 8B/10B encoder/decoder blocks lets designers target >1 GHz internal core frequencies and >6 Gbps transceiver rates while reducing system cost and power. Typical applications include high-end wireline communication line cards, wireless baseband processing, military and aerospace signal processing, ASIC prototyping, high-performance test and measurement, broadcast video processing, and high-port-count networking line cards where parallel processing and high memory bandwidth are required simultaneously. When designing with this part, pay close attention to power architecture: at full utilization the Stratix III E50 can exceed 20 W, demanding a 1.1 V core regulator sized for 25 A+ load and a thermally aware PCB with at least 8+ thermal vias under the BGA thermal balls. The FBGA-780 land pattern requires 1.00 mm or 1.27 mm ball pitch and a reflow profile that complies with JEDEC J-STD-020. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving you actionable procurement and engineering guidance.

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EP3SE50F780I4L - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780I4L

EP3SE50F780I4L - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel

The Intel (Altera) EP3SE50F780I4L is a high-density Stratix III Enhanced (E) FPGA delivering 47,500 logic elements (LEs), 488 user I/Os, and 5,760 Kbits of embedded memory in a 780-pin FC-FBGA package. Manufactured on a 65 nm process, it operates at 0.9 V core with a secondary 1.05 V to 1.15 V option, targeting high-performance signal processing, telecommunications, and ASIC prototyping workloads. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor whose logic fabric, embedded multipliers, block RAM, and high-speed transceivers can be programmed post-manufacture. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy: microcontrollers execute software sequentially, FPGAs implement custom parallel hardware, and ASICs deliver equivalent hardware after a non-recurring engineering (NRE) cost. The Stratix III Enhanced family uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables (LUTs), enabling efficient mapping of wide and narrow datapaths. Key features of the EP3SE50F780I4L include 47,500 LEs organized into 1,900 logic array blocks (LABs), up to 5,760 Kbits of M9K block RAM, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for high-speed external memory interfaces (DDR/DDR2/DDR3/QDRII+) via soft memory controllers. The 488 user I/Os are arranged in 16 banks supporting a wide range of single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. Architecturally, the Stratix III E family integrates dedicated transceivers up to 1.25 Gbps (model-dependent), high-performance PLLs, and a programmable power network that powers down unused regions to reduce static consumption. Partial reconfiguration lets designers swap logic blocks without interrupting adjacent logic, useful for dynamically reconfigurable wireless and test systems. Typical applications include telecom baseband processing, high-throughput DSP pipelines (radar, video broadcast), ASIC prototyping, military/aerospace signal processing, and high-speed serial protocol bridging. The 'I' speed grade and industrial temperature range (-40C to +100C core) suit ruggedized environments. When designing with the EP3SE50F780I4L, note that the device is in legacy lifecycle. Plan firmware, bitstream, and toolchain (Quartus II) compatibility carefully, and verify second-source availability before long-life deployments. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison parameters, and practical FPGA design notes not found in the manufacturer datasheet alone.

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EP3SE50F780I4LG - Stratix III E FPGA 47.5K LE | Intel (Altera)
EP3SE50F780I4LG

EP3SE50F780I4LG - Stratix III E FPGA 47.5K LE | Intel (Altera)

The Intel (Altera) EP3SE50F780I4LG is a high-density Stratix III E Field-Programmable Gate Array (FPGA) IC integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbit of embedded memory into a 780-ball Flip-Chip BGA (FCBGA) package. Housed in the 780-FBGA footprint with 488 user I/Os, it supports core VCC at 1.1 V and industrial temperature operation from -40 C to +100 C. The EP3SE50F780I4LG is the lead-free, RoHS-compliant variant of the EP3SE50 family, distinguished by the 'G' suffix indicating Pb-free ball finish. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement custom digital circuits using configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP blocks and memory. FPGAs occupy the mid-tier of digital logic hierarchy: below fixed-function ASICs in volume cost but above discrete logic ICs in integration density. The Stratix III generation introduced the ALM (Adaptive Logic Module) architecture, which combines 8-input fracturable lookup tables and dedicated adders to deliver higher effective logic capacity per LE than the ALM predecessors. Key features of the EP3SE50F780I4LG include 47,500 logic elements, 19,000 ALMs, 5.49 Mbit embedded RAM, 488 maximum user I/Os, and high-speed transceivers supporting multi-gigabit serial interfaces. The device integrates dedicated DSP blocks for high-performance fixed- and floating-point arithmetic, hard PCI Express Gen1/Gen2 IP cores, and external memory interfaces supporting DDR3 with dedicated DQS phase-shift circuitry. These features collectively enable single-chip implementation of complex DSP pipelines, high-throughput memory controllers, and protocol bridging functions. The EP3SE50F780I4LG is fabricated on a 65 nm TSMC process and combines a programmable fabric with embedded hard IP blocks. The 780-FCBGA flip-chip BGA package provides 488 signal balls allocated between user I/O banks, high-speed transceiver channels, configuration pins, clock inputs, and power/ground. The 1.1 V core supply with separate VCCPD (I/O pre-driver) and VCCIO (I/O driver) rails allows the FPGA to interface with multiple logic standards simultaneously. Compared with Stratix IV (40 nm) and Stratix V (28 nm) successors, the Stratix III E remains a cost-effective mid-density solution with mature Quartus II tool support. Typical applications include high-performance digital signal processing in wireless base stations, software-defined radio (SDR) front-ends, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, Gigabit Ethernet), radar and beam-forming arrays, broadcast video processing, and ASIC prototyping. The high DSP block count and transceiver bandwidth make this device well suited to designs where parallel DSP pipelines must be combined with chip-to-chip serial links. The 5.49 Mbit embedded RAM also serves as on-chip buffering for packet processing in networking line cards. When designing with this device, ensure that PCB layout meets the FCBGA via-in-pad and microvia stack-up requirements specified in the Altera Stratix III Device Handbook. The flip-chip BGA requires precise BGA escape routing and matched-length traces for high-speed transceiver channels; failing to honor the reference stack-up will degrade SERDES eye margins. Thermal management is mandatory because the FCBGA junction-to-ambient thermal resistance is limited, and high transceiver utilization can push junction temperature close to the +100 C industrial limit. This page consolidates distributor inventory, lifecycle status, drop-in alternative analysis, and PCB design guidance for engineers evaluating or sourcing the EP3SE50F780I4LG.

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EP3SE50F780I4LN - Stratix III E FPGA 47.5K LE 780-FBGA | Altera
EP3SE50F780I4LN

EP3SE50F780I4LN - Stratix III E FPGA 47.5K LE 780-FBGA | Altera

The Altera (Intel) EP3SE50F780I4LN is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 47,500 logic elements, 5,760,000 embedded memory bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Operating from 0.85V to 1.2V core supply with industrial -40C to +100C temperature range, it integrates 1,900 Logic Array Blocks (LABs), 1900 Adaptive Logic Modules (ALMs), and dedicated DSP blocks for high-performance signal processing. What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP and memory blocks, and a periphery of high-speed transceivers and general-purpose I/Os. Stratix III E belongs to Altera's high-performance, low-power 65 nm FPGA family, sitting in the device hierarchy as: Stratix III E -> Stratix III family -> Stratix series -> high-end FPGA -> programmable logic device -> semiconductor IC. Key features of the EP3SE50F780I4LN include 488 maximum user I/Os, 1,900 LABs, 5,760,000 bits of embedded RAM, dedicated 18x18 multipliers and DSP blocks, and up to 12 high-speed transceivers depending on package option. The 780-FBGA package supports high pin-count designs with controlled impedance signal routing, while the 'I4' speed grade and 'L' enhanced feature suffix position this device for industrial-grade high-throughput DSP, telecom, and signal-processing applications. The device architecture uses 65 nm process technology, a fine-grained ALM-based fabric, multi-track routing, and dedicated hardware for DSP, memory interfacing, and external memory controllers (DDR/DDR2/QDRII). Hard IP for PCI Express, Gigabit Ethernet, and SERDES up to 6.375 Gbps is integrated, enabling protocol bridging without consuming soft logic. Typical applications include high-throughput digital signal processing (radar, beamforming), telecom baseband and backhaul cards, ASIC prototyping, high-speed serial interface bridging, and military/aerospace compute nodes. With 488 I/Os and 5.76 Mbit embedded memory, the device supports multi-channel data acquisition and image processing pipelines. When designing with this part, allocate sufficient PCB layers (typically 12+) to maintain signal integrity on the FCBGA escape routing. Use the Quartus II design suite (or later Quartus Prime) for synthesis, place-and-route, and timing closure; the device requires configuration via JTAG, passive serial, or fast passive parallel mode. This page synthesizes distributor inventory, parametric drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet alone.

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EP3SE50F780I4N - Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel
EP3SE50F780I4N

EP3SE50F780I4N - Stratix III E FPGA, 488 I/O, 780-FCBGA | Intel

The Intel EP3SE50F780I4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 5,760 Kbits of embedded memory, and 1900 logic array blocks (LABs) in a 780-ball FineLine BGA (FCBGA) package. It supports up to 488 user I/Os and operates from a 0.9V core supply with industrial temperature grade (I4: -40C to +100C). The device is fabricated on TSMC's 65 nm process and integrates up to 304 multipliers (18x18) and 12 PLLs, targeting high-performance DSP, telecommunications, and signal-processing applications. What is an FPGA? A Field-Programmable Gate Array is a programmable semiconductor device whose logic fabric can be configured by the designer after manufacture. Stratix III E belongs to the high-performance tier of FPGAs - positioned below ASICs in unit cost but above low-density CPLDs and traditional microcontrollers in raw throughput. It sits within the broader taxonomy: programmable logic device -> FPGA -> high-performance FPGA -> Stratix family. Engineers choose Stratix III E when deterministic parallelism, high transceiver bandwidth, and DSP block density outweigh the power and unit-cost advantages of microcontrollers or ASSPs. Key features include 1.1 Gbps LVDS performance, 24 transceivers (up to 6.375 Gbps) on the Stratix III GT family, hard PCIe Gen1/Gen2 IP cores, and DSP blocks supporting variable-precision arithmetic. The 780-FCBGA package provides a robust thermal envelope for sustained operation under industrial ambient conditions. The I4 speed/temperature grade (-40C to +100C, fast speed) places it among the highest-performance variants within the Stratix III E family, while the same BGA footprint is shared across many speed grades and density siblings - enabling PCB reuse. The architecture uses ALMs (Adaptive Logic Modules) instead of classic 4-input LUTs, allowing logic synthesis tools to pack combinational paths more efficiently. Combined with dedicated routing tracks on the 65 nm process, this yields a typical core clock Fmax of 500+ MHz in pipelined designs. The device is supported by Intel Quartus II design software (legacy, free updates archived on Intel's FPGA support pages) and accepts standard HDL entry (Verilog, VHDL, SystemVerilog). Typical applications include high-speed telecom line cards, military radar signal processing, ASIC prototyping, and high-throughput digital signal processing. The transceiver-equipped family variants also suit 40G/100G Ethernet bridging and PCIe Gen2 endpoint designs. For PCB layout, the FCBGA requires microvia stack-ups (typically any-layer HDI) and matched-length differential pair routing for transceiver channels.

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EP3SE80F1152C2 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel
EP3SE80F1152C2

EP3SE80F1152C2 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F1152C2 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm TSMC process with a 1.1 V core supply, the device is offered in a commercial 0 C to 85 C temperature grade and supports up to 600 MHz internal operation. The C2 speed grade targets cost-sensitive designs where the highest -2 performance bin is not required. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy a position above general-purpose microcontrollers and below ASICs in the programmable logic hierarchy, offering hardware-level parallelism for DSP, packet processing, and high-throughput data pipelines. The Stratix III E family specifically targets high-performance ASIC prototyping, wireline communications, and DSP-intensive applications. Key features of the EP3SE80F1152C2 include 3,200 Logic Array Blocks (LABs), 8.75 Mbits of M9K memory plus additional MLAB blocks, and integrated Adaptive Logic Modules (ALMs) that support 6-input LUT architecture. The TriMatrix interconnect fabric provides predictable timing closure with multi-track routing, while dedicated DSP blocks implement 18x18 multipliers at full speed. Hard IP for PCIe, memory controllers, and SERDES is available depending on the specific Stratix III E variant. The architecture uses a 65 nm low-k dielectric process and a multi-supply core (1.1 V) with separate VCCPD, VCCIO banks, and PLL analog supplies to isolate sensitive analog circuits from noisy digital switching. Engineers must observe multi-rail power sequencing - VCCINT must reach threshold before VCCPD, with VCCIO following last. The 1152-ball FCBGA package has a fine-pitch ball grid that requires ENIG or ENEPIG surface finish and OSP flux compatibility. Typical applications include ASIC prototyping and emulation, high-end wireline baseband processing, test and measurement equipment, broadcast video processing, and high-speed DSP accelerators. The 744 user I/O count supports parallel LVDS interfaces and multi-channel memory buses typical of telecom line cards. When designing with this device, allocate sufficient PCB area for the 35x35 mm FCBGA footprint, plan for at least 8 power rails with bulk and decoupling capacitance per Quartus II power analysis results, and verify signal-integrity on high-speed LVDS pairs using the IBIS model from the Altera website.

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EP3SE80F1152C2N - 80K LEs Stratix III E FPGA, 1152-BGA | Altera
EP3SE80F1152C2N

EP3SE80F1152C2N - 80K LEs Stratix III E FPGA, 1152-BGA | Altera

The Altera (Intel) EP3SE80F1152C2N is a high-density, high-performance Stratix III E FPGA featuring 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 65nm process with a 1.1V core supply, this device integrates 3,200 Logic Array Blocks (LABs), embedded multipliers, and MultiTrack interconnect for high-bandwidth DSP and ASIC-prototyping workloads. It supports internal clock frequencies up to 800 MHz and is rated for commercial temperature operation (0C to +85C). What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic device -> FPGA -> high-density programmable logic -> ASIC prototyping silicon. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for low-volume production, rapid prototyping, and applications requiring hardware-level parallelism such as signal processing, packet inspection, and high-speed interfacing. Key features of the EP3SE80F1152C2N include 6.84 Mbits of embedded memory, 488 (9x9) embedded multipliers for DSP, partial reconfiguration support, and dedicated circuitry for external memory interfaces (DDR, DDR2, DDR3, QDRII, RLDRAM). The Stratix III E architecture enhances logic and routing efficiency over earlier Stratix generations, while the 1.1V core reduces dynamic power consumption by up to 50% compared with 90nm predecessors. The FCBGA-1152 package provides a robust board-level interconnect suitable for multi-gigabit transceiver (transceiver-less) LVDS, PCI Express Gen1 endpoints, and gigabit Ethernet MAC implementations. Typical applications include high-end ASIC prototyping, high-performance digital signal processing, video broadcast equipment, military radar signal processing, and wireline telecommunications line cards. The 80K LE density positions this part in the mid-density Stratix III E family, large enough for full-system emulation of multi-million-gate ASICs yet still cost-effective versus the larger EP3SE110 and EP3SE260 devices. When designing with this part, allocate sufficient PCB layers (typically 12+ for 1152-ball BGA breakout) and use a Stratix III E reference design for power-rail sequencing, decoupling, and JTAG configuration. Altera Quartus II software (version 9.0 or later) is the required development environment for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.

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EP3SE80F1152C3 - Stratix III E FPGA 80K LE FBGA-1152 | Intel
EP3SE80F1152C3

EP3SE80F1152C3 - Stratix III E FPGA 80K LE FBGA-1152 | Intel

The Intel (Altera) EP3SE80F1152C3 is a high-density Stratix III E Field-Programmable Gate Array delivering 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FBGA) package. It is built on a 65 nm CMOS process with a 1.1 V core supply and supports an internal clock frequency of up to 800 MHz, with transceiver-rich variants of the family reaching 717 MHz in DSP blocks. The device integrates 3,200 Logic Array Blocks (LABs), 12 transceiver channels, and dedicated DSP blocks optimized for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit within the programmable logic hierarchy alongside CPLDs and sit above fixed-function ASICs in flexibility. The Stratix III E family is positioned for high-performance DSP, high-speed serial I/O, and embedded-processor applications where designers need hardware-level parallelism without the NRE cost of an ASIC. Designers typically choose an FPGA like the EP3SE80F1152C3 over a microcontroller when they need parallel processing, custom I/O timing, or hardware-accelerated algorithms such as FFT, FIR filtering, or video processing. Key features of the EP3SE80F1152C3 include up to 6.84 Mbits of M9K and M144K block RAM, 384 18x18 multipliers for DSP, twelve full-duplex transceivers supporting rates up to 6.375 Gbps (C3 speed grade), and Quartus II design-software support with IP cores for PCI Express, DDR2/DDR3, Ethernet MAC, and many standard interfaces. The device is offered in a commercial temperature grade (0 to 85 C) under the speed grade C3, which trades off maximum internal frequency versus power optimization. Typical applications include high-speed DSP and baseband processing in wireless infrastructure, ASIC prototyping for SoC designs, high-end image processing for medical imaging and machine vision, and high-speed serial backplane interfaces for networking and storage systems. The 1152-ball FBGA package provides ample routing channels for the 744 user I/Os and the integrated transceivers. The high logic density combined with embedded memory and DSP blocks makes this device well-suited to designs that previously required multiple FPGAs or a discrete DSP plus FPGA architecture. When designing with the EP3SE80F1152C3, ensure your PCB footprint is rated for the 35x35 mm FBGA-1152 substrate with appropriate microvia stack-ups. Use the Quartus II power analyzer early in the design cycle to size decoupling networks and thermal solution, since DSP-heavy and transceiver-active designs can exceed 10 W of power dissipation. The C3 speed grade is appropriate for cost-sensitive commercial applications; if you need higher Fmax or wider temperature tolerance, the I3 industrial grade or C4 higher-speed grade variants are available on the same pinout. This page synthesizes distributor inventory, same-family Stratix III E drop-in alternatives, and design notes not found in the manufacturer datasheet. Engineers can evaluate commercial availability, parametric match percentages, and packaging reuse across the Stratix III E family without downloading datasheets from multiple distributors.

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EP3SE80F1152C3N - Stratix III E FPGA, 80K LE, 1152-FBGA | Intel
EP3SE80F1152C3N

EP3SE80F1152C3N - Stratix III E FPGA, 80K LE, 1152-FBGA | Intel

The Intel (Altera) EP3SE80F1152C3N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 40 nm low-power process, the device combines abundant programmable logic, dedicated DSP blocks, and high-speed transceivers, targeting demanding digital signal processing, high-bandwidth communications, and ASIC-prototyping workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, the FPGA sits between general-purpose microcontrollers and full custom ASICs, offering hardware-level parallelism with field-reprogrammable bitstream configurability. Stratix III E devices extend the family with enhanced transceivers, partial reconfiguration support, and higher logic density per watt compared with prior Stratix generations. Key features of the EP3SE80F1152C3N include 80,000 logic elements (LEs), 6,843,392 memory bits, 3,200 LABs/CLBs, 744 maximum user I/Os, and Stratix III E class transceiver support (per variant). The device supports up to 717 MHz internal operation and is offered in a commercial temperature grade (C3 speed/power corner). Embedded hard IP blocks for PCIe, DDR3 memory controllers, and multi-gigabit transceivers are integrated on-die, simplifying board design. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs plus dedicated carry, register, and LUT resources, enabling higher packing density than traditional 4-input LUT architectures. The hierarchical routing fabric and MultiTrack interconnect reduce congestion, while the MLAB (Memory Logic Array Block) allows distributed RAM to be sprinkled across the fabric for high-speed small-buffer use cases. Typical applications include high-performance digital signal processing for wireless baseband, ASIC and ASIC-replacement prototyping, high-speed image and video processing pipelines, test and measurement instrumentation, and high-throughput data-acquisition systems. Designers also use Stratix III E devices in wireline backhaul, radar, and software-defined radio platforms where parallel processing is essential. When designing with the EP3SE80F1152C3N, pay careful attention to the FBGA-1152 PCB land pattern, multi-rail decoupling strategy, and JTAG/AS configuration pin budgeting. Quartus II software (legacy) or Quartus Prime with the Stratix III device support is required for synthesis, place-and-route, and bitstream generation. Given the device's NRND/EOL status on some channels, confirm lifecycle status with authorized distributors before committing to new designs. This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives within the Stratix III E family, and PCB-level design considerations not consolidated in the manufacturer datasheet.

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EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
EP3SE80F1152C4

EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera

The Intel (formerly Altera) EP3SE80F1152C4 is a high-density Stratix III Enhanced (E) family FPGA integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package fabricated on a 65 nm CMOS process and powered from a 1.1 V core supply. The device operates across the commercial 0C to 85C junction temperature range and is rated for an internal fabric frequency up to 800 MHz in performance-grade FPGA benchmarks, making it suitable for high-throughput parallel DSP, video bridging, and protocol aggregation designs. What is a Stratix III E FPGA? Stratix III E is the enhanced-logic-and-memory variant of Intel's Stratix III 65 nm FPGA portfolio, an SRAM-programmable logic device that sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. Compared with the Stratix III L variant (logic-optimized) and the Cyclone series (cost-optimized), the E family triples on-chip memory bandwidth by adding dedicated MLAB + M9K + M144K TriMatrix memory blocks, and it is typically chosen when a design needs both rich logic capacity and many megabits of distributed/Block RAM. Key features include 80,000 logic elements (LEs), 3,200 Logic Array Blocks (LABs), 6,843,392 total RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, MultiTrack interconnect with hierarchical routing, and 744 general-purpose I/Os split across 16 or more I/O banks supporting multiple single-ended and differential I/O standards. The 65 nm low-k process and an adaptive logic module (ALM) architecture deliver roughly twice the performance-per-logic-element of the prior Stratix II generation while cutting dynamic power by 50%. Architecturally, the EP3SE80F1152C4 uses the ALM-8 (8-input fracturable LUT) building block, TriMatrix embedded memory (MLAB / M9K / M144K), and dedicated variable-precision DSP blocks. The hard memory controller and high-speed transceivers (not present on this specific part number variant) are bypassed in favor of fabric-only I/O, which keeps die cost down for designs that need abundant user I/O and on-chip memory but not multi-gigabit serial links. Typical applications include high-performance digital signal processing, video processing and image pre-processing pipelines, ASIC prototyping, multi-channel protocol aggregation (e.g., 10/40 Gbps Ethernet bridges), and embedded control with large on-chip memory footprints. The 1152-BGA package also enables dense PCB layouts for line cards and mezzanine modules. When designing with the EP3SE80F1152C4, plan for JTAG-based configuration with EPCS serial configuration devices, plan derating for FBGA solder-joint reliability under thermal cycling, and validate signal-integrity on the 744 I/Os with the Quartus II SignalTap and TimeQuest timing analyzer tool flow. The device is in active production but is now positioned as a mature-node FPGA; lead times should be confirmed with authorized distributors.

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EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera
EP3SE80F1152C4L

EP3SE80F1152C4L - Stratix III E FPGA 80K LE, 1152-FCBGA | Altera

The Altera (now Intel FPGA) EP3SE80F1152C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 80,000 logic elements, 6,843,392 bits of embedded memory, and 744 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package. Built on a 65 nm TSMC process with a 0.9 V core supply, it combines high-performance logic fabric with rich DSP and memory resources and supports DDR3/QDRII+/RLDRAM II external memory interfaces for bandwidth-intensive designs. An FPGA (Field Programmable Gate Array) is a programmable logic class of integrated circuit that allows designers to implement arbitrary digital logic through configuration of an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader taxonomy, FPGAs sit at the top of programmable-logic devices (PLD > CPLD > FPGA) and are widely used for hardware acceleration, digital signal processing, and high-speed interface bridging. The Stratix III E family is the enhanced-logic-memory variant of Stratix III, optimized for memory-intensive and DSP-heavy applications. Key features include 3200 LABs (Logic Array Blocks), 488 embedded 18x18 multipliers, 608 M9K memory blocks, up to 12 transceiver channels, and Quartus II / Qsys design-flow support. The device operates over the commercial 0C to +85C junction range (C4 speed grade) and integrates hard PCIe, hard memory controllers, and SERDES blocks that reduce external component count. The 1152-ball FC-FBGA package provides high pin density and signal integrity for multi-Gbps serial links. Typical applications include high-performance digital signal processing (radar, medical imaging), ASIC prototyping, high-speed networking line cards, video broadcast infrastructure, and test & measurement equipment. The device's combination of abundant memory and DSP blocks makes it well suited to multi-channel baseband processing and protocol bridging. When designing with this part, ensure PCB layout supports the flip-chip BGA with proper microvia stack-up, decoupling follows the Stratix III power distribution network guidelines, and configuration is supplied through one of the supported modes (AS, AP, PS, FPP, JTAG).

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EP3SE80F1152C4LN - 80K LE Stratix III E FPGA, 744 I/O, FBGA-1152
EP3SE80F1152C4LN

EP3SE80F1152C4LN - 80K LE Stratix III E FPGA, 744 I/O, FBGA-1152

The Intel EP3SE80F1152C4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3200 LABs/CLBs, and 6,843,392 bits of embedded memory in a 1152-ball FineLine BGA (FBGA-1152) package. Per the Altera/Intel datasheet, this device is rated for 744 user I/Os and supports a core clock performance envelope up to 717 MHz. The die is fabricated on a CMOS process and integrates hard intellectual-property blocks such as transceivers, DSP blocks, and embedded memory that together make the part a workhorse for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device that combines configurable logic blocks (LBs), programmable interconnect, and dedicated silicon IP such as block RAM, multipliers, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and custom ASICs: FPGAs offer the highest logic density and the highest serial I/O bandwidth, and unlike ASICs they can be reconfigured in the field, trading per-unit cost for design flexibility, time-to-market, and post-deployment updates. Key specifications include 80,000 logic elements, 3200 LABs, 488 user I/Os (note: distributor listings cite 744 I/O; see validation note), 6,843,392 embedded memory bits, and a 717 MHz internal operating frequency. The device is lead-free and ships in a 1152-ball FCBGA at industrial-grade temperature range. Hard IP blocks including high-speed transceivers and DSP slices are tightly coupled to the logic fabric, enabling sustained multi-gigabit serial and parallel DSP workloads without consuming fabric resources. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) along with 9-kbit internal memory blocks, variable-precision DSP blocks, and a multi-gigabit transceiver subsystem. The device is optimized for ASIC prototyping, high-performance DSP pipelines, and protocol bridging; designers typically pair the FPGA with external DDR3/QDR memory controllers instantiated in the fabric. Configuration is handled via Altera's Quartus II design suite with JTAG, passive serial, or fast passive parallel modes. Typical applications include high-end telecommunications baseband processing, ASIC prototyping and emulation, high-speed data-acquisition front ends, broadcast video infrastructure, and test & measurement instrumentation. The 1152-ball package is chosen when the design demands the maximum available I/O count from this family, particularly for parallel DDR memory interfaces and many LVDS channels. When designing with this device, plan power-rail sequencing carefully - Stratix III E requires a monotonic 1.1 V core ramp and a separately managed 2.5 V/3.0 V aux rail; consult the Stratix III E Hardware Reference Manual for the sequencing diagram. Pinout work must use the Altera Pin Planner against the FBGA-1152 footprint, and signal-integrity simulations are strongly recommended for LVDS and DDR3 edges above 533 MHz. This page synthesizes distributor pricing, FPGA-tier drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet - a curated layer on top of the official Altera/Intel Stratix III E documentation.

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EP3SE80F1152C4N - 80K Cell Stratix III E FPGA | Intel / Altera
EP3SE80F1152C4N

EP3SE80F1152C4N - 80K Cell Stratix III E FPGA | Intel / Altera

The Intel (formerly Altera) EP3SE80F1152C4N is a Stratix III E family Field Programmable Gate Array (FPGA) offering 80,000 logic elements, 3,200 LABs (Logic Array Blocks), and 6,843,392 bits of embedded memory, housed in a 1152-ball FC-FBGA package with 744 user I/Os. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a unique position in the digital IC hierarchy: programmable logic device (PLD) -> FPGA -> high-density programmable logic, enabling hardware reconfiguration that ASICs cannot match. Stratix III E is engineered for high-performance, power-optimized applications such as DSP, baseband processing, and high-throughput data pipelines. Key features include 717 MHz maximum internal operating frequency, 1.1 V core supply, integrated DSP blocks for high-throughput arithmetic, 12 transceivers supporting multi-gigabit serial I/O, and a low-power FPGA fabric optimized for power efficiency. The 1152-ball FC-FBGA package provides 744 user I/Os, making it ideal for high-pin-count designs requiring dense signal fan-out. Architecturally, Stratix III E uses a 65 nm process and combines hard DSP blocks, M9K/M144K block RAM, and dedicated memory interfaces (DDR2/DDR3/QDRII/RLDRAM) on a programmable interconnect fabric. The C4 speed grade and industrial temperature grading make this part suitable for demanding signal-processing applications. Typical applications include telecom baseband processing, high-performance digital signal processing, ASIC prototyping, test and measurement instrumentation, and high-speed serial interface aggregation. The device integrates transceivers up to 6.375 Gbps depending on configuration. When designing with the EP3SE80F1152C4N, ensure the PCB layout follows Intel/Altera's recommended power plane stacking, decoupling capacitor guidelines, and JTAG chain configuration to fully leverage the Stratix III architecture's signal integrity. This page synthesizes distributor pricing, drop-in Stratix III E alternatives within the same 1152-FBGA footprint, and practical FPGA design notes that complement the manufacturer datasheet.

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EP3SE80F1152I3 - Stratix III E 80K LE FPGA, 1152-FCBGA | Intel
EP3SE80F1152I3

EP3SE80F1152I3 - Stratix III E 80K LE FPGA, 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE80F1152I3 is a high-performance Stratix III E Field Programmable Gate Array (FPGA) delivering 80,000 logic elements, 3,200 LABs/CLBs, and 6,843,392 bits of embedded RAM in a 1152-ball FineLine BGA (FCBGA) package. Built on a 65 nm process node and supplied at a 1.0 V core, it provides 744 user I/O pins and operates with a maximum internal frequency of 500 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and on-chip memory that can be re-programmed to implement arbitrary digital logic after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> digital logic ICs -> integrated circuits. Stratix III E series parts are positioned as high-density, performance-oriented members of Altera's (now Intel's) programmable logic portfolio, with the E variant tuned for digital signal processing and high-speed parallel interfaces. Key features of the EP3SE80F1152I3 include 80,000 logic elements distributed across 3,200 LABs, dedicated DSP blocks, TriMatrix embedded memory totaling 6,843,392 bits, and 744 user I/O pins supporting multiple I/O standards. The part is offered in the -I3 industrial speed grade, indicating the third-fastest industrial temperature and timing bin, and is specified for an operating temperature range of 0C to 85C with a 1.0 V core supply and supporting I/O voltages typically ranging from 1.2 V to 3.3 V. From an architectural standpoint, the device leverages Altera's adaptive logic module (ALM) and MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process with embedded memory and DSP blocks enables efficient implementation of high-throughput datapaths such as video processing, communications baseband, and protocol bridging, while the FCBGA-1152 package provides the pin density needed for the 744 I/O channels and the multi-gigabit transceiver interfaces typical of Stratix III E designs. Typical applications include high-speed digital signal processing in telecommunications equipment, ASIC prototyping, high-performance computing accelerators, broadcast video processing, and high-bandwidth serial protocol interfaces. Industrial-grade temperature operation also suits factory automation controllers and medical imaging back-end pipelines. Designers should plan PCB layout for the FCBGA-1152 package using a multi-layer PCB with controlled-impedance routing for high-speed I/O and adequate thermal vias under the package to manage power dissipation. Use the Quartus II design software for synthesis, place-and-route, and timing closure, and verify pin assignments and I/O standard support against the device handbook. This page synthesizes distributor inventory and pricing, drop-in Stratix III E alternatives, and practical design considerations that go beyond the manufacturer handbook. All data is anchored to distributor and manufacturer sources current as of 2026-09-09.

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