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EP3SE50F484C3 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera
EP3SE50F484C3

EP3SE50F484C3 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera

The Intel / Altera EP3SE50F484C3 is a high-density Stratix III E FPGA with 47,500 logic elements, 296 user I/Os, and 5,760 Kbits of embedded memory, housed in a 484-ball FineLine BGA package. It is built on TSMC's 40 nm process and is positioned as a low-power, high-performance mid-range member of the Stratix III Enhanced family, suitable for ASIC prototyping, high-speed DSP pipelines, and high-bandwidth interface bridging. The C3 speed grade with a 0C to 85C commercial temperature range targets cost-sensitive applications that do not require industrial-grade screening. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic through a programmable fabric of logic elements (LEs), embedded memory blocks, DSP blocks, and a programmable interconnect network. FPGAs occupy a unique position between general-purpose processors (CPUs/MCUs) and fixed-function ASICs - more flexible than an ASIC but with deterministic latency and much higher parallel throughput than a microcontroller. The Stratix III E family specifically emphasizes high logic density and DSP performance at lower static power than the prior Stratix II generation, making it well-suited for compute-intensive applications in wireless, video processing, and test equipment. Key features of the EP3SE50F484C3 include up to 800 MHz internal operation, 19 of the 24 available high-speed transceivers supported by the die (package-dependent), dedicated hardware multipliers and DSP blocks, and TriMatrix embedded memory supporting true dual-port RAM, simple dual-port RAM, and shift-register configurations. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. The architecture uses an 8-input adaptive logic module (ALM) that combines the flexibility of LUT-based logic with arithmetic carry chains, allowing designers to map legacy 4-input LUT designs efficiently while gaining extra logic capacity for wide datapath functions. MultiTrack interconnect and routing switches are tuned to minimize congestion at high utilization. Typical applications include ASIC prototyping for verification of multi-million-gate designs, high-speed image processing pipelines, wireless baseband processing, and bridging between high-speed serial protocols. The 296 user I/Os and abundant LVDS pairs make the device especially strong for parallel data acquisition cards and high-resolution video frame grabbers. When designing with this device, consider a proper power-sequencing strategy for core and I/O supplies, sufficient decoupling near each power pin, and use of Altera's Quartus II design software (or compatible third-party tools) for synthesis, place-and-route, and timing closure. Thermal management must account for the worst-case junction temperature under maximum toggle rate. This page synthesizes distributor pricing, identical-footprint alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make a faster, more informed decision on this legacy Stratix III E part.

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EP3SE50F484C3G - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
EP3SE50F484C3G

EP3SE50F484C3G - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel

The Intel (Altera) EP3SE50F484C3G is a high-density Stratix III E Field-Programmable Gate Array with 47,500 logic elements, 5,760,000 bits of embedded memory, and 296 user I/O pins, housed in a 484-ball FineLine BGA (FCBGA) package. The "C3G" speed grade denotes a commercial-temperature 3rd-speed-bin device optimized for moderate timing closure with low power consumption. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be programmed after manufacturing to implement custom digital functions. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs (lower NRE cost, higher unit cost) and microcontroller/DSP cores (lower flexibility). The Stratix III family belongs to the high-performance tier, adding dedicated DSP blocks, high-speed transceivers, and large on-chip RAM to the basic FPGA fabric. Key features of the EP3SE50F484C3G include 47.5K adaptive logic modules (ALMs), 2,304 Kbits of M9K memory and 1,888 Kbits of M144K block memory, up to 296 user I/O pins, 384 18x18 multipliers, and 4 PLLs supporting multiple clock domains. Programmable Power Technology allows unused logic to be disabled, reducing static power by up to 50% versus previous generations. The Stratix III E family uses TSMC's 65 nm low-power process with a 1.1V core, achieving clock rates above 500 MHz in pipelined DSP designs. The 484-ball FCBGA package is wire-bond, supports 1.0 mm ball pitch, and provides multiple high-speed serial transceiver lanes (model-dependent). Configuration is supported through JTAG, passive serial, fast passive parallel, and dedicated configuration pins. Typical applications include high-performance DSP for wireless baseband, radar and beamforming, ASIC prototyping and emulation, high-speed packet processing in networking line cards, video broadcast and image processing pipelines, and military/aerospace signal processing. The wide parallel I/O count makes the EP3SE50 suitable for memory-rich data-acquisition systems where the 5.76 Mbit embedded RAM can buffer multiple video frames. When designing with the EP3SE50F484C3G, allocate at least eight layers for PCB routing to escape the 1.0 mm-pitch BGA cleanly. Use Altera's Quartus II design suite (version 13.0 or earlier for full Stratix III support) for synthesis, place-and-route, and power analysis. Engineers migrating to newer Stratix V/10 families should plan a re-validation cycle, as the Stratix III is in its final lifecycle phase. This page consolidates distributor pricing, packaging details, drop-in same-package alternatives, and reference designs that complement, but do not replace, the official Intel Stratix III Device Handbook and per-pin datasheets.

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EP3SE50F484C3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
EP3SE50F484C3N

EP3SE50F484C3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel

The Intel EP3SE50F484C3N is a Stratix III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 2,304 Kbits of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine Ball-Grid Array (FBGA) package. It is built on a TSMC 40 nm low-power process and operates with internal logic frequencies up to 717 MHz (per distributor listings) or 800 MHz (per DigChip), with transceiver rates that historically extend to 6.375 Gbps on Stratix III GT variants. An FPGA is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. The Stratix III E family is positioned in the high-performance tier of Intel's (formerly Altera) mid-2000s/early-2010s programmable logic portfolio, targeting ASIC-prototype, signal-processing, and high-bandwidth telecom applications. Within the broader taxonomy, this part sits at: FPGA -> programmable logic device -> ASIC alternative -> semiconductor IC. Key features include 1,900 Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs) with a register-rich architecture, MultiTrack interconnect for predictable timing closure, and dedicated DSP blocks and TriMatrix memory blocks. The device also includes high-speed serial transceivers for chip-to-chip and backplane serial links, along with embedded hard IP controllers such as PCIe, DDR, and Ethernet MACs. The 484-ball FBGA package supports the high pin-count needed for 296 user I/Os plus dedicated configuration, clock, and transceiver pins. Architecturally, Stratix III E uses a programmable-power technology with logic regions that can be set to high-performance or low-power modes, allowing designers to trade timing margin for dynamic power consumption. The ALM structure (eight inputs per ALM, two outputs) provides higher logic utilization than the older 4-input LUT architecture, while the MultiTrack interconnect offers rows, columns, and direct-link paths for deterministic routing delays. Configuration is via the standard passive-serial, fast passive-parallel, fast active-serial, or JTAG modes using Altera/Intel Quartus II design software. Typical applications include high-performance ASIC prototyping, DSP pipelines (radar, medical imaging, software-defined radio), high-throughput data acquisition, broadcast video processing, and 10G/40G telecom backplanes. The combination of DSP blocks, transceivers, and on-chip memory makes it well-suited for real-time baseband processing in wireless base stations. When designing with this device, use the latest Quartus II software version that supports Stratix III (typically Quartus II v13.1 or the Intel Cyclone/Stratix support add-on) and validate timing closure with the TimeQuest timing analyzer. PCB layout for a 484-ball 1.0 mm-pitch FBGA demands microvia stack-up and 50 ohm controlled-impedance routing on high-speed transceiver traces. This page synthesizes distributor pricing, cross-brand drop-in equivalents from within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.

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EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel
EP3SE50F484C4

EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

Intel EP3SE50F484C4 is a Stratix III E family field-programmable gate array (FPGA) delivering 47,500 logic elements, 5,760 Kbits of embedded memory, and 296 user I/Os in a 484-ball fine-pitch BGA (FBGA-484, FCBGA) package. The device combines high logic density with 8.5 Gbps transceiver capability and dedicated DSP blocks, targeting performance-critical digital signal processing, telecommunications, and ASIC-prototyping applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing configurable logic blocks (XIbs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured after manufacturing, enabling rapid prototyping, in-field upgrades, and low-volume production runs. Key features of the EP3SE50F484C4 include 47,500 logic elements, 5,760 Kbits embedded memory (M9K/M144K TriMatrix blocks), 384 18x18 multipliers, eight 8.5 Gbps transceivers, and 296 user I/Os. The device supports DDR3 memory interfaces up to 800 MHz memory clock and integrates eight fractional PLLs for precise clock synthesis. Operating from 0.85V core supply with 0.9V VCC, the Stratix III E process minimizes dynamic power. Architecturally, Stratix III E FPGAs use a logic-element structure with 8-input adaptive logic modules (ALMs), allowing up to 1.7x the logic capacity of prior generations. Each ALM contains two adaptive LUTs, two dedicated adders, and shared arithmetic chains, ideal for DSP pipelines. The MultiTrack interconnect fabric provides deterministic timing with low skew across long routing distances. Typical applications include 40G/100G Ethernet line cards, wireless baseband processing, high-speed digital signal processing (software-defined radio, radar, medical imaging), ASIC prototyping, and high-performance computing accelerators. The combination of high logic density and 8.5 Gbps transceivers makes the EP3SE50F484C4 especially suited to wireline communication infrastructure and high-bandwidth signal acquisition. When designing with this FPGA, ensure proper power-rail sequencing (3.3V then 1.0V/0.85V core), use Intel's Quartus II design suite (Stratix III device support), and respect thermal design power (TDP) budgets. The FBGA-484 package requires careful PCB layout with controlled-impedance traces for transceiver channels and adequate decoupling to manage simultaneous switching noise (SSN) on the 296 user I/Os.

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EP3SE50F484C4G - 47,500 LE FPGA | Intel | Digital Systems
EP3SE50F484C4G

EP3SE50F484C4G - 47,500 LE FPGA | Intel | Digital Systems

Intel EP3SE50F484C4G is a Stratix III E field-programmable gate array with 47,500 logic elements, 19,000 adaptive logic modules, 5.49 Mbit embedded memory, and 296 I/O in a 484-ball FCBGA package. The verified operating supply voltage is 1.1 V, while its commercial temperature range spans 0 °C to +85 °C. This combination places the device in Intel's high-density FPGA hierarchy, between programmable logic and system-level digital integration. Engineers can use it for datapaths, control logic, protocol processing, and other designs requiring configurable hardware and substantial parallel I/O. A field-programmable gate array, or FPGA, is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and I/O elements. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The hierarchy is FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Stratix III E devices combine programmable fabric with embedded resources, allowing engineers to implement parallel processing and changing interfaces without requiring a custom mask set. Their configuration flexibility is especially useful when algorithms, protocols, or system requirements are still evolving. The EP3SE50F484C4G provides 47,500 logic elements, 19,000 adaptive logic modules, 5.49 Mbit embedded memory, and 296 I/O. It operates from a 1.1 V supply and is specified from 0 °C to +85 °C. The high logic capacity supports complex control and data-processing functions, while 296 I/O provide many connections for external memories, converters, processors, and high-speed interfaces. The package is identified as 484-BBGA, FCBGA and is suitable for surface-mount assembly. Its architecture is built around programmable adaptive logic modules connected by configurable routing. Embedded memory supports data buffering, register files, lookup tables, packet storage, and other localized state functions. The FPGA fabric can implement parallel datapaths and deterministic control logic, but power, timing, I/O banking, configuration, signal integrity, and pin assignment must be evaluated in the target design. The 1.1 V operating supply also requires compatible voltage regulation and power sequencing. Typical applications include industrial automation controllers, communications equipment, digital signal processing, test and measurement systems, networking equipment, and medical monitoring hardware. In these systems, the 47,500 logic elements can implement multiple control and processing blocks, while 296 I/O can connect field buses, memory, converters, and management interfaces. The commercial +85 °C maximum is suitable for controlled commercial and industrial environments, but it does not establish an extended-temperature or automotive qualification. The principal design trade-off is that an FPGA adds configuration complexity and requires a supported design flow, power analysis, timing closure, and careful PCB implementation. A 484-ball FCBGA also demands advanced assembly and controlled routing. Designers should verify unused-pin behavior, configuration circuitry, I/O standards, memory implementation constraints, and thermal performance against the manufacturer documentation before release. This page combines verified distributor specifications, sourcing context, package-aware comparisons, and practical engineering notes. Only exact EP3SE50F484C4G values are presented as confirmed; unprovided electrical, timing, compliance, and alternative-part details are not inferred.

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EP3SE50F484C4L - 47.5K LE Stratix III E FPGA 484-FBGA | Intel
EP3SE50F484C4L

EP3SE50F484C4L - 47.5K LE Stratix III E FPGA 484-FBGA | Intel

The Intel (formerly Altera) EP3SE50F484C4L is a high-density Stratix III E FPGA with 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 296 user I/Os in a 484-ball FC-FBGA package. The -4 speed grade targets performance-oriented designs, the 'C' prefix indicates a commercial temperature grade of 0°C to +85°C, and the 'L' suffix denotes a lead-free finish. Per the Stratix III Device Handbook, the device is built on TSMC's 65nm process and supports up to 5,760 Kbits of embedded memory and 384 (18x18) hardware multipliers. What is a Stratix III FPGA? Stratix III is Intel's third-generation 40nm/65nm high-performance FPGA family targeted at ASIC prototyping, high-speed DSP, and high-bandwidth I/O applications. Stratix III E devices specifically emphasize logic density, memory, and DSP resources, while Stratix III GX variants add transceivers. Within the Stratix family hierarchy, Stratix III sits between Stratix II and Stratix IV/V, representing a programmable-logic platform rather than a fixed-function ASIC. Key features of the EP3SE50F484C4L include 47,500 logic elements, 1,900 LABs, 384 embedded 18x18 multipliers, 4.4 Mbits of MLAB memory plus dedicated M9K/M144K block memory, 12 PLLs, and 296 maximum user I/Os. The device supports high-performance external memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2) via soft memory controllers, with a typical core voltage of 0.9V and supported I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. Architecturally, the EP3SE50F484C4L uses the adaptive logic module (ALM) introduced in Stratix III, providing 8-input fracturable look-up tables that improve effective logic utilization versus older 4-LUT architectures. Programmable Power Technology allows unused logic, memory, and DSP blocks to be disabled at runtime, reducing static power by up to 50% compared with Stratix II in equivalent designs. Typical applications include ASIC prototyping and emulation platforms, high-performance DSP (radar, medical imaging, software-defined radio), high-speed serial protocol bridging, video broadcast processing, and industrial test/measurement instrumentation. Designers often pair the part with external DDR3 memory and a high-speed ADC/DAC front end. When designing with this device, validate the Quartus II / Quartus Prime fitter results carefully because the -4 speed grade with 484-ball FC-FBGA cooling envelope can drive junction temperatures to the upper limit of the 0°C to +85°C commercial grade. Plan thermal copper pours and use Altera's PowerPlay early power estimator before layout finalization. This page synthesizes distributor pricing, drop-in alternative MPNs (same 484-ball FC-FBGA package), and practical Quartus design notes not consolidated in the manufacturer datasheet.

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EP3SE50F484C4LG - Stratix III E FPGA 47.5K LE | Intel | 484-FCBGA
EP3SE50F484C4LG

EP3SE50F484C4LG - Stratix III E FPGA 47.5K LE | Intel | 484-FCBGA

The Intel (formerly Altera) EP3SE50F484C4LG is a Stratix® III E family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 2,886 Kbits of embedded memory (M9K + M144K blocks), and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package at 23x23 mm. It is built on a 40 nm TSMC process and targets high-performance digital signal processing, parallel processing, and high-bandwidth data-path applications where the Stratix III transceiver-rich (E) variant delivers superior DSP throughput compared with the logic-only Stratix III GX variants. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/ALMs) connected by a programmable interconnect fabric, allowing hardware designers to program arbitrary digital logic, memory, and DSP functions after manufacture. FPGAs sit within the broader taxonomy: programmable logic device (PLD) → FPGA → high-end SRAM-based FPGA → DSP-optimized FPGA. Stratix III E parts are positioned above the Cyclone family for cost-optimized designs and below the Stratix V family for newer 28 nm designs, making them the workhorse mid-range DSP FPGA of the late-2000s generation. Key specifications include 19,000 ALMs, 47,500 LEs, 5.49 Mbits total embedded memory, 384 18x18-bit hardware multipliers, 4 PLLs, and a maximum user I/O count of 296. The device operates from a 1.1 V core supply, supports I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and offers a -4 speed grade with the C4 commercial temperature grade (0°C to +85°C). The L suffix indicates a lead-free, RoHS-compliant package finish. Architecturally, the Stratix III E family leverages a programmable-power technology that allows unused logic and interconnect to enter a low-power state, dramatically reducing static power compared with prior Stratix II designs. The combination of high memory-to-logic ratio and abundant dedicated multipliers makes it well-suited to video processing, software-defined radio, and high-speed instrumentation where parallel DSP pipelines are required. Typical applications include wireline telecom baseband processing, software-defined radio (SDR) baseband, video broadcast encoding/decoding, high-speed serial protocol bridging, ASIC prototyping, and high-performance computing accelerators. Designers targeting Stratix III typically pair the device with external DDR2/DDR3 memory controllers and high-speed LVDS links for data acquisition. When designing with the EP3SE50F484C4LG, plan for an Altera/Intel Quartus II design-flow license (version 11.0 or later), use the FCBGA-484 land pattern from the package specification document, and provide a minimum of 8-layer PCB stackup with continuous ground planes under the BGA to manage simultaneous-switching-noise (SSN) on the 296 I/O pins. This page synthesizes distributor pricing, same-brand drop-in speed/temperature/package alternatives, and practical PCB-thermal-design notes not found on a single manufacturer datasheet page.

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EP3SE50F484C4LN - Stratix III E FPGA, 47.5K LEs, 484-FBGA | Intel
EP3SE50F484C4LN

EP3SE50F484C4LN - Stratix III E FPGA, 47.5K LEs, 484-FBGA | Intel

The Intel EP3SE50F484C4LN is a Stratix III E field-programmable gate array (FPGA) fabricated in a 40 nm low-power CMOS process, delivering 47,500 logic elements, 2,304 Kbits of embedded memory, and 296 user I/Os in a 484-ball FineLine BGA (FCBGA) package. The device integrates 1900 LABs/CLBs, 384 18x18 multipliers, and high-speed transceivers supporting up to 6.375 Gbps, making it suitable for high-bandwidth signal-processing applications. Operating from a 0.85 V to 1.1 V core supply with industrial temperature grade, it targets performance-critical systems where power efficiency and density matter. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O serializers can be programmed by the end user to implement custom digital functions. FPGAs sit between fixed-function ASICs (highest performance, highest NRE) and microcontrollers (programmable software, lower throughput), occupying the high-throughput parallel-processing niche. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device within the digital IC category, and the Stratix III family specifically targets high-end signal processing and protocol bridging. The 'E' suffix denotes the enhanced-logic variant with lower static power than the base Stratix III family, and the 'L' suffix indicates a lead-free, RoHS-compliant package. Key features include 47,500 logic elements arranged in 1900 LABs, 2,304 Kbits of embedded RAM organized as M9K/M144K blocks, 384 hard 18x18 multipliers for DSP, and up to 12 transceivers at 6.375 Gbps per channel. The device supports DDR3 interfaces up to 800 MHz memory clock via dedicated PHY blocks, and offers 8 PLLs for clock management. Configuration is supported through fast passive parallel (FPP), active serial (AS), or JTAG modes using industry-standard configuration devices. The EP3SE50F484C4LN's architecture combines the Quartus II design-software toolchain, adaptive logic modules (ALMs) with 8-input fracturable look-up tables, and per-channel transceiver equalization, enabling it to bridge parallel processing with multi-gigabit serial links in a single chip. Compared to the older Stratix II, the Stratix III E cuts dynamic power by approximately 50% at the same performance level thanks to the 40 nm process and programmable power technology. Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, broadcast video processing, medical imaging, and high-end test and measurement equipment. Designers also deploy Stratix III E in radar signal-processing arrays and telecom protocol bridging where the combination of DSP density and high-speed serial I/O is critical. When designing with the EP3SE50F484C4LN, ensure proper decoupling on all core and I/O supply rails (typically 1.0 V VCCHIP, 1.5 V/1.8 V VCCPD, and 2.5 V/3.3 V VCCIO), use 1 oz copper pours for ground, and follow Intel's PCB-layout guidelines for transceivers to maintain signal integrity at multi-gigabit data rates. The device is sensitive to power-rail sequencing - consult the datasheet for the required power-up order to avoid latch-up. This page synthesizes distributor pricing, Stratix III E family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, enabling engineers to compare options and make sourcing decisions in a single view.

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EP3SE50F484C4N - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera
EP3SE50F484C4N

EP3SE50F484C4N - Stratix III E FPGA, 47.5K LE, 484-FBGA | Altera

The Altera (Intel) EP3SE50F484C4N is a high-performance Stratix III E family Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 296 user I/Os, and 5,760 Kbits of embedded memory, housed in a 484-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm process technology with a 1.1 V core voltage, the device delivers up to 450 MHz maximum operating frequency with 1,900 Logic Array Blocks (LABs). An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which also include SPLDs and CPLDs. Compared to ASICs, FPGAs offer rapid prototyping and in-field reconfigurability, while modern high-end FPGAs like the Stratix III E integrate hard IP cores (transceivers, memory controllers, DSP blocks) that compete with mid-range DSP and ASSP devices in performance-per-watt. The Stratix III E family specifically targets high-speed parallel processing, telecom backplanes, and signal-processing applications. Key features of the EP3SE50F484C4N include 47,500 logic elements, 5,760 Kbits embedded RAM, 1,900 LABs, 296 user I/O pins, and 4 PLLs for clock management. The device integrates dedicated DSP blocks optimized for high-speed arithmetic operations and supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL for flexible board-level integration. Programmable via JTAG and supported by the Quartus II design suite, the device offers robust configuration options. Architecturally, the Stratix III E FPGA uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables (LUTs), enabling efficient implementation of arbitrary logic functions. The 65 nm low-k dielectric process reduces power consumption by up to 50% compared to the previous Stratix II generation while maintaining timing margin. The device supports partial reconfiguration and dynamic phase alignment for clock domains. Typical applications include high-performance digital signal processing (DSP), telecom baseband processing, high-speed serial protocol bridges, military radar and signal intelligence systems, ASIC prototyping, and high-throughput data acquisition. The 484-ball FC-FBGA package supports board densities required for industrial and aerospace signal-processing cards. Designers should note the 484-ball BGA package requires careful PCB layout with microvia or via-in-pad technology, controlled-impedance routing, and matched-length differential pairs for LVDS interfaces. Power-rail decoupling must follow the Stratix III E PowerPlay early-power estimator guidelines to manage inrush current during configuration. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the Stratix III E FPGA, providing engineering context not consolidated in the manufacturer datasheet.

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EP3SE50F484I3 - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel
EP3SE50F484I3

EP3SE50F484I3 - Stratix III E FPGA, 47.5K LE, 484-FCBGA | Intel

The Intel (formerly Altera) EP3SE50F484I3 is a Stratix III E family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 296 user I/Os, and 5,760 Kbits of embedded memory in a 484-ball FineLine BGA (FCBGA) package. Built on TSMC's 65 nm low-power process, this FPGA operates at a core voltage of 1.1 V and supports transceiver-rich designs targeting high-speed serial I/O and DSP-intensive applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP resources. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the integrated circuit (IC) hierarchy as high-density digital ICs. Stratix III devices specifically target high-performance, low-power designs requiring hundreds of thousands of logic gates and multi-gigabit transceivers for wired communications, signal processing, and ASIC prototyping. The EP3SE50F484I3 variant carries the 'E' (Enhanced) feature set and the 'I3' industrial temperature grade, supporting -40 °C to +100 °C ambient operation. Key features include 47,500 Logic Elements (LEs), 1,900 LABs, 5,760 Kbits of embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers supporting multi-gigabit serial protocols, and programmable I/O standards including LVDS, LVCMOS, LVTTL, HSTL, and SSTL. The device also integrates hard memory controllers, PLLs for clock management, and configuration support via JTAG, passive serial, or fast passive parallel modes. The Stratix III E architecture combines the Adaptive Logic Module (ALM) with eight-input fracturable look-up tables, delivering higher effective logic density than previous generations. The 65 nm process technology balances performance and static power consumption, while the 'I3' speed/temperature grade optimizes the device for industrial temperature ranges and -3 speed-bin timing closure, offering higher Fmax than the C4/C3 commercial grades. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, SRIO), wireless baseband processing, software-defined radio (SDR), video broadcast infrastructure, radar and signal processing systems, and ASIC prototyping platforms. Its combination of logic density, embedded transceivers, and DSP resources makes it well suited for prototyping and low-volume production designs. When designing with this device, ensure the PCB footprint is laid out for the 484-ball FCBGA with 1.0 mm ball pitch, and verify that the FPGA configuration mode (AS, PS, FPP, JTAG) is properly strapped. The Stratix III E family requires careful signal-integrity analysis for multi-gigabit transceivers and a robust power-delivery network across 0.9 V, 1.1 V, 1.8 V, 2.5 V, and 3.3 V rails. This page synthesizes distributor pricing, Stratix III E drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.

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EP3SE50F484I3G - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I3G

EP3SE50F484I3G - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

The Intel EP3SE50F484I3G is a high-density, high-performance Stratix III E family Field Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Chip-Scale BGA (FCBGA) package. It integrates 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 5.49 Mbits of embedded memory, with 296 user I/O pins and an operating supply voltage of 1.1 V. The device is specified over the industrial -40C to +100C temperature range and is targeted at high-end digital signal processing, ASIC prototyping, and communications infrastructure designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose interconnect, logic fabric, and I/O behaviour are configured by a customer-supplied configuration bitstream after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic devices -> integrated circuits -> semiconductors, and the Stratix III E family is Intel's (formerly Altera's) high-performance 65 nm node targeting DSP, memory-rich, and high-speed transceiver applications. Key features include 47,500 logic elements / 19,000 ALMs, 5.49 Mbits of embedded block RAM (e.g., M9K blocks), support for up to 296 user I/Os, and a 1.1 V core supply. The Stratix III E device integrates dedicated DSP blocks, embedded memory, and high-speed serial transceiver support (via separate GX variants), making it well suited to signal-processing pipelines. The FCBGA-484 package offers a fine-pitch, low-inductance interconnect for high-speed parallel interfaces. Architecturally, the device is built on a 65 nm low-power CMOS process and uses logic-array-block (LAB) tiling with adaptive logic modules that combine fracturable LUTs, dedicated carry chains, and register files. Configuration is stored in SRAM cells, allowing unlimited re-programmability in the field. The Stratix III E family also adds enhanced SEU mitigation features (CRC, parity, scrubbing IP), which is critical for telecom and aerospace applications. Typical applications include high-throughput DSP (radar, software-defined radio, video broadcast processing), ASIC prototyping and emulation, high-speed networking line cards, test and measurement back-end processing, and military/aerospace signal processing. The Stratix III E family is also frequently used in medical imaging front-ends and high-end industrial imaging systems where low-latency parallel processing is required. When designing with this device, verify power-rail sequencing, decoupling, and thermal dissipation early. The 484-ball FCBGA package has specific via-in-pad and thermal via requirements, and the Quartus II / Quartus Prime toolchain must be used for synthesis, place-and-route, and timing closure. PCB stack-up should be tuned for the LVDS and DDR memory interface rates used. This page synthesizes distributor pricing across DigiKey, Mouser, and authorized brokers, drop-in same-package alternatives drawn from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.

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EP3SE50F484I3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
EP3SE50F484I3N

EP3SE50F484I3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel

The Intel (Altera) EP3SE50F484I3N is a high-density Stratix III E field-programmable gate array (FPGA) containing 47,500 logic elements, fabricated on a 65 nm process, and housed in a 484-pin flip-chip BGA (FC-FBGA) package. It supports user I/O counts up to 296, delivers up to 5,760,000 bits of embedded memory, and runs at core voltages of 0.9 V (VCC) and 1.1 V (VCCAUX), with internal performance capable of up to 500 MHz fabric operation. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, and on-chip memory into a single IC that can be reconfigured by the end user. Within the broader semiconductor taxonomy, an FPGA sits below application-specific standard products (ASSPs) and above simple CPLDs in complexity, and belongs to the programmable logic family that complements fixed-function ASICs when time-to-market or post-deployment reconfigurability matter. Key features of the EP3SE50F484I3N include 1,900 LABs (logic array blocks) arranged across the fabric, integrated transceivers supporting high-speed serial I/O, embedded multipliers for DSP, and the Stratix III E partial-reconfiguration flow. The -I3 speed grade denotes an industrial operating temperature with a specific timing closure bin, and the N suffix indicates lead-free / RoHS-compliant packaging. The 484-BGA package supports high pin density for signal integrity and is paired with a flip-chip substrate that improves thermal dissipation relative to wire-bonded BGA predecessors. Architecturally, Stratix III E devices use a logic-element based fabric with dedicated carry chains, MLAB memory blocks, M9K/M144K block RAM, and DSP blocks optimized for high-performance signal processing. The Altera Quartus II design suite is the primary toolchain; designers target the device through VHDL, Verilog, or SystemVerilog and validate timing with TimeQuest. Partial reconfiguration is supported for applications that need to swap logic regions while the rest of the device continues operating. Typical applications include high-performance digital signal processing in wireless baseband cards, ASIC prototyping, wireline telecom line cards, military and aerospace signal conditioning, medical imaging front-ends, and industrial high-speed control. The industrial temperature grade also opens use cases such as factory-floor test instrumentation and outdoor telecom equipment. When designing with this part, note that Stratix III is a legacy node and is no longer recommended for new designs; users should validate lifecycle status against current Intel FPGA product roadmaps and consider Cyclone V, Arria V, or newer families for new projects. This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle context, and Quartus II design considerations not found in any single distributor listing.

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EP3SE50F484I4 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I4

EP3SE50F484I4 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3SE50F484I4 is a Stratix III Enhanced-family field-programmable gate array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, manufactured on a 65 nm CMOS process node and specified for industrial temperature operation. It integrates approximately 47,500 logic elements (LEs), 1,900 logic array blocks (LABs), 2.13 Mbits of embedded memory, and 296 user I/O pins, with a core voltage of 1.1 V and operating frequencies up to 450 MHz. The device is positioned as a mid-density, performance-oriented member of the Stratix III E line, balancing logic capacity, DSP blocks, and transceiver-free general-purpose I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by user configuration data loaded into on-chip SRAM rather than by hard-wired masks during fabrication. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside CPLDs, and below ASICs in the volume-vs-flexibility trade-off. The Stratix III generation succeeded Stratix II by introducing a tiered-architecture family (L, E, GX) that splits power-efficient logic from transceivers, allowing designers to choose the lowest-cost member that meets system requirements. FPGAs are commonly used to implement high-throughput parallel datapaths, custom interface bridges, signal-processing pipelines, and prototype ASICs. Key features of the EP3SE50F484I4 include support for up to 384 Kbits of distributed RAM, up to 1.625 Mbits of M9K block RAM (variable in family datasheets), and dedicated 18x18 multipliers for DSP applications. The 484-ball FBGA package provides a compact 23x23 mm footprint suitable for high-density board designs while preserving signal integrity through controlled-impedance ball-grid routing. Industrial-grade (-40 C to +100 C junction) screening, denoted by the I4 speed/temperature grade, makes the part appropriate for telecom, industrial automation, test and measurement, and military/aerospace prototypes. The architecture relies on 8-input adaptive logic modules (ALMs), programmable interconnects with tri-matrix routing, and on-chip phase-locked loops for clock management. Compared with Stratix II, Stratix III devices introduced programmable power technology that dynamically turns off unused logic to reduce static consumption by roughly 50 percent. For designs targeting high DSP throughput, the SE family contains dedicated hardware multiplier/accumulator blocks that outperform fabric-only implementations by an order of magnitude. Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2, SATA, GigE), digital signal processing for radar and software-defined radio, ASIC prototyping, broadcast video processing, and high-performance custom compute engines. In telecom line cards, the EP3SE50F484I4 typically interfaces DDR2/DDR3 memory controllers and multi-gigabit transceivers on adjacent Stratix III GX devices. In test and measurement, the abundant LABs and block RAM implement real-time correlators and FFT engines. When designing with this FPGA, attention to power sequencing (1.1 V core, 2.5 V/3.0 V aux, 1.5 V/1.8 V I/O banks) and to decoupling (low-ESL ceramics placed within the BGA field) is essential. Designers should also validate thermal dissipation through the 484-ball FC-FBGA exposed-pad variant chosen by their PCB layout, and confirm Quartus II support for the I4 speed grade before committing to layout. This page consolidates distributor pricing, drop-in same-package and same-family alternatives, and design notes drawn from the Stratix III datasheet that are not always surfaced on distributor listings, helping engineers accelerate component selection and verification.

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EP3SE50F484I4G - Stratix III E FPGA 47.5K LE, 484-FCBGA | Intel
EP3SE50F484I4G

EP3SE50F484I4G - Stratix III E FPGA 47.5K LE, 484-FCBGA | Intel

The Intel (formerly Altera) EP3SE50F484I4G is a Stratix III E family Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 5.49 Mbit of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. The 'I4' suffix denotes the industrial temperature grade (-40C to +100 C) and speed grade 4, while the trailing 'G' indicates lead-free / RoHS-compliant terminal finish. According to distributor listings, this device targets high-performance digital signal processing, high-speed serial I/O, and memory-intensive applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement custom digital hardware. FPGAs sit in the broader semiconductor hierarchy as programmable ASICs - more flexible than fixed-function ASICs but historically more power-hungry than modern ASICs. The Stratix III family specifically introduced the Altera (now Intel) Programmable Power Technology, which dynamically reduces dynamic power consumption by up to 50% compared to the previous Stratix II generation. Key features include 47,500 logic elements organized in ALMs, 5.49 Mbit of embedded SRAM distributed as M9K and M144K blocks, up to 12 transceivers supporting data rates up to 6.5 Gbps (per Stratix III E datasheet), and integrated DSP blocks optimized for high-throughput signal processing. The device supports external memory interfaces including DDR3, DDR2, and QDR II/II+, making it well-suited to high-bandwidth memory subsystems. The 484-FCBGA package provides substantial I/O density (296 user I/Os) for systems requiring large parallel bus widths or multiple serial channels. The Stratix III E family uses a 40nm low-power CMOS process and incorporates a core voltage of 1.1 V with auxiliary supplies for I/O and transceiver banks. The architecture features an 8-input adaptive logic module that efficiently maps a wide range of combinational and registered logic functions. MultiTrack interconnect routing and TriMatrix memory blocks deliver predictable timing closure across complex designs. Typical applications include high-performance digital signal processing in wireless base stations, real-time video processing and encoding, high-speed data acquisition systems, radar and sonar processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large embedded memory makes Stratix III E devices a common choice for telecommunications infrastructure and broadcast video equipment. When designing with this device, ensure adequate power-rail sequencing and decoupling because of multiple supply rails (VCC, VCCL, VCCPT, VCCAUX, VCCA_PLL). For high-speed transceiver channels, follow Intel's Stratix III PCB layout guidelines for differential via design, AC-coupling capacitor placement, and reference plane stitching to maintain signal integrity at multi-Gbps data rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SE50F484I4G that are not assembled in a single location in the manufacturer datasheet.

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EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I4L

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

The Intel EP3SE50F484I4L is a member of the Stratix III E family of high-performance, low-power FPGAs (Field-Programmable Gate Arrays) fabricated on a 40 nm CMOS process, delivering 47,500 logic elements in a 484-ball FineLine BGA (FBGA) package with 296 user I/Os. It is offered in the speed grade 4 (slowest), industrial temperature range, and lead-free (L) variant, suitable for cost-optimized, thermally benign designs where maximum performance headroom is not required. The device integrates 1,900 LABs (Logic Array Blocks), 6.39 Mbit of embedded memory (M9K + MLAB), and 384 (18x18) hardware multipliers for DSP workloads. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined by the customer after manufacture, using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit hierarchically between standard logic ICs (fixed function, cheapest per gate) and ASICs (custom silicon, lowest unit cost at very high volume). The Stratix III family is positioned in the high-end, mid-density tier - above entry-level Cyclone devices but below the largest Stratix V/10/Agilex families - and targets applications such as ASIC prototyping, high-speed DSP, and communications infrastructure. Key features of the EP3SE50F484I4L include a maximum core clock of 717 MHz (per third-party listings), 12 transceiver-like PLLs (per Stratix III E family literature), 24 global clock networks, and partial reconfiguration support. The FBGA-484 package enables dense board routing and supports up to 296 user I/O pins with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) per the Stratix III device handbook. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) of eight inputs, allowing finer-grained packing than the 4-input LUT of older families. The 40 nm process node combined with programmable power technology enables lower static power than the prior Stratix II generation while preserving transceivers and DSP density. Typical applications for this device include ASIC prototyping and emulation, high-speed DSP (radar, video processing), communications infrastructure (bridges, line cards), industrial imaging, and test & measurement backplanes. In systems where a Stratix III E FPGA already exists, the speed grade 4 part is commonly chosen for the lowest unit cost. When designing, verify the I/O voltage bank assignments against the Stratix III Device Handbook pin tables; the -4 speed grade trades roughly 25-30% of Fmax versus -2 grades, so timing closure must be budgeted accordingly in Quartus II. The industrial temperature range (-40C to +100C junction) makes this part suitable for outdoor and factory-floor equipment. This page synthesizes distributor pricing, the Stratix III E family datasheet context, and drop-in alternate speed-grade and pin-compatible variants not all listed on a single manufacturer page.

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EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG

EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel

The Intel EP3SE50F484I4LG is a high-performance Stratix III E Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 5,760,000 embedded RAM bits, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. It is built on TSMC's 40 nm process and is configured for industrial temperature operation (-40C to +100C junction) at a 1.1 V core supply voltage. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs/ALMs) connected via programmable interconnect, allowing hardware designers to implement arbitrary digital logic and parallel processing functions after PCB fabrication. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), differing from CPLDs by offering higher logic density, embedded block RAM, DSP blocks, and high-speed transceiver capability. The Stratix III E family is targeted at high-performance signal processing, high-bandwidth data-path, and high-throughput ASIC prototyping applications where raw logic capacity, on-chip memory, and clocking precision are critical. The EP3SE50F484I4LG integrates 19,000 Adaptive Logic Modules (ALMs), 2,640 Kbits of MLAB memory, 5,760 Kbits of total embedded RAM, 104 DSP blocks (18x18 multipliers), and 8 PLLs. It supports up to 296 general-purpose I/O pins with adaptive logic module architecture and offers a maximum user I/O count that makes it well suited for high-density parallel interface aggregation. Its configuration is via a passive serial, fast passive parallel, or JTAG interface, and it supports design security with 256-bit AES bitstream encryption. The architecture combines ALM-based logic fabric with TriMatrix embedded memory (MLAB + M9K + M144K blocks), dedicated DSP slices, and a rich clock network with up to 16 global clocks plus PLLs. This combination enables efficient implementation of wide datapaths, FFT pipelines, and multi-channel serial interfaces. The device also includes features for signal integrity, such as programmable drive strength, on-chip termination (OCT), and dynamic phase alignment. Typical applications include high-speed ASIC prototyping, wireline telecom line-card processing, radar and baseband signal processing, broadcast video infrastructure, and high-performance DSP co-processing cards. Industrial -40C to +100C operation also suits military/aerospace ground systems and test-and-measurement instrumentation where commercial-grade FPGAs are thermally inadequate. Designers should note the 484-FCBGA ball-grid footprint requires controlled-impedance PCB routing and a multi-layer stack-up with buried microstrip or stripline for high-speed LVDS/SERDES signals. Plan power sequencing for the 1.1 V core, 2.5 V/3.0 V auxiliary, and I/O banks independently, and verify JTAG/AS configuration modes against board-level bring-up flow. Because Stratix III is in Intel's last-time-buy/end-of-life phase, second-source considerations and lifecycle planning should be a procurement priority. This page synthesizes verified distributor stock and pricing, lifecycle status, same-family drop-in variants, and PCB-level design notes that are not consolidated on the manufacturer datasheet or distributor parametric page.

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EP3SE50F484I4LN - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I4LN

EP3SE50F484I4LN - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP3SE50F484I4LN is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine Ball-Grid Array (FBGA) package. It integrates 47,500 logic elements backed by approximately 5.76 Mbits of embedded memory, with 296 user I/Os, and is built on a 65 nm TSMC process targeting 0.9 V core / 1.1 V auxiliary operation. The device is the industrial-grade, lead-free, enhanced-temperature variant of the EP3SE50 family. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable I/O cells, that the designer can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or interface bridging logic. FPGAs occupy a tier between fixed-function ASICs and software-defined microcontrollers in the semiconductor hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix III E parts target high-performance compute, telecoms, and signal-processing designs. Key features include 1,900 LABs, 190 (estimated) embedded 18x18 multipliers supporting DSP, multi-gigabit transceivers, up to 12 PLLs, and hard memory controllers. The 484-FBGA package is the medium-density variant of the Stratix III E family and supports high I/O count at moderate board area. Per the Stratix III Device Handbook, the part supports up to 8.5 Gbps transceivers on selected Stratix III variants; transceiver counts on EP3SE50F484 are 0 because the F484 pinout does not include the transceiver I/O bank. The EP3SE50F484I4LN uses a SRAM-based configuration cell, so it must be configured at each power-on by an external flash or EPCS controller. Configuration schemes include fast passive parallel, active serial, and JTAG. The part operates from -40C to +100C ambient (industrial, indicated by the I4 grade), supporting harsh-environment embedded compute. Typical applications include telecom baseband prototyping, high-speed serial bridging, video processing pipelines, and software-defined radio front-ends. Compared with smaller Cyclone III parts, the EP3SE50 delivers roughly 6x the logic capacity and integrated DSP for compute-bound designs. When designing with the EP3SE50F484I4LN, plan power sequencing so that the 0.9 V VCCINT rail reaches regulation before the 1.1 V/1.2 V VCCAUX and VCCIO rails, and use the Quartus II design suite (Altera/Intel) to verify pinout, fitter, and timing closure. This page synthesizes distributor pricing, drop-in Stratix III E alternatives, and practical Quartus design notes not consolidated on any single distributor page.

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EP3SE50F484I4N - Stratix III E FPGA 47.5K LE FBGA-484 | Intel
EP3SE50F484I4N

EP3SE50F484I4N - Stratix III E FPGA 47.5K LE FBGA-484 | Intel

The Intel (formerly Altera) EP3SE50F484I4N is a high-performance Stratix III E FPGA delivering 47,500 equivalent logic elements (LEs), 2.1 Mbits of embedded memory, 296 user I/Os, and 384 18x18 multipliers, all integrated in a 484-pin FC-FBGA package. Built on TSMC's 65 nm low-power CMOS process with a 1.1 V core supply, the device targets high-throughput DSP, memory-rich bridging, and protocol-rich I/O designs where deterministic performance matters more than absolute logic density. A Field Programmable Gate Array (FPGA) is a reconfigurable logic device in the programmable-logic family, sitting alongside CPLDs and structured ASICs in the broader integrated-circuit taxonomy (FPGA -> programmable logic -> logic IC -> semiconductor). FPGAs combine configurable logic blocks (LUTs), programmable interconnect, dedicated block RAM, DSP blocks, and high-speed transceiver fabrics, allowing post-silicon functional changes without re-spinning the board. The Stratix III generation specifically emphasized lower static power versus Stratix II, achieved through programmable power technology that selectively powers unused logic regions. Key features of the EP3SE50F484I4N include 1,900 LABs (Logic Array Blocks), TriMatrix embedded memory totaling 2,136 Kbits across M9K/M144K blocks, 384 18x18 hardware multipliers for DSP, eight transceiver-like PLLs and 48 global clock networks, and support for external memory interfaces including DDR3, DDR2, and QDR II+ via dedicated PHY blocks. The F484 package variant provides 296 user I/Os distributed across 12 I/O banks, supporting a mix of LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCI Express signaling at data rates to 1.25 Gbps. Typical applications span telecom baseband processing, high-end test and measurement, ASIC prototyping, military and aerospace signal processing, and high-speed serial protocol bridging. Designers select this part when they need Stratix III E logic capacity without transceivers but with rich DSP and memory bandwidth in a moderate-pin-count FC-FBGA package. When designing with this FPGA, plan power-rail sequencing carefully: the core (VCC), analog (VCCA_PLL, VCCAUX), and I/O (VCCIO per bank) supplies have specific ramp-order requirements. Use Intel's Quartus II PowerPlay early power estimator before final pinout commitment to validate thermal envelopes. This page synthesizes current distributor pricing, same-family drop-in alternatives, and practical Stratix III E design notes that go beyond the manufacturer datasheet summary, including I/O bank planning and memory interface frequency trade-offs.

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EP3SE50F780C2 - Stratix III E FPGA, 47.5K LE, 780-FCBGA | Intel
EP3SE50F780C2

EP3SE50F780C2 - Stratix III E FPGA, 47.5K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP3SE50F780C2 is a high-density Stratix III E family FPGA delivering 47,500 logic elements, 488 user I/Os, and 5,760,000 bits of embedded memory in a 780-pin flip-chip BGA (FC-FBGA) package. Built on a 65 nm process with a 1.1 V core, the device operates up to 600 MHz and integrates 488 user I/O pins with 12 transceiver channels, providing high-bandwidth signal processing and connectivity for performance-demanding embedded systems. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacturing using a hardware description language. Stratix III E FPGAs belong to the broader category of programmable logic devices (PLDs) and sit within the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are widely used when ASIC-level performance is required but design iteration flexibility is also essential. Key features of the EP3SE50F780C2 include 1,900 LABs/CLBs, 5.76 Mbits embedded block RAM, 384 DSP blocks (18x18 multipliers) for high-throughput signal processing, and support for DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces. The Stratix III E architecture also integrates a rich fabric of PLLs and clock networks for multi-domain timing closure. Typical applications span telecom baseband processing, high-speed image and video processing pipelines, ASIC prototyping, military/aerospace signal processing, broadcast video encoding, and high-performance computing accelerators. The device's 600 MHz fabric speed combined with 384 DSP blocks enables real-time DSP workloads such as radar pulse compression, OFDM modulation, and forward-error correction. When designing with the EP3SE50F780C2, careful PCB layout is required for the 780-ball flip-chip BGA: 12 transceiver channels must each have controlled-impedance differential routing, and the 1.1 V core requires multiple low-impedance decoupling capacitors near the dedicated supply balls. Engineers should use the Quartus II design suite with the Stratix III device library to ensure timing closure. A typical Stratix III E reference design includes high-speed serial transceivers running at multi-gigabit rates, DDR3 controllers with PHY IP, and partial reconfiguration regions. This product page synthesizes current distributor pricing, pin-compatible drop-in alternatives, and application-level design notes that go beyond the manufacturer datasheet alone.

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EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
EP3SE50F780C2G

EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA

The Intel (formerly Altera) EP3SE50F780C2G is a high-density Stratix III E Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 488 user I/Os, and 5.49 Mbit of embedded memory, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. Built on a 65 nm process, this device operates from a 1.1 V core supply and targets performance-driven applications including high-speed digital signal processing, telecom backhaul, and ASIC prototyping. A Field Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnect, and on-chip memory that can be customized after manufacturing to implement virtually any digital logic function. FPGAs occupy the position of programmable logic devices (PLD) within the broader semiconductor hierarchy: PLD -> ASIC family -> logic ICs -> integrated circuits. Stratix III E FPGAs specifically target DSP and high-throughput memory-intensive workloads with dedicated DSP blocks, embedded TriMatrix memory blocks, and high-speed transceivers. Key features of the EP3SE50F780C2G include 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 5.49 Mbit embedded RAM, 488 maximum user I/Os, and 132 embedded 18x18 multipliers. The device integrates up to 12 embedded transceivers (depending on variant) supporting data rates up to 3.75 Gbps for serial connectivity, and supports DDR2/DDR3 memory interfaces at speeds up to 800 MHz. The C2 speed grade indicates commercial temperature range (0C to +85C) with a moderate timing closure rating. The device's 65 nm low-k process technology and adaptive logic modules (ALMs) deliver a balanced ratio of register-rich to combinational logic, enabling efficient pipelined DSP and parallel datapath designs. Programmable Power Technology allows unused blocks to be powered down, reducing static consumption relative to comparable fixed-logic architectures. Typical applications include high-end ASIC prototyping, wireless baseband processing, high-definition video processing, military radar signal chains, and test & measurement equipment. The 780-ball FCBGA package supports high-density board designs where multi-gigabit transceivers and large memory bandwidth are required. The EP3SE50F780C2G is best suited for designs that can fully exploit its DSP blocks and high pin count rather than simple glue-logic applications where a smaller Cyclone device would be more cost-effective. When designing with this part, ensure adequate thermal management for the FCBGA package - a minimum of four PCB layers with thermal vias under the device is recommended. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the Quartus Prime Lite edition does not support Stratix III and the Quartus II Subscription Edition is required for the final timing closure and programming files. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives from the Stratix III E family, and practical design notes not found on a single distributor product page.

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EP3SE50F780C2N - 47.5K LE Stratix III E FPGA, 780-FCBGA | Intel
EP3SE50F780C2N

EP3SE50F780C2N - 47.5K LE Stratix III E FPGA, 780-FCBGA | Intel

The Intel EP3SE50F780C2N is a high-performance Stratix III Enhanced (E) family Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 47,500 logic elements (LEs) and 5,760,000 bits of embedded RAM in a 780-ball FineLine BGA package. The device operates across a 0.9 V to 1.1 V core supply with transceiver and I/O auxiliary rails, and is rated for commercial temperature operation (C2 speed grade). It is a member of the Stratix III E sub-family, which targets high-end DSP, high-speed serial I/O, and memory-rich designs that outperform the Stratix III L (logic-only) variant by adding dedicated DSP blocks and TriMatrix memory. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, programmable interconnect, and configurable I/O. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, ASSPs, and microcontrollers as building blocks for digital systems. The Stratix III generation introduced the Altera Adaptive Logic Module (ALM) architecture - a finer-grained replacement for the previous 4-input LUT structure - and the EP3SE50F780C2N implements 47,500 ALMs grouped into Logic Array Blocks, with embedded M9K and M144K memory blocks and DSP blocks capable of 600 MHz operation. Key features of the EP3SE50F780C2N include 488 user I/O pins, 12 transceiver channels at up to 6.375 Gbps, hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM2, and a configuration subsystem that supports both passive serial and fast parallel configuration from external flash. The C2 speed grade indicates a moderate speed bin that trades peak Fmax for power efficiency, making the device attractive for designs that prioritize deterministic timing over maximum clock rate. Typical applications include high-bandwidth telecom line cards, ASIC prototyping, military and aerospace signal processing, video broadcast equipment, and high-performance DSP co-processing. The 780-ball FCBGA package provides ample signal escape and thermal performance for systems that dissipate several watts. According to the Stratix III Device Handbook, designers should follow Altera's PowerPlay early power estimation flow and provide a minimum 4-layer PCB stack-up with continuous power and ground planes under the BGA footprint to maintain signal and power integrity. This page synthesizes distributor pricing, Stratix III family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP3SE50F780C3 - Stratix III E FPGA 47.5K LE 780-FBGA | Intel / Altera
EP3SE50F780C3

EP3SE50F780C3 - Stratix III E FPGA 47.5K LE 780-FBGA | Intel / Altera

The Intel (formerly Altera) EP3SE50F780C3 is a Stratix III E family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 488 user I/Os, and 5,760 Kbits of embedded memory in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm process with a 1.1 V core supply and 0.9 V logic, the device supports transceiver speeds up to 500 MHz and is positioned for high-performance digital signal processing and high-bandwidth logic designs. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM (BRAM), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital semiconductors, sitting alongside CPLDs and structured ASICs. The Stratix III E variant emphasizes high logic density and DSP throughput for compute-bound applications where microcontrollers or DSP processors cannot keep pace. Key features include up to 47,500 logic elements, 5,760 Kbits of embedded memory (BRAM), dedicated 18x18 multipliers and DSP blocks for fixed/floating-point acceleration, integrated PLLs for clock management, and 488 general-purpose user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards. The Stratix III E architecture introduces adaptive logic modules (ALMs) for finer-grained packing efficiency compared to the previous Stratix II generation. The EP3SE50F780C3 also integrates transceiver capabilities and partial reconfiguration support, allowing portions of the fabric to be reprogrammed while the remainder of the device continues operation. This is particularly useful for systems requiring firmware updates, A/B redundancy, or runtime algorithm switching. The 65 nm process node balances performance and leakage, though later Intel FPGA families (Stratix IV, V, 10) have since migrated to finer nodes. Typical applications include high-speed digital signal processing for communications infrastructure, military radar and electronic warfare, medical imaging accelerators (CT, MRI, ultrasound), ASIC prototyping, and high-throughput video broadcast equipment. The combination of logic density and DSP blocks makes the device suitable for parallel filter banks, FFT pipelines, and forward-error-correction engines. When designing with this part, verify that the Quartus II design software version (typically Quartus II 9.1 to 13.1 depending on Service Pack) supports the specific device and is licensed for SignalTap or Logic Analyzer features if needed. The 780-ball FC-FBGA package requires a multi-layer PCB with controlled-impedance routing and matched-length traces for high-speed I/O. This page synthesizes distributor pricing, drop-in Stratix III E same-family alternatives, lifecycle notes, and practical design considerations not consolidated in the manufacturer datasheet, supporting engineering and procurement teams working with legacy Altera/Intel FPGA inventory.

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EP3SE50F780C3G - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780C3G

EP3SE50F780C3G - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780C3G is a Stratix III E enhanced family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 5,760,000 embedded memory bits, 488 user I/O, and 19,000 adaptive logic modules (ALMs), housed in a 780-ball flip-chip BGA (FBGA) package. It operates from a core supply of 1.1 V with commercial 0C to +85C temperature grading (C3 speed grade), targeting high-performance digital logic, signal processing, and ASIC prototyping designs. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike a fixed-function ASIC, an FPGA's logic, memory, and I/O behavior are defined after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. In the system hierarchy, an FPGA sits between general-purpose microcontrollers and custom ASICs: microcontrollers run software sequentially, ASICs are hardwired and inflexible, while FPGAs deliver hardware-level parallelism with design-time re-programmability. Key features of the EP3SE50F780C3G include 19,000 ALMs (≈47,500 LEs), 5.49 Mbit embedded RAM (5,760 Kbit), embedded DSP blocks for high-throughput arithmetic, programmable I/O supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and a hard memory controller plus PCML/SE SerDes capability that is characteristic of the Stratix III E transceiver-rich variant. The Stratix III E family is built on TSMC's 40 nm process with a 1.1 V core supply, delivering an optimum balance of performance, density, and power efficiency versus the original Stratix III baseline. The 780-FBGA package uses a flip-chip land-grid-array construction with an exposed heat slug, providing low thermal resistance for high-utilization designs. Engineering trade-offs include routing congestion on dense designs and the requirement for Quartus II / Quartus Prime software and a configuration memory device (typically EPCS or separate flash) to load the bitstream at power-up. Typical applications include high-speed digital signal processing, ASIC prototyping, wireline telecom line cards, military/aerospace signal processing, video broadcast infrastructure, and PCI Express endpoint designs using the embedded transceivers. Compared with newer Stratix V / Stratix 10 families, the Stratix III E is preferred when long-term availability, lower unit cost, or design reuse of existing Quartus II IP matters more than peak performance. When designing with this device, plan for the configuration scheme (Passive Serial, Fast Passive Parallel, Active Serial, or JTAG) and ensure PCB layout uses a minimum 12-layer stack-up with continuous GND/power planes beneath the BGA to control simultaneous-switching-noise on the 488 I/O. Verify thermal headroom using the FPGA power estimator early; the exposed heat slug must be soldered to a thermal via array. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes drawn from the Stratix III handbook, providing information gain beyond what the manufacturer datasheet alone offers.

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EP3SE50F780C3N - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780C3N

EP3SE50F780C3N - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3SE50F780C3N is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 488 user I/Os, and 5.76 Mbits of embedded memory in a 780-ball FineLine BGA package. Built on a 65 nm process with a 1.1 V core, the device targets high-performance digital signal processing, telecom backhaul, and ASIC prototyping workloads where logic density, transceiver bandwidth, and DSP throughput are critical. What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP such as DSP slices, block RAM (BRAM), and high-speed transceivers. FPGAs occupy a position in the programmable logic hierarchy between general-purpose microcontrollers (fixed instruction set, low power) and ASICs (custom silicon, high NRE). Stratix III E sits in Intel's high-performance FPGA family, optimized for signal processing and high-bandwidth I/O. Key features include 1900 Logic Array Blocks (LABs), 432 DSP blocks for fixed- and floating-point arithmetic, 312 embedded 9-Kbit M9K memory blocks, and an aggregate embedded memory of 5.76 Mbits. Per the Intel Stratix III Device Handbook, the EP3SE50F780C3N supports 4 PLLs and 488 maximum user I/Os with LVDS, LVTTL, LVCMOS, and SSTL I/O standards. The C3 speed grade and -3 (typical) commercial temperature grade (0C to +85C) are encoded in the suffix. Architecturally, Stratix III E uses an adaptive logic module (ALM) fabric that packs eight inputs into a lookup-table-based structure, achieving higher effective density than older 4-input LUT architectures. The device integrates hard memory controllers (DDR/DDR2/QDRII), PCIe hard IP blocks, and up to 8.5 Gbps transceivers on selected variants, reducing soft-logic overhead. Typical applications include high-end wireless baseband processing, digital video broadcast equipment, radar signal processing, medical imaging accelerators, and ASIC emulation platforms. The large logic capacity and rich DSP resources make the EP3SE50F780C3N well-suited for FFT pipelines, channelizers, and FEC encoders. When designing with this device, plan for a multi-rail power supply (typically 1.1 V VCC, 2.5 V VCCAUX, and per-bank VCCIO) and ensure thermal management can dissipate the 8-12 W typical operating power. Always use the Quartus II design suite (version 13.1 or earlier) - later Quartus releases dropped Stratix III support. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not consolidated in the manufacturer datasheet.

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