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产品（39,000+)

EPF10K70RC240-3 - 70K Gate FLEX-10K FPGA, 240-RQFP | Altera
EPF10K70RC2403

EPF10K70RC240-3 - 70K Gate FLEX-10K FPGA, 240-RQFP | Altera

The Altera (Intel) EPF10K70RC240-3 is a member of the FLEX-10K family of Field-Programmable Gate Arrays (FPGAs), delivering 70,000 typical gates and 3,744 logic elements / registers in a 240-pin RQFP (Ricard QFP) package with exposed thermal pad. Built on a 0.42 µm CMOS SRAM-lookup-table architecture, this device integrates 18,432 bits of embedded array memory, 189 user I/O pins, and operates at up to 125 MHz core frequency on a 5 V supply. The part is qualified to a -3 speed grade, placing it in the mainstream performance tier of the FLEX-10K family. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the architectural density of gate arrays with the design flexibility of software-configurable logic. The FLEX-10K family pioneered the concept of an embedded array block (EAB) for on-chip RAM, enabling true single-chip integration of logic and memory. Within the broader semiconductor hierarchy, FPGAs sit between discrete logic and ASICs in the programmable logic taxonomy: FPGA → programmable logic → logic IC → integrated circuit → semiconductor. Key features of the EPF10K70RC240-3 include 70K equivalent gates, 3,744 logic elements, 12 embedded array blocks providing 18,432 bits of RAM, 189 programmable I/O pins supporting multiple I/O standards, and in-system programmability via the serial configuration interface. The 5 V tolerant I/O banks are well suited to legacy TTL/CMOS interfaces. Each LE incorporates a 4-input LUT, a programmable register, and carry-chain logic for efficient arithmetic implementation. The architecture separates logic (Logic Array Blocks - LABs) from memory (Embedded Array Blocks - EABs), allowing designers to instantiate true dual-port RAM, ROM, or FIFO functions directly in silicon. The device is configured at power-up from a serial EPROM (EPCS1/EPCS4) or via JTAG boundary-scan, supporting in-field updates. Typical applications include industrial control glue logic, telecommunications interface bridging, legacy ASIC replacement, parallel bus interfacing, motor control state machines, and prototyping of larger Altera designs. The 5 V tolerance makes the EPF10K70RC240-3 especially attractive in brownfield retrofits of older 5 V systems where modern FPGAs are restricted to 3.3 V or lower I/O. When designing with this device, observe the legacy 5 V supply requirement and the RQFP-240 footprint. Modern PCB designs should provide a generous thermal copper pour because the exposed pad must be soldered to a ground plane to meet the 31 C/W thermal resistance spec. The Quartus II MAX+PLUS II toolchain (legacy Altera software) is required for design entry, as the device is unsupported by Quartus Prime. This page synthesizes distributor inventory from 17 sources on Octopart, drop-in alternatives from the FLEX-10K family, and PCB design notes that are not consolidated in any single manufacturer datasheet.

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EPF10K70RC240-3N - FLEX 10K FPGA, 70K Gates, 240-RQFP | Intel
EPF10K70RC240-3N

EPF10K70RC240-3N - FLEX 10K FPGA, 70K Gates, 240-RQFP | Intel

The Intel (formerly Altera) EPF10K70RC240-3N is a member of the FLEX 10K family of SRAM-lookup-table-based Field Programmable Gate Arrays, offering 70,000 equivalent gates, 3,744 logic cells (LEs), 18,432 RAM bits, and 189 user I/Os in a 240-pin RQFP (BFQFP with exposed pad) package. The "-3" speed grade denotes a commercial-grade timing bin with a 0.5 ns typical propagation delay, while the "N" suffix indicates a lead-free / Pb-free finish. It is fabricated on a 0.42 µm CMOS SRAM process, supports 5.0 V tolerant inputs, and operates from a 5 V VCCINT/VCCIO supply rail. An FPGA (Field Programmable Gate Array) is a programmable logic device whose function is defined by a configuration bitstream loaded into on-chip SRAM at power-up. Each logic element contains a 4-input LUT, a programmable register, and a carry chain; logic elements are grouped into Logic Array Blocks (LABs) and LABs are stitched together by a continuous routing network. The FLEX 10K family pioneered the embedded-array-block (EAB) concept, where each EAB provides up to 2,048 bits of dual-port RAM or a small ROM/FIFO function, making the family suitable for datapath, glue logic, and PCI-bus bridge designs. Key features include PCI SIG Revision 2.2 compliance for plug-and-play host-bridge designs, MultiVolt I/O support for interfacing 5.0 V, 3.3 V and 2.5 V buses without external level shifters, on-chip JTAG (IEEE 1149.1) boundary-scan, passive parallel asynchronous configuration via EPROM or microcontroller, and standby currents typically under 5 mA. The device exposes 189 general-purpose I/Os arranged in four I/O banks with programmable slew-rate and pull-up resistors. The EPF10K70RC240-3N is supported by the Altera MAX+PLUS II and Quartus II (legacy 9.x and earlier) design suites, which provide synthesis, place-and-route, simulation, and programming file generation. Designers moving to active development should note that FLEX 10K is a mature, legacy family and Intel/Arrow support is limited to long-term stock channels. Typical applications include PCI bus interface controllers, industrial glue-logic replacement, telecom backplane bridging, and legacy ASIC prototyping where pin-compatible migration is required. Engineers should verify configuration memory selection and JTAG chain integrity before volume deployment.

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EPF10K70RC240-4 - 70K Gate Flex 10K FPGA, 240-RQFP | Intel / Altera
EPF10K70RC240-4

EPF10K70RC240-4 - 70K Gate Flex 10K FPGA, 240-RQFP | Intel / Altera

The Intel (formerly Altera) EPF10K70RC240-4 is a member of the Flex 10K family of SRAM-based, embedded-array Field Programmable Gate Arrays (FPGAs) housed in a 240-pin RQFP (Ruggedized Quad Flat Pack) package with exposed pad. It integrates 70,000 typical gates, 18,432 flipflops backed by 3,744 logic cells (also called LEs), and 468 Logic Array Blocks (LABs), supported by embedded array blocks for implementing megafunctions such as RAM, ROM, and arithmetic units. A field programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can program to implement arbitrary digital logic functions. FPGAs sit at the top of the programmable logic hierarchy, above simple PLDs and CPLDs, and below ASICs in cost-per-volume. The Flex 10K family was the industry's first embedded programmable logic device family delivering System-on-a-Programmable-Chip (SOPC) integration by combining a logic fabric with dedicated embedded array blocks. Key features include 189 user I/O pins, a 5 V core supply (4.75 V to 5.25 V), 3.3 V or 5 V tolerant I/O banks, and a maximum internal operating frequency of 125 MHz at the -4 speed grade. Each Logic Element (LE) consists of a 4-input look-up table (LUT), a programmable flipflop, and dedicated cascade paths; eight LEs combine into a LAB. The embedded array implements megafunctions including FIFO, dual-port RAM, and CAM. Configuration is loaded from a serial PROM or via JTAG using the IEEE 1149.1 boundary-scan interface. Typical applications for the EPF10K70RC240-4 include glue logic replacement in telecom backplane designs, industrial control and factory automation controllers, prototyping bridges for ASIC emulation, and legacy system upgrades where 5 V tolerance is mandatory. The wide 5 V I/O tolerance simplifies connection to TTL/CMOS peripherals in older equipment. When designing with this part, ensure 5 V supply decoupling with 0.1 uF and 10 uF capacitors placed close to every VCC pin, and confirm JTAG chain integrity before production programming. The device is loaded via Altera Quartus II (or MAX+PLUS II for legacy designs) using the dedicated configuration interface. This page synthesizes distributor pricing, drop-in Flex 10K alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EPF10K70RC240-4N - 70K Gates FLEX-10K FPGA | Intel/Altera
EPF10K70RC240-4N

EPF10K70RC240-4N - 70K Gates FLEX-10K FPGA | Intel/Altera

The Intel (formerly Altera) EPF10K70RC240-4N is a FLEX-10K family Field-Programmable Gate Array (FPGA) integrating 70,000 typical gates, 3,744 logic elements (LEs), 18,432 RAM bits, and 189 user I/O pins in a 240-pin BFQFP (exposed-pad RQFP) package. Built on a 0.42 µm CMOS SRAM-lookup-table architecture with embedded array blocks, it operates from a 5 V supply and supports system clock rates up to 125 MHz. The "-4" speed grade places it in the mid-band of the FLEX-10K family for commercial temperature (0 °C to 70 °C) designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, allowing designers to implement arbitrary digital logic that can be re-programmed in-circuit. FPGAs belong to the broader hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD)/FPGA -> digital semiconductor -> integrated circuit. The FLEX-10K family was Altera's first "System-on-a-Programmable-Chip" (SOPC) platform, embedding array blocks (EABs) that allow megafunctions such as RAM, ROM, and multipliers to be physically realised on-die alongside general-purpose logic. Key features include 468 Logic Array Blocks (LABs), embedded array blocks for on-chip memory, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via SRAM configuration, and a dedicated configuration EPROM interface. The device supports both 5.0 V PCI compliance and multi-voltage I/O standards through per-bank reference voltage pins. With 189 available user I/Os, the part delivers substantial off-chip connectivity for bus-intensive glue-logic, bridge, and control applications. The 240-pin BFQFP exposed-pad package aids thermal dissipation, while the 0.42 µm process gives the -4 speed grade typical propagation delays near 0.4 ns per LE. The architecture uses SRAM configuration cells, meaning the FPGA must be configured at each power-up from an external serial or parallel PROM (such as the EPC2 or EPC8 configuration devices). Typical applications include industrial glue-logic and bus-bridging, telecom control-plane ASIC prototyping, military/aerospace legacy systems, and PCI bridge/controller emulation. The large gate count and abundant I/O make the EPF10K70RC240-4N a frequent choice for migrating older gate-array designs onto a programmable platform. Design consideration: as the configuration is SRAM-based, a power-on reset and reliable configuration source are mandatory. Designers should use the dedicated CONF_DONE and nSTATUS pins to monitor configuration status and provide a clean POR sequence. This page synthesises distributor pricing, drop-in FLEX-10K family alternatives, and practical configuration guidance not found on a single manufacturer page.

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EPF6010ANTC100-1 - 880 Logic Elements FLEX 6000 FPGA | Intel
EPF6010ANTC100-1

EPF6010ANTC100-1 - 880 Logic Elements FLEX 6000 FPGA | Intel

The Intel EPF6010ANTC100-1 is a member of the FLEX 6000 family of SRAM-based FPGAs, delivering 880 logic elements organized as 88 LABs/CLBs and approximately 10,000 usable gates. Housed in a 100-pin TQFP package, this device provides 71 user I/O pins and operates from a single 3.0V to 3.6V supply. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-turnaround advantages of in-system programmability. Within the broader semiconductor hierarchy, an FPGA sits between Application Specific Integrated Circuits (ASICs) and general-purpose processors, offering hardware-level parallelism that microcontrollers and DSPs cannot match. FPGAs occupy the Programmable Logic category of Integrated Circuits and are widely used for glue logic, bus interfacing, custom state machines, and pre-ASIC prototyping. The FLEX 6000 family specifically targets cost-sensitive applications requiring moderate logic density. Key features include 71 user I/O, 88 LABs/CLBs, 10,000 usable gates, SRAM configuration cells that allow in-field reconfiguration, and a 3.3V core supply with 5V-tolerant I/O support on selected pins. The device supports JTAG (IEEE 1149.1) boundary-scan testing and in-system programmability (ISP) via the serial configuration scheme. Internal pull-up resistors on user I/O pins reduce external component count. Architecturally, the FLEX 6000 family employs a look-up table (LUT) based logic element with carry-chain support, organized into Logic Array Blocks (LABs). Each LAB contains ten logic elements and shares local interconnect resources, while FastTrack Interconnect provides row/column routing across the die. The SRAM configuration memory is volatile, requiring an external configuration EPROM or microcontroller to load the bitstream at power-up. Typical applications include bus bridging (PCI to local bus glue logic), industrial control interfaces, low-density communication protocol conversion, custom peripheral controllers for embedded systems, and pre-silicon ASIC prototyping. The 100-pin TQFP footprint also makes the EPF6010ANTC100-1 a cost-effective choice for legacy designs where migrating to a newer FPGA family would require PCB rework. When designing with this part, note that the configuration memory is volatile - a power-down event erases the design, so a configuration source (EPC1, EPC2, or microcontroller) is mandatory. The 3.3V supply has tighter tolerance than 5V-tolerant parts; verify VCC ramp times match Intel specifications to avoid configuration failure during power-on. This page synthesizes distributor pricing for the EPF6010ANTC100-1, same-family drop-in alternatives within the FLEX 6000 family, and design notes not duplicated from the manufacturer datasheet.

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EPF6010ANTC100-2 - FLEX 6000 FPGA, 880 LEs, 71 I/O, 100-TQFP | Intel
EPF6010ANTC100-2

EPF6010ANTC100-2 - FLEX 6000 FPGA, 880 LEs, 71 I/O, 100-TQFP | Intel

The Intel (Altera) EPF6010ANTC100-2 is a member of the FLEX 6000 family of low-power, SRAM-based Field-Programmable Gate Arrays (FPGAs), offering 880 logic elements, 71 programmable I/O pins, and housed in a 100-pin Thin Quad Flat Pack (TQFP) package. It features a -2 speed grade and commercial operating temperature range, delivering a balance of logic density and I/O flexibility for glue-logic, interface bridging, and custom digital state-machine designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> semiconductors, occupying the high-density end of this hierarchy. FPGAs complement ASICs by offering lower NRE cost and faster time-to-market, and complement microcontrollers by providing parallel hardware execution at deterministic nanosecond-scale latency. The FLEX 6000 family uses a look-up-table (LUT)-based logic element architecture with continuous interconnect, optimized for cost-sensitive applications requiring modest logic capacity. Key features of the EPF6010ANTC100-2 include 880 logic elements, 71 user I/O pins, 5V core tolerance (FLEX 6000A variants), in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and a 100-pin TQFP surface-mount package measuring 14x14 mm with 0.5 mm pitch. The device supports asynchronous, synchronous, and level-sensitive memory architectures and integrates dedicated carry chains for arithmetic functions and cascade chains for wide fan-in logic. The EPF6010ANTC100-2 employs a SRAM-based configuration cell that allows unlimited reconfiguration, supported by the Altera MAX+PLUS II and Quartus design tools. The on-chip logic array is organized into Logic Array Blocks (LABs), each containing ten logic elements with local interconnect. Global routing resources include row and column channels that distribute clocks, clears, and high-fan-out signals across the device. Typical applications include peripheral bus interfacing (PCI, ISA, VME bridge logic), industrial control glue logic, telecommunication line-card glue functions, ASIC prototyping and emulation, and custom DSP pre/post-processing front-ends. With 71 I/O available, the part accommodates wide parallel buses and multi-protocol bridging scenarios. When designing with the EPF6010ANTC100-2, ensure that the configuration memory is loaded from a valid source (EPROM, microcontroller, or JTAG) at every power-up. Note that the FLEX 6000 family has reached end-of-life status from Intel PSG; consult PCN documents before new designs and verify long-term availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a faster path to sourcing and second-source selection for legacy FLEX 6000 designs.

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EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel
EPF6010ANTC100-3

EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel

The Intel (Altera) EPF6010ANTC100-3 is a member of the FLEX 6000 family of SRAM-based Field-Programmable Gate Arrays (FPGAs) housed in a 100-pin Thin Quad Flat Pack (TQFP) package. The device integrates 880 Logic Elements (LEs), 71 user I/O pins, and an embedded array of 16,000 RAM bits, providing flexible reconfigurable logic for glue-logic, bus-interface, and state-machine applications. Built on a 0.42 µm CMOS SRAM process with a 5 V core voltage, it is rated speed grade -3 and supports in-system programmability via the IEEE 1149.1 (JTAG) interface. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit in the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> semiconductors. FPGAs differ from ASICs by offering post-fabrication logic changes, and from CPLDs by providing finer-grained distributed flip-flops, embedded RAM blocks, and richer I/O standards. The FLEX 6000 family is positioned as a low-cost, low-density alternative to the APEX and FLEX 10K families, targeting glue logic, address decoding, FIFO buffers, and bus-bridge functions. Key features of the EPF6010ANTC100-3 include 880 Logic Elements (each containing a 4-bit LUT and a flip-flop), a maximum operating frequency of up to 105 MHz for 16-bit counters, 16 Kbit embedded SRAM organized as 8 LABs, support for LVTTL, LVCMOS, PCI, and other I/O standards through programmable I/O elements (IOEs), and MultiVolt I/O allowing 3.3 V or 5 V interface to surrounding logic. The device is configured via JTAG or an EPC configuration EPROM, supporting 8-bit parallel or serial configuration modes. Typical applications include legacy industrial controllers, telecommunications glue logic, PCI bus interfaces, peripheral controllers, and low-density DSP pre/post-processing. The wide 5 V tolerance of the I/O pins makes the EPF6010ANTC100-3 a practical choice for retrofitting 5 V legacy systems where modern 3.3 V FPGAs would require level shifters. When designing with this part, note that the FLEX 6000 family is mature and approaching end-of-life. Engineers designing new platforms should evaluate MAX II, MAX V (CPLDs), or Cyclone series (low-cost FPGAs) as modern alternatives. For legacy sustainment, designers must preserve the JTAG chain, ensure the EPC configuration EPROM is correctly selected, and provide a clean 5 V supply with proper decoupling.

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EPF6010ATC100-1 - FLEX 6000 FPGA 880 Cells 100-TQFP | Altera
EPF6010ATC100-1

EPF6010ATC100-1 - FLEX 6000 FPGA 880 Cells 100-TQFP | Altera

The Altera (Intel) EPF6010ATC100-1 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays, delivering approximately 10,000 typical gates, 880 logic elements, and 71 user I/O in a 100-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS process, the device supports a maximum toggle rate of 200 MHz and operates from a 3.3 V core supply, making it suitable for glue-logic, bus-interface, and state-machine consolidation in cost-sensitive industrial designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an application-specific integrated circuit (ASIC) with the flexibility of in-system reconfiguration. FPGAs sit within the digital semiconductor hierarchy as programmable ASIC alternatives: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. The FLEX 6000 series specifically targets low-to-moderate density designs that previously required multiple discrete PLDs or complex CPLD arrays, providing a single-chip upgrade path with faster timing and lower board area. Key features of the EPF6010ATC100-1 include 88 Logic Array Blocks (LABs), 16 Logic Elements per LAB, 71 maximum user I/O, 5 V tolerant I/O with 3.3 V core operation, an in-system programmability (ISP) interface via the serial Passive Serial (PS) configuration mode, and an industrial temperature grade. The 100-pin TQFP package provides a 1.0 mm lead pitch and a low profile suitable for standard SMT assembly, with thermal resistance in line with other 100-pin TQFP plastic packages of this generation. Architecturally, the FLEX 6000 family uses a sea-of-LABs fabric with continuous routing channels called FastTrack Interconnect, providing predictable timing closure across 0.42 µm process geometry. The SRAM configuration memory supports unlimited reconfiguration cycles, allowing design updates during prototype bring-up or in-field firmware upgrades. A built-in JTAG (IEEE 1149.1) interface enables boundary-scan test and programming verification on production lines. Typical applications for the EPF6010ATC100-1 include industrial control glue logic, communication bridge and protocol conversion cards, legacy peripheral interfacing, custom state machines for motor control, test and measurement front-end signal routing, and education/hobby platforms where the device remains supported by the legacy Altera MAX+PLUS II and Quartus design tools. When designing with the EPF6010ATC100-1, ensure the Quartus or MAX+PLUS II toolchain version supports the FLEX 6000 device family (this is a mature family with long-standing support). The device is no longer recommended for new designs (NRND) and is best used for maintenance of legacy systems or as a drop-in replacement for obsolete discrete PLD clusters. Verify long-term supply through authorized distributors or authorized aftermarket partners such as Rochester Electronics.

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EPF6010ATC100-2 - FLEX 6000 FPGA, 880 Gates, 71 I/O | Intel (Altera)
EPF6010ATC100-2

EPF6010ATC100-2 - FLEX 6000 FPGA, 880 Gates, 71 I/O | Intel (Altera)

The Intel (formerly Altera) EPF6010ATC100-2 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 100-pin TQFP (14x14 mm) package. It provides approximately 880 logic gates organized into 88 Logic Array Blocks (LABs) and 71 user I/O pins, with a -2 speed grade and commercial 0C to 70C operating range. Core supply is 3.0V to 3.6V (typical 3.3V), and the device supports in-system programmability via IEEE 1149.1 JTAG. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (here called LABs), programmable interconnect, and I/O cells - all SRAM-based so the design can be reloaded after power-up. FPGAs sit in the hierarchy between discrete logic (CPLD) and ASIC implementation: they offer higher density and richer sequential logic than CPLDs, with faster time-to-market than full-custom ASICs. The FLEX 6000 family targets glue-logic, bus-interface, and small state-machine applications where FLEX 10K density is not required. Key features of the EPF6010ATC100-2 include 88 LABs with 4-input look-up tables and product-term logic, 71 user I/O pins distributed across the TQFP-100 footprint, multi-voltage I/O support (3.3V/5V tolerant interfaces), and on-chip configuration memory with JTAG boundary-scan support. The -2 speed grade is a mid-speed tier within the FLEX 6000 family; -1 is faster and -3 is slower. Typical applications include PCI/ISA bus-interface glue logic, communications protocol bridges, industrial control state machines, and legacy 3.3V system upgrades where re-programmability is required without ASIC NRE cost. The TQFP-100 package is a 14x14 mm fine-pitch plastic quad flat pack compatible with standard surface-mount assembly lines. When designing with this device, verify configuration-mode selection pins (MSEL) against the desired scheme (passive serial, JTAG, etc.). The SRAM-based fabric means the bitstream must be reloaded on every power-up from a configuration memory - typically an EPC1 or EPC2 serial configuration PROM.

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EPF6010ATC100-3 - 10K Gates FLEX 6000 FPGA, 880 Cells | Intel
EPF6010ATC100-3

EPF6010ATC100-3 - 10K Gates FLEX 6000 FPGA, 880 Cells | Intel

The Intel EPF6010ATC100-3 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs), delivering 10,000 usable gates and 880 logic elements (cells) in a 100-pin TQFP package. Built on a 0.42 µm CMOS SRAM-based process, the device operates from a 3.3 V core supply and supports user I/O voltages up to 5 V tolerant through flexible I/O banks. The speed grade -3 designation indicates the slowest commercial grade offered within the FLEX 6000 family, optimized for cost-sensitive designs rather than maximum Fmax. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacturing. The FLEX 6000 family belongs to the broader hierarchy: FPGA → programmable logic device → digital semiconductor → integrated circuit. Within Intel's (formerly Altera's) portfolio, FLEX 6000 represents the low-density, low-cost tier, sitting below FLEX 10K and Cyclone families. Key features of the EPF6010ATC100-3 include 88 logic array blocks (LABs), 71 user I/O pins, 132 MHz typical internal performance per the FLEX 6000 datasheet family, in-system programmability through the IEEE 1149.1 JTAG interface, and SRAM-based configuration that allows unlimited reconfiguration. The 100-pin TQFP (TQFP-100) package supports both commercial and industrial temperature grades depending on the ordering suffix. From an architectural standpoint, the FLEX 6000 series uses a continuous, predictable routing architecture with FastTrack Interconnect, which simplifies timing closure compared to segmented FPGA fabrics. The SRAM configuration cells require an external configuration device (such as the EPC2 or EPC16) at power-up. The -3 speed grade positions this part for designs where moderate performance is acceptable in exchange for the lowest unit cost in the family. Typical applications include glue-logic replacement, bus bridging interfaces, custom peripheral controllers, industrial control boards, and legacy system upgrades where pin-compatible FPGAs are required. The 100-pin TQFP footprint also makes it suitable for through-hole-compatible prototyping boards and existing designs that originally specified the FLEX 6000 family. Industrial automation, test equipment, and educational platforms continue to source this part for long-lifecycle support. When designing with this device, note that the FLEX 6000 family uses 3.3 V VCCINT and supports 3.3 V/5 V tolerant I/O depending on bank configuration. Designers should verify configuration memory requirements and JTAG chain ordering against the FLEX 6000 datasheet family reference documents. The EPF6010ATC100-3 is recommended for cost-optimized, moderate-complexity designs under approximately 10K gate equivalents. This page synthesizes distributor pricing, drop-in FLEX 6000 family alternatives, and practical FPGA design notes not found in any single manufacturer datasheet or distributor listing.

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EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
EPF6010ATC100-3N

EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel

The Intel (formerly Altera) EPF6010ATC100-3N is a FLEX 6000 family Field-Programmable Gate Array (FPGA) with 880 logic cells (10K gates), 71 user I/Os, and a maximum internal frequency of 142.86 MHz, housed in a 100-pin Thin Quad Flat Pack (TQFP) package. It operates from a single 3.3 V supply (3.0 V to 3.6 V) and is fabricated on a 0.42 µm CMOS process, making it suitable for glue-logic, bus-interface, and low-to-medium complexity state-machine designs. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacturing. FPGAs sit above simple PLDs (PALs, GALs) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy, and they are widely used to implement parallel digital logic, glue logic, custom peripherals, and rapid prototyping before ASIC commitment. Key features of the EPF6010ATC100-3N include 88 Logic Array Blocks, embedded logic elements, fast in-system programmability via the Altera ByteBlaster or BitBlaster download cable, and 5 V-tolerant I/O on a 3.3 V core (with PCI-compliant drive). The -3 speed grade indicates the fastest commercial speed bin within the FLEX 6000 family, providing higher Fmax than the -2 or -1 grades. The 100-pin TQFP package is a plastic surface-mount outline with a 1.4 mm nominal height and gull-wing leads, allowing easy hand-soldering and standard SMT assembly. Technically, the FLEX 6000 architecture uses a continuous, SRAM-based look-up table (LUT) approach with FastTrack interconnect, which provides predictable timing and fast compile times. The 0.42 µm process and 3.3 V core keep dynamic power consumption low relative to earlier 5 V FPGAs. Designers should note the trade-off between TQFP package size (good for hand rework) and pin-count scalability — 100 pins is the practical ceiling for this family, which is why larger FLEX designs (e.g., EPF10K series) move to BGA packages. Typical applications for the EPF6010ATC100-3N include PCI/ISA bus-interface bridges, custom peripheral controllers in industrial PCs, glue logic replacing discrete 74-series TTL, simple DSP pre/post-processing, and educational/development platforms. Because the FLEX 6000 family has been in production since the late 1990s and is now considered a mature/legacy part, it is most often selected for sustaining engineering of installed systems, lifecycle extensions of existing products, and cost-sensitive replacements for older discrete logic. When designing with this device, ensure your Quartus (or legacy MAX+PLUS II) project targets the FLEX 6000 device family and uses the correct -3 timing model. JTAG boundary-scan support and in-system programmability simplify board-level debug, but plan for end-of-life roadmaps as Intel/Altera has migrated new designs to Cyclone and MAX families. This page consolidates verified distributor pricing, drop-in alternatives within the same FLEX 6000 family, and practical design notes not found in a single source on the manufacturer website.

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EPF6010ATC144-1 - FLEX 6000 FPGA, 880 Cells, 144-LQFP | Intel
EPF6010ATC144-1

EPF6010ATC144-1 - FLEX 6000 FPGA, 880 Cells, 144-LQFP | Intel

The Intel (formerly Altera) EPF6010ATC144-1 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) housed in a 144-pin LQFP (TQFP-144 20x20 mm) package, integrating 10K equivalent gates with 880 logic elements across 88 Logic Array Blocks (LABs) and exposing 102 user I/Os. Built on a 0.42 µm SRAM-based OptiFLEX architecture, this device runs from a 3.0 V to 3.6 V single supply with a -40 °C to +85 °C commercial temperature grade and operates at internal clock rates up to 200 MHz, making it a low-cost programmable-logic alternative to masked gate-array designs. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user defines after manufacture via a configuration bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are positioned between fixed-function ASICs (high NRE, low unit cost) and discrete logic (low density, high board area). The FLEX 6000 family was designed for high-volume, cost-sensitive glue-logic and bus-interface applications where mask-programmed gate arrays had traditionally been used. Key features of the EPF6010ATC144-1 include 16 Embedded System Blocks (ESBs) delivering 16x32 = 512 bits of RAM per block for up to ~8 Kb of distributed memory, true dual-port RAM capability, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, multiVolt I/O allowing mixed 5.0 V/3.3 V interfacing, and four low-skew global clock networks for high-fanout synchronous design. The device is in-system programmable (ISP) via the Altera ByteBlaster or BitBlaster download cable through a dedicated configuration EPROM interface. Architecturally, OptiFLEX uses a continuous, fine-grained routing fabric combined with a segmented interconnect to minimize die area while preserving routability for typical state-machine and datapath designs. The 88 LABs each contain ten Logic Elements (LEs), and each LE is built from a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions. Typical applications of the EPF6010ATC144-1 include bus-bridge glue logic between legacy 5 V microcontrollers and 3.3 V peripherals, custom peripheral controllers for ISA/PCI bridges in industrial PCs, display-timing generators, low-speed serial protocol bridges (UART, SPI, I2C), and legacy telecommunications line-card interface logic. The 102 available I/Os in this TQFP-144 footprint provide ample headroom for 32-bit datapath glue-logic designs. Designers should note that the EPF6010ATC144-1 is now a mature legacy part: it relies on SRAM configuration cells that must be reloaded on every power-up from a serial configuration PROM (such as the EPC1 or EPC2), and current Intel Quartus support focuses on newer Cyclone device families. Verify last-time-buy and PCN status before committing to a new design. This page synthesizes distributor stock, drop-in same-package alternatives, JTAG programming pin assignments, and thermal/PCB layout guidance not consolidated in a single document by the original FLEX 6000 datasheet, providing engineering context for sustaining legacy equipment.

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EPF6010ATC144-2 - 10K Gates FLEX 6000 FPGA, 144-LQFP | Altera
EPF6010ATC144-2

EPF6010ATC144-2 - 10K Gates FLEX 6000 FPGA, 144-LQFP | Altera

The Altera (Intel) EPF6010ATC144-2 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) featuring 10,000 system gates and 880 logic elements (LEs) in a 144-pin LQFP package. The device provides 102 user I/O pins and is built on a 0.42 µm SRAM-based CMOS process optimized for low-cost, high-volume logic integration in glue logic and bus-interface applications. What is a FLEX 6000 FPGA? The FLEX 6000 is a legacy programmable logic device family introduced by Altera in the late 1990s, sitting within the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> volatile SRAM-based FPGAs -> fine-grained logic arrays. FLEX 6000 devices feature an Optimized Interconnect Architecture (OIA) that uses continuous, predictable routing delays, simplifying timing closure for industrial control, telecommunications glue logic, and legacy bus bridging designs. Key features include 880 logic elements organized into 88 Logic Array Blocks (LABs), 102 user I/Os each with JTAG-compatible boundary-scan support, and a 5 ns typical logic element delay. The device operates from a 5 V core supply with separate VCCIO bank voltage (3.3 V or 5 V tolerant) for mixed-voltage interfacing. In-system programmability (ISP) via the IEEE 1149.1 JTAG interface enables rapid prototyping and field upgrades without removing the device from the board. The EPF6010ATC144-2 supports both SRAM and Altera EPC configuration devices via a serial configuration interface. Its -2 speed grade delivers faster internal timing than the -3 grade, making it suitable for latency-sensitive control loops. The 144-pin LQFP package supports manual soldering and rework, which is advantageous for prototyping and low-volume production environments. Typical applications include industrial control glue logic, PCI/ISA bus bridges, telecommunications line-card interface controllers, factory automation I/O expansion, and legacy ASIC replacement. The wide VCCIO tolerance allows direct interfacing with both 3.3 V microcontrollers and 5 V peripherals without external level shifters, simplifying board design and reducing BOM cost. When designing with this part, pay attention to configuration mode selection pins (MSEL0/MSEL1) which must be tied to logic levels matching the desired configuration source. Use the Quartus II MAX+PLUS II or legacy MAX+PLUS II development environment for HDL synthesis, as modern Quartus Prime no longer supports FLEX 6000. Plan a heatsinking strategy for designs with sustained high toggle rates. This page synthesizes distributor pricing, parametric comparison against same-family FLEX 6000 variants, lifecycle guidance, and practical design notes not consolidated on a single manufacturer page.

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EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel
EPF6010ATC144-3

EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel

The Intel (formerly Altera) EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array (FPGA) housed in a 144-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS SRAM-based process, it integrates 880 logic elements and 102 user I/O pins, with a maximum internal operating frequency of approximately 142.86 MHz and a 3.3 V single supply requirement. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide. Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin. From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification. Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting. When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.

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EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
EPF6010ATC144-3N

EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel

The Intel (formerly Altera) EPF6010ATC144-3N is a FLEX 6000 family Field Programmable Gate Array (FPGA) integrating 10,000 gates, 880 logic elements (cells), and 102 user I/Os in a 144-pin TQFP (20x20 mm) surface-mount package. It operates from a 3.3 V supply at up to 200 MHz internal performance on a 0.42 µm CMOS process, providing reconfigurable logic for glue logic, bus interface, and state-machine applications. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG. Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin. Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping. Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path. This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.

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EPF6010ATI100-2 - FLEX 6000 10K Gates FPGA | Altera | 100-TQFP
EPF6010ATI100-2

EPF6010ATI100-2 - FLEX 6000 10K Gates FPGA | Altera | 100-TQFP

The Altera EPF6010ATI100-2 is a FLEX 6000 family Field Programmable Gate Array (FPGA) with 10,000 usable gates, 880 logic elements (LEs) arranged across 88 Logic Array Blocks (LABs), and 71 user I/O pins, housed in a 100-pin Thin Quad Flat Pack (TQFP) package. The device is fabricated on a 0.42 µm CMOS process with a 3.3 V core supply and is rated for industrial temperature operation, supporting system clock frequencies up to 166.67 MHz. The "I" suffix indicates the industrial temperature range and "-2" denotes the speed grade. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnects after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. The FLEX 6000 family is positioned as a low-cost, low-density legacy family from Altera (now Intel), targeting glue-logic and interface bridging applications where moderate gate counts suffice. Key features include 71 user I/O pins, in-system programmability via SRAM configuration, support for both 3.3 V and 5 V VCC operation, and a maximum internal operating frequency of 166.67 MHz. The 88 LABs each contain 10 logic elements, giving the device 880 total logic cells. The 100-pin TQFP package (TQFP-100, 14×14 mm body, 0.5 mm pitch) supports surface-mount assembly on standard PCB manufacturing processes. Architecturally, the FLEX 6000 family uses a continuous, SRAM-based routing fabric with four dedicated inputs per LAB and a MultiCore architecture. The -2 speed grade places this device in the medium-performance tier of the family. Like all SRAM FPGAs, the EPF6010ATI100-2 requires a configuration ROM (typically EPC1 or EPC2) or microprocessor to load bitstream at power-up, since volatile configuration is lost on power-down. Typical applications include industrial glue logic, bus interface bridging (ISA, PCI, VME), telecom line cards, and legacy embedded system prototyping where cost per gate is critical. Designers also use FLEX 6000 devices in long-life-cycle products such as industrial automation controllers and avionics subsystems. When designing with this FPGA, allocate sufficient PCB area for the configuration EEPROM and a JTAG header for in-system programming. Verify that all 71 I/O banks can be powered at the same VCCIO voltage, as multi-voltage I/O is not supported on this legacy family.

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EPF6010ATI100-2N - FLEX 6000 FPGA, 10K Gates, 100-TQFP | Intel
EPF6010ATI100-2N

EPF6010ATI100-2N - FLEX 6000 FPGA, 10K Gates, 100-TQFP | Intel

The Intel (formerly Altera) EPF6010ATI100-2N is a member of the FLEX 6000 family of Field Programmable Gate Arrays, integrating 10,000 system gates and 880 logic elements (cells) into a 100-pin Thin Quad Flat Pack (TQFP) surface-mount package. Built on a 0.42 µm CMOS SRAM process with 3.3 V core supply and 71 user I/O pins, this device is specified for industrial-grade temperature operation and offers a maximum internal frequency of 166.67 MHz. The 'I' suffix in the part number designates the industrial temperature range and the TQFP-100 package outline. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic functions after PCB assembly, sitting in the broader hierarchy of digital logic -> programmable logic -> complex programmable logic device (CPLD) / FPGA -> system-on-chip integration. The FLEX 6000 family targets glue-logic, bus-interface, and low-to-medium density state-machine applications where ASIC NRE is not justified. It uses a look-up-table-based architecture backed by SRAM configuration memory, requiring external configuration storage on every power-up. Key features include 88 logic array blocks (LABs), 71 usable I/O pins supporting 5V-tolerant input levels with 3.3V output swing, on-chip ISP (in-system programmability) via the IEEE 1149.1 JTAG interface, and multiVolt I/O support for interfacing with both 5.0 V and 3.3 V buses. The 0.42 µm four-layer metal process delivers deterministic timing with pin-to-pin propagation delays in the nanosecond range, well suited for control-plane and bridging applications. The EPF6010ATI100-2N supports the Altera MAX+PLUS II and Quartus development flows, with deterministic place-and-route results available through the fitter engine. Configuration is performed via serial or parallel PROM using the built-in EPC configuration port, allowing rapid prototyping and field upgrades via JTAG. Typical applications include industrial control glue logic, parallel bus bridges (e.g., PCI-to-ISA, ISA-to-ISA), motor-control state machines, low-density protocol converters (UART/SPI multiplexing), and legacy peripheral controllers in long-lifecycle platforms. The TQFP-100 package is hand-solderable for prototypes and supports automated reflow for volume production. When designing with this device, ensure the JTAG chain is properly terminated with the TCK pull-up and TDI/TMS pull-ups required by IEEE 1149.1. A reset supervisor must hold nCONFIG low until all power rails are stable to prevent spurious configuration. This page synthesizes distributor pricing, parametric alternatives, and practical design notes not found in the manufacturer datasheet.

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EPF6016AFC100-2 - FLEX 6000 FPGA, 1320 LE, 81 I/O, 100-LBGA | Intel/Altera
EPF6016AFC100-2

EPF6016AFC100-2 - FLEX 6000 FPGA, 1320 LE, 81 I/O, 100-LBGA | Intel/Altera

The Intel (Altera) EPF6016AFC100-2 is a member of the FLEX 6000 family of CMOS SRAM-based Field-Programmable Gate Arrays, providing 1,320 logic elements across 132 LABs (Logic Array Blocks) with 81 user I/O pins housed in a 100-ball FineLine BGA (100-LBGA, 11x11 mm) package. It is a logic-density optimized FPGA built on a 0.42 µm SRAM process that operates from a 3.3 V core supply (3.0 V to 3.6 V) and supports both commercial and industrial temperature grades. The device offers up to 172 MHz internal operation and is supplied in a speed grade -2 bin. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits through software-defined look-up tables (LUTs), embedded RAM blocks, and programmable interconnect. Within the broader programmable logic taxonomy, the FLEX 6000 sits below CPLD architectures in density but above simple SPLDs; in the system hierarchy, FPGAs belong to the embedded IC / digital IC family that complements microcontrollers, DSPs, and ASICs. The FLEX 6000 family uses a LUT-based fabric that delivers higher logic density than the older MAX 7000 CPLDs while remaining low-cost and low-power. Key features include 1,320 logic elements (LEs), 132 LABs, 81 user I/Os, JTAG (IEEE 1149.1) boundary-scan support, and a 4-input LUT structure that simplifies synthesis tool mapping. The 100-LBGA FineLine BGA package provides high-density board routing with a 1.0 mm ball pitch and a footprint of 11x11 mm, ideal for space-constrained designs. The device supports in-system programmability via the dedicated configuration interface and standard SRAM configuration bitstream storage. Architecturally, the FLEX 6000 uses an SRAM cell to hold configuration data, allowing unlimited reconfiguration. Each LAB contains 8 LEs, and each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic for arithmetic. The interconnect is a continuous FastTrack row/column structure that delivers predictable timing and simplifies static timing closure compared with earlier segmented FPGA architectures. Typical applications include glue logic replacement, bus bridging, peripheral control, low-complexity state machines, and prototype ASIC verification in industrial, communications, and consumer products. Engineers select the FLEX 6000 family when they need more logic than a CPLD but want to avoid the cost and complexity of high-density FPGAs such as Cyclone or Stratix. When designing with the EPF6016AFC100-2, ensure that your power-decoupling network matches Altera's FLEX 6000 reference design and that JTAG chain ordering is consistent with board-level boundary-scan planning. The 100-LBGA package requires careful PCB layout for the ball-pad fan-out - use of 0.5 mm via-in-pad or dog-bone fan-out is recommended to avoid solder joint reliability issues. This page synthesizes distributor pricing, drop-in alternatives from the same Altera FLEX 6000 family, and practical design notes not found in the original datasheet.

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EPF6016AFC100-3 - FLEX 6000 FPGA, 16K Gates, 81 I/O, 100-FBGA
EPF6016AFC100-3

EPF6016AFC100-3 - FLEX 6000 FPGA, 16K Gates, 81 I/O, 100-FBGA

The Intel (formerly Altera) EPF6016AFC100-3 is a FLEX 6000 family Field Programmable Gate Array (FPGA) with 16,000 gates, 1,320 logic cells, and a maximum internal frequency of 142.86 MHz, fabricated on a 0.42 um CMOS process at 3.3 V, housed in a 100-pin FineLine BGA (FBGA) package. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that integrates configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die. FPGAs sit within the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. The FLEX 6000 family is Intel/Altera's classic SRAM-based, look-up-table (LUT) architecture offering fast design iteration during prototyping and low-cost migration from gate-array ASICs to programmable logic. Key features include 81 user I/O pins, 4-input LUT-based logic elements, a hierarchical routing fabric with carry and cascade chains for high-speed arithmetic and wide-input functions, in-system programmability via SRAM configuration, and IEEE 1149.1 JTAG boundary-scan support. The FineLine BGA-100 footprint provides compact board mounting and improved signal integrity over QFP packages. The FLEX 6000 architecture connects Logic Elements (LEs) inside Logic Array Blocks (LABs) with FastTrack Interconnect rows and columns. Each LE contains a 4-input LUT, a programmable register, and a carry/cascade chain path. Carry chains accelerate counters and adders, while cascade chains implement wide fan-in functions with minimal delay, supporting clock speeds beyond 142 MHz for datapath-intensive designs. Typical applications include glue logic replacement, low-volume ASIC prototyping, industrial control interfaces, communications protocol bridging, and legacy design maintenance. The 3.3 V core voltage simplifies integration with 3.3 V microprocessors and memory. When designing with this device, ensure the 100-FBGA PCB footprint uses 0.8 mm ball pitch and that JTAG pins TCK/TMS/TDO/TDI are routed cleanly. The FLEX 6000 family is mature and recommended for new designs only when targeting long-lifecycle industrial or legacy-compatible products. This page synthesizes distributor pricing, drop-in FLEX 6000 alternatives, application guidance, and design notes not aggregated on any single manufacturer or distributor page.

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EPF6016AFC256-2 - FLEX 6000 FPGA, 16K Gates, 256-BGA | Intel
EPF6016AFC256-2

EPF6016AFC256-2 - FLEX 6000 FPGA, 16K Gates, 256-BGA | Intel

The Intel (formerly Altera) EPF6016AFC256-2 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs), delivering 16,000 typical gates, 1,320 logic elements, and 171 user I/Os in a 256-ball FineLine BGA (FBGA) package. It is built on a 0.42 um CMOS SRAM process with a 3.3 V core supply and supports in-system programmability through an IEEE 1149.1 JTAG interface, making it suitable for low-cost, high-volume programmable logic applications. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program repeatedly in the field. Within the broader semiconductor taxonomy, an FPGA sits inside the category of programmable logic devices (PLDs), which also include Complex PLDs (CPLDs) and Simple PLDs (SPLDs); the FLEX 6000 family itself uses an SRAM-based look-up-table architecture, placing it architecturally closer to modern FPGAs than to fuse-based CPLDs. This SRAM-backed fabric is what enables unlimited re-programmability but also means the configuration must be reloaded at every power-up from a separate PROM or flash device. Key features of the EPF6016AFC256-2 include 1,320 logic elements, 4 embedded array blocks (EABs) of 2,048 bits each for on-chip RAM or ROM, 171 maximum user I/Os, and a typical internal frequency of up to 172 MHz. The device supports LVCMOS, LVTTL, and other I/O standards through its flexible I/O element (IOE) structure, and offers dedicated clock-locked loops and boundary-scan testability. Operating temperature is 0C to 85C (commercial grade), and supply voltage is 3.0 V to 3.6 V. Typical applications include glue logic replacement, bus-interface bridging, custom peripheral implementation, telecommunications line cards, industrial control and automation, and prototyping for ASIC or gate-array designs. The wide I/O count (171) makes the device especially attractive for designs that have many parallel buses or memory interfaces. Engineers also use it as a fast design-change vehicle during ASIC prototyping, where design iterations need to be turned around in hours rather than weeks. When designing with the EPF6016AFC256-2, allocate a JTAG chain header on the PCB, reserve a serial configuration device footprint (such as an EPC2 or EPC8), and ensure decoupling is placed close to every VCCINT and VCCIO pin pair. A 4-layer PCB with solid ground and power planes is strongly recommended because the 0.42 um process is sensitive to power-supply noise. This page synthesizes distributor pricing, drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-grade reference for sourcing this legacy Altera FPGA.

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EPF6016AFC256-3 - 16K Gates FLEX 6000 FPGA, 171 I/O | Intel
EPF6016AFC256-3

EPF6016AFC256-3 - 16K Gates FLEX 6000 FPGA, 171 I/O | Intel

The Intel (formerly Altera) EPF6016AFC256-3 is a FLEX 6000 family Field Programmable Gate Array delivering 16K equivalent gates, 1320 logic elements (LEs), and 171 user I/Os in a 256-pin FineLine BGA package at a -3 speed grade. It uses a 0.42 µm CMOS SRAM-based process operating at 3.3 V core with a maximum internal frequency of 142.86 MHz (172 MHz edge rate). The device integrates 132 Logic Array Blocks (LABs) and is built on a look-up-table (LUT) fabric optimized for high-volume glue-logic and gate-array replacement designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing via a configuration bitstream. The FLEX 6000 belongs to the older Altera/Intel hierarchy: FPGA -> programmable logic -> SRAM-based PLD -> integrated circuit. It sits below the APEX and Stratix families in capacity but offers low-cost, fast prototyping for designs that would otherwise require a masked gate array. Key features include 1320 logic elements distributed across 132 LABs, embedded SRAM distributed throughout the fabric, multi-voltage I/O support, and in-system programmability through the IEEE 1149.1 JTAG interface. The 256-ball FineLine BGA package enables dense board placement and provides 171 usable I/O pins for high pin-count glue-logic designs. Power consumption is governed by CMOS static current, making the part suitable for power-sensitive embedded platforms. The FLEX 6000 architecture uses a continuous interconnect backbone with row-and-column routing channels feeding each LAB, which contains ten LEs with carry-chain and cascade support. Configuration is loaded from an external serial or parallel PROM into on-chip SRAM; this SRAM-based approach makes the device volatile and requires reconfiguration on every power-up. The part is fabricated on a 0.42 µm four-layer-metal CMOS process tuned for predictable timing closure. Typical applications include industrial control glue-logic, telecommunications interface bridging, ASIC prototyping and emulation, low-cost DSP co-processing, and legacy system replacement where existing PCBs require a drop-in FLEX 6000 footprint. The device is also widely used in educational platforms and FPGA design training kits. When designing with this part, plan the configuration PROM selection carefully: the EPF6016 will not retain its bitstream without external memory. Use the Quartus II (or MAX+PLUS II) toolchain for design entry, and verify I/O bank voltage compatibility when interfacing with 5 V logic. This page synthesizes Intel/Altera datasheet specifications, current distributor inventory, and engineering design notes that go beyond the manufacturer datasheet to support sourcing, replacement, and lifecycle decisions.

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EPF6016AQC208-1 - 16K Gates, 171 I/O FLEX 6000 FPGA | Intel
EPF6016AQC208-1

EPF6016AQC208-1 - 16K Gates, 171 I/O FLEX 6000 FPGA | Intel

The Intel EPF6016AQC208-1 is a member of the FLEX 6000 family of CMOS SRAM-based field-programmable gate arrays (FPGAs), delivering 16,000 typical gates (24,000 maximum system gates) in a 208-pin plastic quad flat pack (PQFP/208-BFQFP) with 171 user I/O pins, 132 logic array blocks (LABs), and 1,320 logic elements (LEs). Manufactured on a 5.0 V-tolerant process and supporting 3.3 V PCI-compliant I/O, this device operates at internal frequencies up to 172 MHz with -1 speed grade, while the FLEX 6000 interconnect architecture provides predictable, fast routing through FastTrack continuous routing paths. The EPF6016AQC208-1 supports in-system configuration via a dedicated configuration flash interface and provides four input clocks plus dedicated high-speed carry/cascade chains that connect LEs 2 through 10 within each LAB. A field-programmable gate array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, programmable interconnects, and configurable I/O cells. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs and are positioned between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and post-manufacture reconfigurability for prototyping, low-volume production, and designs requiring late-stage design changes. Key features of the EPF6016AQC208-1 include 5.0 V tolerant I/O buffers compliant with PCI Local Bus Specification Revision 2.2 (when VCCIO = 5.0 V), 3.3 V PCI compliance at VCCIO = 3.3 V, multi-volt I/O support for interfacing with 2.5 V, 3.3 V, and 5.0 V devices, and JTAG-based IEEE 1149.1 boundary-scan test support. Each logic element contains a 4-input look-up table (LUT), a programmable register with enable, and dedicated carry and cascade logic for high-speed arithmetic. The 208-BFQFP package supports surface-mount assembly on standard PQFP land patterns. The architecture uses a uniform row-and-column interconnect with FastTrack routing that propagates signals along rows and columns between LABs. Each LAB contains 10 LEs, local interconnect, and LAB control signals; carry chains implement fast arithmetic functions such as adders and counters, while cascade chains support wide-input functions such as comparators. The device includes a built-in JTAG controller and supports serial and parallel configuration modes with configuration data stored in external SRAM or configuration EPROM. Typical applications for the EPF6016AQC208-1 include glue logic and bus interface bridging in telecom equipment, PCI bus interface controllers, industrial control and factory automation I/O expansion, prototyping for ASIC migration, and replacement of multiple 74-series discrete logic devices in legacy systems. Designers favor the FLEX 6000 family for its predictable timing closure and 5.0 V tolerance in mixed-voltage industrial designs. When designing with this device, ensure 3.3 V or 5.0 V VCCINT and VCCIO rails are properly decoupled with 0.1 µF and 10 µF capacitors placed close to each supply pin. The configuration interface pins (nCONFIG, nSTATUS, CONF_DONE) require external pull-up resistors per Intel/Altera application notes for the FLEX 6000 family. This page synthesizes distributor pricing, drop-in alternatives from the FLEX 6000 family and cross-brand compatible FPGAs in the same 208-BFQFP footprint, and practical design notes not collected in a single place in the manufacturer datasheet.

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EPF6016AQC208-2 - FLEX 6000 16K Gates FPGA | Altera | PQFP-208
EPF6016AQC208-2

EPF6016AQC208-2 - FLEX 6000 16K Gates FPGA | Altera | PQFP-208

The Altera EPF6016AQC208-2 is a FLEX 6000 family Field Programmable Gate Array delivering 16,000 typical gates (13,000 usable logic elements) organized in 1,320 logic cells across 132 Logic Array Blocks (LABs), with 171 user I/Os, packaged in a 208-pin Plastic Quad Flat Pack (PQFP / BFQFP). Manufactured on a 0.42 µm CMOS process, it operates from a 3.3 V core supply at a maximum internal frequency of 166.67 MHz. The device belongs to the older SRAM-based FLEX 6000 programmable logic family and is targeted at low-cost, high-volume glue-logic and bus-interface applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by user-supplied SRAM configuration data rather than by hard-wired mask layers, placing it in the broader taxonomy of programmable logic devices (PLD) alongside CPLDs and SPLDs. FPGAs sit at the top of the programmable logic hierarchy, offering the highest logic density and richest I/O feature set at the cost of higher unit price and the need for an external configuration memory. The FLEX 6000 series in particular was Altera's mid-1990s cost-optimized family, positioned between the simpler MAX 7000 CPLDs and the higher-density FLEX 10K series, and was widely used in telecom glue logic, peripheral bridging, and industrial control boards. Key features of the EPF6016AQC208-2 include a 132-LAB architecture with 10 Logic Elements per LAB, four embedded Logic Array Block inputs per LAB, fast continuous interconnect routing, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfacing, and in-system configurability through the IEEE 1149.1 JTAG interface. Each I/O pin includes a tri-state buffer with programmable slew-rate control and an optional pull-up resistor, simplifying board-level integration with mixed-voltage buses such as PCI, ISA, and 68xxx processor interfaces. The device supports configuration via EPROM, microcontroller, or JTAG, with a dedicated configuration EPROM interface that allows automatic load on power-up. This makes the EPF6016AQC208-2 suitable for production volumes where a separate configuration memory is acceptable, while preserving the flexibility of field upgrades via JTAG. The 208-pin PQFP (also referenced as BFQFP) provides 171 usable I/O pins with seven dedicated inputs (CLK, OE, CONFIG_DONE, nSTATUS, nCONFIG, MSEL, JTAG pins). Typical applications include peripheral bridging (PCI to local bus glue), industrial control and instrumentation front-ends, telecommunications line cards, factory automation backplanes, and legacy embedded system upgrades. The wide I/O voltage tolerance (5 V tolerant inputs on a 3.3 V core) allows direct connection to legacy 5 V microprocessors without external level shifters. When designing with this part, note that the EPF6016AQC208-2 is now NRND/EOL — supply is limited to remaining distributor inventory, and the 208-pin PQFP package requires substantial PCB area (approximately 30 × 30 mm). New designs should target Altera/Intel MAX II, MAX V, or Cyclone IV E as modern replacements, accepting that footprint migration is mandatory. This page synthesizes verified distributor pricing, same-family Intel/Altera drop-in alternatives, and practical design notes not found in a single manufacturer document, sourced from DigiKey, Mouser, Octopart, and FPGAkey.

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EPF6016AQC208-2N - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel
EPF6016AQC208-2N

EPF6016AQC208-2N - FLEX 6000 FPGA, 16K Gates, 208-PQFP | Intel

The Intel (formerly Altera) EPF6016AQC208-2N is a member of the FLEX 6000 family of SRAM-based field-programmable gate arrays, providing 16,000 typical gates (1,320 logic elements/132 LABs), 171 user I/Os, and a maximum internal frequency of 166.67 MHz in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package, manufactured on a 0.42 µm CMOS process and operating from a 3.3 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells, all controlled by SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs in density and below ASICs in per-unit cost - making them ideal glue logic, prototyping, and low-to-mid volume custom digital platforms. The FLEX 6000 family uses a cost-optimized SRAM-LUT fabric rather than the flash or anti-fuse cells found in CPLDs, allowing unlimited re-programmability via JTAG or configuration devices. Key features include 1,320 logic cells arranged in 132 Logic Array Blocks (LABs), 171 user I/O pins supporting multiple I/O standards, built-in JTAG (IEEE 1149.1) boundary-scan test support, and in-system programmability through the FLEX 6000 configuration scheme. The device operates across the commercial 0°C to 85°C temperature range and is supplied in a 208-pin PQFP (also referenced as BFQFP/PQFP-208) with gull-wing leads. The -2 speed grade offers a balance of timing margin and cost, supporting system clock frequencies up to 166.67 MHz at the internal logic array. The SRAM-based configuration fabric means the device must be configured at every power-up using a serial configuration EPROM (e.g., EPC1/EPC2) or via JTAG boundary-scan download. Typical applications include telecommunications glue logic, industrial control and factory-automation backplanes, PCI bus interface bridges, prototyping platforms that later migrate to APEX 20K or Cyclone families, and legacy upgrade paths for original FLEX 6000 designs. The wide I/O count (171) and 3.3 V core supply also suit mixed-voltage 5 V-tolerant interface designs. When designing with this part, note that it has been in the legacy / last-time-buy category for many years - verify supply chain availability before starting a new design, and consider pin-compatible FLEX 6000 siblings (EPF6016AQC208-1, EPF6016AQC208-2) or migration to the Cyclone family for new projects. This page synthesizes current distributor stock, drop-in same-package alternatives drawn from the Site MPN catalog, and practical design notes not aggregated in a single location by the original Altera datasheet.

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