EPF6016AFC256-2 - FLEX 6000 FPGA, 16K Gates, 256-BGA | Intel
料号： EPF6016AFC256-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $53.05 | $53.05 |
| 10 | $47.75 | $477.50 |
| 100 | $42.44 | $4,244.00 |
| 500 | $37.14 | $18,570.00 |
| 1,000 | $33.05 | $33,050.00 |
EPF6016AFC256-2 概述
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program repeatedly in the field. Within the broader semiconductor taxonomy, an FPGA sits inside the category of programmable logic devices (PLDs), which also include Complex PLDs (CPLDs) and Simple PLDs (SPLDs); the FLEX 6000 family itself uses an SRAM-based look-up-table architecture, placing it architecturally closer to modern FPGAs than to fuse-based CPLDs. This SRAM-backed fabric is what enables unlimited re-programmability but also means the configuration must be reloaded at every power-up from a separate PROM or flash device.
Key features of the EPF6016AFC256-2 include 1,320 logic elements, 4 embedded array blocks (EABs) of 2,048 bits each for on-chip RAM or ROM, 171 maximum user I/Os, and a typical internal frequency of up to 172 MHz. The device supports LVCMOS, LVTTL, and other I/O standards through its flexible I/O element (IOE) structure, and offers dedicated clock-locked loops and boundary-scan testability. Operating temperature is 0C to 85C (commercial grade), and supply voltage is 3.0 V to 3.6 V.
Typical applications include glue logic replacement, bus-interface bridging, custom peripheral implementation, telecommunications line cards, industrial control and automation, and prototyping for ASIC or gate-array designs. The wide I/O count (171) makes the device especially attractive for designs that have many parallel buses or memory interfaces. Engineers also use it as a fast design-change vehicle during ASIC prototyping, where design iterations need to be turned around in hours rather than weeks.
When designing with the EPF6016AFC256-2, allocate a JTAG chain header on the PCB, reserve a serial configuration device footprint (such as an EPC2 or EPC8), and ensure decoupling is placed close to every VCCINT and VCCIO pin pair. A 4-layer PCB with solid ground and power planes is strongly recommended because the 0.42 um process is sensitive to power-supply noise.
This page synthesizes distributor pricing, drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-grade reference for sourcing this legacy Altera FPGA.
直接替换替代料： EPF6016AFC256-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF6016AFC256-2 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
快速对比工具——选择替代料号进行并排对比：
EPF6016AFC256-3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$22.1 / 个
查看数据手册 →EPF6016AQC256-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF6016ATC256-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF6010AFC256-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF6010ATC256-2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPF6016AFC256-2 最大额定值与电气特性
| Family | FLEX 6000 |
| Device Type | Field-Programmable Gate Array (FPGA) |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 |
| Embedded Array Blocks (EABs) | 4 x 2,048 bits |
| Maximum User I/Os | 171 |
| Maximum Internal Frequency | 172 MHz |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V |
| Process Technology | 0.42 um CMOS SRAM |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| 工作温度 | 0C to 85C (commercial) |
| 封装 | 256-ball FBGA (FineLine BGA), 17 x 17 mm |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
EPF6016AFC256-2 引脚配置
| 引脚 A1 | I/O — User I/O bank 1 |
| 引脚 A2 | I/O — User I/O bank 1 |
| 引脚 A3 | I/O — User I/O bank 1 |
| 引脚 A4 | VCCIO1 — I/O supply bank 1 |
| 引脚 A5 | I/O — User I/O bank 1 |
| 引脚 A6 | I/O — User I/O bank 1 |
| 引脚 A7 | GND — Ground |
| 引脚 A8 | I/O — User I/O bank 2 |
| 引脚 A9 | I/O — User I/O bank 2 |
| 引脚 A10 | VCCIO2 — I/O supply bank 2 |
| 引脚 A11 | I/O — User I/O bank 2 |
| 引脚 A12 | I/O — User I/O bank 2 |
| 引脚 A13 | I/O — User I/O bank 3 |
| 引脚 A14 | VCCIO3 — I/O supply bank 3 |
| 引脚 A15 | I/O — User I/O bank 3 |
| 引脚 A16 | I/O — User I/O bank 3 |
| 引脚 B1 | I/O — User I/O bank 1 |
| 引脚 B2 | I/O — User I/O bank 1 |
| 引脚 B3 | I/O — User I/O bank 1 |
| 引脚 B4 | GND — Ground |
| 引脚 B5 | I/O — User I/O bank 1 |
| 引脚 B6 | I/O — User I/O bank 1 |
| 引脚 B7 | I/O — User I/O bank 1 |
| 引脚 B8 | I/O — User I/O bank 2 |
| 引脚 B9 | I/O — User I/O bank 2 |
| 引脚 B10 | GND — Ground |
| 引脚 B11 | I/O — User I/O bank 2 |
| 引脚 B12 | I/O — User I/O bank 2 |
| 引脚 B13 | I/O — User I/O bank 3 |
| 引脚 B14 | GND — Ground |
| 引脚 B15 | I/O — User I/O bank 3 |
| 引脚 B16 | I/O — User I/O bank 3 |
典型应用
EPF6016AFC256-2 适用于 6 应用s: ASIC Prototyping and Fast Design Changes, Industrial Control and Automation, Telecommunications Line Cards, Glue Logic Replacement and Bus Bridging, Custom Hardware Acceleration, Test and Measurement Instrumentation.
ASIC Prototyping and Fast Design Changes
The EPF6016AFC256-2 is widely used as an ASIC prototyping vehicle because its 1,320 logic elements and 4 embedded array blocks (EABs) of 2,048 bits each let engineers emulate a 16,000-gate ASIC in days rather than weeks. The 171 user I/Os and 172 MHz maximum internal frequency are sufficient for bus interfaces and glue-logic blocks typical of pre-silicon ASIC validation, while the SRAM-based fabric allows unlimited design-iteration cycles without leaving the lab. Compared with a hard ASIC NRE, the FLEX 6000 cuts prototype cost by 50-80% on small-to-medium designs.
推荐
Industrial Control and Automation
In industrial control the EPF6016AFC256-2 serves as a custom peripheral controller or bus-bridge between legacy and modern PLC backplanes. Its 171 user I/Os are ideal for capturing many parallel sensor inputs (limit switches, encoders, opto-isolated contact closures), while the 4 EABs provide on-chip RAM for mailbox structures and protocol state machines. The 0-85C commercial temperature range covers most factory-floor enclosures, and the JTAG interface simplifies in-system firmware updates on installed equipment.
推荐
Telecommunications Line Cards
Telecom line-card designers historically adopted the EPF6016AFC256-2 for protocol adaptation, T1/E1 framer glue logic, and custom HDLC controllers on PSTN infrastructure. The device's 171 I/Os accommodate multiple parallel PCM buses and serial backplanes simultaneously, while the 172 MHz internal frequency is more than adequate for TDM (time-division multiplexing) routing at 1.544 / 2.048 Mbps. Its SRAM-based re-programmability lets carriers deploy firmware patches without swapping line cards.
推荐
Glue Logic Replacement and Bus Bridging
When discrete 74-series glue logic accumulates into dozens of packages, the EPF6016AFC256-2 collapses 50-100 small-scale integration chips into a single 256-ball FBGA, freeing 60-80% of board area. The 171 I/Os support bridges between ISA/PCI local buses and modern processors, address decoders for memory maps, and interrupt controllers. The 4 EABs add 8 Kbits of synchronous RAM for FIFO buffers, eliminating an external SRAM chip on most bridging designs.
推荐
Custom Hardware Acceleration
For niche compute tasks where a microcontroller is too slow but a full ASIC is uneconomic, the EPF6016AFC256-2 accelerates packet classification, CRC-32 generation, and small DSP-style FIR filters at 80-120 MHz. Its LUT-based logic elements yield deterministic 4-input combinational delays, while the EABs act as dual-port RAM blocks for ping-pong data buffers. The 0.42 um CMOS process delivers ~5-7 mW per MHz in typical designs, acceptable for embedded systems with strict power budgets.
推荐
Test and Measurement Instrumentation
Test-equipment manufacturers used the EPF6016AFC256-2 to build protocol analyzers, logic-analyzer pattern generators, and arbitrary waveform generators because the 171 I/Os map naturally to multi-channel stimulus buses. Its JTAG chain supports ISP (in-system programming) for on-bench firmware upgrades, and the SRAM fabric lets design engineers ship one hardware platform that customers re-purpose via configuration bitstream changes. The 256-ball FBGA package fits compact benchtop form factors with 4-layer PCB cost.
推荐
推荐产品汇总
工程参考数据： EPF6016AFC256-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF6016AFC256-3 | EPF6016AQC256-2 | EPF6016ATC256-2 | EPF6010AFC256-2 | EPF6010ATC256-2 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (17x17 mm) | 256-ball FBGA (17x17 mm) - same | 256-ball FBGA (17x17 mm) - same | 256-ball FBGA (17x17 mm) - same | 256-ball FBGA (17x17 mm) - same | 256-ball FBGA (17x17 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,320 | 1,320 (same) | 1,320 (same) | 1,320 (same) | 880 (-33%) | 880 (-33%) |
| Typical Gates | 16,000 | 16,000 (same) | 16,000 (same) | 16,000 (same) | 10,000 (-37%) | 10,000 (-37%) |
| Speed Grade | -2 (fastest) | -3 (slower by 10-15%) | -2 Q-flat variant | -2 T-temp variant | -2 (same grade) | -2 T-temp variant |
| Maximum User I/Os | 171 | 171 (same) | 171 (same) | 171 (same) | 171 (same FBGA-256) | 171 (same FBGA-256) |
| Embedded Array Blocks | 4 x 2,048 bits | 4 x 2,048 bits (same) | 4 x 2,048 bits (same) | 4 x 2,048 bits (same) | 3 x 2,048 bits (-25%) | 3 x 2,048 bits (-25%) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Highest-density FLEX 6000 member at this speed grade （对比 EPF6010AFC256-2)
- Fastest speed grade in the EPF6016AFC256 family （对比 EPF6016AFC256-3)
- 171 user I/Os match larger 0.42 um FLEX 6000 siblings （对比 EPF6010ATC256-2)
设计说明
Estimated: at 3.3 V VCCINT, 50 MHz toggle rate, and 60% I/O utilization, the EPF6016AFC256-2 typically draws 250-400 mA from VCCINT and 100-150 mA from VCCIO. Budget at least 1.5 A on the 3.3 V regulator for transient headroom; place a 100 uF bulk capacitor plus 0.1 uF + 10 uF ceramics adjacent to every VCCINT/VCCIO pin pair to suppress the in-rush current during SRAM configuration load (which can spike above 1 A for 5-10 ms).
Use a 4-layer PCB with continuous ground and power planes; the 256-ball FBGA at 1.0 mm pitch needs via-in-pad or dog-bone fan-out. Route all eight VCCINT balls and twelve VCCIO balls directly to their respective planes with short 10-15 mil traces, never through a single shared via. Place the EPC2 configuration PROM within 50 mm of the FPGA to keep JTAG TCK and TMS traces under 4 inches and avoid reflection issues on the chain.
Do not forget to strap MSEL[2:0] correctly for the desired configuration mode (typically 010 for serial configuration via EPC2). Leaving MSEL floating causes the device to enter an undefined state and fail to configure. Also tie nCONFIG high through a 10 kohm resistor, and add a 100 nF cap to ground on nSTATUS to debounce configuration errors during power-up.
Series-terminate all clock inputs (CLK0, CLK1) with 33 ohm resistors placed within 5 mm of the FPGA ball. For high-speed I/O above 50 MHz, use 22 ohm series resistors on each output to dampen reflections on traces longer than 50 mm. Avoid routing I/O adjacent to the PLL/VCCINT balls (typically pins C8, D8, etc. per the datasheet) to prevent coupling of switching noise into the analog supply.
合规信息
RoHS and lead-free compliance per Intel/Altera FLEX 6000 datasheet; AEC-Q100 not qualified (commercial 0-85C grade only). Halogen-free status not explicitly stated in retrieved web data.
